MC3403_06 ONSEMI | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 9
Technical content
Features
- Short Circuit Protected Outputs
- Class AB Output Stage for Minimal Crossover Distortion
- True Differential Input Stage
- Single Supply Operation: 3.0 V to 36 V
- Split Supply Operation: ±1.5 V to ±18 V
- Low Input Bias Currents: 500 nA Max
- Four Amplifiers Per Package
- Internally Compensated
- Similar Performance to Popular MC1741C
- Industry Standard Pin−outs
- ESD Diodes Added for Increased Ruggedness
- Pb−Free Packages are Available
3.0 V to 36 V
VEE, GND V CC VCC V EE
1.5 V to 18 V
x = 3 or 4 A = Assembly Location WL = Wafer Lot YY, Y = Year WW = Work Week G= P b −Free Package PDIP−14 P SUFFIX CASE 646 PIN CONNECTIONS Out 1 Inputs 1 VCC VEE/GND Inputs 2 Out 2 Out 4 Inputs 4 Inputs 3 Out 3 (Top View) MC3x03P AWLYYWWG http://onsemi.com See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet.
ORDERING INFORMATION
SOIC−14 D SUFFIX CASE 751A MC3x03DG AWLYWW
MC3403, MC3303 http://onsemi.com Device Package Shipping† MC3303D SOIC−14
55 Units / RailMC3303DG SOIC−14
(Pb−Free) MC3303DR2 SOIC−14
2500 Tape & ReelMC3303DR2G SOIC−14
(Pb−Free) MC3303P PDIP−14
25 Units / RailMC3303PG PDIP−14
(Pb−Free) MC3403D SOIC−14
55 Units / RailMC3403DG SOIC−14
(Pb−Free) MC3403DR2 SOIC−14
2500 Tape & ReelMC3403DR2G SOIC−14
(Pb−Free) MC3403P PDIP−14
25 Units / RailMC3403PG PDIP−14
(Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. MAXIMUM RATINGS Rating Symbol Value Unit Power Supply Voltages Single Supply Split Supplies VCC VCC, VEE ±18 Vdc Input Differential Voltage Range (Note 1) VIDR ±36 Vdc Input Common Mode Voltage Range (Notes 1 and 2) VICR ±18 Vdc Storage Temperature Range Tstg −55 to +125 °C Operating Ambient Temperature Range MC3303 MC3403 TA −40 to +85 0 to +70 Junction Temperature TJ 150 °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above t he Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Split power supplies. 2. For supply voltages less than ±18 V, the absolute maximum input voltage is equal to the supply voltage.
MC3403, MC3303 http://onsemi.com
ELECTRICAL CHARACTERISTICS
(VCC = +15 V, VEE = −15 V for MC3403; VCC = +14 V, VEE = GND for MC3303 TA = 25°C, unless otherwise noted.) Characteristic Symbol MC3403 MC3303 UnitMin Typ Max Min Typ Max Input Offset Voltage TA = Thigh to Tlow (Note 3) VIO − 2.0 2.0 8.0 mV Input Offset Current TA = Thigh to Tlow IIO − 200 250 nA Large Signal Open Loop Voltage Gain VO = ±10 V, RL = 2.0 k/C0087 TA = Thigh to Tlow AVOL 200 200 V/mV Input Bias Current TA = Thigh to Tlow IIB − −200 −500 −800 −200 −500 −1000 nA Output Impedance f = 20 Hz zo − 75 − − 75 − /C0087 Input Impedance f = 20 Hz zi 0.3 1.0 − 0.3 1.0 − M/C0087 Output Voltage Range RL = 10 k/C0087 RL = 2.0 k/C0087 RL = 2.0 k/C0087, TA = Thigh to Tlow VO ±12 ±10 ±10 ±13.5 ±13 12.5 V Input Common Mode Voltage Range VICR +13 V −VEE +13 V −VEE − +12 V −VEE +12.5 V −VEE − V Common Mode Rejection RS ≤ 10 k/C0087 CMR 70 90 − 70 90 − dB Power Supply Current (VO = 0) RL = ∞ ICC, IEE − 2.8 7.0 − 2.8 7.0 mA Individual Output Short−Circuit Current (Note 4) ISC ±10 ±20 ±45 ±10 ±30 ±45 mA Positive Power Supply Rejection Ratio PSRR+ − 30 150 − 30 150 /C0109V/V Negative Power Supply Rejection Ratio PSRR− − 30 150 − 30 150 /C0109V/V Average Temperature Coefficient of Input Offset Current T A = Thigh to Tlow /C0068IIO//C0068T − 50 − − 50 − pA/°C Average Temperature Coefficient of Input Offset Voltage T A = Thigh to Tlow /C0068VIO//C0068T − 10 − − 10 − /C0109V/°C Power Bandwidth AV = 1, RL = 10 k/C0087/C0044 VO = 20 V(p−p), THD = 5% BWp − 9.0 − − 9.0 − kHz Small−Signal Bandwidth AV = 1, RL = 10 k/C0087/C0044 VO = 50 mV Slew Rate AV = 1, Vi = −10 V to +10 V SR − 0.6 − − 0.6 − V//C0109s Rise Time AV = 1, RL = 10 k/C0087/C0044 VO = 50 mV tTLH − 0.35 − − 0.35 − /C0109s Fall Time AV = 1, RL = 10 k/C0087/C0044 VO = 50 mV tTLH − 0.35 − − 0.35 − /C0109s Overshoot AV = 1, RL = 10 k/C0087/C0044 VO = 50 mV os − 20 − − 20 − % Phase Margin AV = 1, RL = 2.0 k/C0087, VO = 200 pF /C0102m − 60 − − 60 − ° Crossover Distortion (Vin = 30 mVpp,Vout= 2.0 Vpp, f = 10 kHz) 3. MC3303: T low = −40°C, Thigh = +85°C, MC3403: Tlow = 0°C, Thigh = +70°C 4. Not to exceed maximum package power dissipation.
- Output will swing to ground with a 10 k /C0087 pull down resistor.
Figure 1. Representative Schematic Diagram
Figure 2. Inverter Pulse Response
5.0 V/DIV
accomplished by splitting the collectors of Q24 and Q22. exhibit any crossover distortion in split supply operation. This is possible because Class AB operation is utilized. excellent power supply rejection. Figure 3. Sine Wave Response Figure 4. Open Loop Frequency Response *Note Class A B output stage produces distortion less sinewave. Figure 5. Power Bandwidth Figure 6. Output Swing versus Supply Voltage
Figure 13. Bi−Quad Filter Figure 14. Function Generator Figure 15. Multiple Feedback Bandpass Filter where fo and BW are expressed in Hz. voltage follower buffer to stabilize filter parameters.
2 A(fo)
4 CRf R1
MC3403, MC3303 http://onsemi.com PACKAGE DIMENSIONS SOIC−14 CASE 751A−03 ISSUE H NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. −A− −B− G P 7 PL 14 8 M0.25 (0.010) B M SBM0.25 (0.010) A ST −T− FR X 45 SEATING PLANE D 14 PL K C JM /C0095 DIM MIN MAX MIN MAX INCHESMILLIMETERS A 8.55 8.75 0.337 0.344 B 3.80 4.00 0.150 0.157 C 1.35 1.75 0.054 0.068 D 0.35 0.49 0.014 0.019 F 0.40 1.25 0.016 0.049 G 1.27 BSC 0.050 BSC J 0.19 0.25 0.008 0.009 K 0.10 0.25 0.004 0.009 M 0 7 0 7 P 5.80 6.20 0.228 0.244 R 0.25 0.50 0.010 0.019 /C0095/C0095/C0095/C0095 7.04 14X 0.58 14X 1.52 1.27 DIMENSIONS: MILLIMETERS PITCH SOLDERING FOOTPRINT* *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
MC3403, MC3303 http://onsemi.com PACKAGE DIMENSIONS PDIP−14 CASE 646−06 ISSUE P 14 8 B A DIM MIN MAX MIN MAX MILLIMETERSINCHES A 0.715 0.770 18.16 19.56 B 0.240 0.260 6.10 6.60 C 0.145 0.185 3.69 4.69 D 0.015 0.021 0.38 0.53 F 0.040 0.070 1.02 1.78 G 0.100 BSC 2.54 BSC H 0.052 0.095 1.32 2.41 J 0.008 0.015 0.20 0.38 K 0.115 0.135 2.92 3.43 L N 0.015 0.039 0.38 1.01 /C0095/C0095 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. F HG D K C SEATING PLANE N −T− 14 PL M0.13 (0.005) L M J 0.290 0.310 7.37 7.87 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 MC3403/D LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative