MC10H302 MOTOROLA | Alldatasheet
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Advance Information Lsurex cenAuie PACKAGE vr Cast aso DUAL 6-4 INPUT PARITY CHECKER wo PE ‘The MC10H302 produces a fast, 6-bit and a 4-bit parity checker. P sUFRIx This device is primarily used in parity checking, parity generation MLASTICPACKAGE 4g and error detection and correction circuits. For example, in main- ’ frame and add-on memory systems, an 88-bit Error Detection and Correetion Unit (EDCU) oan be designed by using 6-MC10905's FN SUFFIX (16-bit EDCU) and 6-MC10H302’s with four 4-bit parity checkers a cate Ses 2 left over. The H302's are used in generating the syndrome and 1 check bits (See MC10905 data sheet). © Propagation Delay, 1.5 ns Typical © Improved Noise Margin 150 mV (Over Operating Voltage and Temperature Range) LOGIC DIAGRAM © Voltage Compensated 1 © MECL 10K-Compatible 3 D> 2 MAXIMUM RATINGS , cy Power Supply Vee = 0) “ado Input Voltage (Voc = 0) . = Surge * Vec1 = Pint | Operating TemperatwreRange | Ta | Ow r75 |e | Vocz » fin 36 Storage Temperature Range — Plastic Tstqg | -55to +159] °C ee Ceramic Seto +165 Run TABLE ELECTRICAL CHARACTERISTICS (Vee = —5.2 V = 5%) (See Note) Se ona [oc [sac [+70 | Som of High Pine [ in [ tax [Min [Max [Min | Max | Level nga 2.14.16 [Power Suppiy Curent] ig | -e7 | — | -o5 | — | -e7 | — [mace] | [fen [tow a a a Input Current High Ade waza = [input Gurrenttow | tim [os | — [os | — | 03 | — [nase] PIN ASSIGNMENT [woh output votes | Vow [~102| 08a] -ose]-oar] -a0z| ors] va | [ tow Output Vottage | Vou | = 196] ~ 163] -1.95| - 163] 195] — +60] vac | Vee: 16 Fvece foc co [ High Input Vorage | Vin | =1.17| 094] -1.13| ont | 1.07] -0.736) vac | d> 18 A cout Aout ou [Low Input votioge | vu] =1.95] - 1.48] ~ 196] “148 196] - 145 | vac | AC PARAMETERS Ain CY 3 14P) Bout Propagation Delay tba An 4 3Ocn Pins 79.10.10.12.18 os | 20 | 06 06 Pins 34.56 os | 23 | 08 08 Ans 12: cin [fiseaFattimes [yey] os | te [os | 17 [os [18 | os | ane 1 cin Sore Each MECL TOKH series circuit has boen designed to meet the de specications shown in the test table Bin] 7 10D cin she vor on ten ease The twins tt ned ped Creut board and ranevere a flow grate’ han 30pm tmatnaned. Guu oe terminate ough 250 ohm resttorto 20 vote. Vee] 8 Den Tis document contin information on a product Under development. Motorola reserves height 1 in atignmnt sor Duan Peckage change or discontinue this product without notice. For PLCC pin assignment, see tables on page 1-31. 2-82
b. are : MOTOROLA SC LoGIC LHE O | 6367252 0062450 7 | T-90-20 A letter suffix to the MECL logic function part number is used to specify the package style (see drawings below). See appropriate selector guide for specific packaging available for a given device type. L SUFFIX (LW SUFFIX L SUFFIX CERAMIC PACKAGE FOR CERAMIC PACKAGE CASE 620-09 CASE 623-05 Monae DAAAAAAL it I . PITTI | | 1 pe lalaladalad aiid — : atk r —l a , 5 t e=teal tLe YH dai | etie teeta tee sons: Persecter tira me [eT oe Tso Tote Tea | 1 aes wis ot em nant acs oF TUE Pa tiee Cise bon Tone | EADS WEN FORE Fececcettie tsar] ‘romaine ras srascnar Fetter eet] woe Fetiet retire] — Sat como Fate steer eae) MM Feta Taaat™ | 2 houie tc nstounuso yor Peper tet ge| esate Paras Trae faa Pasar] cenasac on ax cor. [et sages 1 cumasc | Poston ar SeATHG KANE Eeterter tartan] 2 ous rors crs enema Feta irra] touted Feria ere * a Pcterieteetee] | uma aTeA ” fea} PLASTIC PACKAGE ee L SUFFIX CASE 626-04 / 7 CERAMIC PACKAGE eB CASE 632-08 preorerererert—t bn} 1E vA = roe le : | i iv + (e[esnem STs] xO) [e]e2snew © T1739) Fetietisteutei| ,Wesnesaltae[sa] HEPES CHT eae Ti | + Siscne norounen rer as fp {ome Tost Tears Team | 2 OMENSONL TO CENTER OF LEADS WHEN FST ase son Tass 0200] 2 courpotinc oMMensiON: VCH. Fee Ti tase Toe |, fore maski, nowoce Foto {ow Tons Leow] x oyaenson 1 cemencr Lo unen Hieron ita tas] _saucccones, Ee ae ar et euene a Ss ae . 1-26 :
MOTOROLA :SC LOGIC LYE OD ff e3e7a52 g04e651 9 | PACKAGE OUTLINE DIMENSIONS (continued) T-90-20 P SUFFIX P SUFFIX PLASTIC PACKAGE PLASTIC PACKAGE CASE 646-06 CASE 648-08 LAMBA AH iT hAAAAAAA A AAA fougeyet!t | 1 Ct i — aa haanal mane ¢ fCoTh { { tt rh " [ i ah f) " f \\ @ om we—ee-—o ee Siam SEES (oa Fee oc noms: [ou pan | WaT WT WI ores Hebert eta! Biman Seer terate tan] T'Shnsoeng a roumacnorn Litas tesctaue fear], waeeatcooa, Feta Pea tis ac] commaungeueson so Petes tas toate) temeorerocworasme | PPT PETES) Savalsor rocaortoor we Fe et ear], oni raac [ota 1 enmasc] —, FORMOPARMLEL, Fact ia | ag ams | ae) 2 QUENSION'E" ORES NOT NCU MOD [eT “taresc 1 omaase | « ONENSON" ODES NOT cue HOLD EERE ES TH LY eo conenorow, Eran eee e| «Mkiocaet rom. Hope [eee | Peet ietome- Pa] P SUFFIX (PW SUFFIX ‘F SUFFIX PLASTIC PACKAGE FOR MC10H181 CERAMIC PACKAGE CASE 649-03 ONLY) CASE 650-05 co ° H — = wz { ; | = = i t. we ct . reo Soto Gain TKS 19) ‘em FS | sero Bie iv a é SSS ee TER = " ’ me a a Heart tase aa Fear area] rons, [ou Hier wa mia] "YS mo raranar Fee te Tet" Esamanenewmosorme | Meret iettetee| ‘eames [G_|— 2stase fain asc ‘POSITION AT SEATING PLANE AT BAXCMUE [-s-[-x 1 6a | 92s [oreo ) 2 CONTROLLING DEMENSION: INCH. [Ho] ies | ane Fines | ons MATERAL CONDTION (eis 216 Femme [oars] 3. MENSON “A” AND "8" ALLOW FOR LID ff oe eee ‘2 DMERSON TO CENTER GF LEADS WHEN [0 }-a3e Tous F ore Tone AESALIGHMENT, AID GLASS MENISCUS. PEE Tee Tai foumornenut Fat ise {Sear | « gueson wou te mimo Ane (LPs [ise Foss | osto [Te Toor [ones | oo] POINT OF ENT OF TSE LEAD FROM THE BODY. Bee re ee FEC Mtsir tea tan] «Wanna wernt gy 20810 ot ramvamcreraey Fares tials fea) aot eee, Sheth ah tas Fo. Ei et tae) etn Somnronnroavce one 1-27
Looe : MOTORCLA SC LOGIC 14E O | 6367252 G04628Se O I PACKAGE OUTLINE DIMENSIONS (continued) T-90-20 L SUFFIX P SUFFIX (CERAMIC PACKAGE PLASTIC PACKAGE CASE 693-02 CASE 707-02 rt a eeooeetl_t duuoTUUe + | " i f L 4 | — " Ht | roms I . 4 ae Enda OF sama Phy i ie Ue [one Hie eae Tr] [ge Hi bp {¢ Pex [sos Foi [emo ) pores: [e386 Tesi Jia Tats) | 1 POSmONAL TOLERANCE OF LEADS (0, ALL BE [o-Taa—tost [ogi Laem.) ans umeyrs mn 000g RAD OF TRUE [ofa [ose ace Tere] wines casei cot AT MAKIMUM MATERAL [ey 1 16s Foes Tooss |} POSITION AT SEATING PLANE AT MAXGMUM eT ia Tn Pac Toc) CONDATION. [¥ RELATION TO SEATING PLANE. Hite tea ser] amosoreroamonucsme | Heat aauta! Mont ec ynen beta -ear Peet | FCCHEE SOT is sis] 3 SuossonsooesvorneweewnDrase P SUFFIX L SUFFIX PLASTIC PACKAGE CERAMIC PACKAGE CASE 724-03 CASE 726-04 AAAAAAAAA e, [ft io wen Seams ——— {er Grint LL 1 co TAT eo on i = Hf or a yy dL a me A rl sun = Dun ag vif Gite tae Oe oe Ta CE Petras tether tae Hite tiectee tase] sons: Lites aetoiTHs sons. Fett Sartre tar] “es mutrosnowo wines isan Fetiet tates Pa] Saueaes cana crmu. Pepe beet tia] Waa atsoomcroe a aca Fepaatenteastam} tewwwamncwomerme | [otarteatrtear] _ teemcnon fey tise 1 ooo | PARALLEL [Cefn Tvs Focis Tacr] 2. 054 °1" TOCENTER OF LEADS WEN FORMED. [-E | too | 15 Go | 006 | 2. oaenSous ano TOLERANCES Pen ANSI. (oT zstasc | atopasc | PARALLEL. Leta tear sar] «otitis owasov sat Pitertertetimr] tPotncorswentwes ar [x2 Tass Fone Tos | - PoP ar Peies Tan} ‘LEADS APE OPTIONAL AT LEAD POSITIONS 1,8 bee ete] a oo 1-28
MOTOROLA SC LOGIC 14E O | 6367252 0082853 ¢ | T-90-20 PACKAGE OUTLINE DIMENSIONS (continued) : L SUFFIX ‘P SUFFIX : CERAMIC PACKAGE PLASTIC PACKAGE . CASE 732-03 . CASE 738-03 yAn—--——"Ad = anaaanesaal } A Sooweerer 4 - * TA ae jt 1
4 Traore 4
Le iol Le 1 « hae rey Vt a Fl dan a i Dan (aes [7125] keh, amt feb © swe Gimmape) “see he. Hee eH oes Hea ELEY “acomcsomumcomns Ts-tem {aw (oms toe | + eaosmeyarsen one on. me Foca tas Pome tear| ask [r} 14 tas | 00s | 008s | CORO A SEARENG PGR, A WoL [le to tanec" ogi sc} 2. CONTROLLING GIMENSON: INCH. [o-{~ 2maee | onmasc | MATERAL CONDON. [ce [oaa? Liar forma $ oem] 2. O:MERSION™L" TO CENTER OF LEAD WHEN Catas | iar [oem | onto | ‘2 GUL BO.CONTER OF READE WEN POR (a |" pesese [ob isc} FORMED PARALLEL [s1-om 19m | oma | oo | PAARL Fa [oaar [ema otee | coms] - 4 OMENSION “3” DOES NOT CLUDE MOLD [k-}-318 140s Tous Tere | ‘SAAR RUCEE ECR, (x [am Tass Tone Pow) PUSH, Lee P| Bs Cut ors Far [00 1 908 J Cates 101 Too | e087} D SUFFIX L SUFFIX PLASTIC SOIC PACKAGE ‘CERAMIC PACKAGE CASE 751-03 CASE 758-01 2 acm, a 7 t jit tga a ke eee ner «ht Dalle te Cy eal LES i aces ee a et ef = merits i | a a Earsiatcy ee ee HE Te] "i ncosasoreweommsno | Set let ikem rea, “musa sous Cette beatae) 'Srsaowmumsnrace epagcee ae tena! 2 postose rtenaceronutos orvees [0 Foss Toe [oom Toor} 2 owensioseya AND TOLERANCNG PER ANSE 7 of tao oats cant (olor oo SIr1A 5) [-E }-om 1 125 | cots {208 | YM, 1982. 14187 | 068-0062, 4 CT] 5 SEATING PLANE. Heir tier! Uanittnocs war. cts caine |Last en owas en [2] aie fos 1 Star Fone | DaueNSI0N “A” AND“S™ 00 NOT INCLUDE 920, 08 00m 008 “FORMED PARALLEL Hieteetesteectaa| “taomonisne Pasar Tear Ri 5 cumsorse aio reuscNs HANS tetetetemta| “Se fmomsonsrsnoains | Fy os ar same eae | A 1-29
MOTOROLA SC LOGIC ue o pusezes2 ooszas4 4 i T-90-20 nores: TY ORTUMS 4, ANO TERED ven » Fname TROPOLTUG) WHERE TO OF x0 SwOULOeS ExT PAST ) r= 00Y AT MUD PANG UNE be v Gaiam s TeoreTeus) 2. DM G TRUE POSTON To MEASURED AT OAT SEATING PUKE [= 2. DM R AND U 00 NOT INCLUDE MOLD FROTRUSON ALLORABLE MOLD PROIRUSON sSozs mara ease, i tor 4. Dahon 9 TO.EMAONG ERAN ‘YS 2. c ke $5. CONTROLUNG DaZENSON: Wok. 4 ‘ rE Hac ° i (Yanai TROFTTLOUD) warren [NGS TEAST NSTSTETG) weweo Low Fi | a (Giana © LLOaaTASTO) ufthenmis gvopers) [ean eae oe — fl Petes Toe Tons ea | Ct ae ae aa a a Eefiomerae IL. Gemmoppoxopera Crt e Tao Pose Tae] cerns {diane [rxoraltowel Fra Tae Tone [ose | FN SUFFIX zee re te Forts am | oo Las | PLASTIC PACKAGE Fac} ie f= fone} =| CASE 775-02 Car et ee} rons "DUE TO SPACE UMATATION, CASE 77-08 SHALL BE REPRESENTED BY A aise naive RATHER THAN SHOWING. qe aE onavang pan aatlon be | ETT 2 Daub hk. # xem EO { b nore Roratusonatscise rq bot ow \\* i 2 Sue Peer Be | Bonseanasee. rome nae tL 4 '$. DUENSONING AND TOUERANCNG PR ANS ¥ i Le rust, at TS Ta ewy {6 CONTROLUNG EMERSON: NOH AGRGRTTTRETNT wen ESSE i-— Tees Ted oot A A a seerieite: sri oda lel > enn -— Se bet ioe ae ws Sime ree eeg ahaha oma S ommes (acres = Pome RSS ERTS eenrtarsecsers Whxeeas TiebuteDeD a eeetberaer ent PLASTIC PACKAGE Pettitt CASE 776-02 Ge eS 1-30
. t Loic nye o feaez2s2 coaesss & Bf nes T-90-20 MECL Logic Surface Mount WHY SURFACE MOUNT? ‘Surface Mount Technology is now being utilized to _the latest EIA RS-481A specification. The antistatic offer answers to many problems that have been created embossed tape provides @ secure cavity sealed with a in the use of insertion technology. peel-back cover tape. Limitations have been reached with insertion packages ‘and PC board technology. Surface Mount Technology GENERAL INFORMATION offers the opportunity to continue to advance the State- @ Reel Size 13 inch (330 mm) Suffix: R2 ofthe-Art designs that cannot be accomplished with @ Tape Width 16 mm Insertion Technology. © Units/Reel 1000 Surface Mount Packages allow more optimum device performance with the smaller Surface Mount configu- MECHANICAL POLARIZATION ration, Internal lead lengths, parasitic capacitance and inductance that placed limitations on chip performance Typical have been reduced. The lower profile of Surface Mount Packages allows 5-~6-6-$-$-$ 9-4-4 more boards to be utilized in a given amount of space. . . They are stacked closer together and utilize less total PH eeH HeP) View from ‘volume than insertion populated PC boards. PIN’ tape si Printed circuit costs are lowered with the reduction of the number of board layers required. The elimination or reduction of the number of plated through holes in the Cineay aveation travel board, contribute significantly to lower PC board prices. inear direction of travel ‘Surface Mount assembly does not require the propa- ration of components that are common on insertiontech- ORDERING INFORMATION nology lines, Surface Mount components are sent ini Size:Dovice Type = - directly to the assembly line, eliminating an intermediate 2 Mini Rota Counts avatebin step. - a ‘@ To order devices which are to be delivered in Tape Automatic placement equipment is available that can and Reel, add the appropriate suffix to the device place Surface Mount components at the rate of 2 few number being ordered. thousand per hour to hundreds of thousands of com- ponents per hour. EXAMPLE: Surface Mount Technology is cost effective, allowing the manufacturer the opportunity to produce smaller ORDERING CODE SHIPMENT METHOD units and offer increased functions with the same size MC10100FN Magazines (Rails) product. MC10100FNR2 13 inch Tape and Reel MC10H100FN Magazines (Rails) MECL AVAILABILITY IN SURFACE MOUNT eH CON? i hale on Reel lagazit ils Motorola is now offering MECL 10K and MECL 10KH Mc12016DR2 43 moh Tape and Reel In the PLCC (Plastic Leaded Chip Carrier) packages. MECL in PLCC may be ordered in conventional plastic rails or on Tape and Reel. Refer to the Tape and Reel aN section for ordering details. eee CONVERSION DATA TAPE AND REEL The following tables give the equivalent LO pinouts of
5 Dual-In-Line (DIL) packages and Plastic Leaded Chip Car-
Motorola has now added the convenience of Tape and rier (PLCC) packages. Reel packaging for our growing family of standard Inte- Grated Circuit products. The packaging fully conforms to Conversion Tables 1-31