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Technical content

Features

  • hFE, 100−300
  • Low VCE(sat), ≤ 0.4 V
  • Simplifies Circuit Design
  • Reduces Board Space
  • Reduces Component Count
  • Available in 8 mm, 7−inch/3,000 Unit Tape and Reel
  • S and NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable
  • These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant MAXIMUM RATINGS Rating Symbol Value Unit Collector−Emitter Voltage VCEO 40 Vdc Collector−Base Voltage VCBO 60 Vdc Emitter−Base Voltage VEBO 6.0 Vdc Collector Current − Continuous IC 200 mAdc Electrostatic Discharge ESD HBM Class 2 MM Class B Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. THERMAL CHARACTERISTICS Characteristic Symbol Max Unit Total Package Dissipation (Note 1) TA = 25°C PD 150 mW Thermal Resistance, Junction−to−Ambient R/C0113JA 833 °C/W Junction and Storage Temperature Range TJ, Tstg −55 to +150 °C 1. Device mounted on FR4 glass epoxy printed circuit board using the minimum recommended footprint. Device Package Shipping†

ORDERING INFORMATION

SOT−363/SC−88/ SC70−6 CASE 419B (1)(2)(3) (4) (5) (6) MBT3904DW1T1 STYLE 1 www.onsemi.com

6 XX M/C0071

/C0071 MARKING DIAGRAM XX = MA for MBT3904DW1T1G MJ for MBT3904DW2T1G M = Date Code /C0071= Pb−Free Package (Note: Microdot may be in either location) (1)(2)(3) (4) (5) MBT3904DW2T1 STYLE 27 (6) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification s Brochure, BRD8011/D. MBT3904DW1T1G, MBT3904DW2T1G SOT−363 (Pb−Free) 3000 / Tape & Reel SMBT3904DW1T1G SOT−363 (Pb−Free) 3000 / Tape & Reel NSVMBT3904DW1T3G SOT−363 (Pb−Free) 10000 / Tape & Reel

MBT3904DW1, MBT3904DW2, SMBT3904DW1, NSVMBT3904DW1 www.onsemi.com ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Characteristic Symbol Min Max Unit OFF CHARACTERISTICS Collector−Emitter Breakdown Voltage (Note 2) (IC = 1.0 mAdc, IB = 0) V(BR)CEO 40 − Vdc Collector−Base Breakdown Voltage (IC = 10 /C0109Adc, IE = 0) V(BR)CBO 60 − Vdc Emitter−Base Breakdown Voltage (IE = 10 /C0109Adc, IC = 0) V(BR)EBO 6.0 − Vdc Base Cutoff Current (VCE = 30 Vdc, VEB = 3.0 Vdc) IBL − 50 nAdc Collector Cutoff Current (VCE = 30 Vdc, VEB = 3.0 Vdc) ICEX − 50 nAdc ON CHARACTERISTICS (Note 2) DC Current Gain (IC = 0.1 mAdc, VCE = 1.0 Vdc) (IC = 1.0 mAdc, VCE = 1.0 Vdc) (IC = 10 mAdc, VCE = 1.0 Vdc) (IC = 50 mAdc, VCE = 1.0 Vdc) (IC = 100 mAdc, VCE = 1.0 Vdc) hFE 100 300 Collector−Emitter Saturation Voltage (IC = 10 mAdc, IB = 1.0 mAdc) (IC = 50 mAdc, IB = 5.0 mAdc) VCE(sat) 0.2 0.3 Vdc Base−Emitter Saturation Voltage (IC = 10 mAdc, IB = 1.0 mAdc) (IC = 50 mAdc, IB = 5.0 mAdc) VBE(sat) 0.65 0.85 0.95 Vdc SMALL−SIGNAL CHARACTERISTICS Current−Gain − Bandwidth Product (IC = 10 mAdc, VCE = 20 Vdc, f = 100 MHz) fT 300 − MHz Output Capacitance (VCB = 5.0 Vdc, IE = 0, f = 1.0 MHz) Cobo − 4.0 pF Input Capacitance (VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz) Cibo − 8.0 pF Input Impedance (VCE = 10 Vdc, IC = 1.0 mAdc, f = 1.0 kHz) hie 1.0 2.0 k /C0087 Voltage Feedback Ratio (VCE = 10 Vdc, IC = 1.0 mAdc, f = 1.0 kHz) hre 0.5 0.1 8.0 X 10−4 Small−Signal Current Gain (VCE = 10 Vdc, IC = 1.0 mAdc, f = 1.0 kHz) hfe 100 100 400 400 Output Admittance (VCE = 10 Vdc, IC = 1.0 mAdc, f = 1.0 kHz) hoe 1.0 3.0 /C0109mhos Noise Figure (VCE = 5.0 Vdc, IC = 100 /C0109Adc, RS = 1.0 k /C0087, f = 1.0 kHz) NF − 5.0 dB 2. Pulse Test: Pulse Width ≤ 300 /C0109s; Duty Cycle ≤ 2.0%.

1.0 Sec

Figure 19. Current Gain Bandwidth Product Figure 20. Safe Operating Area

MBT3904DW1, MBT3904DW2, SMBT3904DW1, NSVMBT3904DW1 www.onsemi.com PACKAGE DIMENSIONS SC−88/SC70−6/SOT−363 CASE 419B−02 ISSUE Y STYLE 1: PIN 1. EMITTER 2 2. BASE 2 3. COLLECTOR 1 4. EMITTER 1 5. BASE 1 6. COLLECTOR 2 STYLE 27: PIN 1. BASE 2 2. BASE 1 3. COLLECTOR 1 4. EMITTER 1 5. EMITTER 2 6. COLLECTOR 2 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRU- SIONS, OR GATE BURRS SHALL NOT EXCEED 0.20 PER END. 4. DIMENSIONS D AND E1 AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY AND DATUM H. 5. DATUMS A AND B ARE DETERMINED AT DATUM H. 6. DIMENSIONS b AND c APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN 0.08 AND 0.15 FROM THE TIP . 7. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 TOTAL IN EXCESS OF DIMENSION b AT MAXIMUM MATERIAL CONDI- TION. THE DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OF THE FOOT. Cddd M 12 3 A c 65 4 E b6X DIM MIN NOM MAX MILLIMETERS A1 0.00 −−− 0.10 ddd b 0.15 0.20 0.25 C 0.08 0.15 0.22 D 1.80 2.00 2.20 0.000 −−− 0.004 0.006 0.008 0.010 0.003 0.006 0.009 0.070 0.078 0.086 MIN NOM MAX INCHES 0.10 0.004 E1 1.15 1.25 1.35 e 0.65 BSC L 0.26 0.36 0.46 2.00 2.10 2.20 0.045 0.049 0.053

0.026 BSC

0.010 0.014 0.018 0.078 0.082 0.086 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* 0.65 0.66 DIMENSIONS: MILLIMETERS 0.30 PITCH 2.50 RECOMMENDED TOP VIEW SIDE VIEW END VIEW bbb H B SEATING PLANE DETAIL A E L2 0.15 BSC 0.006 BSC aaa 0.15 0.006 bbb 0.30 0.012 ccc 0.10 0.004 A-B D aaa C 2X 3 TIPSD D e A aaa H D D L PLANE DETAIL A H GAGE C ccc C ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 MBT3904DW1T1/D LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative