MC15XS3400

MC15XS3400 FREESCALE | Alldatasheet

Document overview

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Technical content

Features

• Four protected 15m Ω high side switches (at 25°C)
• Operating voltage range of 6. 0V to 20V with standby current < 5.0μA, extended mode from 4.0V to 28V
• 8MHz 16-bit 3.3V and 5V SPI control and status reporting with daisy chain capability
• PWM module using external clock or calibratable internal oscillator with programmable outputs delay management
• Smart over-current shutdown, severe short-circuit, over- temperature protections with time limited autoretry, and Fail-safe mode in case of MCU damage
• Output OFF or ON open-load detection compliant to bulbs or leds and short to battery detection. Analog current feedback with selectable ratio and board temperature feedback.

Figure 1. 15XS3400 Simplified Application Diagram

ORDERING INFORMATION

Range (TA) Package MC15XS3400CPNA - 40°C to 125°C 24 PQFN MCU 15XS3400 VDD VDD VPWR VDD VPWR WAKE FS SCLK CS SO RST SI IN0 IN1 IN2 IN3 CSNS FSI GND VDD VPWR HS0 HS1 HS2 HS3 LOADI/O SCLK CS SI I/O SO I/O I/O I/O I/O A/D GND LOAD LOAD LOAD

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Figure 2. 15XS3400 Simplified Internal Block Diagram

Figure 3. 15XS3400 Pin Connections Table 1. 15XS3400 Pin Definitions A functional description of each pin can be found in the Functional Pin Description section beginning on page 21.

1 CSNS Output Output Current

recopy and temperature feedback is SPI programmable. are used to directly control HS0 : HS3 high side output pins.

7 FS Output Fault Status

resistor to VDD for fault reporting. 8 WAKE Input Wake This input pin controls the device mode.

9 RST Input Reset This input pin is used to initialize the device configuration and fault registers,

as well as place the device in a low-current Sleep mode.

10 CS Input Chip Select

12 SI Input Serial Input This pin is a command data input pin connected to the SPI serial data output

of the MCU or to the SO pin of the previous device of a daisy-chain of devices.

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of the device. These ground pins must be also shorted in the board. the SI pin of the next device of a daisy-chain of devices. Output High Side Outputs Protected 15mΩ high side power output pins to the load. 4, 20 NC N/A No Connect These pins may not be connected. 24 FSI Input Fail-safe Input This input enables the watchdog timeout feature. Table 1. 15XS3400 Pin Definitions (continued) A functional description of each pin can be found in the Functional Pin Description section beginning on page 21.

Analog Integrated Circuit Device Data Freescale Semiconductor 5 15XS3400

ELECTRICAL CHARACTERISTICS

Table 2. Maximum Ratings permanent damage to the device.

1. Continuous high side output current rating so long as maximum junction temperature is not exceeded. Calculation of maximum output

current using package thermal resistance is required.

1. Active clamp energy using si ngle-pulse method (L = 2mH, RL = 0Ω, VPWR = 14V, TJ = 150°C initial).
2. ESD testing is performed in accordance with the Human Body Model (HBM) (C ZAP = 100pF, RZAP = 1500Ω), the Machine Model (MM)

(CZAP = 200pF, RZAP = 0Ω), and the Charge Device Model (CDM), Robotic (CZAP = 4.0pF).

1. Input / Output pins are: IN[0:3], RST, FSI, CSNS, SI, SCLK, CS, SO, FS

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Thermal Resistance(5) Junction to Case Junction to Ambient RθJC RθJA <1.0 °C/ W Peak Pin Reflow Temperature During Solder Mounting(6) TSOLDER 245 °C Notes 5. Device mounted on a 2s2p test board per JEDEC JESD51-2. 15 °C/W of R θJA can be reached in a real application case (4 layers board). 6. Pin soldering temperature limit is for 10 seconds maximum dura tion. Not designed for immersion soldering. Exceeding these limits may cause malfunction or permanent damage to the device. Table 2. Maximum Ratings (continued) permanent damage to the device.

Analog Integrated Circuit Device Data Freescale Semiconductor 7 15XS3400 STATIC ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS Table 3. Static Electrical Characteristics

1. In extended mode, the functionality is guaranteed but not the elec trical parameters. From 4.0V to 6.0V voltage range, the device is only

protected with the thermal shutdown detection.

1. Measured with the outputs open.
2. Typical value guaranteed per design.
3. Output will automatically recover with time limited autoretry to instructed state when VPWR voltage is restored to normal as long as the

supplied by VPWR and assumes that the external VDD supply is within specification.

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STATIC ELECTRICAL CHARACTERISTICS OUTPUTS HS0 TO HS3 Output Drain-to-Source ON Resistance (IHS = 5.0A, TA = 25°C) VPWR = 4.5V VPWR = 6.0V VPWR = 10V VPWR = 13V RDS(ON)_25 mΩ Output Drain-to-Source ON Resistance (IHS = 5.0A, TA = 150°C) VPWR = 4.5V VPWR = 6.0V VPWR = 10V VPWR = 13V RDS(ON)_150 mΩ Output Source-to-Drain ON Resistance (IHS = -5.0A, VPWR = -18V)(11) TA = 25°C TA = 150°C RSD(ON) 22.5 mΩ Maximum Severe Short-Circuit Impedance Detection(12) RSHORT 28 64 100 mΩ Output Over-current Detection Levels (6.0V < VHS[0:3] < 20V) 28W bit = 0 28W bit = 1 OCHI1_0 OCHI2_0 OC1_0 OC2_0 OC3_0 OC4_0 OCLO4_0 OCLO3_0 OCLO2_0 OCLO1_0 OCHI1_1 OCHI2_1 OC1_1 OC2_1 OC3_1 OC4_1 OCLO4_1 OCLO3_1 OCLO2_1 OCLO1_1 44.1 37.8 31.5 25.2 18.9 12.6 10.0 6.4 22.0 18.9 15.7 12.6 4.5 4.5 4.5 3.0 94.0 60.0 52.5 45.0 37.5 30.0 22.5 15.0 12.0 8.0 47.0 30.0 26.2 22.5 18.7 15.0 6.0 6.0 6.0 4.0 110 60.9 52.2 43.5 34.8 26.1 17.4 14.0 9.6 30.5 26.1 21.8 17.4 7.5 7.5 7.5 5.0 A Notes 11. Source-Drain ON Resistance (Reverse Drain-to -Source ON Resistance) with negative polarity VPWR. 12. Short-circuit impedance calcul ated from HS[0:3] to GND pins. Value guaranteed per design. Table 3. Static Electrical Characteristics (continued)

Analog Integrated Circuit Device Data Freescale Semiconductor 9 15XS3400 STATIC ELECTRICAL CHARACTERISTICS Current Sense Ratio (6.0V < HS[0:3] < 20V, CSNS < 5.0V)(13) 28W bit = 0 CSNS_ratio bit = 0 CSNS_ratio bit = 1 28W bit = 1 CSNS_ratio bit = 0 CSNS_ratio bit = 1 CSR0_0 CSR1_0 CSR0_1 CSR1_1 Current Sense Ratio (CSR0) Accuracy (6.0V < VHS[0:3] < 20V) with 28W bit=0 Output Current 12.5A 5.0A 3.0A 1.5A CSR0_0_ACC -12 -13 -16 -20 Current Sense Ratio (CSR0) Accuracy (6.0V < VHS < 20V) with 28W bit=1 Output Current 3.0A 1.5A CSR0_1_ACC -16 -20 CSR0 Current Recopy Accuracy with one calibration point (6.0V < VHS[0:3] < 20V)(14) Output Current 5.0A CSR0_0_ACC(CAL) -5.0 – 5.0 % Notes 13. Current sense ratio = I CSNS / IHS[0:3]. 14. Based on statistical analysis, it is not production tested.

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STATIC ELECTRICAL CHARACTERISTICS OUTPUTS HS0 TO HS3 (continued) CSR0 Current Recopy Temperature Drift (6.0V < VHS[0:3] < 20V) with 28W bit=0(15) Output Current 5.0A Δ(CSR0_0)/Δ(T) 0.04 %/°C Current Sense Ratio (CSR1) Accuracy (6.0V < VHS[0:3] < 20V) with 28W bit=0 Output Current 12.5A 75A CSR1_0_ACC -17 -12 +17 +12 Current Sense Clamp Voltage CSNS Open; IHS[0:3] = 5.0A with CSR0 ratio VCL(CSNS) VDD+0.25 - VDD+1.0 V OFF Open-load Detection Source Current(16) IOLD(OFF) 30 – 100 μA OFF Open-load Fault Detection Voltage Threshold VOLD(THRES) 2.0 3.0 4.0 V ON Open-load Fault Detection Current Threshold IOLD(ON) 100 300 600 mA ON Open-load Fault Detection Current Threshold with LED VHS[0:3] = VPWR - 0.75V IOLD(ON_LED) 2.5 5.0 10 mA Output Short to VPWR Detection Voltage Threshold Output programmed OFF VOSD(THRES) VPWR-1.2 VPWR-0.8 VPWR-0.4 V Output Negative Clamp Voltage 0.5A < IHS[0:3] < 5.0A, Output programmed OFF VCL - 22 – -16 V Output Over-temperature Shutdown (for 4.5V < VPWR < 28V) TSD 155 175 195 °C Notes 15. Based on statistical data: delta(C SR0)/delta(T)={(measured ICSNS at T1 - measured ICSNS at T2) / measured ICSNS at room} / {T1-T2}. No production tested. 16. Output OFF Open-load Detection Current is the current requir ed to flow through the load for the purpose of detecting the existence of an open-load condition when the specific output is commanded OFF. Pull-up current is measured for VHS=VOLD(THRES)

Analog Integrated Circuit Device Data Freescale Semiconductor 11 15XS3400 STATIC ELECTRICAL CHARACTERISTICS CONTROL INTERFACE Input Logic High Voltage(17) VIH 2.0 – VDD+0.3 V Input Logic Low Voltage(17) VIL -0.3 – 0.8 V Input Logic Pull-down Current (SCLK, SI)(20) IDWN 5.0 – 20 μA Input Logic Pull-up Current (CS)(21) IUP 5.0 – 20 μA SO, FS Tri-state Capacitance(18) CSO – – 20 pF Input Logic Pull-down Resistor (RST, WAKE and IN[0:3]) RDWN 125 250 500 kΩ Input Capacitance(18) CIN – 4.0 12 pF Wake Input Clamp Voltage(19) ICL(WAKE) < 2.5mA VCL(WAKE) 18 25 32 V Wake Input Forward Voltage ICL(WAKE) = -2.5mA VF(WAKE) - 2.0 – - 0.3 V SO High State Output Voltage IOH = 1.0mA VSOH VDD-0.4 – – V SO and FS Low-state Output Voltage IOL = -1.0mA VSOL – – 0.4 V SO, CSNS and FS Tri-State Leakage Current CS = VIH and 0V < VSO < VDD, or FS = 5.5V, or CSNS=0.0V ISO(LEAK) - 2.0 0 2.0 μA FSI External Pull-down Resistance(22) Watchdog Disabled Watchdog Enabled RFS – Infinite 1.0 kΩ Notes 17. Upper and lower logic threshold voltage range applies to SI, CS, SCLK, RST, IN[0:3] and WAKE input signals. The WAKE and RST signals may be supplied by a derived voltage referenced to VPWR. 18. Input capacitance of SI, CS, SCLK, RST, IN[0:3] and WAKE. This parameter is guaranteed by process monitoring but is not production tested. 19. The current must be limited by a series resistance when using voltages > 7.0V. 20. Pull-down current is with V SI > 1.0V and VSCLK > 1.0V. 21. Pull-up current is with V CS < 2.0V. CS has an active internal pull-up to VDD. 22. In Fail-Safe HS[0:3] depends respectively on ON [0:3]. FSI has an active internal pull-up to VREG ~ 3.0V.

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DYNAMIC ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTICS Table 4. Dynamic Electrical Characteristics

1. Rise and Fall Slew Rates measured across a 5.0 Ω resistive load at high side output = 30% to 70% (see Figure 4, page 18).
2. Turn-ON delay time measured fr om rising edge of any signal (IN[0 : 3] and CS) that would turn the output ON to VHS[0 : 3] = VPWR / 2 with
3. Turn-OFF delay time measured fr om falling edge of any signal (IN[0 : 3] and CS) that would turn the output OFF to VHS[0 : 3] =VPWR / 2

with RL = 5.0Ω resistive load.

Analog Integrated Circuit Device Data Freescale Semiconductor 13 15XS3400 DYNAMIC ELECTRICAL CHARACTERISTICS POWER OUTPUT TIMING HS0 TO HS3 (CONTINUED) Fault Detection Blanking Time(26) tFAULT – 5.0 20 μs Output Shutdown Delay Time(27) tDETECT – 7.0 30 μs CS to CSNS Valid Time(28) t CNSVAL – 70 100 μs Watchdog Timeout(29) t WDTO 217 310 400 ms ON Open-load Fault Cyclic Detection Time with LED TOLD(LED) 105 150 195 ms Output Over-current Time Step for 28W bit = 0 OC[1:0]=00 (slow by default) OC[1:0]=01 (fast) OC[1:0]=10 (medium) OC[1:0]=11 (very slow) tOC1_00 tOC2_00 tOC3_00 tOC4_00 tOC5_00 tOC6_00 tOC7_00 tOC1_01 tOC2_01 tOC3_01 tOC4_01 tOC5_01 tOC6_01 tOC7_01 tOC1_10 tOC2_10 tOC3_10 tOC4_10 tOC5_10 tOC6_10 tOC7_10 tOC1_11 tOC2_11 tOC3_11 tOC4_11 tOC5_11 tOC6_11 tOC7_11 4.40 1.62 2.10 2.88 4.58 10.16 73.2 1.10 0.40 0.52 0.72 1.14 2.54 18.2 2.20 0.81 1.05 1.44 2.29 5.08 36.6 8.8 3.2 4.2 5.7 9.1 20.3 146.4 6.30 2.32 3.00 4.12 6.56 14.52 104.6 1.57 0.58 0.75 1.03 1.64 3.63 26.1 3.15 1.16 1.50 2.06 3.28 7.26 52.3 12.6 4.6 6.0 8.2 13.1 29.0 209.2 8.02 3.00 3.90 5.36 8.54 18.88 134.0 2.00 0.75 0.98 1.34 2.13 4.72 34.0 4.01 1.50 1.95 2.68 4.27 9.44 68.0 16.4 21.4 7.8 10.7 17.0 37.7 272.0 ms Notes 26. Time necessary to report the fault to FS pin. 27. Time necessary to switch-off the output in case of OT or OC or SC or UV fault detection (from negative edge of FS pin to HS voltage = 50% of VPWR 28. Time necessary for the CSNS to be with ±5% of the targeted value (from HS voltage= 50% of V PWR to ±5% of the targeted CSNS value). 29. For FSI open, the watchdog timeout delay measured from the ri sing edge of RST, to HS[0,2] output state depend on the corresponding input command. Table 4. Dynamic Electrical Characteristics (continued)

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DYNAMIC ELECTRICAL CHARACTERISTICS Output Over-current Time Step for 28W bit = 1 OC[1:0]=00 (slow by default) OC[1:0]=01 (fast) OC[1:0]=10 (medium) OC[1:0]=11 (very slow) tOC1_00 tOC2_00 tOC3_00 tOC4_00 tOC5_00 tOC6_00 tOC7_00 tOC1_01 tOC2_01 tOC3_01 tOC4_01 tOC5_01 tOC6_01 tOC7_01 tOC1_10 tOC2_10 tOC3_10 tOC4_10 tOC5_10 tOC6_10 tOC7_10 tOC1_11 tOC2_11 tOC3_11 tOC4_11 tOC5_11 tOC6_11 tOC7_11 3.4 1.1 1.4 2.0 3.4 8.5 62.4 0.86 0.28 0.36 0.51 0.78 2.14 20.2 1.7 0.5 0.7 1.0 1.7 4.2 31.2 6.8 2.2 2.9 4.0 6.8 17.0 124.8 4.9 1.6 2.1 2.9 4.9 12.2 89.2 1.24 0.40 0.52 0.74 1.12 3.06 22.2 2.5 0.8 1.0 1.5 2.5 6.1 44.6 9.8 3.2 4.2 5.8 9.8 24.4 178.4 6.4 2.1 2.8 3.8 6.4 15.9 116.0 1.61 0.52 0.68 0.96 1.46 3.98 28.9 3.3 1.0 1.3 2.0 3.3 6.0 58.0 12.8 16.7 5.5 7.6 12.8 31.8 232.0 ms

Analog Integrated Circuit Device Data Freescale Semiconductor 15 15XS3400 DYNAMIC ELECTRICAL CHARACTERISTICS Bulb Cooling Time Step for 28W bit = 0 CB[1:0]=00 or 11 (medium) CB[1:0]=01 (fast) CB[1:0]=10 (slow) for 28W bit = 1 CB[1:0]=00 or 11 (medium) CB[1:0]=01 (fast) CB[1:0]=10 (slow) tBC1_00 tBC2_00 tBC3_00 tBC4_00 tBC5_00 tBC6_00 tBC1_01 tBC2_01 tBC3_01 tBC4_01 tBC5_01 tBC6_01 tBC1_10 tBC2_10 tBC3_10 tBC4_10 tBC5_10 tBC6_10 tBC1_00 tBC2_00 tBC3_00 tBC4_00 tBC5_00 tBC6_00 tBC1_01 tBC2_01 tBC3_01 tBC4_01 tBC5_01 tBC6_01 tBC1_10 tBC2_10 tBC3_10 tBC4_10 tBC5_10 tBC6_10 242 126 140 158 181 211 121 105 484 252 280 316 362 422 291 156 178 208 251 314 146 101 126 226 583 312 357 417 501 628 347 181 200 226 259 302 173 100 113 129 151 694 362 400 452 518 604 417 224 255 298 359 449 209 112 127 145 180 324 834 448 510 596 717 898 452 236 260 294 337 393 226 118 130 147 169 197 1904 472 520 588 674 786 542 292 332 388 467 584 272 146 166 189 234 422 1085 582 665 775 933 1170 ms

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DYNAMIC ELECTRICAL CHARACTERISTICS PWM MODULE TIMING Input PWM Clock Range on IN0 fIN0 7.68 – 30.72 kHz Input PWM Clock Low Frequency Detection Range on IN0(30) fIN0(LOW) 1.0 2.0 4.0 kHz Input PWM Clock High Frequency Detection Range on IN0(30) fIN0(HIGH) 100 200 400 kHz Output PWM Frequency Range fPWM - - 1000 Hz Output PWM Frequency Accuracy using Calibrated Oscillator AFPWM(CAL) -10 – +10 % Default Output PWM Frequency using Internal Oscillator fPWM(0) 84 120 156 Hz CS Calibration Low Minimum Time Detection Range t CSB(MIN) 14 20 26 μs CS Calibration Low Maximum Tine Detection Range t CSB(MAX) 140 200 260 μs Output PWM Duty-cycle Range for fPWM = 400Hz(31) RPWM_400 10 98 % Output PWM Duty-cycle Range for fPWM = 200Hz(31) RPWM_200 5.0 98 % Output PWM Duty-cycle Range for fPWM = 1.0kHz(31) RPWM_1k 6.0 - 94 % INPUT TIMING Direct Input Toggle Timeout tIN 175 250 325 ms AUTORETRY TIMING Autoretry Period tAUTO 105 150 195 ms TEMPERATURE ON THE GND FLAG Thermal Prewarning Detection(32) TOTWAR 110 125 140 °C Analog Temperature Feedback at TA = 25°C with RCSNS=2.5kΩ TFEED 1.15 1.20 1.25 V Analog Temperature Feedback Derating with RCSNS=2.5kΩ(33) DTFEED -3.5 -3.7 -3.9 mV/°C Notes 30. Clock Fail detector available fo r PWM_en bit is set to logic [1] and CLOCK_sel is set to logic [0]. 31. The PWM ratio is measured at V HS = 50% of VPWR and for the default SR value. It is possible to put the device fully-on (PWM duty-cycle 100%) and fully-off (duty-cycle 0%). For values outside this range, a calibration is needed between the PWM duty-cycle programming and the PWM on the output with RL = 5.0Ω resistive load. 32. Typical value guaranteed per design. 33. Value guaranteed per statistical analysis.

Analog Integrated Circuit Device Data Freescale Semiconductor 17 15XS3400 DYNAMIC ELECTRICAL CHARACTERISTICS SPI INTERFACE CHARACTERISTICS(34) Maximum Frequency of SPI Operation f SPI – – 8.0 MHz Required Low State Duration for RST(35) t WRST 10 – – μs Rising Edge of CS to Falling Edge of CS (Required Setup Time)(36) t CS – – 1.0 μs Rising Edge of RST to Falling Edge of CS (Required Setup Time)(36) t ENBL – – 5.0 μs Falling Edge of CS to Rising Edge of SCLK (Required Setup Time)(36) t LEAD – – 500 ns Required High State Duration of SCLK (Required Setup Time)(36) t WSCLKh – – 50 ns Required Low State Duration of SCLK (Required Setup Time)(36) t WSCLKl – – 50 ns Falling Edge of SCLK to Rising Edge of CS (Required Setup Time)(36) t LAG – – 60 ns SI to Falling Edge of SCLK (Required Setup Time)(37) t SI (SU) – – 37 ns Falling Edge of SCLK to SI (Required Setup Time)(37) t SI (HOLD) – – 49 ns SO Rise Time CL = 80pF t RSO – – 13 ns SO Fall Time CL = 80pF t FSO – – 13 ns SI, CS, SCLK, Incoming Signal Rise Time(37) t RSI – – 13 ns SI, CS, SCLK, Incoming Signal Fall Time(37) t FSI – – 13 ns Time from Rising Edge of SCLK to SO Low-impedance(38) t SO(EN) – – 60 ns Time from Rising Edge of SCLK to SO High-impedance(39) t SO(DIS) – – 60 ns Notes 34. Parameters guaranteed by design. 35. RST low duration measured with outputs enabled and going to OFF or disabled condition. 36. Maximum setup time required for the 15XS3400 is the minimum guaranteed time needed from the microcontroller. 37. Rise and Fall time of incoming SI, CS, and SCLK signals suggested for design consideration to prevent the occurrence of double pulsing. 38. Time required for output status data to be available for use at SO. 1.0k Ω on pull-up on CS. 39. Time required for output status data to be terminated at SO. 1.0k Ω on pull-up on CS.

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Figure 4. Output Slew Rate and Time Delays Figure 5. Overcurrent Shutdown Protection

Analog Integrated Circuit Device Data Freescale Semiconductor 19 15XS3400 Figure 6. Bulb Cooling Management Figure 7. Input Timing Switching Characteristics

0.7 VDD

0.2 VDD

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Figure 8. SCLK Waveform and Valid SO Data Delay Time

Analog Integrated Circuit Device Data Freescale Semiconductor 21 15XS3400 FUNCTIONAL DESCRIPTION INTRODUCTION FUNCTIONAL DESCRIPTION INTRODUCTION The 15XS3400 is one in a family of devices designed for low-voltage automotive lighting applications. Its four low RDS(ON) MOSFETs (quad 15mΩ) can control four separate 55W / 28W bulbs and/or Xenon modules. Programming, control and diagnostics are accomplished using a 16-bit SPI interface. Its output with selectable slew- rate improves electromagnetic compatibility (EMC) behavior. Additionally, each output has its own parallel input or SPI control for pulse-width modulation (PWM) control if desired. The 15XS3400 allows the user to program via the SPI the fault current trip levels and duration of acceptable lamp inrush. The device has Fail-safe mode to provide fail-safe functionality of the outputs in case of MCU damaged. FUNCTIONAL PIN DESCRIPTION OUTPUT CURRENT MONITORING (CSNS) The Current Sense pin provides a current proportional to the designated HS0 : HS3 output or a voltage proportional to the temperature on the GND flag. That current is fed into a ground-referenced resistor (4.7kΩ typical) and its voltage is monitored by an MCU's A/D. The output type is selected via the SPI. This pin can be tri-stated through the SPI. DIRECT INPUTS (IN0, IN1, IN2, IN3) Each IN input wakes the device. The IN0 : IN3 high side input pins are also used to directly control HS0 : HS3 high side output pins. If the outputs are controlled by the PWM module, the external PWM clock is applied to IN0 pin. These pins are to be driven with CMOS levels, and they have a passive internal pull-down, R DWN. FAULT STATUS (FS) This pin is an open drain configured output requiring an external pull-up resistor to VDD for fault reporting. If a device fault condition is detected, this pin is active LOW. Specific device diagnostics and faults are reported via the SPI SO pin. WAKE The wake input wakes the device. An internal clamp protects this pin from high damaging voltages with a series resistor (10kΩ typ). This input has a passive internal pull- down, RDWN. RESET (RST) The reset input wakes the device. This is used to initialize the device configuration and fault registers, as well as place the device in a low-current Sleep mode. The pin also starts the watchdog timer when transitioning from logic [0] to logic [1]. This pin has a passive internal pull-down, RDWN. CHIP SELECT (CS) The CS pin enables communication with the master microcontroller (MCU). When this pin is in a logic [0] state, the device is capable of transferring information to, and receiving information from, the MCU. The 15XS3400 latches in data from the input shift registers to the addressed registers on the rising edge of CS. The device transfers status information from the power output to the Shift register on the falling edge of CS. The SO output driver is enabled when CS is logic [0]. CS should transition from a logic [1] to a logic [0] state only when SCLK is a logic [0]. CS has an active internal pull-up from VDD, IUP. SERIAL CLOCK (SCLK) The SCLK pin clocks the internal shift registers of the 15XS3400 device. The serial input (SI) pin accepts data into the input shift register on the falling edge of the SCLK signal while the serial output (SO) pin shifts data information out of the SO line driver on the rising edge of the SCLK signal. It is important the SCLK pin be in a logic low state whenever CS makes any transition. For this reason, it is recommended the SCLK pin be in a logic [0] whenever the device is not accessed (CS logic [1] state). SCLK has an active internal pull-down. When CS is logic [1], signals at the SCLK and SI pins are ignored and SO is tri-stated (high-impedance) (see Figure 9, page 24). SCLK input has an active internal pull- down, IDWN. SERIAL INPUT (SI) This is a serial interface (SI) command data input pin. Each SI bit is read on the falling edge of SCLK. A 16-bit stream of serial data is required on the SI pin, starting with D15 (MSB) to D0 (LSB). The internal registers of the 15XS3400 are configured and controlled using a 5-bit addressing scheme described in Table 9, page 33. Register addressing and configuration are described in Table 10, page 33. SI input has an active internal pull-down, IDWN. DIGITAL DRAIN VOLTAGE (VDD) This pin is an external voltage input pin used to supply power to the SPI circuit. In the event VDD is lost (VDD Failure), the device goes to Fail-safe mode.

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FUNCTIONAL PIN DESCRIPTION GROUND (GND) These pins are the ground for the device. POSITIVE POWER SUPPLY (VPWR) This pin connects to the positive power supply and is the source of operational power for the device. The VPWR contact is the backside surface mount tab of the package. SERIAL OUTPUT (SO) The SO data pin is a tri-stateable output from the shift register. The SO pin remains in a high-impedance state until the CS pin is put into a logic [0] state. The SO data is capable of reporting the status of the output, the device configuration, the state of the key inputs, etc. The SO pin changes state on the rising edge of SCLK and reads out on the falling edge of SCLK. SO reporting descriptions are provided in Table 22, page 37. HIGH SIDE OUTPUTS (HS3, HS1, HS0, HS2) Protected 15mΩ high side power outputs to the load. FAIL-SAFE INPUT (FSI) This pin incorporates an active internal pull-up current source from internal supply (VREG). This enables the watchdog timeout feature. When the FSI pin is opened, the watchdog circuit is enabled. After a watchdog timeout occurs, the output states depends on IN[0:3]. When the FSI pin is connected to GND, the watchdog circuit is disabled. The output states depends on IN[0:3] in case of V DD failure condition, in case VDD failure detection is activated (VDD_FAIL_en bit sets to logic [1]).

Analog Integrated Circuit Device Data Freescale Semiconductor 23 15XS3400 FUNCTIONAL DESCRIPTION FUNCTIONAL INTERNAL BLOCK DESCRIPTION FUNCTIONAL INTERNAL BLOCK DESCRIPTION POWER SUPPLY The 15XS3400 is designed to operate from 4.0V to 28V on the VPWR pin. Characteristics are provided from 6.0V to 20V for the device. The VPWR pin supplies power to internal regulator, analog, and logic circuit blocks. The VDD supply is used for Serial Peripheral Interface (SPI) communication in order to configure and diagnose the device. This IC architecture provides a low quiescent current Sleep mode. Applying V PWR and VDD to the device will place the device in the Normal mode. The device will transit to Fail-safe mode in case of failures on the SPI or/and on VDD voltage. HIGH SIDE SWITCHES: HS0 – HS3 These pins are the high side outputs controlling automotive lamps located for the front of vehicle, such as 65W/55W bulbs and Xenon-HID modules. Those N-channel MOSFETs with 15mΩ RDS(ON) are self-protected and present extended diagnostics in order to detect bulb outage and short-circuit fault condition. The HS output is actively clamped during turn off of inductive loads and inductive battery line. When driving DC motors or solenoid loads, demanding multiple switching, an external recirculation device must be used to maintain the device in its safe operating area. MCU INTERFACE AND OUTPUT CONTROL In Normal mode, each bulb is controlled directly from the MCU through SPI. A pulse width modulation control module allows improvement of lamp lifetime with bulb power regulation (PWM frequency range from 100Hz to 400Hz) and addressing the dimming application (day running light). An analog feedback output provides a current proportional to the load current or the temperature of the board. The SPI is used to configure and to read the diagnostic status (faults) of high side outputs. The reported fault conditions are: open load, short circuit to battery, short circuit to ground (over-current and severe short-circuit), thermal shutdown, and under/over- voltage. Thanks to accurate and configurable over-current detection circuitry and wire-harness optimization, the vehicle is lighter. In Fail-safe mode, each lamp is controlled with dedicated parallel input pins. The device is configured in default mode. 15XS3400 - Functional Block Diagram Power Supply MCU Interface & Output Control Power Supply Internal Regulator MCU Interface & Output Control Self-Protected High Side Switches HS0 - HS3SPI Interface PWM Controller Parallel Control Inputs Switches

24 Freescale Semiconductor

compatible with 5.0V or 3.3V CMOS logic levels. Figure 9. Single 16-Bit Word SPI Communication

1. RSTB is in a logic H state during the above operation.
2. DO, D1, D2, ... , and D15 relate to the most recent ordered entry of program data into the LUX IC
3. RST is a logic [1] state during the above operation.
4. D15:D0 relate to the most recent ordered entry of data into the device.
5. OD15:OD0 relate to the first 16 bits of ordered fault and status data out of the device.

26 Freescale Semiconductor

• V PWR and VDD are within the normal voltage range,
• wake-up = 1,
• fail = 0,
• f a u l t = 0 . In this mode, the NM bit is set to lfault_contrologic [1] and the outputs HS[0:3] are under control, as defined by hson signal: hson[x] = ( ( (IN[x] and DIR_dis[x]) or On bit[x] ) and PWM_en ) or (On bit [x] and Duty_cycle[x] and PWM_en). In this mode and also in Fail-safe, the fault condition reset depends on fault_control signal, as defined below: fault_control[x] = ( (IN_ON[x] and DIR_dis[x]) and PWM_en ) or (On bit [x]). Programmable PWM module The outputs HS[0:3] are controlled by the programmable PWM module if PWM_en and On bits are set to logic [1]. The clock frequency from IN0 input pin or from internal clock is the factor 27 (128) of the output PWM frequency (CLOCK_sel bit). The outputs HS[0:3] can be controlled in the range of 5% to 98% with a resolution of 7 bits of duty cycle (Table 6). The state of other IN pin is ignored. The timing includes seven programmable PWM switching delay (number of PWM clock rising edges) to improve overall EMC behavior of the light module (Table 7). The clock frequency from IN0 is permanently monitored in order to report a clock failure in case of the frequency is out a specified frequency range (from fIN0(LOW) to fIN0(HIGH)). In case of clock failure, no PWM feature is provided, the On bit defines the outputs state and the CLOCK_fail bit reports [1]. Calibratable internal clock The internal clock can vary as much as +/-30 percent corresponding to typical fPWM(0) output switching period. Using the existing SPI inputs and the precision timing reference already available to the MCU, the 15XS3400 allows clock period setting within ±10 percent of accuracy. Calibrating the internal clock is initiated by defined word to CALR register. The calibration pulse is provided by the MCU. The pulse is sent on the CS pin after the SPI word is launched. At the moment, the CS pin transitions from logic [1] to [0] until from logic [0] to [1] determine the period of internal clock with a multiplicative factor of 128. In case of negative CS pulse is outside a predefined time range (from t CSB(MIN) to t CSB(MAX)), the calibration event will be ignored and the internal clock will be unaltered or reset to default value (fPWM(0)) if this was not calibrated before. The calibratable clock is used, instead of the clock from IN0 input, when CLOCK_sel is set to [1].

Table 6. Output PWM Resolution

0 X OFF

Table 7. Output PWM Switching Delay

• V PWR is within the normal voltage range,
• wake-up = 1,
• fail = 1,
• f a u l t = 0 . Watchdog If the FSI input is not grounded, the watchdog timeout detection is active when either the WAKE or IN_ON[0:3] or RST input pin transitions from logic [0] to logic [1]. The WAKE input is capable of being pulled up to VPWR with a series of limiting resistance limiting the internal clamp current according to the specification. The watchdog timeout is a multiple of an internal oscillator. As long as the WD bit (D15) of an incoming SPI message is toggled within the minimum watchdog timeout period (WDTO), the device will operate normally. Fail-safe Conditions If an internal watchdog timeout occurs before the WD bit for FSI open (Table 8) or in case of VDD failure condition (VDD< VDD(FAIL))) for VDD_FAIL_en bit is set to logic [1], the device will revert to a Fail-safe mode until the WD bit is written to logic [1] (see fail-safe to normal mode transition paragraph) and VDD is within the normal voltage range. During the Fail-safe mode, the outputs will depend on the corresponding input. The SPI register content is reset to their default value (except POR bit) and fault protections are fully operational. The Fail-safe mode can be detected by monitoring the NM bit is set to [0]. NORMAL & FAIL-SAFE MODE TRANSITIONS Transition Fail-Safe to Normal mode To leave the Fail-safe mode, VDD must be in nominal voltage and the microcontroller has to send a SPI command with WDIN bit set to logic [1] ; the other bits are not considered. The previous latched faults are reset by the transition into Normal mode (autoretry included). Moreover, the device can be brought out of the Fail-safe mode due to watchdog timeout issue by forcing the FSI pin to logic [0]. Transition Normal to Fail-safe Mode To leave the Normal mode, a fail-safe condition must occurred (fail=1). The previous latched faults are reset by the transition into Fail-safe mode (autoretry included).

Table 8. SPI Watchdog Activation

Analog Integrated Circuit Device Data

28 Freescale Semiconductor

FUNCTIONAL DEVICE OPERATION OPERATIONAL MODES FAULT MODE The 15XS3400 is in Fault mode when:

• V PWR and VDD are within the normal voltage range,
• wake-up = 1,
• fail = X,
• f a u l t = 1 . This device indicates the faults below as they occur by driving the FS pin to logic [0] for RST input is pulled up:
• Over-temperature fault,
• Over-current fault,
• Severe short-circuit fault,
• Output(s) shorted to VPWR fault in OFF state,
• Open load fault in OFF state,
• Over-voltage fault (enabled by default),
• Under-voltage fault. The FS pin will automatically return to logic [1] when the fault condition is removed, except for over-current, severe short-circuit, over-temperature and under-voltage which will be reset by a new turn-on command (each fault_control signal to be toggled). Fault information is retained in the SPI fault register and is available (and reset) via the SO pin during the first valid SPI communication. The Open load fault in ON state is only reported through SPI register without effect on the corresponding output state (HS[x]) and the FS pin. START-UP SEQUENCE The 15XS3400 enters in Normal mode after start-up if following sequence is provided:
• VPWR and VDD power supplies must be above their under-voltage thresholds,
• generate wake-up event (wake-up=1) from 0 to 1 on RSTB. The device switches to Normal mode with SPI register content is reset (as defined in Table 10 and Table 22). All features of 15XS3400 will be available after 50μs typical and all SPI registers are set to default values (set to logic [0]). The UV fault is reported in the SPI status registers. And, in case of the PWM module is used (PWM_en bit is set to logic [1]) with an external reference clock:
• apply PWM clock on IN0 input pin after maximum 200μs (min. 50μs). If the correct start-up sequence is not provided, the PWM function is not guaranteed.

Analog Integrated Circuit Device Data

30 Freescale Semiconductor

FUNCTIONAL DEVICE OPERATION PROTECTION AND DIAGNOSTIC FEATURES The SPI fault report (SC[0:3] bits) is removed after a read operation. Over-voltage Fault (Enabled by default) By default, the over-voltage protection is enabled. The 15XS3400 shuts down all outputs and FS will go to logic [0] during an over-voltage fault condition on the VPWR pin (VPWR > VPWR(OV)). The outputs remain in the OFF state until the over-voltage condition is removed (VPWR < VPWR(OV) - VPWR(OVHYS)). When experiencing this fault, the OVF fault bit is set to logic [1] and cleared after either a valid SPI read. The over-voltage protection can be disabled through SPI (OV_dis bit is disabled set to logic [1]). The fault register reflects any over-voltage condition (VPWR > VPWR(OV)). This over-voltage diagnosis, as a warning, is removed after a read operation, if the fault condition disappears. The HS[0:3] outputs are not commanded in RDS(ON) above the OV threshold. In Fail-safe mode, the over-voltage activation depends on the RST logic state; enable for RST = 1 and disable for RST = 0. The device is still protected with over-temperature protection in case the over-voltage feture is disabled. Under-voltage Fault The output(s) will latch off at some battery voltage below VPWR(UV). As long as the VDD level stays within the normal specified range, the internal logic states within the device will remain (configuration and reporting). In the case where battery voltage drops below the under- voltage threshold (VPWR < VPWR(UV)), the outputs will turn off, FS will go to logic [0], and the fault register UV bit will be set to [1]. Two cases need to be considered when the battery level recovers (VPWR > VPWR(UV)_UP):

• If outputs command are low, FS will go to logic [1] but the UV bit will remain set to 1 until the next read operation (warning report).
• If the output command is ON, FS will remain at logic [0]. To delatch the fault and be able to turn ON again the outputs, the failure condition must disappear and the autoretry circuitry must be active or the corresponding output must be commanded OFF and then ON (toggling fault_control signal of corresponding output) or V SUPPLY(POR) condition if VDD = 0. In extended mode, the output is protected by over- temperature shutdown circuitry. All previous latched faults, occurred when VPWR was within the normal voltage range, are guaranteed if VDD is within the operational voltage range or until VSUPPLY(POR) if VDD = 0. Any new OT fault is detected (VDD failure included) and reported through SPI above VPWR (UV). The output state is not changed as long as the VPWR voltage does not drop any lower than 3.5V typical. All latched faults (over-temperature, over-current, severe short-circuit, over and under-voltage) are reset if :
• V DD < VDD(FAIL) with VPWR in nominal voltage range,
• V DD and VPWR supplies is below VSUPPLY(POR) voltage value.

Figure 12. Auto-retry State Machine retry[x] = OC[x] or OT[x] or UV. The Figure 12 describes the auto-retry state machine. disabled through SPI (OS_DIS[0:3] bit). detection circuitries on output to detect OFF and ON state. output. The OL_OFF[0:3] fault bit is set in the status register. the status register will be cleared after reading the register. through SPI (OLOFF_DIS[0:3] bit).

Analog Integrated Circuit Device Data

32 Freescale Semiconductor

FUNCTIONAL DEVICE OPERATION PROTECTION AND DIAGNOSTIC FEATURES Open-load Detection In On State The ON output open-load current thresholds can be chosen by SPI to detect a standard bulbs or LEDs (OLLED[0:3] bit set to logic [1]). In cases where the load current drops below the defined current threshold, the OLON bit will be set to a logic [1], the output will stay ON and FS will not be disturbed. Open-load Detection In On State For Led Open load for LEDs only (OLLED[0:3] set to logic [1]) is detected periodically each t OLLED (fully-on, D[6:0]=7F). To detect OLLED in fully-on state, the output must be ON at least t OLLED. To delatch the diagnosis, the condition should be removed and SPI read operation is needed (OL_ON[0:3] bit). The ON output open-load protection can be disabled through SPI (OLON_DIS[0:3] bit). Analog Current Recopy and Temperature Feedbacks The CSNS pin is an analog output reporting a current proportional to the designed output current or a voltage proportional to the temperature of the GND flag (pin #14). The routing is SPI programmable (TEMP_en, CSNS_en, CSNS_s[1,0] and CSNS_ratio_s bits). In case the current recopy is active, the CSNS output delivers current only during ON time of the output switch without overshoot. The maximum current is 2mA typical. The typical value of external CSNS resistor connected to the ground is 4.7k The current recopy is not active in Fail-safe mode. Temperature Prewarning Detection In Normal mode, the 15XS3400 provides a temperature prewarning reported via SPI in case of the temperature of the GND flag is higher than TOTWAR . This diagnosis (OTW bit set to [1]) is latched in the SPI DIAGR0 register. To delatch, a read SPI command is needed. ACTIVE CLAMP ON VPWR The device provides an active gate clamp circuit in order to limit the maximum transient VPWR voltage at VPWR(CLAMP). In case of overload on an output the corresponding output is turned off which leads to high- voltage at VPWR with an inductive VPWR line. When VPWR voltage exceeds VPWR (CLAMP) threshold, the turn-off on the corresponding output is deactivated and all HS[0:3] outputs are switched ON automatically to demagnetize the inductive Battery line. REVERSE BATTERY ON VPWR The output survives the application of reverse voltage as low as -18V. Under these conditions, the ON resistance of the output is 2 times higher than typical ohmic value in forward mode. No additional passive components are required except on VDD current path. GROUND DISCONNECT PROTECTION In the event the 15XS3400 ground is disconnected from load ground, the device protects itself and safely turns OFF the output regardless of the state of the output at the time of disconnection (maximum VPWR=16V). A 10kΩ resistor needs to be added between the MCU and each digital input pin in order to ensure that the device turns off in case of ground disconnect and to prevent this pin from exceeding maximum ratings. LOSS OF SUPPLY LINES Loss of VDD If the external VDD supply is disconnected (or not within specification: VDD<VDD(FAIL)) with VDD_FAIL_en bit is set to logic [1]), all SPI register content is reset. The outputs can still be driven by the direct inputs IN[0 : 3] if VPWR is within specified voltage range. The 15XS3400 uses the battery input to power the output MOSFET-related current sense circuitry and any other internal logic providing Fail-safe device operation with no VDD supplied. In this state, the over-temperature, over-current, severe short-circuit, short to VPWR and OFF open-load circuitry are fully operational with default values corresponding to all SPI bits are set to logic [0]. No current is conducted from VPWR to V DD. Loss of VPWR If the external VPWR supply is disconnected (or not within specification), the SPI configuration, reporting and daisy chain features are provided for RST is set to logic [1] under VDD in nominal conditions. This fault condition can be diagnosed with a UV fault in the SPI STATR_s registers. The SPI pull-up and pull-down current sources are not operational. The previous device configuration is maintained. No current is conducted from VDD to VPWR. Loss of VPWR and VDD If the external VPWR and VDD supplies are disconnected (or not within specification: (VDD and VPWR) < V SUPPLY(POR)), all SPI register contents are reset with default values corresponding to all SPI bits are set to logic [0] and all latched faults are also reset. EMC PERFORMANCES All following tests are performed on Freescale evaluation board in accordance with the typical application schematic. The device is protected in case of positive and negative transients on the VPWR line (per ISO 7637-2). The 15XS3400 successfully meets the Class 5 of the CISPR25 emission standard and 200V/m or BCI 200mA injection level for immunity tests.

with the MSB D15 and ending with the LSB, D0 (Table 9). the outputs and their protection features. latch in a message that is not 16 bits will be ignored. configure the device and to control the state of the outputs. Table 10 summarizes the SI registers. Table 9. SI Message Bit Assignment MSB D15 Watchdog in: toggled to satisfy watchdog requirements. D14 : D13 Register address bits used in some cases for output selection (Table 12). D12 : D10 Register address bits. D9 Not used (set to logic [0]). LSB D8:D0 Used to configure the inputs, outputs, and the device protection features and SO status content. Table 10. Serial Input Address and Configuration Bit Map

4 D13 D1

0 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0

s = Output selection with the bits A1A0 as defined in Table 11.

34 Freescale Semiconductor

addresses (D[14:10]) and their impact on device operation. of the D14 : D13 bits (Table 11). state of the D14 : D13 bits (Table 11). output is only controlled by On bit). PWM_en bit is set to logic [1]). corresponding output fault management through the SPI. based on the state of the D14 : D13 bits (Table 11). default value [0] corresponds to enable this feature. [0] corresponds to enable this feature (Table 13). default value [0] corresponds to enable this feature. detection is set for bulbs (Table 13). value [0] is the low ratio (Table 14). Table 11. Output Selection Table 12. Slew Rate Speed Selection Table 13. ON Open-load Selection

1 X disable

current profile, as described Figure 13. Figure 13. Over-current profile depending on Xenon bit shown Table 15 and Table 16. replaced by OCHI2 during tOC1, as shown Figure 14. Figure 14. Over-current profile with OCHI bit set to ‘1’ current levels in steady state, as defined in Table 17 . mode, as described Table 18. Table 14. Current Sense Ratio Selection

0 CRS0 (default)

1 CRS1

Table 15. Cooling and Inrush Curve Selection Table 16. Inrush Curve Selection Table 17. Output Steady State Selection Table 18. Over-current Mode Selection

36 Freescale Semiconductor

to Fail-safe mode for VDD < VDD(FAIL). feedback on CSNS output pin, as shown in Table 20. clock, as explained in Figure 12. well as message verification. accept new fault status information. STATR write until changed with an updated STATR write.

• The previous SPI communication was determined to be invalid. In this case, the status will be reported as though the invalid SPI communication never occurred.
• The VPWR voltage is below 4.0V, the status must be ignored by the MCU. SERIAL OUTPUT BIT ASSIGNMENT The 16 bits of serial output data depend on the previous serial input message, as explained in the following paragraphs. Table 22, summarizes SO returned data for bits OD15 : OD0.
• Bit OD15 is the MSB; it reflects the state of the Watchdog bit from the previously clocked-in message. 1 inrush current and bulb cooling management

Table 19. PWM Module Selection

0 X PWM module disabled

Table 20. CSNS Reporting Selection Table 21. Output Current Recopy Selection

• Bits OD14:OD10 reflect the state of the bits SOA4 : SOA0 from the previously clocked in message.
• Bit OD9 is set to logi c [1] in Normal mode (NM).
• The contents of bits OD8 : OD0 depend on bits D4 : D0 from the most recent STATR command SOA4 : SOA0 as explained in the paragraphs following Table 22. PREVIOUS ADDRESS SOA4 : SOA0 = A1A0000 (STATR_S) The returned data OD8 reports logic [1] in case of previous Power ON Reset condition (VSUPPLY(POR)). This bit is only reset by a read operation. Bits OD7: OD0 reflect the current state of the Fault register (FLTR) corresponding to the output previously selected with the bits SOA4:SOA3 = A1A0 (Table 22).
• OC_s: over-current fault detection for a selected output,
• SC_s: severe short-circuit f ault detection for a selected output,
• OS_s: output shorted to VPWR fault detection for a selected output,
• OLOFF_s: openload in OFF state fault detection for a selected output,
• OLON_s: openload in ON state fault detection (depending on current level threshold: bulb or LED) for a selected output,
• OV: over-voltage fault detection,
• UV: under-voltage fault detection
• POR: power on reset detection. The FS pin reports all faults. For latched faults, this pin is reset by a new Switch OFF command (toggling fault_control signal). PREVIOUS ADDRESS SOA4 : SOA0 = A1A0001 (PWMR_S) The returned data contains the programmed values in the PWMR register for the output selected with A1A0. PREVIOUS ADDRESS SOA4 : SOA0 = A1A0010 (CONFR0_S) The returned data contains the programmed values in the CONFR0 register for the output selected with A1A0. PREVIOUS ADDRESS SOA4 : SOA0 = A1A0011 (CONFR1_S) The returned data contains the programmed values in the CONFR1 register for the output selected with A1A0.

Table 22. Serial Output Bit Map Description

10 OD9 OD8 OD7 OD6 OD5 OD4 OD3 OD2 OD1 OD0

38 Freescale Semiconductor

OCR register for the output selected with A1A0. clock on IN0 pin is out of specified frequency range. of the direct input IN[3:0]. explained in the following Table 23. to 010 for Protected Quad 15mΩ High Side Switches.

• HS output is commanded by corresponding IN input or On bit through SPI. The medium slew-rate is used,
• HS output is fully protected by the Xenon over-current profile by default, the severe short-circuit protection, the under-voltage and the over-temperature protection. The auto-retry feature is enabled,
• Open-load in ON and OFF state and HS shorted to VPWR detections are available,
• No current recopy and no analog temperature feedback active,
• Over-voltage protection is enabled,
• SO reporting fault status from HS0,
• VDD failure detection is disabled.

Table 23. Watchdog activation report

Analog Integrated Circuit Device Data Freescale Semiconductor 39 15XS3400 TYPICAL APPLICATIONS TYPICAL APPLICATIONS The following figure shows a typical automotive lighting application (only one vehicle corner) using an external PWM clock from the main MCU. A redundancy circuitry has been implemented to substitute light control (from MCU to watchdog) in case of a Fail-safe condition. It is recommended to locate a 22nF decoupling capacitor to the module connector. 15XS3400 VDD VDD VPWR GND MCU Voltage regulator VPWR 22nF HS2 HS0 HS1 HS3 VPWRVDD WAKE FS IN0 IN2 IN3 SCLK CS SI SO FSI RST IN1 100nF I/O I/O SCLK CS SI SO 10k 10k 10k 10k 10k 10k LOAD 0 LOAD 1 CSNSA/D VDD VDD VPWRVDD 22nF 22nF LOAD 2 22nF LOAD 3 22nF 22nF 10k Watchdog direct light commands (pedal, comodo, ...) VPWR ignition switch 1nF 10µF100nF10µF100nF 4.7k 10k10k 10k 10k

Analog Integrated Circuit Device Data

40 Freescale Semiconductor

The 15XS3400 is packaged in a surface mount power package intended to be soldered directly on the printed circuit board. The 15XS3400 was qualified in accordance with JEDEC standards J-STD-020C Sn-Pb reflow profile. The maximum peak temperature during the soldering process should not exceed 245 for 10 seconds maximum duration. The AN2469 provides guidelines for Printed Circuit Board design and assembly. PACKAGE DIMENSIONS For the most current package revision, visit www.freescale.com and perform a keyword search using the 98ARL10596D listed below. PNA SUFFIX 24-PIN PQFN NONLEADED PACKAGE 98ARL10596D ISSUE D

Analog Integrated Circuit Device Data Freescale Semiconductor 41 15XS3400 PACKAGING PACKAGE DIMENSIONS PNA SUFFIX 24-PIN PQFN NONLEADED PACKAGE 98ARL10596D ISSUE D

42 Freescale Semiconductor

Figure 15. Package Mechanical Outline

Analog Integrated Circuit Device Data Freescale Semiconductor 43 15XS3400 PACKAGING PACKAGE DIMENSIONS PNA SUFFIX 24-PIN PQFN NONLEADED PACKAGE 98ARL10596D ISSUE D

44 Freescale Semiconductor

temperatures, TJ1 and TJ2, and a thermal resistance matrix with RθJAmn. reference temperature while only heat source 1 is heating with P1. to RθJ21 and RθJ22, respectively. Figure 16. Detail of Copper Traces Under Device with Table 24. Thermal Performance Comparison

1. Per JEDEC JESD51-2 at natural convection, still air
2. 2s2p thermal test board per JEDEC JESD51-7and
3. Per JEDEC JESD51-8, with the board temperature on the

center trace near the power outputs.

1. Single layer thermal test board per JEDEC JESD51-3 and
2. Thermal resistance between the die junction and the

exposed pad, “infinite” heat sink attached to exposed pad.

46 Freescale Semiconductor

where the junction temperature is sensed. Figure 20. Steady State Thermal Resistance in Dependance on Heat Streading Area; Table 25. Thermal Resistance Performance

Analog Integrated Circuit Device Data

48 Freescale Semiconductor

REVISION HISTORY

REVISION DATE DESCRIPTION OF CHANGES 5.0 9/2008 • Initial release 6.0 10/2008 • Changed Maximum rating for Output Source-to-Drain ON Resistance in Static Electrical Characteristics Table on page 8.

• Added explanation for recovering to Sleep Mode on page 26.
• Updated Outline Drawing to new Revision. 7.0 12/2008 • Changed Orderale Part Number from PC15XS3400CPNA to MC15XS3400CPNA on page 1.
• Removed Pb-Free throughout document. This device is not Pb-free.
• Changed V suppply(POR), Max limit from 0.8 to 0.9 and VDD(FAIL), from Min = 0.5, Typ = -, Max =

Rev. 7.0 Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”, must be validated for each customer application by customer’s technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc., 2008. All rights reserved. How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516

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