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Features

  • Moisture Sensitivity Level: 1
  • NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC −Q101 Qualified and PPAP Capable
  • These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant MAXIMUM RATINGS Rating Symbol Value Unit Collector−Emitter Voltage VCEO 40 Vdc Collector−Base Voltage VCBO 75 Vdc Emitter−Base Voltage VEBO 6.0 Vdc Collector Current − Continuous IC 600 mAdc Electrostatic Discharge ESD HBM Class 2 MM Class B THERMAL CHARACTERISTICS Characteristic Symbol Max Unit Total Package Dissipation (Note 1), TA = 25°C PD 150 mW Thermal Resistance, Junction−to−Ambient R/C0113JA 833 °C/W Junction and Storage Temperature TJ, Tstg −55 to +150 °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Device mounted on FR4 glass epoxy printed circuit board using the minimum recommended footprint. Device Package Shipping †

ORDERING INFORMATION

(1)(2)(3) (4) (5) (6) SC−88/SC70−6/SOT−363 CASE 419B STYLE 1 †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 1P M /C0071 /C0071 MBT2222ADW1T1G SOT −363 (Pb−Free) 3000 / Tape & Reel 1P = Specific Device Code M = Date Code /C0071 = Pb−Free Package (Note: Microdot may be in either location) NSVBT2222ADW1T1G SOT −363 (Pb−Free) 3000 / Tape & Reel

MBT2222ADW1, NSVBT2222ADW1 http://onsemi.com ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Characteristic Symbol Min Max Unit OFF CHARACTERISTICS Collector−Emitter Breakdown Voltage (I C = 10 mAdc, IB = 0) V(BR)CEO 40 − Vdc Collector−Base Breakdown Voltage (I C = 10 /C0109Adc, IE = 0) V(BR)CBO 75 − Vdc Emitter−Base Breakdown Voltage, (I E = 10 /C0109Adc, IC = 0) V(BR)EBO 6.0 − Vdc Collector Cutoff Current (V CE = 60 Vdc, VEB(off) = 3.0 Vdc) ICEX − 10 nAdc Collector Cutoff Current (VCB = 60 Vdc, IE = 0) (VCB = 60 Vdc, IE = 0, TA = 125°C) ICBO 0.01 /C0109Adc Emitter Cutoff Current (V EB = 3.0 Vdc, IC = 0) IEBO − 100 nAdc Base Cutoff Current (V CE = 60 Vdc, VEB(off) = 3.0 Vdc) IBL − 20 nAdc ON CHARACTERISTICS DC Current Gain (IC = 0.1 mAdc, VCE = 10 Vdc) (IC = 1.0 mAdc, VCE = 10 Vdc) (IC = 10 mAdc, VCE = 10 Vdc) (IC = 10 mAdc, VCE = 10 Vdc, TA = −55°C) (IC = 150 mAdc, VCE = 10 Vdc) (Note 2) (IC = 150 mAdc, VCE = 1.0 Vdc) (Note 2) (IC = 500 mAdc, VCE = 10 Vdc) (Note 2) hFE 100 300 Collector−Emitter Saturation Voltage (Note 2) (IC = 150 mAdc, IB = 15 mAdc) (IC = 500 mAdc, IB = 50 mAdc) VCE(sat) 0.3 1.0 Vdc Base−Emitter Saturation Voltage (Note 2) (IC = 150 mAdc, IB = 15 mAdc) (IC = 500 mAdc, IB = 50 mAdc) VBE(sat) 0.6 1.2 2.0 Vdc SMALL−SIGNAL CHARACTERISTICS Current−Gain − Bandwidth Product (Note 3) (IC = 20 mAdc, VCE = 20 Vdc, f = 100 MHz) fT 300 − MHz Output Capacitance (V CB = 10 Vdc, IE = 0, f = 1.0 MHz) Cobo − 8.0 pF Input Capacitance (V EB = 0.5 Vdc, IC = 0, f = 1.0 MHz) Cibo − 25 pF Input Impedance (IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz) (IC = 10 mAdc, VCE = 10 Vdc, f = 1.0 kHz) hie 2.0 0.25 8.0 1.25 k/C0087 Voltage Feedback Ratio (IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz) (IC = 10 mAdc, VCE = 10 Vdc, f = 1.0 kHz) hre 8.0 4.0 X 10−4 Small−Signal Current Gain (IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz) (IC = 10 mAdc, VCE = 10 Vdc, f = 1.0 kHz) hfe 300 375 Output Admittance (IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz) (IC = 10 mAdc, VCE = 10 Vdc, f = 1.0 kHz) hoe 5.0 200 /C0109mhos Collector Base Time Constant (I E = 20 mAdc, VCB = 20 Vdc, f = 31.8 MHz) rb, Cc − 150 ps Noise Figure (I C = 100 /C0109Adc, VCE = 10 Vdc, RS = 1.0 k/C0087, f = 1.0 kHz) NF − 4.0 dB SWITCHING CHARACTERISTICS Delay Time (VCC = 30 Vdc, VBE(off) = −0.5 Vdc, IC = 150 mAdc, IB1 = 15 mAdc) td − 10 ns Rise Time tr − 25 Storage Time (VCC = 30 Vdc, IC = 150 mAdc, IB1 = IB2 = 15 mAdc) ts − 225 ns Fall Time tf − 60 2. Pulse Test: Pulse Width ≤ 300 /C0109s, Duty Cycle ≤ 2.0%. 3. f T is defined as the frequency at which |hfe| extrapolates to unity.

Figure 11. “On” Voltages

0.2 V, VOLTAGE (VOLTS)

Figure 12. Temperature Coefficients

MBT2222ADW1, NSVBT2222ADW1 http://onsemi.com PACKAGE DIMENSIONS SC−88/SC70−6/SOT−363 CASE 419B−02 ISSUE Y STYLE 1: PIN 1. EMITTER 2 2. BASE 2 3. COLLECTOR 1 4. EMITTER 1 5. BASE 1 6. COLLECTOR 2 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRU- SIONS, OR GATE BURRS SHALL NOT EXCEED 0.20 PER END. 4. DIMENSIONS D AND E1 AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY AND DATUM H. 5. DATUMS A AND B ARE DETERMINED AT DATUM H. 6. DIMENSIONS b AND c APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN 0.08 AND 0.15 FROM THE TIP. 7. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 TOTAL IN EXCESS OF DIMENSION b AT MAXIMUM MATERIAL CONDI- TION. THE DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OF THE FOOT. Cddd M 12 3 A c 65 4 E b6X DIM MIN NOM MAX MILLIMETERS A1 0.00 −−− 0.10 ddd b 0.15 0.20 0.25 C 0.08 0.15 0.22 D 1.80 2.00 2.20 0.000 −−− 0.004 0.006 0.008 0.010 0.003 0.006 0.009 0.070 0.078 0.086 MIN NOM MAX INCHES 0.10 0.004 E1 1.15 1.25 1.35 e 0.65 BSC L 0.26 0.36 0.46 2.00 2.10 2.20 0.045 0.049 0.053

0.026 BSC

0.010 0.014 0.018 0.078 0.082 0.086 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* 0.65 0.66 DIMENSIONS: MILLIMETERS 0.30 PITCH 2.50 RECOMMENDED TOP VIEW SIDE VIEW END VIEW bbb H B SEATING PLANE DETAIL A E L2 0.15 BSC 0.006 BSC aaa 0.15 0.006 bbb 0.30 0.012 ccc 0.10 0.004 A-B D aaa C 2X 3 TIPSD D e A aaa H D D L PLANE DETAIL A H GAGE C ccc C ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a numb er of patents, trademarks, reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for e ach customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designe d, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthori zed use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This l iterature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 MBT2222ADW1T1/D LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your loc a Sales Representative