MBD4448HAQW_15 TSC | Alldatasheet
Document overview
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Technical content
MBD4448HAQW/HADW/HCDW/HSDW/HTW - Fast switching speed - Surface device type mounting - Moisture sensitivity level 1 - High conductance power dissipation - For general purpose switching applications - Pb free version and RoHS compliant - Packing code with suffix "G" means green compound (halogen-free) - Case: SOT-363 small outline plastic package SYMBOL UNIT P D mW VRRM V VR V IF(AV) mA IO mA @ t = 1 μs @ t = 1 s RθJA oC/W TJ , TSTG oC SYMBOL UNIT Reverse Breakdown Voltage IR=100μAV (BR) V IF=5.0mA IF=10mA IF=100mA IF=150mA VR=70V nA VR=75V, TJ=150oC μA VR=25V, TJ=150oC μA VR=20V nA VR=6V, f=1MHz CJ pF IF=5mA, VR=6V trr ns Note 1: Device mounted on FR-4 PCB, 1 inch × 0.85 inch × 0.062 inch Note 2: Short duration test pulse uesd tu minimize self-heating effect Document Number: DS_S1501009 Version: C15 -55 to 150 1.5 Average Rectified Output Current Average Rectified Forward Current Reverse Voltage Junction and Storage Temperature Range Thermal Resistance (Junction to Ambient) Non-Repetitive Peak Forward Surge Current PARAMETER 200 500 250 625 MIN MAX 0.620 0.715 - 0.855 - 1.000 VF V 1.250 100 V F Forward Voltage Reverse Leakage Current -3 . 5 -4 . 0 Junction Capacitance Reverse Recovery Time I FSM A MECHANICAL DATA - Terminal: Matte tin plated, lead free., solderable per MIL-STD-202, Method 208 guaranteed - High temperature soldering guaranteed : 260°C/10s MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise noted) PARAMETER VALUE Taiwan Semiconductor Small Signal Product Switching Diode
FEATURES
Repetitive Peak Reverse Voltage Power Dissipation
MBD4448HAQW/HADW/HCDW/HSDW/HTW DIMENSIONS Min Max Min Max A 2.00 2.20 0.079 0.087 B 1.15 1.35 0.045 0.053 C 0.15 0.35 0.006 0.014 D 1.20 1.40 0.047 0.055 E 2.15 2.45 0.085 0.096 F 0.85 1.05 0.033 0.041 G 0.25 0.46 0.010 0.018 H 0.00 0.10 0.000 0.004 SUGGESTED PAD LAYOUT Z G X Y PIN CONFIGURATION Document Number: DS_S1501009 Version: C15 0.80 0.031 2.40 0.094 0.95 0.037 3.20 0.126 1.60 0.063 0.55 0.022 DIM. Unit (mm) Unit (inch) DIM. Unit (mm) Unit (inch) Typ. Typ. Taiwan Semiconductor Small Signal Product ORDER INFORMATION (EXAMPLE) SOT-363 MBD4448HAQW RFG Green compound code Packing code Part no. B A C D G F E H
MBD4448HAQW/HADW/HCDW/HSDW/HTW MARKING Document Number: DS_S1501009 Version: C15 Part no. Marking code MBD4448HAQW MBD4448HADW KA6 MBD4448HCDW KA7 KA5 MBD4448HSDW KA8 MBD4448HTW KAA Taiwan Semiconductor Small Signal Product
MBD4448HAQW/HADW/HCDW/HSDW/HTW Small Signal Product assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied,to any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. Document Number: DS_S1501009 Version: C15 Taiwan Semiconductor Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,