MC33030_06 ONSEMI | Alldatasheet

Document overview

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Technical content

Features

  • On−Chip Error Amp for Feedback Monitoring
  • Window Detector with Deadband and Self Centering Reference Input
  • Drive/Brake Logic with Direction Memory
  • 1.0 A Power H−Switch
  • Programmable Overcurrent Detector
  • Programmable Overcurrent Shutdown Delay
  • Overvoltage Shutdown
  • Pb−Free Packages are Available* *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. MARKING DIAGRAMS A = Assembly Location WL = Wafer Lot YY = Year WW = Work Week G = Pb−Free Package PDIP−16 P SUFFIX CASE 648C SO−16W DW SUFFIX CASE 751G 11 6 (Top View) Reference Input Reference Input Filter Error Amp Output Filter/Feedback Input GND Error Amp Output Error Amp Inverting Input Error Amp Non− Inverting Input Overcurrent Delay GND Error Amp Input Filter PIN CONNECTIONS Driver Output B V CC Driver Output A Overcurrent Reference Pins 4, 5, 12 and 13 are electrical ground and heat sink pins for IC. http://onsemi.com See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet.

ORDERING INFORMATION

http://onsemi.com Motor 141011 VCC ROCCDLY 1516 Power H−Switch Programmable Over− Current Detector & Latch 4, 5, 12, 13 Reference Position VCC − Direction Memory Window Detector Drive/ Brake Logic Over− Voltage Monitor Error Amp 9Feedback Position VCC Representative Block Diagram This device contains 119 active transistors. Device Package Shipping† MC33030DW SOIC−16 47 Units / Rail MC33030DWG SOIC−16 (Pb−Free) MC33030DWR2 SOIC−16 1000 / Tape & Reel MC33030DWR2G SOIC−16 (Pb−Free) MC33030P PDIP−16 25 Units / Rail MC33030PG PDIP−16 (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.

http://onsemi.com MAXIMUM RATINGS Rating Symbol Value Unit Power Supply Voltage VCC 36 V Input Voltage Range Op Amp, Comparator, Current Limit VIR −0.3 to V CC V Input Differential Voltage Range Op Amp, Comparator (Pins 1, 2, 3, 6, 7, 8, 9) VIDR −0.3 to V CC V Delay Pin Sink Current (Pin 16) IDLY(sink) 20 mA Output Source Current (Op Amp) Isource 10 mA Drive Output Voltage Range (Note 1) VDRV −0.3 to (V CC + VF) V Drive Output Source Current (Note 2) IDRV(source) 1.0 A Drive Output Sink Current (Note 2) IDRV(sink) 1.0 A Brake Diode Forward Current (Note 2) IF 1.0 A Power Dissipation and Thermal Characteristics P Suffix, Dual In Line Case 648C Thermal Resistance, Junction−to−Air Thermal Resistance, Junction−to−Case DW Suffix, Dual In Line Case 751G Thermal Resistance, Junction−to−Air Thermal Resistance, Junction−to−Case R/C0113JA R/C0113JC R/C0113JA R/C0113JC °C/W Operating Junction Temperature TJ +150 °C Operating Ambient Temperature Range TA −40 to +85 °C Storage Temperature Range Tstg −65 to +150 °C Electrostatic Discharge Sensitivity (ESD) Human Body Model (HBM) Machine Model (MM) ESD 2000 200 V Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above t he Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. The upper voltage level is clamped by the forward drop, V F, of the brake diode. 2. These values are for continuous DC current. Maximum package power dissipation limits must be observed. ELECTRICAL CHARACTERISTICS (VCC = 14 V, TA = 25°C, unless otherwise noted.) Characteristic Symbol Min Typ Max Unit ERROR AMP Input Offset Voltage (− 40°C /C0112 TA /C0112 85°C), VPin 6 = 7.0 V, RL = 100 k VIO − 1.5 10 mV Input Offset Current (VPin 6 = 1.0 V, RL = 100 k) IIO − 0.7 − nA Input Bias Current (VPin 6 = 7.0 V, RL = 100 k) IIB − 7.0 − nA Input Common−Mode Voltage Range /C0068VIO = 20 mV, RL = 100 k VICR − 0 to (VCC − 1.2) − V Slew Rate, Open Loop (VID = 0.5 V, CL = 15 pF) SR − 0.40 − V//C0109s Unity−Gain Crossover Frequency fc − 550 − kHz Unity−Gain Phase Margin φm − 63 − deg Common−Mode Rejection Ratio (VPin 6 = 7.0 V, RL = 100 k) CMRR 50 82 − dB Power Supply Rejection Ratio VCC = 9.0 to 16 V, VPin 6 = 7.0 V, RL = 100 k PSRR − 89 − dB Output Source Current (VPin 6 = 12 V) IO + − 1.8 − mA Output Sink Current (VPin 6 = 1.0 V) IO − − 250 − /C0109A Output Voltage Swing (RL = 17 k to Ground) VOH VOL 12.5 13.1 0.02 V V

http://onsemi.com ELECTRICAL CHARACTERISTICS (continued) (VCC = 14 V, TA = 25°C, unless otherwise noted.) Characteristic Symbol Min Typ Max Unit WINDOW DETECTOR Input Hysteresis Voltage (V1 − V4, V2 − V3, Figure 18) VH 25 35 45 mV Input Dead Zone Range (V2 − V4, Figure 18) VIDZ 166 210 254 mV Input Offset Voltage (⎢[V2 − VPin 2] − [VPin 2 − V4]⎟ Figure 18) VIO − 25 − mV Input Functional Common−Mode Range (Note 3) Upper Threshold Lower Threshold VIH VIL (VCC − 1.05) 0.24 V Reference Input Self Centering Voltage Pins 1 and 2 Open VRSC − (1/2 VCC) − V Window Detector Propagation Delay Comparator Input, Pin 3, to Drive Outputs VID = 0.5 V, RL(DRV) = 390 /C0087 tp(IN/DRV) − 2.0 − /C0109s OVERCURRENT MONITOR Overcurrent Reference Resistor Voltage (Pin 15) ROC 3.9 4.3 4.7 V Delay Pin Source Current VDLY = 0 V, ROC = 27 k, IDRV = 0 mA IDLY(source) − 5.5 6.9 /C0109A Delay Pin Sink Current (ROC = 27 k, IDRV = 0 mA) VDLY = 5.0 V VDLY = 8.3 V VDLY = 14 V IDLY(sink) 0.1 0.7 16.5 mA Delay Pin Voltage, Low State (IDLY = 0 mA) VOL(DLY) − 0.3 0.4 V Overcurrent Shutdown Threshold VCC = 14 V VCC = 8.0 V Vth(OC) 6.8 5.5 7.5 6.0 8.2 6.5 V Overcurrent Shutdown Propagation Delay Delay Capacitor Input, Pin 16, to Drive Outputs, V ID = 0.5 V tp(DLY/DRV) − 1.8 − /C0109s POWER H−SWITCH Drive−Output Saturation (− 40 °C /C0112 TA /C0112+ 85°C, Note 4) High−State (I source = 100 mA) Low−State (I sink = 100 mA) VOH(DRV) VOL(DRV) (VCC − 2) (VCC − 0.85) 0.12 1.0 V Drive−Output Voltage Switching Time (CL = 15 pF) Rise Time Fall Time tr tf 200 200 ns Brake Diode Forward Voltage Drop (IF = 200 mA, Note 4) VF − 1.04 2.5 V TOTAL DEVICE Standby Supply Current ICC − 14 25 mA Overvoltage Shutdown Threshold (− 40 °C /C0112 TA /C0112 + 85°C) Vth(OV) 16.5 18 20.5 V Overvoltage Shutdown Hysteresis (Device “off” to “on”) VH(OV) 0.3 0.6 1.0 V Operating Voltage Lower Threshold (− 40 °C /C0112 TA /C0112 + 85°C) VCC − 7.5 8.0 V 3. The upper or lower hysteresis will be lost when operating the Input, Pin 3, close to the respective rail. Refer to Figure 4. 4. Low duty cycle pulse techniques are used during test to maintain junction temperature as close to ambient temperature as poss ible.

Figure 1. Error Amp Input Common−Mode Figure 2. Error Amp Output Saturation

0.1 GND

Figure 3. Open Loop Voltage Gain and Figure 4. Window Detector Reference−Input Figure 5. Window Detector Feedback−Input Figure 6. Output Driver Saturation

http://onsemi.com OPERATING DESCRIPTION The MC33030 was designed to drive fractional horsepower DC motors and sense actuator position by voltage feedback. A typical servo application and representative internal block diagram are shown in Figure 17. The system operates by setting a voltage on the reference input of the Window Detector (Pin 1) which appears on (Pin 2). A DC motor then drives a position sensor, usually a potentiometer driven by a gear box, in a corrective fashion so that a voltage proportional to position is present at Pin 3. The servo motor will continue to run until the voltage at Pin 3 falls within the dead zone, which is centered about the reference voltage. The Window Detector is composed of two comparators, A and B, each containing hysteresis. The reference input, common to both comparators, is pre−biased at 1/2 V CC for simple two position servo systems and can easily be overridden by an external voltage divider. The feedback voltage present at Pin 3 is connected to the center of two resistors that are driven by an equal magnitude current source and sink. This generates an offset voltage at the input of each comparator which is centered about Pin 3 that can float virtually from V CC to ground. The sum of the upper and lower offset voltages is defined as the window detector input dead zone range. To increase system flexibility, an on−chip Error Amp is provided. It can be used to buffer and/or gain−up the actuator position voltage which has the effect of narrowing the dead zone range. A PNP differential input stage is provided so that the input common−mode voltage range will include ground. The main design goal of the error amp output stage was to be able to drive the window detector input. It typically can source 1.8 mA and sink 250 /C0109A. Special design considerations must be made if it is to be used for other applications. The Power H−Switch provides a direct means for motor drive and braking with a maximum source, sink, and brake current of 1.0 A continuous. Maximum package power dissipation limits must be observed. Refer to Figure 15 for thermal information. For greater drive current requirements, a method for buffering that maintains all the system features is shown in Figure 30. The Overcurrent Monitor is designed to distinguish between motor startup or locked rotor conditions that can occur when the actuator has reached its travel limit. A fraction of the Power H−Switch source current is internally fed into one of the two inverting inputs of the current comparator, while the non−inverting input is driven by a programmable current reference. This reference level is controlled by the resistance value selected for R OC, and must be greater than the required motor run−current with its mechanical load over temperature; refer to Figure 8. During an overcurrent condition, the comparator will turn off and allow the current source to charge the delay capacitor, C DLY. When CDLY charges to a level of 7.5 V , the set input of the overcurrent latch will go high, disabling the drive and brake functions of the Power H−Switch. The programmable time delay is determined by the capacitance value−selected for C DLY. tDLY /C0043 Vref CDLY IDLY(source) /C0043

7.5 CDLY

5.5 μA /C00431.36 CDLY in μF This system allows the Power H−Switch to supply motor startup current for a predetermined amount of time. If the rotor is locked, the system will time−out and shutdown. This feature eliminates the need for servo end−of−travel or limit switches. Care must be taken so as not to select too large of a capacitance value for CDLY. An overcurrent condition for an excessively long time−out period can cause the integrated circuit to overheat and eventually fail. Again, the maximum package power dissipation limits must be observed. The overcurrent latch is reset upon powerup or by readjusting VPin 2 as to cause V Pin 3 to enter or pass through the dead zone. This can be achieved by requesting the motor to reverse direction. An Overvoltage Monitor circuit provides protection for the integrated circuit and motor by disabling the Power H−Switch functions if VCC should exceed 18 V . Resumption of normal operation will commence when VCC falls below 17.4 V . A timing diagram that depicts the operation of the Drive/Brake Logic section is shown in Figure 18. The waveforms grouped in [1] show a reference voltage that was preset, appearing on Pin 2, which corresponds to the desired actuator position. The true actuator position is represented by the voltage on Pin 3. The points V1 through V4 represent the input voltage thresholds of comparators A and B that cause a change in their respective output state. They are defined as follows: V1 = Comparator B turn−off threshold V2 = Comparator A turn−on threshold V3 = Comparator A turn−off threshold V4 = Comparator B turn−on threshold V1−V4 = Comparator B input hysteresis voltage V2−V3 = Comparator A input hysteresis voltage V2−V4 = Window detector input dead zone range |(V2−VPin2) − (VPin2 − V4)| = Window detector input voltage

Pin 3 becomes greater than V1. resting position of the actuator after braking. Figure 17. Representative Block Diagram and Typical Servo Application

Figure 18. Timing Diagram

Figure 25. Notch Filter Figure 26. Differential Input Amplifier Figure 27. Temperature Sensing Servo System heat/air conditioner modulator door in a duct system. Figure 28. Bridge Amplifier

3 VRef

Figure 29. Remote Latched Shutdown reset the overcurrent latch. Figure 30. Power H−Switch Buffer

6.0 V for 100 kPa

2.0 V for Zero

Figure 31. Adjustable Pressure Differential Regulator

http://onsemi.com PACKAGE DIMENSIONS PDIP−16 P SUFFIX CASE 648C−04 ISSUE D DIM MIN MAX MIN MAX MILLIMETERSINCHES A 0.744 0.783 18.90 19.90 B 0.240 0.260 6.10 6.60 C 0.145 0.185 3.69 4.69 D 0.015 0.021 0.38 0.53 E 0.050 BSC 1.27 BSC F 0.040 0.70 1.02 1.78 G 0.100 BSC 2.54 BSC J 0.008 0.015 0.20 0.38 K 0.115 0.135 2.92 3.43 L 0.300 BSC 7.62 BSC M 0 10 0 10 N 0.015 0.040 0.39 1.01 /C0095/C0095/C0095/C0095 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.16 9 D G E N K C 16X AM0.005 (0.13) T SEATING PLANE BM0.005 (0.13) T J16X M L A A B F T B SO−16 WB CASE 751G−03 ISSUE C D 14X B16X SEATING PLANE SAM0.25 B ST 16 9 h X 45/C0095 MBM0.25 H8X E B A e T A L C /C0113 NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS D AND E DO NOT INLCUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF THE B DIMENSION AT MAXIMUM MATERIAL CONDITION. DIM MIN MAX MILLIMETERS A 2.35 2.65 A1 0.10 0.25 B 0.35 0.49 C 0.23 0.32 D 10.15 10.45 E 7.40 7.60 e 1.27 BSC H 10.05 10.55 h 0.25 0.75 L 0.50 0.90 q 0 7 /C0095/C0095

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