MBT3906DW1T1 ONSEMI | Alldatasheet

Document overview

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Technical content

Features

  • hFE , 100−300
  • Low V CE(sat), ≤ 0.4 V
  • Simplifies Circuit Design
  • Reduces Board Space
  • Reduces Component Count
  • Available in 8 mm, 7−inch/3,000 Unit Tape and Reel
  • Pb−Free Package is Available MAXIMUM RATINGS Rating Symbol Value Unit Collector−Emitter Voltage VCEO −40 Vdc Collector−Base Voltage VCBO −40 Vdc Emitter−Base Voltage VEBO −5.0 Vdc Collector Current − Continuous IC −200 mAdc Electrostatic Discharge ESD HBM>16000, MM>2000 V Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. THERMAL CHARACTERISTICS Characteristic Symbol Max Unit Total Package Dissipation (Note 1) TA = 25°C PD 150 mW Thermal Resistance, Junction−to−Ambient R JA 833 °C/W Junction and Storage Temperature Range TJ, Tstg −55 to +150 °C 1. Device mounted on FR4 glass epoxy printed circuit board using the minimum recommended footprint. Device Package Shipping †

ORDERING INFORMATION

MBT3906DW1T1 SOT−363 SOT−363/SC−88 CASE 419B STYLE 1

3000 Units/Reel

(1)(2)(3) (4) (5) (6) Q 2 MBT3906DW1T1G SOT−363 (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. MARKING DIAGRAM A2 = Device Code d = Date Code A2d http://onsemi.com

http://onsemi.com ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Characteristic Symbol Min Max Unit OFF CHARACTERISTICS Collector−Emitter Breakdown Voltage (Note 2) V(BR)CEO −40 − Vdc Collector−Base Breakdown Voltage V(BR)CBO −40 − Vdc Emitter−Base Breakdown Voltage V(BR)EBO −5.0 − Vdc Base Cutoff Current IBL − −50 nAdc Collector Cutoff Current ICEX − −50 nAdc ON CHARACTERISTICS (Note 2) DC Current Gain (IC = −0.1 mAdc, VCE = −1.0 Vdc) (IC = −1.0 mAdc, VCE = −1.0 Vdc) (IC = −10 mAdc, VCE = −1.0 Vdc) (IC = −50 mAdc, VCE = −1.0 Vdc) (IC = −100 mAdc, VCE = −1.0 Vdc) hFE 100 300 Collector−Emitter Saturation Voltage (IC = −10 mAdc, IB = −1.0 mAdc) (IC = −50 mAdc, IB = −5.0 mAdc) VCE(sat) −0.25 −0.4 Vdc Base−Emitter Saturation Voltage (IC = −10 mAdc, IB = −1.0 mAdc) (IC = −50 mAdc, IB = −5.0 mAdc) VBE(sat) −0.65 −0.85 −0.95 Vdc SMALL−SIGNAL CHARACTERISTICS Current−Gain − Bandwidth Product fT 250 − MHz Output Capacitance C obo − 4.5 pF Input Capacitance C ibo − 10.0 pF 2. Pulse Test: Pulse Width ≤ 300 s; Duty Cycle ≤ 2.0%. ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) (Continued) Characteristic Symbol Min Max Unit Input Impedance (VCE = −10 Vdc, IC = −1.0 mAdc, f = 1.0 kHz) hie 2.0 12 k Voltage Feedback Ratio (VCE = −10 Vdc, IC = −1.0 mAdc, f = 1.0 kHz) hre 0.1 10 X 10−4 Small−Signal Current Gain (VCE = −10 Vdc, IC = −1.0 mAdc, f = 1.0 kHz) hfe 100 400 − Output Admittance (VCE = −10 Vdc, IC = −1.0 mAdc, f = 1.0 kHz) hoe 3.0 60 mhos Noise Figure (VCE = −5.0 Vdc, IC = −100 Adc, RS = 1.0 k , f = 1.0 kHz) NF − 4.0 dB SWITCHING CHARACTERISTICS Delay Time (VCC = −3.0 Vdc, VBE = 0.5 Vdc) td − 35 ns Rise Time (IC = −10 mAdc, IB1 = −1.0 mAdc) tr − 35 ns Storage Time (VCC = −3.0 Vdc, IC = −10 mAdc) ts − 225 ns Fall Time (IB1 = IB2 = −1.0 mAdc) tf − 75 ns

Figure 1. Delay and Rise Time Figure 2. Storage and Fall Time

10.6 V 300 ns

Figure 3. Capacitance Figure 4. Charge Data Figure 5. Turn−On Time Figure 6. Fall Time

http://onsemi.com PACKAGE DIMENSIONS SOT−363/SC−88 CASE 419B−02 ISSUE U NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419B−01 OBSOLETE, NEW STANDARD 419B−02. DIM A MIN MAX MIN MAX MILLIMETERS 1.80 2.200.071 0.087 INCHES B 1.15 1.350.045 0.053 C 0.80 1.100.031 0.043 D 0.10 0.300.004 0.012 G 0.65 BSC0.026 BSC J 0.10 0.250.004 0.010 K 0.10 0.300.004 0.012 N 0.20 REF0.008 REF 123 A G S H C N J K 654 −B− D 6 PL STYLE 1: PIN 1. EMITTER 2 2. BASE 2 3. COLLECTOR 1 4. EMITTER 1 5. BASE 1 6. COLLECTOR 2 mm inchesSCALE 20:1 0.65 0.025 0.65 0.025 0.50 0.0197 0.40 0.0157 1.9 0.0748 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone : 81−3−5773−3850 MBT3906DW1T1/D LITERATURE FULFILLMENT : Literature Distribution Center for ON Semiconductor P.O. Box 61312, Phoenix, Arizona 85082−1312 USA Phone : 480−829−7710 or 800−344−3860 Toll Free USA/Canada Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative.