MC3303N

MC3403 TI | Alldatasheet

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MC3303, MC3403 QUADRUPLE LOW-POWER OPERATIONAL AMPLIFIERS SLOS101C – FEBRUARY 1979 – REVISED FEBRUARY 2002 1POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 /C0068 Wide Range of Supply Voltages, Single Supply ...3 V t o 3 6 V o r Dual Supplies /C0068 Class AB Output Stage /C0068 True Differential Input Stage /C0068 Low Input Bias Current /C0068 Internal Frequency Compensation /C0068 Short-Circuit Protection /C0068 Designed to Be Interchangeable With Motorola MC3303, MC3403

description

The MC3303 and the MC3403 are quadruple operational amplifiers similar in performance to the µA741, but with several distinct advantages. They are designed to operate from a single supply over a range of voltages from 3 V to 36 V. Operation from split supplies also is possible, provided the difference between the two supplies is 3 V to 36 V. The common-mode input range includes the negative supply. Output range is from the negative supply to V CC – 1.5 V. Quiescent supply currents are less than one-half those of the µA741. The MC3303 is characterized for operation from –40°C to 85°C, and the MC3403 is characterized for operation from 0°C to 70°C. AVAILABLE OPTIONS PACKAGE TA VIOMAX AT 25°C PLASTIC SMALL OUTLINE (D, NS) PLASTIC SHRINK SMALL OUTLINE (DB) PLASTIC DIP (N) PLASTIC THIN SHRINK SMALL OUTLINE (PW) 0°C to 70°C 10 mV MC3403D MC3403NS MC3403DB MC3403N MC3403PW –40°C to 85°C 8 mV MC3303D — MC3303N MC3303PW The D package is available taped and reeled. Add R suffix to the device type (e.g., MC3403DR). The DB, NS, and PW packages are only available taped and reeled. logic diagram (each amplifier) IN+ OUT IN– Copyright  2002, Texas Instruments IncorporatedPRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. 1OUT 1IN– 1IN+ VCC+ 2IN+ 2IN– 2OUT 4OUT 4IN– 4IN+ VCC– 3IN+ 3IN– 3OUT MC3303 ...D , N , O R P W PACKAGE MC3403 . . . D, DB, N, NS, OR PW PACKAGE (TOP VIEW)

MC3303, MC3403 QUADRUPLE LOW-POWER OPERATIONAL AMPLIFIERS SLOS101C – FEBRUARY 1979 – REVISED FEBRUARY 2002

2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

schematic (each amplifier) IN– IN+ VCC+ Common Bias Circuitry VCC – Output To Three Other Amplifiers 2.4 kΩ 5 pF Component values shown are nominal. absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. These voltage values are with respect to the midpoint between VCC+ and VCC –. 2. Differential voltages are at IN+ with respect to IN–. 3. Neither input must ever be more positive than VCC+ or more negative than VCC –. 4. The package thermal impedance is calculated in accordance with JESD 51-7.

MC3303, MC3403 QUADRUPLE LOW-POWER OPERATIONAL AMPLIFIERS SLOS101C – FEBRUARY 1979 – REVISED FEBRUARY 2002 3POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 recommended operating conditions MIN MAX UNIT VCC Supply voltage 5 30 V Dual supply voltage VCC+ 2.5 15 V Dual-supply voltage VCC – –2.5 –15 V TA O perating free air temperature MC3303 –40 85 °CTA Operating free-air temperature MC3403 0 70 electrical characteristics at specified free-air temperature, VCC+ = 14 V, VCC – = 0 V for MC3303, VCC ± = ±15 V for MC3403 (unless otherwise noted) PARAMETER TEST CONDITIONS † MC3303 MC3403 UNITPARAMETER TEST CONDITIONS † MIN TYP MAX MIN TYP MAX UNIT VIO Input offset voltage See Note 5 25°C 2 8 2 10 mVVIO Input offset voltage See Note 5 Full range 10 12 mV /C0097 V IO Temperature coefficient of input offset voltageSee Note 5 Full range 10 10 µV/°C IIO Input offset current See Note 5 25°C 30 75 30 50 nAIIO Input offset current See Note 5 Full range 250 200 nA /C0097 IIO Temperature coefficient of input offset currentSee Note 5 Full range 50 50 pA/C IIB Input bias current See Note 5 µAIIB Input bias current See Note 5 Full range –1 –0.8 µA VICR Common-mode input voltage range‡ 25°C VCC – to 12 VCC – to 12.5 VCC – to 13 VCC – to 13.5 V Pk tt R L = 10 kΩ 25°C 12 12.5 ±12 ±13.5 VOM Peak output voltage swing R L = 2 kΩ 25°C 10 12 ±10 ±13 Vvoltage swing R L = 2 kΩ Full range 10 ±10 AVD Large-signal differentialVO = ±10 V RL =2k Ω 25°C 20 200 20 200 V/mVAVD gg voltage amplificationVO = ±10 V, R L = 2 kΩ Full range 15 15 V/mV BOM Maximum-output-swing bandwidth VOPP = 20 V, AVD = 1, THD ≤ 5%, RL = 2 kΩ 25°C 9 9 kHz B1 Unity-gain bandwidth VO = 50 mV, RL = 10 kΩ 25°C 1 1 MHz φm Phase margin C L = 200 pF, RL = 2 kΩ 25°C 60° 60° ri Input resistance f = 20 Hz 25°C 0.3 1 0.3 1 M Ω ro Output resistance f = 20 Hz 25°C 75 75 Ω CMRR Common-mode rejection ratio VIC = VICRmin 25°C 70 90 70 90 dB kSVS Supply voltage sensitivity (∆VIO/∆VCC ) VCC ± =±2.5 to ±15 V 25°C 30 150 30 150 µV/V IOS Short-circuit output current§ 25°C ±10 ±30 ±45 ±10 ±30 ±45 mA ICC Total supply current No load, See Note 5 25°C 2.8 7 2.8 7 mA † All characteristics are measured under open-loop conditions with zero common-mode voltage unless otherwise specified. Full range for TA is –40°C to 85°C for MC3303, and 0°C to 70°C for MC3403. ‡ The VICR limits are linked directly, volt-for-volt, to supply voltage; the positive limit is 2 V less than VCC+ . § Temperature and/or supply voltages must be limited to ensure that the dissipation rating is not exceeded. NOTE 5: V IO, IIO, IIB, and ICC are defined at VO = 0 for MC3403 and VO = 7 V for MC3303.

4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

† All characteristics are measured under open-loop conditions with zero common-mode input voltage unless otherwise specified. ‡ Output will swing essentially to ground. Figure 1. Unity-Gain Amplifier

MC3303, MC3403 QUADRUPLE LOW-POWER OPERATIONAL AMPLIFIERS SLOS101C – FEBRUARY 1979 – REVISED FEBRUARY 2002

6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

TYPICAL CHARACTERISTICS † I TA – Free-Air Temperature – °C ÎÎÎÎÎ ÎÎÎÎÎ VCC ± = ±15 V INPUT BIAS CURRENT vs FREE-AIR TEMPERATURE Figure 6 IB– Input Bias Current – mA 250 200 150 100 –75 –50 –25 0 25 50 75 100 125 INPUT BIAS CURRENT vs SUPPLY VOLTAGE |VCC ±| – Supply Voltage – V ÎÎÎÎ ÎÎÎÎ TA = 25°C Figure 7 IIB– Input Bias Current – mA 250 200 150 100 02 4681 0 1 2 1 4 1 6 † Operation of the device at these or any other conditions beyond those indicated under ‘‘recommended operating conditions” is not implied.

www.ti.com 23-May-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) MC3303D Obsolete Production SOIC (D) | 14 - - Call TI Call TI -40 to 85 MC3303 MC3303DR Active Production SOIC (D) | 14 2500 | LARGE T&R Yes NIPDAU | NIPDAU Level-1-260C-UNLIM -40 to 85 MC3303 MC3303DR.A Active Production SOIC (D) | 14 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 MC3303 MC3303N Active Production PDIP (N) | 14 25 | TUBE Yes NIPDAU N/A for Pkg Type -40 to 85 MC3303N MC3303N.A Active Production PDIP (N) | 14 25 | TUBE Yes NIPDAU N/A for Pkg Type -40 to 85 MC3303N MC3303PW Obsolete Production TSSOP (PW) | 14 - - Call TI Call TI -40 to 85 M3303 MC3303PWR Active Production TSSOP (PW) | 14 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 M3303 MC3303PWR.A Active Production TSSOP (PW) | 14 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 M3303 MC3403D Obsolete Production SOIC (D) | 14 - - Call TI Call TI 0 to 70 MC3403 MC3403DR Active Production SOIC (D) | 14 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM 0 to 70 MC3403 MC3403DR.A Active Production SOIC (D) | 14 2500 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM 0 to 70 MC3403 MC3403N Active Production PDIP (N) | 14 25 | TUBE Yes NIPDAU N/A for Pkg Type 0 to 70 MC3403N MC3403N.A Active Production PDIP (N) | 14 25 | TUBE Yes NIPDAU N/A for Pkg Type 0 to 70 MC3403N MC3403NSR Active Production SOP (NS) | 14 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM 0 to 70 MC3403 MC3403NSR.A Active Production SOP (NS) | 14 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM 0 to 70 MC3403 MC3403PWR Obsolete Production TSSOP (PW) | 14 - - Call TI Call TI 0 to 70 M3403 (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. Addendum-Page 1

www.ti.com 23-May-2025 (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 23-May-2025 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION www.ti.com 23-May-2025 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) MC3303DR SOIC D 14 2500 356.0 356.0 35.0 MC3303PWR TSSOP PW 14 2000 356.0 356.0 35.0 MC3303PWR TSSOP PW 14 2000 353.0 353.0 32.0 MC3403DR SOIC D 14 2500 340.5 336.1 25.0 MC3403DR SOIC D 14 2500 353.0 353.0 32.0 MC3403NSR SOP NS 14 2000 356.0 356.0 35.0 Pack Materials-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 23-May-2025 TUBE L - Tube length T - Tube height W - Tube width B - Alignment groove width *All dimensions are nominal Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm) MC3303N N PDIP 14 25 506 13.97 11230 4.32 MC3303N N PDIP 14 25 506 13.97 11230 4.32 MC3303N.A N PDIP 14 25 506 13.97 11230 4.32 MC3303N.A N PDIP 14 25 506 13.97 11230 4.32 MC3403N N PDIP 14 25 506 13.97 11230 4.32 MC3403N N PDIP 14 25 506 13.97 11230 4.32 MC3403N.A N PDIP 14 25 506 13.97 11230 4.32 MC3403N.A N PDIP 14 25 506 13.97 11230 4.32 Pack Materials-Page 3

www.ti.com PACKAGE OUTLINE C TYP6.2 5.8

1.75 MAX

12X 1.27 14X 0.51 0.31 7.62 TYP0.25 0.13 0 - 8 0.25 0.10 0.25 GAGE PLANE 1.27 0.40 A NOTE 3 8.75 8.55 B NOTE 4 4.0 3.8 4220718/A 09/2016 SOIC - 1.75 mm max heightD0014A SMALL OUTLINE INTEGRATED CIRCUIT NOTES: 1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm, per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.43 mm, per side. 5. Reference JEDEC registration MS-012, variation AB. 1 14

0.25 C A B

0.1 C SEE DETAIL A DETAIL A TYPICAL SCALE 1.800

www.ti.com EXAMPLE BOARD LAYOUT (5.4)

0.07 MAX

0.07 MIN

14X (1.55) 14X (0.6) 12X (1.27) (R0.05) TYP 4220718/A 09/2016 SOIC - 1.75 mm max heightD0014A SMALL OUTLINE INTEGRATED CIRCUIT SYMM SYMM LAND PATTERN EXAMPLE SCALE:8X 7 8 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. METALSOLDER MASK OPENING NON SOLDER MASK DEFINED SOLDER MASK DETAILS SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED

www.ti.com EXAMPLE STENCIL DESIGN (5.4) 12X (1.27) 14X (0.6) 14X (1.55) 4220718/A 09/2016 SOIC - 1.75 mm max heightD0014A SMALL OUTLINE INTEGRATED CIRCUIT NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. SYMM SYMM 7 8 SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:8X

www.ti.com PACKAGE OUTLINE C 12X 0.65 3.9 14X 0.30 0.17 6.6

6.2 TYP

1.2 MAX

0.15 0.05 0.25 GAGE PLANE 0 -8 4X (0 -12 ) B 4.5 4.3 NOTE 4 A 5.1 4.9 NOTE 3 0.75 0.50 (0.15) TYP TSSOP - 1.2 mm max heightPW0014A SMALL OUTLINE PACKAGE 4220202/B 12/2023

0.1 C A B

0.1 C NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side. 5. Reference JEDEC registration MO-153. SEATING PLANE A 20 DETAIL A TYPICAL SCALE 2.500

www.ti.com EXAMPLE BOARD LAYOUT

0.05 MAX

0.05 MIN

14X (1.5) 14X (0.45) 12X (0.65) (5.8) (R0.05) TYP TSSOP - 1.2 mm max heightPW0014A SMALL OUTLINE PACKAGE 4220202/B 12/2023 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 10X SYMM SYMM 7 8 15.000 METALSOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK OPENING EXPOSED METALEXPOSED METAL SOLDER MASK DETAILS NON-SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED

www.ti.com EXAMPLE STENCIL DESIGN 14X (1.5) 14X (0.45) 12X (0.65) (5.8) (R0.05) TYP TSSOP - 1.2 mm max heightPW0014A SMALL OUTLINE PACKAGE 4220202/B 12/2023 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE: 10X SYMM SYMM 7 8

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