MC1558 TI1 | Alldatasheet
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www.ti.com SLOS847 –APRIL 2013 DUALGENERAL-PURPOSEOPERATIONALAMPLIFIER Check forSamples: MC1558-DIE 1FEATURES
- Short-CircuitProtection • No Frequency Compensation Required
- Wide Common-Mode and DifferentialVoltage • Low Power Consumption Ranges • No Latch-Up
DESCRIPTION
The MC1558-DIE isa dualgeneral-purposeoperationalamplifier,witheach halfelectricallysimilartotheμA741, exceptthatoffsetnullcapabilityisnotprovided. The high-common-mode inputvoltagerange and theabsence oflatch-upmake thisamplifieridealforvoltage- followerapplications.The MC1558-DIE is short-circuitprotectedand the internalfrequencycompensation ensuresstabilitywithoutexternalcomponents. ORDERING INFORMATION (1) PACKAGEPRODUCT PACKAGE ORDERABLE PART NUMBER PACKAGE QUANTITYDESIGNATOR MC1558TDC1 400 MC1558 TD Bare dieinwafflepack(2) MC1558TDC2 10 (1) Forthemost currentpackage and orderinginformation,see thePackage OptionAddendum attheend ofthisdocument,orsee theTI web siteatwww.ti.com. (2) ProcessingispertheTexas Instrumentscommercialproductionbaselineand isincompliancewiththeTexas InstrumentsQuality ControlSystem ineffectatthetimeofmanufacture.ElectricalscreeningconsistsofDC parametricand functionaltestingatroom temperatureonly.Unlessotherwisespecifiedby Texas InstrumentsAC performanceand performanceovertemperatureisnot warranted.VisualInspectionisperformedinaccordancewithMIL-STD-883 TestMethod 2010 ConditionB at75X minimum. Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 2013,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.
SLOS847 –APRIL 2013 www.ti.com This integratedcircuitcan be damaged by ESD. Texas Instrumentsrecommends thatallintegratedcircuitsbe handled with appropriateprecautions.Failuretoobserveproperhandlingand installationprocedurescan cause damage. ESD damage can rangefromsubtleperformancedegradationtocompletedevicefailure.Precisionintegratedcircuitsmay be more susceptibletodamage because verysmallparametricchanges couldcause thedevicenottomeet itspublishedspecifications. BARE DIE INFORMATION BACKSIDE BOND PAD BOND PADDIE THICKNESS BACKSIDE FINISH POTENTIAL METALLIZATION COMPOSITION THICKNESS 10.5mils. Siliconwithbackgrind Floating AlCuTiW 1627 nm Table1.Bond Pad CoordinatesinMicrons DESCRIPTION PAD NUMBER X MIN Y MIN X MAX Y MAX 1OUT 1 215.9 810.26 304.8 906.78 1IN- 2 121.92 271.78 218.44 365.76 1IN+ 3 121.92 120.65 218.44 217.17 VCC- 4 683.26 124.46 779.78 220.98 2IN+ 5 1244.6 120.65 1341.12 217.17 2IN- 6 1244.6 271.78 1341.12 365.76 2OUT 7 1158.24 810.26 1247.14 906.78 VCC+ 8 683.26 792.48 779.78 894.08
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www.ti.com 10-Oct-2013 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples MC1558TDC1 ACTIVE 0 374 TBD Call TI N / A for Pkg Type 0 to 0 MC1558TDC2 ACTIVE 0 10 TBD Call TI N / A for Pkg Type 0 to 0 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
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