MB9B410R

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32-bit ARM® Cortex®-M3 based Microcontroller MB9BF412N/R, MB9BF414N/R, MB9BF415N/R, MB9BF416N/R Data Sheet (Full Production) Publication Number MB9B410R-DS706-00026 Revision 3.0 Issue Date March 11, 2015 CONFIDENTIAL Notice to Readers: This document states the current technical specifications regarding the Spansion product(s) described herein. Spansion Inc. deems the products to have been in sufficient production volume such that subsequent versions of this document are not expected to change. However, typographical or specification corrections, or modifications to the valid combinations offered may occur.

MB9B410R-DS706-00026-3v0-E, March 11, 2015 CONFIDENTIAL Notice On Data Sheet Designations Spansion Inc. issues data sheets with Advance Information or Preliminary designations to advise readers of product information or intended specifications throughout the product life cycle, including development, qualification, initial production, and full production. In all cases, however, readers are encouraged to verify that they have the latest information before finalizing their design. The following descriptions of Spansion data sheet designations are presented here to highlight their presence and definitions. Advance Information The Advance Information designation indicates that Spansion Inc. is developing one or more specific products, but has not committed any design to production. Information presented in a document with this designation is likely to change, and in some cases, development on the product may discontinue. Spansion Inc. therefore places the following conditions upon Advance Information content: “This document contains information on one or more products under development at Spansion Inc. The information is intended to help you evaluate this product. Do not design in this product without contacting the factory. Spansion Inc. reserves the right to change or discontinue work on this proposed product without notice.” Preliminary The Preliminary designation indicates that the product development has progressed such that a commitment to production has taken place. This designation covers several aspects of the product life cycle, including product qualification, initial production, and the subsequent phases in the manufacturing process that occur before full production is achieved. Changes to the technical specifications presented in a Preliminary document should be expected while keeping these aspects of production under consideration. Spansion places the following conditions upon Preliminary content: “This document states the current technical specifications regarding the Spansion product(s) described herein. The Preliminary status of this document indicates that product qualification has been completed, and that initial production has begun. Due to the phases of the manufacturing process that require maintaining efficiency and quality, this document may be revised by subsequent versions or modifications due to changes in technical specifications.” Combination Some data sheets contain a combination of products with different designations (Advance Information, Preliminary, or Full Production). This type of document distinguishes these products and their designations wherever necessary, typically on the first page, the ordering information page, and pages with the DC Characteristics table and the AC Erase and Program table (in the table notes). The disclaimer on the first page refers the reader to the notice on this page. Full Production (No Designation on Document) When a product has been in production for a period of time such that no changes or only nominal changes are expected, the Preliminary designation is removed from the data sheet. Nominal changes may include those affecting the number of ordering part numbers available, such as the addition or deletion of a speed option, temperature range, package type, or VIO range. Changes may also include those needed to clarify a description or to correct a typographical error or incorrect specification. Spansion Inc. applies the following conditions to documents in this category: “This document states the current technical specifications regarding the Spansion product(s) described herein. Spansion Inc. deems the products to have been in sufficient production volume such that subsequent versions of this document are not expected to change. However, typographical or specification corrections, or modifications to the valid combinations offered may occur.” Questions regarding these document designations may be directed to your local sales office.

32-bit ARM® Cortex®-M3 based Microcontroller MB9BF412N/R, MB9BF414N/R, MB9BF415N/R, MB9BF416N/R Data Sheet (Full Production) Publication Number MB9B410R-DS706-00026 Revision 3.0 Issue Date March 11, 2015 CONFIDENTIAL This document states the current technical specifications regarding the Spansion product(s) described herein. Spansion Inc. deems the products to have been in sufficient production volume such that subsequent versions of this document are not expected to change. However, typographical or specification corrections, or modifications to the valid combinations offered may occur.  Description The MB9B410R Series are a highly integrated 32-bit microcontrollers dedicated for embedded controllers with high-performance and competitive cost. These series are based on the ARM Cortex-M3 Processor with on-chip Flash memory and SRAM, and has peripheral functions such as Motor Control Timers, ADCs and Communication Interfaces (CAN, UART, CSIO, I2C, LIN). The products which are described in this data sheet are placed into TYPE4 product categories in FM3 Family Peripheral Manual. Note: ARM and Cortex are the registered trademarks of ARM Limited in the EU and other countries.

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 Features  32-bit ARM Cortex-M3 Core ・ Processor version: r2p1 ・ Up to 144MHz Frequency Operation ・ Memory Protection Unit (MPU): improves the reliability of an embedded system ・ Integrated Nested Vectored Interrupt Controller (NVIC): 1 NMI (non-maskable interrupt) and 48 peripheral interrupts and 16 priority levels ・ 24-bit System timer (Sys Tick): System timer for OS task management  On-chip Memories [Flash memory] These series are based on two independent on-chip Flash memories. ・ MainFlash ・ Up to 512 Kbyte ・ Built-in Flash Accelerator System with 16 Kbyte trace buffer memory ・ The read access to Flash memory can be achieved without wait cycle up to operation frequency of 72MHz. Even at the operation frequency more than 72 MHz, an equivalent access to Flash memory can be obtained by Flash Accelerator System. ・ Security function for code protection ・ WorkFlash ・ 32 Kbyte ・ Read cycle ・ 4 wait-cycle: the operation frequency more than 72 MHz ・ 2 wait-cycle: the operation frequency more than 40 MHz, and to 72 MHz ・ 0 wait-cycle: the operation frequency to 40 MHz ・ Security function is shared with code protection [SRAM] This Series contain a total of up to 64Kbyte on-chip SRAM. This is composed of two independent SRAM (SRAM0, SRAM1). SRAM0 is connected to I-code bus and D-code bus of Cortex-M3 core. SRAM1 is connected to System bus. ・ SRAM0: Up to 32 Kbyte ・ SRAM1: Up to 32 Kbyte  External Bus Interface ・ Supports SRAM, NOR and NAND Flash device ・ Up to 8 chip selects ・ 8-/16-bit Data width ・ Up to 25-bit Address bit ・ Maximum area size : Up to 256 Mbytes ・ Supports Address/Data multiplex ・ Supports external RDY input

March 11, 2015, MB9B410R-DS706-00026-3v0-E 3 CONFIDENTIAL  CAN Interface (Max two channels) ・ Compatible with CAN Specification 2.0A/B ・ Maximum transfer rate: 1 Mbps ・ Built-in 32 message buffer  Multi-function Serial Interface (Max eight channels) ・ 4 channels with 16 steps×9-bit FIFO (ch.4 to ch.7), 4 channels without FIFO (ch.0 to ch.3) ・ Operation mode is selectable from the followings for each channel. ・ UART ・ CSIO ・ LIN ・ I2C [UART] ・ Full-duplex double buffer ・ Selection with or without parity supported ・ Built-in dedicated baud rate generator ・ External clock available as a serial clock ・ Hardware Flow control : Automatically control the transmission by CTS/RTS (only ch.4) ・ Various error detect functions available (parity errors, framing errors, and overrun errors) [CSIO] ・ Full-duplex double buffer ・ Built-in dedicated baud rate generator ・ Overrun error detect function available [LIN] ・ LIN protocol Rev.2.1 supported ・ Full-duplex double buffer ・ Master/Slave mode supported ・ LIN break field generate (can be changed 13 to 16-bit length) ・ LIN break delimiter generate (can be changed 1 to 4-bit length) ・ Various error detect functions available (parity errors, framing errors, and overrun errors) [I2C] Standard-mode (Max 100 kbps) / Fast-mode (Max 400kbps) supported  DMA Controller (Eight channels) DMA Controller has an independent bus for CPU, so CPU and DMA Controller can process simultaneously. ・ 8 independently configured and operated channels ・ Transfer can be started by software or request from the built-in peripherals ・ Transfer address area: 32-bit (4 Gbyte) ・ Transfer mode: Block transfer/Burst transfer/Demand transfer ・ Transfer data type: byte/half-word/word ・ Transfer block count: 1 to 16 ・ Number of transfers: 1 to 65536  A/D Converter (Max 16 channels) [12-bit A/D Converter] ・ Successive Approximation Register type ・ Built-in 3 unit ・ Conversion time: 1.0 μs @ 5 V ・ Priority conversion available (priority at 2 levels) ・ Scanning conversion mode ・ Built-in FIFO for conversion data storage (for SCAN conversion: 16steps, for Priority conversion: 4steps)

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 Base Timer (Max eight channels) Operation mode is selectable from the followings for each channel. ・ 16-bit PWM timer ・ 16-bit PPG timer ・ 16-/32-bit reload timer ・ 16-/32-bit PWC timer  General Purpose I/O Port This series can use its pins as general purpose I/O ports when they are not used for external bus or peripherals. Moreover, the port relocate function is built in. It can set which I/O port the peripheral function can be allocated. ・ Capable of pull-up control per pin ・ Capable of reading pin level directly ・ Built-in the port relocate function ・ Up 103 fast general purpose I/O Ports@ 120 pin Package ・ Some pin is 5V tolerant I/O. See "Pin Description" to confirm the corresponding pins.  Multi-function Timer (Max three units) The Multi-function timer is composed of the following blocks. ・ 16-bit free-run timer × 3ch./unit ・ Input capture × 4ch./unit ・ Output compare × 6ch./unit ・ A/D activation compare × 3ch./unit ・ Waveform generator × 3ch./unit ・ 16-bit PPG timer × 3ch./unit The following function can be used to achieve the motor control. ・ PWM signal output function ・ DC chopper waveform output function ・ Dead time function ・ Input capture function ・ A/D convertor activate function ・ DTIF (Motor emergency stop) interrupt function  Real-time Clock (RTC) The Real-time clock can count Year/Month/Day/Hour/Minute/Second/A day of the week from 01 to 99. ・ Interrupt function with specifying date and time (Year/Month/Day/Hour/Minute/Second/A day of the week.) is available. This function is also available by specifying only Year, Month, Day, Hour or Minute. ・ Timer interrupt function after set time or each set time. ・ Capable of rewriting the time with continuing the time count. ・ Leap year automatic count is available.  Quadrature Position/Revolution Counter (QPRC) (Max three channels) The Quadrature Position/Revolution Counter (QPRC) is used to measure the position of the position encoder. Moreover, it is possible to use up/down counter. ・ The detection edge of the three external event input pins AIN, BIN and ZIN is configurable. ・ 16-bit position counter ・ 16-bit revolution counter ・ Two 16-bit compare registers

March 11, 2015, MB9B410R-DS706-00026-3v0-E 5 CONFIDENTIAL  Dual Timer (32-/16-bit Down Counter) The Dual Timer consists of two programmable 32-/16-bit down counters. Operation mode is selectable from the followings for each channel. ・ Free-running ・ Periodic (=Reload) ・ One-shot  Watch Counter The Watch counter is used for wake up from power consumption mode. Interval timer: up to 64 s (Max) @ Sub Clock : 32.768 kHz  External Interrupt Controller Unit ・ Up to 16 external interrupt input pin ・ Include one non-maskable interrupt (NMI)  Watchdog Timer (Two channels) A watchdog timer can generate interrupts or a reset when a time-out value is reached. This series consists of two different watchdogs, a "Hardware" watchdog and a "Software" watchdog. "Hardware" watchdog timer is clocked by low-speed internal CR oscillator. Therefore, "Hardware" watchdog is active in any power consumption mode except Stop mode.  CRC (Cyclic Redundancy Check) Accelerator The CRC accelerator helps a verify data transmission or storage integrity. CCITT CRC16 and IEEE-802.3 CRC32 are supported. ・ CCITT CRC16 Generator Polynomial: 0x1021 ・ IEEE-802.3 CRC32 Generator Polynomial: 0x04C11DB7  Clock and Reset [Clocks] Five clock sources (2 external oscillators, 2 internal CR oscillator, and Main PLL) that are dynamically selectable. ・ Main Clock: 4 MHz to 48 MHz ・ Sub Clock: 32.768 kHz ・ High-speed internal CR Clock: 4 MHz ・ Low-speed internal CR Clock: 100 kHz ・ Main PLL Clock [Resets] ・ Reset requests from INITX pin ・ Power on reset ・ Software reset ・ Watchdog timers reset ・ Low-voltage detector reset ・ Clock supervisor reset  Clock Super Visor (CSV) Clocks generated by internal CR oscillators are used to supervise abnormality of the external clocks. ・ External OSC clock failure (clock stop) is detected, reset is asserted. ・ External OSC frequency anomaly is detected, interrupt or reset is asserted.

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 Low-Voltage Detector (LVD) This Series include 2-stage monitoring of voltage on the VCC pins. When the voltage falls below the voltage has been set, Low-V oltage Detector generates an interrupt or reset. ・ LVD1: error reporting via interrupt ・ LVD2: auto-reset operation  Low-Power Consumption Mode Three power consumption modes supported. ・ Sleep ・ Timer ・ Stop  Debug ・ Serial Wire JTAG Debug Port (SWJ-DP) ・ Embedded Trace Macrocells (ETM) provide comprehensive debug and trace facilities.  Power Supply Wide range voltage: VCC = 2.7 V to 5.5 V

March 11, 2015, MB9B410R-DS706-00026-3v0-E 7 CONFIDENTIAL  Product Lineup  Memory size Product name MB9BF412N/R MB9BF414N/R MB9BF415N/R MB9BF416R MainFlash 128 Kbyte 256 Kbyte 384 Kbyte 512 Kbyte WorkFlash 32 Kbyte 32 Kbyte 32 Kbyte 32 Kbyte On-chip RAM 16 Kbyte 32 Kbyte 48 Kbyte 64 Kbyte SRAM0 8 Kbyte 16 Kbyte 24 Kbyte 32 Kbyte SRAM1 8 Kbyte 16 Kbyte 24 Kbyte 32 Kbyte

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 Function Product name MB9BF412N MB9BF414N MB9BF415N MB9BF416N MB9BF412R MB9BF414R MB9BF415R MB9BF416R Pin count 100/112 120 CPU Cortex-M3 Freq. 144 MHz Power supply voltage range VCC: 2.7 V to 5.5 V CAN Interface 2ch. (Max) DMAC 8ch. External Bus Interface Addr: 25-bit (Max) R/Wdata: 8-/16-bit (Max) CS: 8 (Max) Support: SRAM, NOR Flash Addr: 25-bit (Max) R/Wdata: 8-/16-bit (Max) CS: 8 (Max) Support: SRAM, NOR & NAND Flash MF Serial Interface (UART/CSIO/LIN/I2C) 8ch. (Max) ch.4 to ch.7: FIFO (16 steps × 9-bit) ch.0 to ch.3: No FIFO Base Timer (PWC/Reload timer/PWM/PPG) 8ch. (Max) MF- Timer A/D activation compare 3ch. 3 units (Max) Input capture 4ch. Free-run timer 3ch. Output compare 6ch. Waveform generator 3ch. PPG 3ch. QPRC 3ch. (Max) Dual Timer 1 unit Real-Time Clock 1 unit Watch Counter 1 unit CRC Accelerator Yes Watchdog timer 1ch. (SW) + 1ch. (HW) External Interrupts 16pins (Max) + NMI × 1 I/O ports 83 pins (Max) 103 pins (Max) 12-bit A/D converter 16ch. (3 units) CSV (Clock Super Visor) Yes LVD (Low-Voltage Detector) 2ch. Internal OSC High-speed 4 MHz Low-speed 100 kHz Debug Function SWJ-DP/ETM Note: All signals of the peripheral function in each product cannot be allocated by limiting the pins of package. It is necessary to use the port relocate function of the General I/O port according to your function use. See " Electrical Characteristics 4.AC Characteristics (3)Built-in CR Oscillation Characteristics" for accuracy of built-in CR.

March 11, 2015, MB9B410R-DS706-00026-3v0-E 9 CONFIDENTIAL  Packages Product name Package MB9BF412N MB9BF414N MB9BF415N MB9BF416N MB9BF412R MB9BF414R MB9BF415R MB9BF416R QFP: FPT-100P-M36 (0.65 mm pitch)  - LQFP: FPT-100P-M23 (0.5 mm pitch)  - LQFP: FPT-120P-M37 (0.5 mm pitch) -  BGA: BGA-112P-M04 (0.8 mm pitch)  - : Supported Note: See "Package Dimensions" for detailed information on each package.

10 MB9B410R-DS706-00026-3v0-E, March 11, 2015

 Pin Assignment ・ FPT-100P-M23 (TOP VIEW) VSS P81 P80 VCC P60/SIN5_0/TIOA2_2/INT15_1/MRDY_0 P61/SOT5_0/TIOB2_2 P62/SCK5_0/ADTG_3/TX0_2/MOEX_0 P63/INT03_0/SIN5_1/RX0_2/MWEX_0 P0F/NMIX/CROUT_1/RTCCO_0/DTTI2X_0/DTTI2X_1/SUBOUT_0 P0E/CTS4_0/TIOB3_2/IC13_0/IC23_0/RTO25_1/MDQM1_0 P0D/RTS4_0/TIOA3_2/IC12_0/IC22_0/RTO24_1/MDQM0_0 P0C/SCK4_0/TIOA6_1/IC11_0/IC21_0/RTO23_1/MALE_0 P0B/SOT4_0/TIOB6_1/IC10_0/IC20_0/RTO22_1/MCSX0_0 P0A/SIN4_0/INT00_2/FRCK1_0/FRCK2_0/RTO21_1/MCSX1_0 P09/TRACECLK/TIOB0_2/RTS4_2/RTO20_1/MCSX2_0 P08/TRACED3/TIOA0_2/CTS4_2/ZIN2_1/MCSX3_0 P07/TRACED2/ADTG_0/SCK4_2/BIN2_1/MCLKOUT_0 P06/TRACED1/TIOB5_2/SOT4_2/INT01_1/AIN2_1/MCSX4_0 P05/TRACED0/TIOA5_2/SIN4_2/INT00_1/MCSX5_0 P04/TDO/SWO P03/TMS/SWDIO P02/TDI/MCSX6_0 P01/TCK/SWCLK P00/TRSTX/MCSX7_0 VCC 100 VCC 1 75 VSS P50/INT00_0/AIN0_2/SIN3_1/RTO10_0/MADATA00_0 2 74 P20/INT05_0/CROUT_0/AIN1_1/MAD24_0 P51/INT01_0/BIN0_2/SOT3_1/RTO11_0/MADATA01_0 3 73 P21/SIN0_0/INT06_1/BIN1_1 P52/INT02_0/ZIN0_2/SCK3_1/RTO12_0/MADATA02_0 4 72 P22/SOT0_0/TIOB7_1/ZIN1_1 P53/SIN6_0/TIOA1_2/INT07_2/RTO13_0/MADATA03_0 5 71 P23/SCK0_0/TIOA7_1 P54/SOT6_0/TIOB1_2/RTO14_0/MADATA04_0 6 70 P1F/AN15/ADTG_5/FRCK0_1/MAD23_0 P55/SCK6_0/ADTG_1/RTO15_0/MADATA05_0 7 69 P1E/AN14/RTS4_1/DTTI0X_1/MAD22_0 P56/INT08_2/DTTI1X_0/MADATA06_0 8 68 P1D/AN13/CTS4_1/IC03_1/MAD21_0 P30/AIN0_0/TIOB0_1/INT03_2/MADATA07_0 9 67 P1C/AN12/SCK4_1/IC02_1/MAD20_0 P31/BIN0_0/TIOB1_1/SCK6_1/INT04_2/MADATA08_0 10 66 P1B/AN11/SOT4_1/IC01_1/MAD19_0 P32/ZIN0_0/TIOB2_1/SOT6_1/INT05_2/MADATA09_0 11 65 P1A/AN10/SIN4_1/INT05_1/IC00_1/MAD18_0 P33/INT04_0/TIOB3_1/SIN6_1/ADTG_6/MADATA10_0 12 64 P19/AN09/SCK2_2/MAD17_0 P34/FRCK0_0/TIOB4_1/TX0_1/MADATA11_0 13 63 P18/AN08/SOT2_2/MAD16_0 P35/IC03_0/TIOB5_1/RX0_1/INT08_1/MADATA12_0 14 62 AVSS P36/IC02_0/SIN5_2/INT09_1/MADATA13_0 15 61 AVRH P37/IC01_0/SOT5_2/INT10_1/MADATA14_0 16 60 AVCC P38/IC00_0/SCK5_2/INT11_1/MADATA15_0 17 59 P17/AN07/SIN2_2/INT04_1/MAD15_0 P39/DTTI0X_0/ADTG_2 18 58 P16/AN06/SCK0_1/MAD14_0 P3A/RTO00_0/TIOA0_1/RTCCO_2/SUBOUT_2 19 57 P15/AN05/SOT0_1/IC03_2/MAD13_0 P3B/RTO01_0/TIOA1_1 20 56 P14/AN04/SIN0_1/INT03_1/IC02_2/MAD12_0 P3C/RTO02_0/TIOA2_1 21 55 P13/AN03/SCK1_1/RTCCO_1/SUBOUT_1/IC01_2/MAD11_0 P3D/RTO03_0/TIOA3_1 22 54 P12/AN02/SOT1_1/TX1_2/IC00_2/MAD10_0 P3E/RTO04_0/TIOA4_1 23 53 P11/AN01/SIN1_1/INT02_1/RX1_2/FRCK0_2/MAD09_0 P3F/RTO05_0/TIOA5_1 24 52 P10/AN00 VSS 25 51 VCC VCC P40/TIOA0_0/RTO10_1/INT12_1 P41/TIOA1_0/RTO11_1/INT13_1 P42/TIOA2_0/RTO12_1 P43/TIOA3_0/RTO13_1/ADTG_7 P44/TIOA4_0/RTO14_1/MAD00_0 P45/TIOA5_0/RTO15_1/MAD01_0 C VSS VCC P46/X0A P47/X1A INITX P48/DTTI1X_1/INT14_1/SIN3_2/MAD02_0 P49/TIOB0_0/IC10_1/AIN0_1/SOT3_2/MAD03_0 P4A/TIOB1_0/IC11_1/BIN0_1/SCK3_2/MAD04_0 P4B/TIOB2_0/IC12_1/ZIN0_1/MAD05_0 P4C/TIOB3_0/IC13_1/SCK7_1/AIN1_2/MAD06_0 P4D/TIOB4_0/FRCK1_1/SOT7_1/BIN1_2/MAD07_0 P4E/TIOB5_0/INT06_2/SIN7_1/ZIN1_2/MAD08_0 PE0/MD1 MD0 PE2/X0 PE3/X1 VSS LQFP - 100 <Note> The number after the underscore ("_") in pin names such as XXX_1 and XXX_2 indicates the relocated port number. For these pins, there are multiple pins that provide the same function for the same channel. Use the extended port function register (EPFR) to select the pin.

March 11, 2015, MB9B410R-DS706-00026-3v0-E 11 CONFIDENTIAL ・ FPT-120P-M37 (TOP VIEW) VSS P81 P80 VCC P60/SIN5_0/TIOA2_2/INT15_1/MRDY_0 P61/SOT5_0/TIOB2_2 P62/SCK5_0/ADTG_3/TX0_2/MOEX_0 P63/INT03_0/SIN5_1/RX0_2/RTO20_0/MWEX_0 P64/TIOA7_0/SOT5_1/INT10_2/FRCK2_1/RTO21_0 P65/TIOB7_0/SCK5_1/IC23_1/RTO22_0 P66/SIN3_0/ADTG_8/INT11_2/IC22_1/RTO23_0 P67/SOT3_0/TIOA7_2/IC21_1/RTO24_0 P68/SCK3_0/TIOB7_2/INT12_2/IC20_1/RTO25_0 P0F/NMIX/CROUT_1/RTCCO_0/DTTI2X_0/DTTI2X_1/SUBOUT_0 P0E/CTS4_0/TIOB3_2/IC13_0/IC23_0/RTO25_1/MDQM1_0 P0D/RTS4_0/TIOA3_2/IC12_0/IC22_0/RTO24_1/MDQM0_0 P0C/SCK4_0/TIOA6_1/IC11_0/IC21_0/RTO23_1/MALE_0 P0B/SOT4_0/TIOB6_1/IC10_0/IC20_0/RTO22_1/MCSX0_0 P0A/SIN4_0/INT00_2/FRCK1_0/FRCK2_0/RTO21_1/MCSX1_0 P09/TRACECLK/TIOB0_2/RTS4_2/RTO20_1/MCSX2_0 P08/TRACED3/TIOA0_2/CTS4_2/ZIN2_1/MCSX3_0 P07/TRACED2/ADTG_0/SCK4_2/BIN2_1/MCLKOUT_0 P06/TRACED1/TIOB5_2/SOT4_2/INT01_1/AIN2_1/MCSX4_0 P05/TRACED0/TIOA5_2/SIN4_2/INT00_1/MCSX5_0 P04/TDO/SWO P03/TMS/SWDIO P02/TDI/MCSX6_0 P01/TCK/SWCLK P00/TRSTX/MCSX7_0 VCC 120 119 118 117 116 115 114 113 112 111 110 109 108 107 106 105 104 103 102 101 100 VCC 1 90 VSS P50/INT00_0/AIN0_2/SIN3_1/RTO10_0/MADATA00_0 2 89 P20/INT05_0/CROUT_0/AIN1_1/MAD24_0 P51/INT01_0/BIN0_2/SOT3_1/RTO11_0/MADATA01_0 3 88 P21/SIN0_0/INT06_1/BIN1_1 P52/INT02_0/ZIN0_2/SCK3_1/RTO12_0/MADATA02_0 4 87 P22/SOT0_0/TIOB7_1/ZIN1_1 P53/SIN6_0/TIOA1_2/INT07_2/RTO13_0/MADATA03_0 5 86 P23/SCK0_0/TIOA7_1/RTO00_1 P54/SOT6_0/TIOB1_2/RTO14_0/MADATA04_0 6 85 P24/RX1_0/SIN2_1/INT01_2/RTO01_1 P55/SCK6_0/ADTG_1/RTO15_0/MADATA05_0 7 84 P25/TX1_0/SOT2_1/RTO02_1 P56/SIN1_0/INT08_2/DTTI1X_0/MADATA06_0 8 83 P26/SCK2_1/RTO03_1 P57/SOT1_0/MADATA07_0 9 82 P27/TIOA6_2/INT02_2/RTO04_1 P58/SCK1_0/AIN2_0/MADATA08_0 10 81 P28/TIOB6_2/ADTG_4/RTO05_1 P59/SIN7_0/RX1_1/INT09_2/BIN2_0/MADATA09_0 11 80 P1F/AN15/ADTG_5/FRCK0_1/MAD23_0 P5A/SOT7_0/TX1_1/ZIN2_0/MADATA10_0 12 79 P1E/AN14/RTS4_1/DTTI0X_1/MAD22_0 P5B/SCK7_0/MADATA11_0 13 78 P1D/AN13/CTS4_1/IC03_1/MAD21_0 P30/AIN0_0/TIOB0_1/INT03_2/MADATA12_0 14 77 P1C/AN12/SCK4_1/IC02_1/MAD20_0 P31/BIN0_0/TIOB1_1/SCK6_1/INT04_2/MADATA13_0 15 76 P1B/AN11/SOT4_1/IC01_1/MAD19_0 P32/ZIN0_0/TIOB2_1/SOT6_1/INT05_2/MADATA14_0 16 75 P1A/AN10/SIN4_1/INT05_1/IC00_1/MAD18_0 P33/INT04_0/TIOB3_1/SIN6_1/ADTG_6/MADATA15_0 17 74 P19/AN09/SCK2_2/MAD17_0 P34/FRCK0_0/TIOB4_1/TX0_1/MNALE_0 18 73 P18/AN08/SOT2_2/MAD16_0 P35/IC03_0/TIOB5_1/RX0_1/INT08_1/MNCLE_0 19 72 AVSS P36/IC02_0/SIN5_2/INT09_1/MNWEX_0 20 71 AVRH P37/IC01_0/SOT5_2/INT10_1/MNREX_0 21 70 AVCC P38/IC00_0/SCK5_2/INT11_1 22 69 P17/AN07/SIN2_2/INT04_1/MAD15_0 P39/DTTI0X_0/ADTG_2 23 68 P16/AN06/SCK0_1/MAD14_0 P3A/RTO00_0/TIOA0_1/RTCCO_2/SUBOUT_2 24 67 P15/AN05/SOT0_1/IC03_2/MAD13_0 P3B/RTO01_0/TIOA1_1 25 66 P14/AN04/SIN0_1/INT03_1/IC02_2/MAD12_0 P3C/RTO02_0/TIOA2_1 26 65 P13/AN03/SCK1_1/RTCCO_1/SUBOUT_1/IC01_2/MAD11_0 P3D/RTO03_0/TIOA3_1 27 64 P12/AN02/SOT1_1/TX1_2/IC00_2/MAD10_0 P3E/RTO04_0/TIOA4_1 28 63 P11/AN01/SIN1_1/INT02_1/RX1_2/FRCK0_2/MAD09_0 P3F/RTO05_0/TIOA5_1 29 62 P10/AN00 VSS 30 61 VCC VCC P40/TIOA0_0/RTO10_1/INT12_1 P41/TIOA1_0/RTO11_1/INT13_1 P42/TIOA2_0/RTO12_1 P43/TIOA3_0/RTO13_1/ADTG_7 P44/TIOA4_0/RTO14_1/MAD00_0 P45/TIOA5_0/RTO15_1/MAD01_0 C VSS VCC P46/X0A P47/X1A INITX P48/DTTI1X_1/INT14_1/SIN3_2/MAD02_0 P49/TIOB0_0/IC10_1/AIN0_1/SOT3_2/MAD03_0 P4A/TIOB1_0/IC11_1/BIN0_1/SCK3_2/MAD04_0 P4B/TIOB2_0/IC12_1/ZIN0_1/MAD05_0 P4C/TIOB3_0/IC13_1/SCK7_1/AIN1_2/MAD06_0 P4D/TIOB4_0/FRCK1_1/SOT7_1/BIN1_2/MAD07_0 P4E/TIOB5_0/INT06_2/SIN7_1/ZIN1_2/MAD08_0 P70/TX0_0/TIOA4_2 P71/RX0_0/INT13_2/TIOB4_2 P72/SIN2_0/INT14_2/TIOA6_0 P73/SOT2_0/INT15_2/TIOB6_0 P74/SCK2_0 PE0/MD1 MD0 PE2/X0 PE3/X1 VSS LQFP - 120 <Note> The number after the underscore ("_") in pin names such as XXX_1 and XXX_2 indicates the relocated port number. For these pins, there are multiple pins that provide the same function for the same channel. Use the extended port function register (EPFR) to select the pin.

12 MB9B410R-DS706-00026-3v0-E, March 11, 2015

・ FPT-100P-M36 (TOP VIEW) P50/INT00_0/AIN0_2/SIN3_1/RTO10_0/MADATA00_0 VCC VSS P81 P80 VCC P60/SIN5_0/TIOA2_2/INT15_1/MRDY_0 P61/SOT5_0/TIOB2_2 P62/SCK5_0/ADTG_3/TX0_2/MOEX_0 P63/INT03_0/SIN5_1/RX0_2/MWEX_0 P0F/NMIX/CROUT_1/RTCCO_0/DTTI2X_0/DTTI2X_1/SUBOUT_0 P0E/CTS4_0/TIOB3_2/IC13_0/IC23_0/RTO25_1/MDQM1_0 P0D/RTS4_0/TIOA3_2/IC12_0/IC22_0/RTO24_1/MDQM0_0 P0C/SCK4_0/TIOA6_1/IC11_0/IC21_0/RTO23_1/MALE_0 P0B/SOT4_0/TIOB6_1/IC10_0/IC20_0/RTO22_1/MCSX0_0 P0A/SIN4_0/INT00_2/FRCK1_0/FRCK2_0/RTO21_1/MCSX1_0 P09/TRACECLK/TIOB0_2/RTS4_2/RTO20_1/MCSX2_0 P08/TRACED3/TIOA0_2/CTS4_2/ZIN2_1/MCSX3_0 P07/TRACED2/ADTG_0/SCK4_2/BIN2_1/MCLKOUT_0 P06/TRACED1/TIOB5_2/SOT4_2/INT01_1/AIN2_1/MCSX4_0 P05/TRACED0/TIOA5_2/SIN4_2/INT00_1/MCSX5_0 P04/TDO/SWO P03/TMS/SWDIO P02/TDI/MCSX6_0 P01/TCK/SWCLK P00/TRSTX/MCSX7_0 VCC VSS P20/INT05_0/CROUT_0/AIN1_1/MAD24_0 P21/SIN0_0/INT06_1/BIN1_1 P51/INT01_0/BIN0_2/SOT3_1/RTO11_0/MADATA01_0 81 50 P22/SOT0_0/TIOB7_1/ZIN1_1 P52/INT02_0/ZIN0_2/SCK3_1/RTO12_0/MADATA02_0 82 49 P23/SCK0_0/TIOA7_1 P53/SIN6_0/TIOA1_2/INT07_2/RTO13_0/MADATA03_0 83 48 P1F/AN15/ADTG_5/FRCK0_1/MAD23_0 P54/SOT6_0/TIOB1_2/RTO14_0/MADATA04_0 84 47 P1E/AN14/RTS4_1/DTTI0X_1/MAD22_0 P55/SCK6_0/ADTG_1/RTO15_0/MADATA05_0 85 46 P1D/AN13/CTS4_1/IC03_1/MAD21_0 P56/INT08_2/DTTI1X_0/MADATA06_0 86 45 P1C/AN12/SCK4_1/IC02_1/MAD20_0 P30/AIN0_0/TIOB0_1/INT03_2/MADATA07_0 87 44 P1B/AN11/SOT4_1/IC01_1/MAD19_0 P31/BIN0_0/TIOB1_1/SCK6_1/INT04_2/MADATA08_0 88 43 P1A/AN10/SIN4_1/INT05_1/IC00_1/MAD18_0 P32/ZIN0_0/TIOB2_1/SOT6_1/INT05_2/MADATA09_0 89 42 P19/AN09/SCK2_2/MAD17_0 P33/INT04_0/TIOB3_1/SIN6_1/ADTG_6/MADATA10_0 90 41 P18/AN08/SOT2_2/MAD16_0 P34/FRCK0_0/TIOB4_1/TX0_1/MADATA11_0 91 40 AVSS P35/IC03_0/TIOB5_1/RX0_1/INT08_1/MADATA12_0 92 39 AVRH P36/IC02_0/SIN5_2/INT09_1/MADATA13_0 93 38 AVCC P37/IC01_0/SOT5_2/INT10_1/MADATA14_0 94 37 P17/AN07/SIN2_2/INT04_1/MAD15_0 P38/IC00_0/SCK5_2/INT11_1/MADATA15_0 95 36 P16/AN06/SCK0_1/MAD14_0 P39/DTTI0X_0/ADTG_2 96 35 P15/AN05/SOT0_1/IC03_2/MAD13_0 P3A/RTO00_0/TIOA0_1/RTCCO_2/SUBOUT_2 97 34 P14/AN04/SIN0_1/INT03_1/IC02_2/MAD12_0 P3B/RTO01_0/TIOA1_1 98 33 P13/AN03/SCK1_1/RTCCO_1/SUBOUT_1/IC01_2/MAD11_0 P3C/RTO02_0/TIOA2_1 99 32 P12/AN02/SOT1_1/TX1_2/IC00_2/MAD10_0 P3D/RTO03_0/TIOA3_1 100 31 P11/AN01/SIN1_1/INT02_1/RX1_2/FRCK0_2/MAD09_0 P3E/RTO04_0/TIOA4_1 P3F/RTO05_0/TIOA5_1 VSS VCC P40/TIOA0_0/RTO10_1/INT12_1 P41/TIOA1_0/RTO11_1/INT13_1 P42/TIOA2_0/RTO12_1 P43/TIOA3_0/RTO13_1/ADTG_7 P44/TIOA4_0/RTO14_1/MAD00_0 P45/TIOA5_0/RTO15_1/MAD01_0 C VSS VCC P46/X0A P47/X1A INITX P48/DTTI1X_1/INT14_1/SIN3_2/MAD02_0 P49/TIOB0_0/IC10_1/AIN0_1/SOT3_2/MAD03_0 P4A/TIOB1_0/IC11_1/BIN0_1/SCK3_2/MAD04_0 P4B/TIOB2_0/IC12_1/ZIN0_1/MAD05_0 P4C/TIOB3_0/IC13_1/SCK7_1/AIN1_2/MAD06_0 P4D/TIOB4_0/FRCK1_1/SOT7_1/BIN1_2/MAD07_0 P4E/TIOB5_0/INT06_2/SIN7_1/ZIN1_2/MAD08_0 PE0/MD1 MD0 PE2/X0 PE3/X1 VSS VCC P10/AN00 QFP - 100 <Note> The number after the underscore ("_") in pin names such as XXX_1 and XXX_2 indicates the relocated port number. For these pins, there are multiple pins that provide the same function for the same channel. Use the extended port function register (EPFR) to select the pin.

March 11, 2015, MB9B410R-DS706-00026-3v0-E 13 CONFIDENTIAL ・ BGA-112P-M04 (TOP VIEW) H J A B C 6 7 K L D E F G 8 9 103 4 51 2 VSS VCC P50 P53 VSS P54 VSS X1A INITXVCC P4BP42 P48 VCC VSS P20 P23 AN12 AN09 AN01VCC P3F AN07 AN04 VSS AN06 AN03 P4E MD1 P4C P07 P30 P34 P37 P3B P35 VSS P40 P81 P80 VCC P0E P44 VSS AN14 AN10 AN05 VSS P09 P0A AN13 P0C P08 VSS P22 P56 TRSTXP0B P3D P55 P32 P36 TMS/ SWDIO AN08 P52 P61 P0F X1VSS VSS P33 P39 P38 P3C P3E P63 Index VCC VSS C X0A VSS P41 P45 P4A P43 P49 MD0 X0 VSS VSS TDI P21 AN15 AN11 AVRH AVSS AN00 P31 P60 P62 P0DP51 VSS P3A P4D AN02 TCK/ SWCLK VSS P06 TDO/ SWO P05 AVCC PFBGA - 112 <Note> The number after the underscore ("_") in pin names such as XXX_1 and XXX_2 indicates the relocated port number. For these pins, there are multiple pins that provide the same function for the same channel. Use the extended port function register (EPFR) to select the pin.

14 MB9B410R-DS706-00026-3v0-E, March 11, 2015

 List of Pin Functions  List of pin numbers The number after the underscore ("_") in pin names such as XXX_1 and XXX_2 indicates the relocated port number. For these pins, there are multiple pins that provide the same function for the same channel. Use the extended port function register (EPFR) to select the pin. Pin No Pin Name I/O circuit type Pin state type LQFP-100 BGA-112 LQFP-120 QFP-100

1 B1 1 79 VCC -

2 C1 2 80

INT00_0 AIN0_2 SIN3_1 RTO10_0 (PPG10_0) MADATA00_0

3 C2 3 81

INT01_0 BIN0_2 SOT3_1 (SDA3_1) RTO11_0 (PPG10_0) MADATA01_0

4 B3 4 82

INT02_0 ZIN0_2 SCK3_1 (SCL3_1) RTO12_0 (PPG12_0) MADATA02_0

5 D1 5 83

SIN6_0 TIOA1_2 INT07_2 RTO13_0 (PPG12_0) MADATA03_0

6 D2 6 84

SOT6_0 (SDA6_0) TIOB1_2 RTO14_0 (PPG14_0) MADATA04_0

March 11, 2015, MB9B410R-DS706-00026-3v0-E 15 CONFIDENTIAL Pin No Pin Name I/O circuit type Pin state type LQFP-100 BGA-112 LQFP-120 QFP-100

7 D3 7 85

SCK6_0 (SCL6_0) ADTG_1 RTO15_0 (PPG14_0) MADATA05_0 8 D5 P56 E H INT08_2 DTTI1X_0 MADATA06_0 - - - SIN1_0 (120pin only) - - 9 - P57 E I SOT1_0 (SDA1_0) MADATA07_0 - - 10 - P58 E I SCK1_0 (SCL1_0) AIN2_0 MADATA08_0 - - 11 - P59 E H SIN7_0 RX1_1 INT09_2 BIN2_0 MADATA09_0 - - 12 - P5A E I SOT7_0 (SDA7_0) TX1_1 ZIN2_0 MADATA10_0 - - 13 - P5B E I SCK7_0 (SCL7_0) MADATA11_0

16 MB9B410R-DS706-00026-3v0-E, March 11, 2015

Pin No Pin Name I/O circuit type Pin state type LQFP-100 BGA-112 LQFP-120 QFP-100 9 E1 P30 E H AIN0_0 TIOB0_1 INT03_2 - MADATA07_0 (100pin only) - - 14 - MADATA12_0 (120pin only) 10 E2 P31 E H BIN0_0 TIOB1_1 SCK6_1 (SCL6_1) INT04_2 - MADATA08_0 (100pin only) - - 15 - MADATA13_0 (120pin only) 11 E3 P32 E H ZIN0_0 TIOB2_1 SOT6_1 (SDA6_1) INT05_2 - MADATA09_0 (100pin only) - - 16 - MADATA14_0 (120pin only) 12 E4 P33 E H INT04_0 TIOB3_1 SIN6_1 ADTG_6 - MADATA10_0 (100pin only) - - 17 - MADATA15_0 (120pin only) 13 F1 P34 E I FRCK0_0 TIOB4_1 TX0_1 - MADATA11_0 (100pin only) - - 18 - MNALE_0 (120pin only)

March 11, 2015, MB9B410R-DS706-00026-3v0-E 17 CONFIDENTIAL Pin No Pin Name I/O circuit type Pin state type LQFP-100 BGA-112 LQFP-120 QFP-100 14 F2 P35 E H IC03_0 TIOB5_1 RX0_1 INT08_1 - MADATA12_0 (100pin only) - - 19 - MNCLE_0 (120pin only) 15 F3 P36 E H IC02_0 SIN5_2 INT09_1 - MADATA13_0 (100pin only) - - 20 - MNWEX_0 (120pin only) 16 G1 P37 E H IC01_0 SOT5_2 (SDA5_2) INT10_1 - MADATA14_0 (100pin only) - - 21 - MNREX_0 (120pin only) 17 G2 P38 E H IC00_0 SCK5_2 (SCL5_2) INT11_1 - MADATA15_0 (100pin only)

18 F4 23 96

E I DTTI0X_0 ADTG_2

19 G3 24 97

RTO00_0 (PPG00_0) TIOA0_1 RTCCO_2 SUBOUT_2 - B2 - - VSS -

18 MB9B410R-DS706-00026-3v0-E, March 11, 2015

Pin No Pin Name I/O circuit type Pin state type LQFP-100 BGA-112 LQFP-120 QFP-100

20 H1 25 98

G I RTO01_0 (PPG00_0) TIOA1_1

21 H2 26 99

G I RTO02_0 (PPG02_0) TIOA2_1

22 G4 27 100

G I RTO03_0 (PPG02_0) TIOA3_1

23 H3 28 1

G I RTO04_0 (PPG04_0) TIOA4_1

24 J2 29 2

G I RTO05_0 (PPG04_0) TIOA5_1

25 L1 30 3 VSS -

26 J1 31 4 VCC -

27 J4 32 5

TIOA0_0 RTO10_1 (PPG10_1) INT12_1

28 L5 33 6

TIOA1_0 RTO11_1 (PPG10_1) INT13_1

29 K5 34 7

G I TIOA2_0 RTO12_1 (PPG12_1)

30 J5 35 8

TIOA3_0 RTO13_1 (PPG12_1) ADTG_7 - K2 - - VSS - - J3 - - VSS - - H4 - - VSS -

March 11, 2015, MB9B410R-DS706-00026-3v0-E 19 CONFIDENTIAL Pin No Pin Name I/O circuit type Pin state type LQFP-100 BGA-112 LQFP-120 QFP-100

31 H5 36 9

TIOA4_0 RTO14_1 (PPG14_1) MAD00_0

32 L6 37 10

TIOA5_0 RTO15_1 (PPG14_1) MAD01_0

33 L2 38 11 C -

34 L4 39 12 VSS -

35 K1 40 13 VCC -

36 L3 41 14 P46 D M X0A

37 K3 42 15 P47 D N X1A

38 K4 43 16 INITX B C

39 K6 44 17

DTTI1X_1 INT14_1 SIN3_2 MAD02_0

40 J6 45 18

TIOB0_0 IC10_1 AIN0_1 SOT3_2 (SDA3_2) MAD03_0

41 L7 46 19

TIOB1_0 IC11_1 BIN0_1 SCK3_2 (SCL3_2) MAD04_0

42 K7 47 20

TIOB2_0 IC12_1 ZIN0_1 MAD05_0

20 MB9B410R-DS706-00026-3v0-E, March 11, 2015

Pin No Pin Name I/O circuit type Pin state type LQFP-100 BGA-112 LQFP-120 QFP-100

43 H6 48 21

I* I TIOB3_0 IC13_1 SCK7_1 (SCL7_1) AIN1_2 MAD06_0

44 J7 49 22

I* I TIOB4_0 FRCK1_1 SOT7_1 (SDA7_1) BIN1_2 MAD07_0

45 K8 50 23

I* H TIOB5_0 INT06_2 SIN7_1 ZIN1_2 MAD08_0 - - 51 - P70 E I TX0_0 TIOA4_2 - - 52 - P71 E H RX0_0 INT13_2 TIOB4_2 - - 53 - P72 E H SIN2_0 INT14_2 TIOA6_0 - - 54 - P73 E H SOT2_0 (SDA2_0) INT15_2 TIOB6_0 - - 55 - P74 E I SCK2_0 (SCL2_0)

46 K9 56 24 PE0 C P MD1

47 L8 57 25 MD0 P D

March 11, 2015, MB9B410R-DS706-00026-3v0-E 21 CONFIDENTIAL Pin No Pin Name I/O circuit type Pin state type LQFP-100 BGA-112 LQFP-120 QFP-100

48 L9 58 26 PE2 A A X0

49 L10 59 27 PE3 A B X1

50 L11 60 28 VSS -

51 K11 61 29 VCC -

52 J11 62 30 P10 F K AN00

53 J10 63 31

SIN1_1 INT02_1 RX1_2 FRCK0_2 MAD09_0 - K10 - - VSS - - J9 - - VSS -

54 J8 64 32

SOT1_1 (SDA1_1) TX1_2 IC00_2 MAD10_0

55 H10 65 33

SCK1_1 (SCL1_1) RTCCO_1 SUBOUT_1 IC01_2 MAD11_0

22 MB9B410R-DS706-00026-3v0-E, March 11, 2015

Pin No Pin Name I/O circuit type Pin state type LQFP-100 BGA-112 LQFP-120 QFP-100

56 H9 66 34

SIN0_1 INT03_1 IC02_2 MAD12_0

57 H7 67 35

SOT0_1 (SDA0_1) IC03_2 MAD13_0

58 G10 68 36

SCK0_1 (SCL0_1) MAD14_0

59 G9 69 37

SIN2_2 INT04_1 MAD15_0

60 H11 70 38 A VCC -

61 F11 71 39 A VRH -

62 G11 72 40 A VSS -

63 G8 73 41

SOT2_2 (SDA2_2) MAD16_0

64 F10 74 42

SCK2_2 (SCL2_2) MAD17_0

65 F9 75 43

SIN4_1 INT05_1 IC00_1 MAD18_0 - H8 - - VSS -

March 11, 2015, MB9B410R-DS706-00026-3v0-E 23 CONFIDENTIAL Pin No Pin Name I/O circuit type Pin state type LQFP-100 BGA-112 LQFP-120 QFP-100

66 E11 76 44

SOT4_1 (SDA4_1) IC01_1 MAD19_0

67 E10 77 45

SCK4_1 (SCL4_1) IC02_1 MAD20_0

68 F8 78 46

CTS4_1 IC03_1 MAD21_0

69 E9 79 47

RTS4_1 DTTI0X_1 MAD22_0

70 D11 80 48

ADTG_5 FRCK0_1 MAD23_0 - - 81 - P28 E I TIOB6_2 ADTG_4 RTO05_1 (PPG04_1) - - 82 - P27 E H TIOA6_2 INT02_2 RTO04_1 (PPG04_1) - - 83 - P26 E I SCK2_1 (SCL2_1) RTO03_1 (PPG02_1)

24 MB9B410R-DS706-00026-3v0-E, March 11, 2015

Pin No Pin Name I/O circuit type Pin state type LQFP-100 BGA-112 LQFP-120 QFP-100 - - 84 - P25 E I TX1_0 SOT2_1 (SDA2_1) RTO02_1 (PPG02_1) - B10 - - VSS - - C9 - - VSS - - - 85 - P24 E H RX1_0 SIN2_1 INT01_2 RTO01_1 (PPG00_1)

71 D10

SCK0_0 (SCL0_0) TIOA7_1 - - - RTO00_1 (PPG00_1)

72 E8 87 50

SOT0_0 (SDA0_0) TIOB7_1 ZIN1_1

73 C11 88 51

E H SIN0_0 INT06_1 BIN1_1

74 C10 89 52

INT05_0 CROUT_0 AIN1_1 MAD24_0

75 A11 90 53 VSS -

76 A10 91 54 VCC -

77 A9 92 55

MCSX7_0

78 B9 93 56

March 11, 2015, MB9B410R-DS706-00026-3v0-E 25 CONFIDENTIAL Pin No Pin Name I/O circuit type Pin state type LQFP-100 BGA-112 LQFP-120 QFP-100

79 B11 94 57

MCSX6_0

80 A8 95 58

81 B8 96 59

82 C8 97 60

TIOA5_2 SIN4_2 INT00_1 MCSX5_0 - D8 - - VSS -

83 D9 98 61

TIOB5_2 SOT4_2 (SDA4_2) INT01_1 AIN2_1 MCSX4_0

84 A7 99 62

ADTG_0 SCK4_2 (SCL4_2) BIN2_1 MCLKOUT_0

85 B7 100 63

TIOA0_2 CTS4_2 ZIN2_1 MCSX3_0

86 C7 101 64

TIOB0_2 RTS4_2 RTO20_1 (PPG20_1) MCSX2_0

26 MB9B410R-DS706-00026-3v0-E, March 11, 2015

Pin No Pin Name I/O circuit type Pin state type LQFP-100 BGA-112 LQFP-120 QFP-100

87 D7 102 65

I* H SIN4_0 INT00_2 FRCK1_0 FRCK2_0 RTO21_1 (PPG20_1) MCSX1_0

88 A6 103 66

I* I SOT4_0 (SDA4_0) TIOB6_1 IC10_0 IC20_0 RTO22_1 (PPG22_1) MCSX0_0

89 B6 104 67

I* I SCK4_0 (SCL4_0) TIOA6_1 IC11_0 IC21_0 RTO23_1 MALE_0

90 C6 105 68

RTS4_0 TIOA3_2 IC12_0 IC22_0 RTO24_1 (PPG24_1) MDQM0_0

91 A5 106 69

CTS4_0 TIOB3_2 IC13_0 IC23_0 RTO25_1 (PPG24_1) MDQM1_0 - D4 - - VSS - - C3 - - VSS -

March 11, 2015, MB9B410R-DS706-00026-3v0-E 27 CONFIDENTIAL Pin No Pin Name I/O circuit type Pin state type LQFP-100 BGA-112 LQFP-120 QFP-100

92 B5 107 70

CROUT_1 RTCCO_0 SUBOUT_0 DTTI2X_0 DTTI2X_1 - - 108 - P68 G H SCK3_0 (SCL3_0) TIOB7_2 INT12_2 IC20_1 RTO25_0 (PPG24_0) - - 109 - P67 G I SOT3_0 (SDA3_0) TIOA7_2 IC21_1 RTO24_0 (PPG24_0) - - 110 - P66 G H SIN3_0 ADTG_8 INT11_2 IC22_1 RTO23_0 (PPG22_0) - - 111 - P65 G I TIOB7_0 SCK5_1 (SCL5_1) IC23_1 RTO22_0 (PPG22_0) - - 112 - P64 G H TIOA7_0 SOT5_1 (SDA5_1) INT10_2 FRCK2_1 RTO21_0 (PPG20_0)

28 MB9B410R-DS706-00026-3v0-E, March 11, 2015

Pin No Pin Name I/O circuit type Pin state type LQFP-100 BGA-112 LQFP-120 QFP-100 93 D6 113 P63 G H INT03_0 SIN5_1 RX0_2 MWEX_0 - - - RTO20_0 (PPG20_0)

94 C5 114 72

SCK5_0 (SCL5_0) ADTG_3 TX0_2 MOEX_0

95 B4 115 73

E I SOT5_0 (SDA5_0) TIOB2_2

96 C4 116 74

I* H SIN5_0 TIOA2_2 INT15_1 MRDY_0

97 A4 117 75 VCC -

98 A3 118 76 P80 H O

99 A2 119 77 P81 H O

100 A1 120 78 VSS -

*: 5 V tolerant I/O

March 11, 2015, MB9B410R-DS706-00026-3v0-E 29 CONFIDENTIAL  List of pin functions The number after the underscore ("_") in pin names such as XXX_1 and XXX_2 indicates the relocated port number. For these pins, there are multiple pins that provide the same function for the same channel. Use the extended port function register (EPFR) to select the pin. Module Pin name Function Pin No LQFP- 100 BGA- 112 LQFP- 120 QFP- 100 ADC ADTG_0 A/D converter external trigger input pin ADTG_1 7 D3 7 85 ADTG_2 18 F4 23 96 ADTG_3 94 C5 114 72 ADTG_4 - - 81 - ADTG_5 70 D11 80 48 ADTG_6 12 E4 17 90 ADTG_7 30 J5 35 8 ADTG_8 - - 110 - AN00 A/D converter analog input pin. ANxx describes ADC ch.xx.

52 J11 62 30

TIOA0_0 Base timer ch.0 TIOA pin TIOA0_1 19 G3 24 97 TIOA0_2 85 B7 100 63 TIOB0_0 Base timer ch.0 TIOB pin TIOB0_1 9 E1 14 87 TIOB0_2 86 C7 101 64 Base Timer TIOA1_0 Base timer ch.1 TIOA pin TIOA1_1 20 H1 25 98 TIOA1_2 5 D1 5 83 TIOB1_0 Base timer ch.1 TIOB pin TIOB1_1 10 E2 15 88 TIOB1_2 6 D2 6 84 Base Timer TIOA2_0 Base timer ch.2 TIOA pin TIOA2_1 21 H2 26 99 TIOA2_2 96 C4 116 74 TIOB2_0 Base timer ch.2 TIOB pin TIOB2_1 11 E3 16 89 TIOB2_2 95 B4 115 73

30 MB9B410R-DS706-00026-3v0-E, March 11, 2015

TIOA3_0 Base timer ch.3 TIOA pin TIOA3_1 22 G4 27 100 TIOA3_2 90 C6 105 68 TIOB3_0 Base timer ch.3 TIOB pin TIOB3_1 12 E4 17 90 TIOB3_2 91 A5 106 69 Base Timer TIOA4_0 Base timer ch.4 TIOA pin TIOA4_1 23 H3 28 1 TIOA4_2 - - 51 - TIOB4_0 Base timer ch.4 TIOB pin TIOB4_1 13 F1 18 91 TIOB4_2 - - 52 - Base Timer TIOA5_0 Base timer ch.5 TIOA pin TIOA5_1 24 J2 29 2 TIOA5_2 82 C8 97 60 TIOB5_0 Base timer ch.5 TIOB pin TIOB5_1 14 F2 19 92 TIOB5_2 83 D9 98 61 Base Timer TIOA6_0 Base timer ch.6 TIOA pin - - 53 - TIOA6_1 89 B6 104 67 TIOA6_2 - - 82 - TIOB6_0 Base timer ch.6 TIOB pin - - 54 - TIOB6_1 88 A6 103 66 TIOB6_2 - - 81 - Base Timer TIOA7_0 Base timer ch.7 TIOA pin - - 112 - TIOA7_1 71 D10 86 49 TIOA7_2 - - 109 - TIOB7_0 Base timer ch.7 TIOB pin - - 111 - TIOB7_1 72 E8 87 50 TIOB7_2 - - 108 - CAN 0 TX0_0 CAN interface ch.0 TX output pin - - 51 - TX0_1 13 F1 18 91 TX0_2 94 C5 114 72 RX0_0 CAN interface ch.0 RX output pin - - 52 - RX0_1 14 F2 19 92 RX0_2 93 D6 113 71 CAN 1 TX1_0 CAN interface ch.1 TX output pin - - 84 - TX1_1 - - 12 - TX1_2 54 J8 64 32 RX1_0 CAN interface ch.1 RX output pin - - 85 - RX1_1 - - 11 - RX1_2 53 J10 63 31

March 11, 2015, MB9B410R-DS706-00026-3v0-E 31 CONFIDENTIAL Module Pin name Function Pin No LQFP- 100 BGA- 112 LQFP- 120 QFP- 100 Debugger SWCLK Serial wire debug interface clock input pin 78 B9 93 56 SWDIO Serial wire debug interface data input / output pin 80 A8 95 58 SWO Serial wire viewer output pin 81 B8 96 59 TCK J-TAG test clock input pin 78 B9 93 56 TDI J-TAG test data input pin 79 B11 94 57 TDO J-TAG debug data output pin 81 B8 96 59 TMS J-TAG test mode state input/output pin 80 A8 95 58 TRACECLK Trace CLK output pin of ETM 86 C7 101 64 TRACED0 Trace data output pin of ETM TRSTX J-TAG test reset Input pin 77 A9 92 55 External Bus MAD00_0 External bus interface address bus MAD01_0 32 L6 37 10 MAD02_0 39 K6 44 17 MAD03_0 40 J6 45 18 MAD04_0 41 L7 46 19 MAD05_0 42 K7 47 20 MAD06_0 43 H6 48 21 MAD07_0 44 J7 49 22 MAD08_0 45 K8 50 23 MAD09_0 53 J10 63 31 MAD10_0 54 J8 64 32 MAD11_0 55 H10 65 33 MAD12_0 56 H9 66 34 MAD13_0 57 H7 67 35 MAD14_0 58 G10 68 36 MAD15_0 59 G9 69 37 MAD16_0 63 G8 73 41 MAD17_0 64 F10 74 42 MAD18_0 65 F9 75 43 MAD19_0 66 E11 76 44 MAD20_0 67 E10 77 45 MAD21_0 68 F8 78 46 MAD22_0 69 E9 79 47 MAD23_0 70 D11 80 48 MAD24_0 74 C10 89 52 MCSX0_0 External bus interface chip select output pin MCSX1_0 87 D7 102 65 MCSX2_0 86 C7 101 64 MCSX3_0 85 B7 100 63 MCSX4_0 83 D9 98 61 MCSX5_0 82 C8 97 60 MCSX6_0 79 B11 94 57 MCSX7_0 77 A9 92 55

32 MB9B410R-DS706-00026-3v0-E, March 11, 2015

MADATA0_0 External bus interface data bus (Address / data multiplex bus) MADATA1_0 3 C2 3 81 MADATA2_0 4 B3 4 82 MADATA3_0 5 D1 5 83 MADATA4_0 6 D2 6 84 MADATA5_0 7 D3 7 85 MADATA6_0 8 D5 8 86 MADATA7_0 9 E1 9 87 MADATA8_0 10 E2 10 88 MADATA9_0 11 E3 11 89 MADATA10_0 12 E4 12 90 MADATA11_0 13 F1 13 91 MADATA12_0 14 F2 14 92 MADATA13_0 15 F3 15 93 MADATA14_0 16 G1 16 94 MADATA15_0 17 G2 17 95 MDQM0_0 External bus interface byte mask signal output pin MDQM1_0 91 A5 106 69 MALE_0 External bus interface Address Latch enable output signal for multiplex 89 B6 104 67 MRDY_0 External bus interface external RDY input signal 96 C4 116 74 MCLKOUT_0 External bus interface external clock output pin 84 A7 99 62 MNALE_0 External bus interface ALE signal to control NAND Flash output pin - - 18 - MNCLE_0 External bus interface CLE signal to control NAND Flash output pin - - 19 - MNREX_0 External bus interface read enable signal to control NAND Flash - - 21 - MNWEX_0 External bus interface write enable signal to control NAND Flash - - 20 - MOEX_0 External bus interface read enable signal for SRAM 94 C5 114 72 MWEX_0 External bus interface write enable signal for SRAM 93 D6 113 71

March 11, 2015, MB9B410R-DS706-00026-3v0-E 33 CONFIDENTIAL Module Pin name Function Pin No LQFP- 100 BGA- 112 LQFP- 120 QFP- 100 External Interrupt INT00_0 External interrupt request 00 input pin INT00_1 82 C8 97 60 INT00_2 87 D7 102 65 INT01_0 External interrupt request 01 input pin INT01_1 83 D9 98 61 INT01_2 - - 85 - INT02_0 External interrupt request 02 input pin INT02_1 53 J10 63 31 INT02_2 - - 82 - INT03_0 External interrupt request 03 input pin

93 D6 113 71

INT03_1 56 H9 66 34 INT03_2 9 E1 14 87 INT04_0 External interrupt request 04 input pin

12 E4 17 90

INT04_1 59 G9 69 37 INT04_2 10 E2 15 88 INT05_0 External interrupt request 05 input pin INT05_1 65 F9 75 43 INT05_2 11 E3 16 89 INT06_1 External interrupt request 06 input pin 73 C11 88 51 INT06_2 45 K8 50 23 INT07_2 External interrupt request 07 input pin 5 D1 5 83 INT08_1 External interrupt request 08 input pin 14 F2 19 92 INT08_2 8 D5 8 86 INT09_1 External interrupt request 09 input pin 15 F3 20 93 INT09_2 - - 11 - INT10_1 External interrupt request 10 input pin 16 G1 21 94 INT10_2 - - 112 - INT11_1 External interrupt request 11 input pin 17 G2 22 95 INT11_2 - - 110 - INT12_1 External interrupt request 12 input pin 27 J4 32 5 INT12_2 - - 108 - INT13_1 External interrupt request 13 input pin 28 L5 33 6 INT13_2 - - 52 - INT14_1 External interrupt request 14 input pin 39 K6 44 17 INT14_2 - - 53 - INT15_1 External interrupt request 15 input pin 96 C4 116 74 INT15_2 - - 54 - NMIX Non-Maskable Interrupt input pin 92 B5 107 70

34 MB9B410R-DS706-00026-3v0-E, March 11, 2015

General-purpose I/O port 0 General-purpose I/O port 1 General-purpose I/O port 2

March 11, 2015, MB9B410R-DS706-00026-3v0-E 35 CONFIDENTIAL Module Pin name Function Pin No LQFP- 100 BGA- 112 LQFP- 120 QFP- 100 GPIO P30 General-purpose I/O port 3

9 E1 14 87

General-purpose I/O port 4 General-purpose I/O port 5

36 MB9B410R-DS706-00026-3v0-E, March 11, 2015

General-purpose I/O port 6 General-purpose I/O port 7 - - 51 - P71 - - 52 - P72 - - 53 - P73 - - 54 - P74 - - 55 - P80 General-purpose I/O port 8 98 A3 118 76 P81 99 A2 119 77 PE0 General-purpose I/O port E

46 K9 56 24

SIN0_0 Multi-function serial interface ch.0 input pin 73 C11 88 51 SIN0_1 56 H9 66 34 SOT0_0 (SDA0_0) Multi-function serial interface ch.0 output pin. This pin operates as SOT0 when it is used in a UART/CSIO/LIN (operation modes 0 to 3) and as SDA0 when it is used in an I2C (operation mode 4). SOT0_1 (SDA0_1) 57 H7 67 35 SCK0_0 (SCL0_0) Multi-function serial interface ch.0 clock I/O pin. This pin operates as SCK0 when it is used in a UART/CSIO/LIN (operation modes 0 to 3) and as SCL0 when it is used in an I2C (operation mode 4).

71 D10 86 49

SCK0_1 (SCL0_1) 58 G10 68 36 Multi- function Serial SIN1_0 Multi-function serial interface ch.1 input pin - - 8 - SIN1_1 53 J10 63 31 SOT1_0 (SDA1_0) Multi-function serial interface ch.1 output pin. This pin operates as SOT1 when it is used in a UART/CSIO/LIN (operation modes 0 to 3) and as SDA1 when it is used in an I2C (operation mode 4). - - 9 - SOT1_1 (SDA1_1) 54 J8 64 32 SCK1_0 (SCL1_0) Multi-function serial interface ch.1 clock I/O pin. This pin operates as SCK1 when it is used in a CSIO (operation modes 4) and as SCL1 when it is used in an I2C (operation mode 4). - - 10 - SCK1_1 (SCL1_1) 55 H10 65 33

March 11, 2015, MB9B410R-DS706-00026-3v0-E 37 CONFIDENTIAL Module Pin name Function Pin No. LQFP- 100 BGA- 112 LQFP- 120 QFP- 100 Multi- function Serial SIN2_0 Multi-function serial interface ch.2 input pin - - 53 - SIN2_1 - - 85 - SIN2_2 59 G9 69 37 SOT2_0 (SDA2_0) Multi-function serial interface ch.2 output pin. This pin operates as SOT2 when it is used in a UART/CSIO/LIN (operation modes 0 to 3) and as SDA2 when it is used in an I2C (operation mode 4). - - 54 - SOT2_1 (SDA2_1) - - 84 - SOT2_2 (SDA2_2) 63 G8 73 41 SCK2_0 (SCL2_0) Multi-function serial interface ch.2 clock I/O pin. This pin operates as SCK2 when it is used in a CSIO (operation modes 2) and as SCL2 when it is used in an I2C (operation mode 4). - - 55 - SCK2_1 (SCL2_1) - - 83 - SCK2_2 (SCL2_2) 64 F10 74 42 Multi- function Serial SIN3_0 Multi-function serial interface ch.3 input pin - - 110 - SIN3_1 2 C1 2 80 SIN3_2 39 K6 44 17 SOT3_0 (SDA3_0) Multi-function serial interface ch.3 output pin. This pin operates as SOT3 when it is used in a UART/CSIO/LIN (operation modes 0 to 3) and as SDA3 when it is used in an I2C (operation mode 4). - - 109 - SOT3_1 (SDA3_1) 3 C2 3 81 SOT3_2 (SDA3_2) 40 J6 45 18 SCK3_0 (SCL3_0) Multi-function serial interface ch.3 clock I/O pin. This pin operates as SCK3 when it is used in a CSIO (operation modes 2) and as SCL3 when it is used in an I2C (operation mode 4). - - 108 - SCK3_1 (SCL3_1) 4 B3 4 82 SCK3_2 (SCL3_2) 41 L7 46 19

38 MB9B410R-DS706-00026-3v0-E, March 11, 2015

SIN4_0 Multi-function serial interface ch.4 input pin SIN4_1 65 F9 75 43 SIN4_2 82 C8 97 60 SOT4_0 (SDA4_0) Multi-function serial interface ch.4 output pin. This pin operates as SOT4 when it is used in a UART/CSIO/LIN (operation modes 0 to 3) and as SDA4 when it is used in an I2C (operation mode 4). SOT4_1 (SDA4_1) 66 E11 76 44 SOT4_2 (SDA4_2) 83 D9 98 61 SCK4_0 (SCL4_0) Multi-function serial interface ch.4 clock I/O pin. This pin operates as SCK4 when it is used in a CSIO (operation modes 2) and as SCL4 when it is used in an I2C (operation mode 4). SCK4_1 (SCL4_1) 67 E10 77 45 SCK4_2 (SCL4_2) 84 A7 99 62 RTS4_0 Multi-function serial interface ch.4 RTS output pin RTS4_1 69 E9 79 47 RTS4_2 86 C7 101 64 CTS4_0 Multi-function serial interface ch.4 CTS input pin CTS4_1 68 F8 78 46 CTS4_2 85 B7 100 63 Multi- function Serial SIN5_0 Multi-function serial interface ch.5 input pin SIN5_1 93 D6 113 93 SIN5_2 15 F3 20 93 SOT5_0 (SDA5_0) Multi-function serial interface ch.5 output pin. This pin operates as SOT5 when it is used in a UART/CSIO/LIN (operation modes 0 to 3) and as SDA5 when it is used in an I2C (operation mode 4). SOT5_1 (SDA5_1) - - 112 - SOT5_2 (SDA5_2) 16 G1 21 94 SCK5_0 (SCL5_0) Multi-function serial interface ch.5 clock I/O pin. This pin operates as SCK5 when it is used in a CSIO (operation modes 2) and as SCL5 when it is used in an I2C (operation mode 4). SCK5_1 (SCL5_1) - - 111 - SCK5_2 (SCL5_2) 17 G2 22 95

March 11, 2015, MB9B410R-DS706-00026-3v0-E 39 CONFIDENTIAL Module Pin name Function Pin No LQFP- 100 BGA- 112 LQFP- 120 QFP- 100 Multi- function Serial SIN6_0 Multi-function serial interface ch.6 input pin 5 D1 5 83 SIN6_1 12 E4 17 90 SOT6_0 (SDA6_0) Multi-function serial interface ch.6 output pin. This pin operates as SOT6 when it is used in a UART/CSIO/LIN (operation modes 0 to 3) and as SDA6 when it is used in an I2C (operation mode 4). SOT6_1 (SDA6_1) 11 E3 16 89 SCK6_0 (SCL6_0) Multi-function serial interface ch.6 clock I/O pin. This pin operates as SCK6 when it is used in a CSIO (operation modes 2) and as SCL6 when it is used in an I2C (operation mode 4). SCK6_1 (SCL6_1) 10 E2 15 88 Multi- function Serial SIN7_0 Multi-function serial interface ch.7 input pin - - 11 - SIN7_1 45 K8 50 23 SOT7_0 (SDA7_0) Multi-function serial interface ch.7 output pin. This pin operates as SOT7 when it is used in a UART/CSIO/LIN (operation modes 0 to 3) and as SDA7 when it is used in an I2C (operation mode 4). - - 12 - SOT7_1 (SDA7_1) 44 J7 49 22 SCK7_0 (SCL7_0) Multi-function serial interface ch.7 clock I/O pin. This pin operates as SCK7 when it is used in a CSIO (operation modes 2) and as SCL7 when it is used in an I2C (operation mode 4). - - 13 - SCK7_1 (SCL7_1) 43 H6 48 21

40 MB9B410R-DS706-00026-3v0-E, March 11, 2015

DTTI0X_0 Input signal controlling wave form generator outputs RTO00 to RTO05 of Multi-function timer 0. DTTI0X_1 69 E9 79 47 FRCK0_0 16-bit free-run timer ch.0 external clock input pin

13 F1 18 91

FRCK0_1 70 D11 80 48 FRCK0_2 53 J10 63 31 IC00_0 16-bit input capture ch.0 input pin of Multi-function timer 0. ICxx describes channel number.

17 G2 22 95

IC00_1 65 F9 75 43 IC00_2 54 J8 64 32 IC01_0 16 G1 21 94 IC01_1 66 E11 76 44 IC01_2 55 H10 65 33 IC02_0 15 F3 20 93 IC02_1 67 E10 77 45 IC02_2 56 H9 66 34 IC03_0 14 F2 19 92 IC03_1 68 F8 78 46 IC03_2 57 H7 67 35 RTO00_0 (PPG00_0) Wave form generator output pin of Multi-function timer 0. This pin operates as PPG00 when it is used in PPG0 output modes. RTO00_1 (PPG00_1) - - 86 - RTO01_0 (PPG00_0) Wave form generator output pin of Multi-function timer 0. This pin operates as PPG00 when it is used in PPG0 output modes. RTO01_1 (PPG00_1) - - 85 - RTO02_0 (PPG02_0) Wave form generator output pin of Multi-function timer 0. This pin operates as PPG02 when it is used in PPG0 output modes. RTO02_1 (PPG02_1) - - 84 - RTO03_0 (PPG02_0) Wave form generator output pin of Multi-function timer 0. This pin operates as PPG02 when it is used in PPG0 output modes. RTO03_1 (PPG02_1) - - 83 - RTO04_0 (PPG04_0) Wave form generator output pin of Multi-function timer 0. This pin operates as PPG04 when it is used in PPG0 output modes. RTO04_1 (PPG04_1) - - 82 - RTO05_0 (PPG04_0) Wave form generator output pin of Multi-function timer 0. This pin operates as PPG04 when it is used in PPG0 output modes. RTO05_1 (PPG04_1) - - 81 -

March 11, 2015, MB9B410R-DS706-00026-3v0-E 41 CONFIDENTIAL Module Pin name Function Pin No LQFP- 100 BGA- 112 LQFP- 120 QFP- 100 Multi- function Timer DTTI1X_0 Input signal controlling wave form generator outputs RTO10 to RTO15 of Multi-function timer 1.

8 D5 8 86

DTTI1X_1 39 K6 44 17 FRCK1_0 16-bit free-run timer ch.1 external clock input pin FRCK1_1 44 J7 49 22 IC10_0 16-bit input capture ch.1 input pin of Multi-function timer 1. ICxx describes channel number. IC10_1 40 J6 45 18 IC11_0 89 B6 104 67 IC11_1 41 L7 46 19 IC12_0 90 C6 105 68 IC12_1 42 K7 47 20 IC13_0 91 A5 106 69 IC13_1 43 H6 48 21 RTO10_0 (PPG10_0) Wave form generator output pin of Multi-function timer 1. This pin operates as PPG10 when it is used in PPG1 output modes. RTO10_1 (PPG10_1) 27 J4 32 5 RTO11_0 (PPG10_0) Wave form generator output pin of Multi-function timer 1. This pin operates as PPG10 when it is used in PPG1 output modes. RTO11_1 (PPG10_1) 28 L5 33 6 RTO12_0 (PPG12_0) Wave form generator output pin of Multi-function timer 1. This pin operates as PPG12 when it is used in PPG1 output modes. RTO12_1 (PPG12_1) 29 K5 34 7 RTO13_0 (PPG12_0) Wave form generator output pin of Multi-function timer 1. This pin operates as PPG12 when it is used in PPG1 output modes. RTO13_1 (PPG12_1) 30 J5 35 8 RTO14_0 (PPG14_0) Wave form generator output pin of Multi-function timer 1. This pin operates as PPG14 when it is used in PPG1 output modes. RTO14_1 (PPG14_1) 31 H5 36 9 RTO15_0 (PPG14_0) Wave form generator output pin of Multi-function timer 1. This pin operates as PPG14 when it is used in PPG1 output modes. RTO15_1 (PPG14_1) 32 L6 37 10

42 MB9B410R-DS706-00026-3v0-E, March 11, 2015

DTTI2X_0 Input signal controlling wave form generator outputs RTO20 to RTO25 of Multi-function timer 2. DTTI2X_1 92 B5 107 70 FRCK2_0 16-bit free-run timer ch.2 external clock input pin FRCK2_1 - - 112 - IC20_0 16-bit input capture ch.2 input pin of Multi-function timer 2. ICxx describes channel number. IC20_1 - - 108 - IC21_0 89 B6 104 67 IC21_1 - - 109 - IC22_0 90 C6 105 68 IC22_1 - - 110 - IC23_0 91 A5 106 69 IC23_1 - - 111 - RTO20_0 (PPG20_0) Wave form generator output pin of Multi-function timer 2. This pin operates as PPG20 when it is used in PPG2 output modes. - - 113 - RTO20_1 (PPG20_1) 86 C7 101 64 RTO21_0 (PPG20_0) Wave form generator output pin of Multi-function timer 2. This pin operates as PPG20 when it is used in PPG2 output modes. - - 112 - RTO21_1 (PPG20_1) 87 D7 102 65 RTO22_0 (PPG22_0) Wave form generator output pin of Multi-function timer 2. This pin operates as PPG22 when it is used in PPG2 output modes. - - 111 - RTO22_1 (PPG22_1) 88 A6 103 66 RTO23_0 (PPG22_0) Wave form generator output pin of Multi-function timer 2. This pin operates as PPG22 when it is used in PPG2 output modes. - - 110 - RTO23_1 (PPG22_1) 89 B6 104 67 RTO24_0 (PPG24_0) Wave form generator output pin of Multi-function timer 2. This pin operates as PPG24 when it is used in PPG2 output modes. - - 109 - RTO24_1 (PPG24_1) 90 C6 105 68 RTO25_0 (PPG24_0) Wave form generator output pin of Multi-function timer 2. This pin operates as PPG24 when it is used in PPG2 output modes. - - 108 - RTO25_1 (PPG24_1) 91 A5 106 69

March 11, 2015, MB9B410R-DS706-00026-3v0-E 43 CONFIDENTIAL Module Pin name Function Pin No LQFP- 100 BGA- 112 LQFP- 120 QFP- 100 Quadrature Position/ Revolution Counter AIN0_0 QPRC ch.0 AIN input pin AIN0_1 40 J6 45 18 AIN0_2 2 C1 2 80 BIN0_0 QPRC ch.0 BIN input pin

10 E2 15 88

BIN0_1 41 L7 46 19 BIN0_2 3 C2 3 81 ZIN0_0 QPRC ch.0 ZIN input pin

11 E3 16 89

ZIN0_1 42 K7 47 20 ZIN0_2 4 B3 4 82 Quadrature Position/ Revolution Counter AIN1_1 QPRC ch.1 AIN input pin 74 C10 89 52 AIN1_2 43 H6 48 21 BIN1_1 QPRC ch.1 BIN input pin 73 C11 88 51 BIN1_2 44 J7 49 22 ZIN1_1 QPRC ch.1 ZIN input pin 72 E8 87 50 ZIN1_2 45 K8 50 23 Quadrature Position/ Revolution Counter AIN2_0 QPRC ch.2 AIN input pin - - 10 - AIN2_1 83 D9 98 61 BIN2_0 QPRC ch.2 BIN input pin - - 11 - BIN2_1 84 A7 99 62 ZIN2_0 QPRC ch.2 ZIN input pin - - 12 - ZIN2_1 85 B7 100 63 Real-time clock RTCCO_0 0.5 seconds pulse output pin of Real-time clock RTCCO_1 55 H10 65 33 RTCCO_2 19 G3 24 97 SUBOUT_0 Sub clock output pin SUBOUT_1 55 H10 65 33 SUBOUT_2 19 G3 24 97

44 MB9B410R-DS706-00026-3v0-E, March 11, 2015

RESET INITX External Reset Input pin. A reset is valid when INITX="L". 38 K4 43 16 Mode MD0 Mode 0 pin. During normal operation, MD0="L" must be input. During serial programming to Flash memory, MD0="H" must be input.

47 L8 57 25

Mode 1 pin. During serial programming to Flash memory, MD1="L" must be input. POWER VCC Power supply Pin 1 B1 1 79 VCC Power supply Pin 26 J1 31 4 VCC Power supply Pin 35 K1 40 13 VCC Power supply Pin 51 K11 61 29 VCC Power supply Pin 76 A10 91 54 VCC Power supply Pin 97 A4 117 75 GND VSS GND Pin - B2 - VSS GND Pin 25 L1 30 3 VSS GND Pin - K2 - VSS GND Pin - J3 - VSS GND Pin - H4 - VSS GND Pin 34 L4 39 12 VSS GND Pin 50 L11 60 28 VSS GND Pin - K10 - VSS GND Pin - J9 - VSS GND Pin - H8 - VSS GND Pin - B10 - VSS GND Pin - C9 - VSS GND Pin 75 A11 90 53 VSS GND Pin - D8 - VSS GND Pin - D4 - VSS GND Pin - C3 - VSS GND Pin 100 A1 120 78 CLOCK X0 Main clock (oscillation) input pin 48 L9 58 26 X0A Sub clock (oscillation) input pin 36 L3 41 14 X1 Main clock (oscillation) I/O pin 49 L10 59 27 X1A Sub clock (oscillation) I/O pin 37 K3 42 15 CROUT_0 Built-in high-speed CR-osc clock output port 74 C10 89 52 CROUT_1 92 B5 107 70 Analog POWER A VCC A/D converter analog power pin 60 H11 70 38 A VRH A/D converter analog reference voltage input pin 61 F11 71 39 Analog GND A VSS A/D converter GND pin 62 G11 72 40 C pin C Power stabilization capacity pin 33 L2 38 11

March 11, 2015, MB9B410R-DS706-00026-3v0-E 45 CONFIDENTIAL  I/O Circuit Type Type Circuit Remarks A It is possible to select the main oscillation / GPIO function When the main oscillation is selected. ・ Oscillation feedback resistor : Approximately 1 MΩ ・ With Standby mode control When the GPIO is selected. ・ CMOS level output. ・ CMOS level hysteresis input ・ With pull-up resistor control ・ With standby mode control ・ Pull-up resistor : Approximately 50 kΩ ・ IOH = -4 mA, IOL = 4 mA B ・ CMOS level hysteresis input ・ Pull-up resistor : Approximately 50 kΩ P-ch P-ch N-ch R R P-ch P-ch N-ch Pull-up resistor Feedback resistor Pull-up resistor Digital output Digital output Pull-up resistor control Digital input Standby mode Control Clock input Standby mode Control Digital input Standby mode Control Digital output Digital output Pull-up resistor control Pull-up resistor Digital input

46 MB9B410R-DS706-00026-3v0-E, March 11, 2015

C N-ch ・ Open drain output ・ CMOS level hysteresis input D It is possible to select the sub oscillation / GPIO function When the sub oscillation is selected. ・ Oscillation feedback resistor : Approximately 5 MΩ ・ With Standby mode control When the GPIO is selected. ・ CMOS level output. ・ CMOS level hysteresis input ・ With pull-up resistor control ・ With standby mode control ・ Pull-up resistor : Approximately 50 kΩ ・ IOH = -4 mA, IOL= 4 mA P-ch P-ch N-ch R R P-ch P-ch N-ch X0A X1A Pull-up resistor Feedback resistor Pull-up resistor Digital input Digital output Digital output Digital output Pull-up resistor control Digital input Standby mode Control Clock input Standby mode Control Digital input Standby mode Control Digital output Digital output Pull-up resistor control

March 11, 2015, MB9B410R-DS706-00026-3v0-E 47 CONFIDENTIAL Type Circuit Remarks E P-chP-ch N-ch R ・ CMOS level output ・ CMOS level hysteresis input ・ With pull-up resistor control ・ With standby mode control ・ Pull-up resistor : Approximately 50 kΩ ・ IOH = -4 mA, IOL = 4 mA ・ When this pin is used as an I2C pin, the digital output P-ch transistor is always off ・ +B input is available F P-chP-ch N-ch R ・ CMOS level output ・ CMOS level hysteresis input ・ With input control ・ Analog input ・ With pull-up resistor control ・ With standby mode control ・ Pull-up resistor : Approximately 50 kΩ ・ IOH = -4 mA, IOL = 4 mA ・ When this pin is used as an I2C pin, the digital output P-ch transistor is always off ・ +B input is available Digital output Digital output Pull-up resistor control Digital input Standby mode Control Digital output Digital output Pull-up resistor control Digital input Standby mode Control Analog input Input control

48 MB9B410R-DS706-00026-3v0-E, March 11, 2015

G P-chP-ch N-ch R ・ CMOS level output ・ CMOS level hysteresis input ・ With pull-up resistor control ・ With standby mode control ・ Pull-up resistor : Approximately 50 kΩ ・ IOH= -12 mA, IOL= 12 mA ・ +B input is available H P-ch N-ch R ・ CMOS level output ・ CMOS level hysteresis input ・ With standby mode control ・ IOH= -20.5 mA, IOL= 18.5 mA Digital output Digital output Pull-up resistor control Digital input Standby mode Control Digital output Digital output Digital input Standby mode Control

March 11, 2015, MB9B410R-DS706-00026-3v0-E 49 CONFIDENTIAL Type Circuit Remarks I P-chP-ch N-ch R ・ CMOS level output ・ CMOS level hysteresis input ・ With pull-up resistor control ・ 5 V tolerant ・ With standby mode control ・ IOH = -4 mA, IOL = 4 mA ・ Available to control of PZR registers. ・ When this pin is used as an I2C pin, the digital output P-ch transistor is always off J CMOS level hysteresis input Digital output Digital output Pull-up resistor control Digital input Standby mode Control Mode input

50 MB9B410R-DS706-00026-3v0-E, March 11, 2015

 Handling Precations Any semiconductor devices have inherently a certain rate of failure. The possibility of failure is greatly affected by the conditions in which they are used (circuit conditions, environmental conditions, etc.). This page describes precautions that must be observed to minimize the chance of failure and to obtain higher reliability from your Spansion semiconductor devices. 1. Precautions for Product Design This section describes precautions when designing electronic equipment using semiconductor devices. ・Absolute Maximum Ratings Semiconductor devices can be permanently damaged by application of stress (voltage, current, temperature, etc.) in excess of certain established limits, called absolute maximum ratings. Do not exceed these ratings. ・Recommended Operating Conditions Recommended operating conditions are normal operating ranges for the semiconductor device. All the device's electrical characteristics are warranted when operated within these ranges. Always use semiconductor devices within the recommended operating conditions. Operation outside these ranges may adversely affect reliability and could result in device failure. No warranty is made with respect to uses, operating conditions, or combinations not represented on the data sheet. Users considering application outside the listed conditions are advised to contact their sales representative beforehand. ・Processing and Protection of Pins These precautions must be followed when handling the pins which connect semiconductor devices to power supply and input/output functions. (1) Preventing Over-V oltage and Over-Current Conditions Exposure to voltage or current levels in excess of maximum ratings at any pin is likely to cause deterioration within the device, and in extreme cases leads to permanent damage of the device. Try to prevent such overvoltage or over-current conditions at the design stage. (2) Protection of Output Pins Shorting of output pins to supply pins or other output pins, or connection to large capacitance can cause large current flows. Such conditions if present for extended periods of time can damage the device. Therefore, avoid this type of connection. (3) Handling of Unused Input Pins Unconnected input pins with very high impedance levels can adversely affect stability of operation. Such pins should be connected through an appropriate resistance to a power supply pin or ground pin. ・Latch-up Semiconductor devices are constructed by the formation of P-type and N-type areas on a substrate. When subjected to abnormally high voltages, internal parasitic PNPN junctions (called thyristor structures) may be formed, causing large current levels in excess of several hundred mA to flow continuously at the power supply pin. This condition is called latch-up. CAUTION: The occurrence of latch-up not only causes loss of reliability in the semiconductor device, but can cause injury or damage from high heat, smoke or flame. To prevent this from happening, do the following: (1) Be sure that voltages applied to pins do not exceed the absolute maximum ratings. This should include attention to abnormal noise, surge levels, etc. (2) Be sure that abnormal current flows do not occur during the power-on sequence. Code: DS00-00004-3E

March 11, 2015, MB9B410R-DS706-00026-3v0-E 51 CONFIDENTIAL ・Observance of Safety Regulations and Standards Most countries in the world have established standards and regulations regarding safety, protection from electromagnetic interference, etc. Customers are requested to observe applicable regulations and standards in the design of products. ・Fail-Safe Design Any semiconductor devices have inherently a certain rate of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions. ・Precautions Related to Usage of Devices Spansion semiconductor devices are intended for use in standard applications (computers, office automation and other office equipment, industrial, communications, and measurement equipment, personal or household devices, etc.). CAUTION: Customers considering the use of our products in special applications where failure or abnormal operation may directly affect human lives or cause physical injury or property damage, or where extremely high levels of reliability are demanded (such as aerospace systems, atomic energy controls, sea floor repeaters, vehicle operating controls, medical devices for life support, etc.) are requested to consult with sales representatives before such use. The company will not be responsible for damages arising from such use without prior approval. 2. Precautions for Package Mounting Package mounting may be either lead insertion type or surface mount type. In either case, for heat resistance during soldering, you should only mount under Spansion's recommended conditions. For detailed information about mount conditions, contact your sales representative. ・Lead Insertion Type Mounting of lead insertion type packages onto printed circuit boards may be done by two methods: direct soldering on the board, or mounting by using a socket. Direct mounting onto boards normally involves processes for inserting leads into through-holes on the board and using the flow soldering (wave soldering) method of applying liquid solder. In this case, the soldering process usually causes leads to be subjected to thermal stress in excess of the absolute ratings for storage temperature. Mounting processes should conform to Spansion recommended mounting conditions. If socket mounting is used, differences in surface treatment of the socket contacts and IC lead surfaces can lead to contact deterioration after long periods. For this reason it is recommended that the surface treatment of socket contacts and IC leads be verified before mounting. ・Surface Mount Type Surface mount packaging has longer and thinner leads than lead-insertion packaging, and therefore leads are more easily deformed or bent. The use of packages with higher pin counts and narrower pin pitch results in increased susceptibility to open connections caused by deformed pins, or shorting due to solder bridges. You must use appropriate mounting techniques. Spansion recommends the solder reflow method, and has established a ranking of mounting conditions for each product. Users are advised to mount packages in accordance with Spansion ranking of recommended conditions.

52 MB9B410R-DS706-00026-3v0-E, March 11, 2015

・Lead-Free Packaging CAUTION: When ball grid array (BGA) packages with Sn-Ag-Cu balls are mounted using Sn-Pb eutectic soldering, junction strength may be reduced under some conditions of use. ・Storage of Semiconductor Devices Because plastic chip packages are formed from plastic resins, exposure to natural environmental conditions will cause absorption of moisture. During mounting, the application of heat to a package that has absorbed moisture can cause surfaces to peel, reducing moisture resistance and causing packages to crack. To prevent, do the following: (1) Avoid exposure to rapid temperature changes, which cause moisture to condense inside the product. Store products in locations where temperature changes are slight. (2) Use dry boxes for product storage. Products should be stored below 70% relative humidity, and at temperatures between 5°C and 30°C. When you open Dry Package that recommends humidity 40% to 70% relative humidity. (3) When necessary, Spansion packages semiconductor devices in highly moisture-resistant aluminum laminate bags, with a silica gel desiccant. Devices should be sealed in their aluminum laminate bags for storage. (4) Avoid storing packages where they are exposed to corrosive gases or high levels of dust. ・Baking Packages that have absorbed moisture may be de-moisturized by baking (heat drying). Follow the Spansion recommended conditions for baking. Condition: 125°C/24 h ・Static Electricity Because semiconductor devices are particularly susceptible to damage by static electricity, you must take the following precautions: (1) Maintain relative humidity in the working environment between 40% and 70%. Use of an apparatus for ion generation may be needed to remove electricity. (2) Electrically ground all conveyors, solder vessels, soldering irons and peripheral equipment. (3) Eliminate static body electricity by the use of rings or bracelets connected to ground through high resistance (on the level of 1 MΩ). Wearing of conductive clothing and shoes, use of conductive floor mats and other measures to minimize shock loads is recommended. (4) Ground all fixtures and instruments, or protect with anti-static measures. (5) Avoid the use of styrofoam or other highly static-prone materials for storage of completed board assemblies.

March 11, 2015, MB9B410R-DS706-00026-3v0-E 53 CONFIDENTIAL 3. Precautions for Use Environment Reliability of semiconductor devices depends on ambient temperature and other conditions as described above. For reliable performance, do the following: (1) Humidity Prolonged use in high humidity can lead to leakage in devices as well as printed circuit boards. If high humidity levels are anticipated, consider anti-humidity processing. (2) Discharge of Static Electricity When high-voltage charges exist close to semiconductor devices, discharges can cause abnormal operation. In such cases, use anti-static measures or processing to prevent discharges. (3) Corrosive Gases, Dust, or Oil Exposure to corrosive gases or contact with dust or oil may lead to chemical reactions that will adversely affect the device. If you use devices in such conditions, consider ways to prevent such exposure or to protect the devices. (4) Radiation, Including Cosmic Radiation Most devices are not designed for environments involving exposure to radiation or cosmic radiation. Users should provide shielding as appropriate. (5) Smoke, Flame CAUTION: Plastic molded devices are flammable, and therefore should not be used near combustible substances. If devices begin to smoke or burn, there is danger of the release of toxic gases. Customers considering the use of Spansion products in other special environmental conditions should consult with sales representatives. Please check the latest handling precautions at the following URL. http://www.spansion.com/fjdocuments/fj/datasheet/e-ds/DS00-00004.pdf

54 MB9B410R-DS706-00026-3v0-E, March 11, 2015

 Handling Devices  Power supply pins In products with multiple VCC and VSS pins, respective pins at the same potential are interconnected within the device in order to prevent malfunctions such as latch-up. However, all of these pins should be connected externally to the power supply or ground lines in order to reduce electromagnetic emission levels, to prevent abnormal operation of strobe signals caused by the rise in the ground level, and to conform to the total output current rating. Moreover, connect the current supply source with each POWER pins and GND pins of this device at low impedance. It is also advisable that a ceramic capacitor of approximately 0.1 µF be connected as a bypass capacitor between each Power supply pin and GND pin, between A VCC pin and A VSS pin near this device.  Stabilizing power supply voltage A malfunction may occur when the power supply voltage fluctuates rapidly even though the fluctuation is within the recommended operating conditions of the VCC power supply voltage. As a rule, with voltage stabilization, suppress the voltage fluctuation so that the fluctuation in VCC ripple (peak-to-peak value) at the commercial frequency (50 Hz/60 Hz) does not exceed 10% of the VCC value in the recommended operating conditions, and the transient fluctuation rate does not exceed 0.1 V/μs when there is a momentary fluctuation on switching the power supply.  Crystal oscillator circuit Noise near the X0/X1 and X0A/X1A pins may cause the device to malfunction. Design the printed circuit board so that X0/X1, X0A/X1A pins, the crystal oscillator (or ceramic oscillator), and the bypass capacitor to ground are located as close to the device as possible. It is strongly recommended that the PC board artwork be designed such that the X0/X1 and X0A/X1A pins are surrounded by ground plane as this is expected to produce stable operation. Evaluate oscillation of your using crystal oscillator by your mount board.  Using an external clock When using an external clock, the clock signal should be input to the X0, X0A pin only and the X1, X1A pin should be kept open.  Handling when using Multi-function serial pin as I2C pin If it is using multi-function serial pin as I2C pins, P-ch transistor of digital output is always disable. However, I2C pins need to keep the electrical characteristic like other pins and not to connect to external I2C bus system with power OFF.  Example of Using an External Clock Device X0(X0A) X1(X1A) Open

March 11, 2015, MB9B410R-DS706-00026-3v0-E 55 CONFIDENTIAL  C Pin This series contains the regulator. Be sure to connect a smoothing capacitor (CS) for the regulator between the C pin and the GND pin. Please use a ceramic capacitor or a capacitor of equivalent frequency characteristics as a smoothing capacitor. However, some laminated ceramic capacitors have the characteristics of capacitance variation due to thermal fluctuation (F characteristics and Y5V characteristics). Please select the capacitor that meets the specifications in the operating conditions to use by evaluating the temperature characteristics of a capacitor. A smoothing capacitor of about 4.7μF would be recommended for this series.  Mode pins (MD0) Connect the MD pin (MD0) directly to VCC or VSS pins. Design the printed circuit board such that the pull-up/down resistance stays low, as well as the distance between the mode pins and VCC pins or VSS pins is as short as possible and the connection impedance is low, when the pins are pulled-up/down such as for switching the pin level and rewriting the Flash memory data. It is because of preventing the device erroneously switching to test mode due to noise.  Notes on power-on Turn power on/off in the following order or at the same time. If not using the A/D converter, connect A VCC = VCC and A VSS = VSS. Turning on : VCC → AVCC → AVRH Turning off : A VRH → AVCC → VCC  Serial Communication There is a possibility to receive wrong data due to the noise or other causes on the serial communication. Therefore, design a printed circuit board so as to avoid noise. Consider the case of receiving wrong data due to noise, perform error detection such as by applying a checksum of data at the end. If an error is detected, retransmit the data.  Differences in features among the products with different memory sizes and between Flash products and MASK products The electric characteristics including power consumption, ESD, latch-up, noise characteristics, and oscillation characteristics among the products with different memory sizes and between Flash products and MASK products are different because chip layout and memory structures are different. If you are switching to use a different product of the same series, please make sure to evaluate the electric characteristics.  Pull-Up function of 5 V tolerant I/O Please do not input the signal more than VCC voltage at the time of Pull-Up function use of 5 V tolerant I/O. Device C VSS CS GND

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 Block Diagram MainFlash I/F Cortex-M3 Core 144MHz(Max) Clock Reset Generator Dual-Timer Watchdog Timer (Hardware) DMAC 8ch. Multi-function Timer x 3 Multi-function Serial I/F 8ch. (with FIFO ch.4-ch.7) HW flow control(ch.4) 16-bit Free-run Timer 3ch. 16-bit Output Compare 6ch. 16-bit Input Capture 4ch. Waveform Generator 3ch. A/D Activation Compare 3ch. 16-bit PPG 3ch. Watch Counter GPIO CSV External Interrupt Controller 16-pin + NMI TPIU ROM Table ETM SRAM0 8/16/24/32Kbyte SWJ-DP SRAM1 8/16/24/32KbyteI D Sys MB9BF412N/R, MB9BF414N/R, MB9BF415N/R, MB9BF416N/R Base Timer 16-bit 8ch./ 32-bit 4ch. NVIC Watchdog Timer (Software) Security TRSTX,TCK, TDI,TMS TRACED[3:0], TRACECLK TIOA[7:0] TIOB[7:0] IC0[3:0] DTTI[2:0]X RTO0[5:0] FRCK[2:0] TDO SCK[7:0] SIN[7:0] SOT[7:0] INT[15:00] NMIX P0[F:0], P1[F:0], Px[x:0] INITX MODE-Ctrl IRQ-Monitor PIN-Function-Ctrl MD[1:0] QPRC 3ch. AIN[2:0] BIN[2:0] ZIN[2:0] LVD Ctrl CRC Accelerator IC1[3:0] RTS4 CTS4 External Bus I/F MAD[24:00] MADATA[15:00] MCSX[7:0], MALE, MOEX,MWEX, MNALE, MNCLE, MNWEX, MNREX, MDQM[1:0] RTO1[5:0] MPU Trace Buffer (16Kbyte) IC2[3:0] RTO2[5:0] TX1, RX1 CAN TX0, RX0 CAN MainFlash 128Kbyte/ 256Kbyte/ 384Kbyte/ 512Kbyte LVD Power On Reset Regulator C WorkFlash 32KbyteWorkFlash I/F AHB-AHB Bridge CAN Prescaler Real-Time Clock RTCCO SUBOUT MRDY Unit 0 12-bit A/D Converter × 3 Unit 1 Unit 2 AVCC, AVSS, AVRH AN[15:00] ADTG[8:0] X0A PLL CLK CR 100kHz Source Clock CROUT Main Osc Sub Osc CR 4MHz AHB-APB Bridge: APB0(Max 72MHz) Multi-layer AHB (Max 144MHz) AHB-APB Bridge : APB1 (Max 72MHz) AHB-APB Bridge : APB2 (Max 72MHz)  Memory Size See "Product Lineup" of "  Memory size" to confirm the memory size.

March 11, 2015, MB9B410R-DS706-00026-3v0-E 57 CONFIDENTIAL  Memory Map  Memory Map (1) Peripherals Area 0x41FF_FFFF Reserved 0x4006_4000 0x4006_3000 CAN ch.1 0x4006_2000 CAN ch.0 0x4006_1000 Reserved 0x4006_0000 DMAC Reserved 0x4004_0000 0x4003_F000 EXT-bus I/F 0x4003_C000 Reserved 0x4003_B000 RTC 0x4003_A000 Watch Counter 0x4003_9000 CRC 0x4003_8000 MFS 0x4003_7000 CAN Prescaler 0x4003_6000 Reserved 0x4003_5000 LVD Ctrl 0x4003_4000 Reserved 0x4003_3000 GPIO 0x4003_2000 Reserved 0x4003_1000 Int-Req. Read 0x4003_0000 EXTI 0x4002_F000 Reserved 0x4002_E000 CR Trim 0x4002_8000 Reserved 0x4002_7000 A/DC 0x4002_6000 QPRC 0x4002_5000 Base Timer 0x4002_4000 PPG 0x4002_3000 Reserved 0x4002_2000 MFT unit2 0x4002_1000 MFT unit1 0x4002_0000 MFT unit0 0x4001_6000 Reserved 0x4001_5000 Dual Timer 0x4001_3000 Reserved 0x4001_2000 SW WDT 0x4001_1000 HW WDT 0x4001_0000 Clock/Reset 0x4000_1000 Reserved 0x4000_0000 MainFlash I/F 0xFFFF_FFFF Reserved 0xE010_0000 0xE000_0000 Cortex-M3 Private Peripherals 0x7000_0000 Reserved 0x6000_0000 External Device Area 0x4400_0000 Reserved 0x4200_0000 32Mbyte Bit band alias 0x4000_0000 Peripherals 0x2400_0000 Reserved 0x2200_0000 32Mbyte Bit band alias 0x200E_1000 Reserved See the next page "Memory Map (2), (3)" for the memory size details. 0x200E_0000 WorkFlash I/F 0x200C_0000 WorkFlash 0x2008_0000 Reserved 0x2000_0000 SRAM1 0x1FFF_0000 SRAM0 0x0010_2000 Reserved 0x0010_0000 Security/CR Trim 0x0000_0000 MainFlash

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 Memory Map (2) *: See "MB9B510R/410R/310R/110R Series Flash programming Manual" for sector structure of Flash. MB9BF416N/R 0x200E_0000 Reserved WorkFlash 32Kbyte 0x200C_8000 0x200C_0000 SA0-3 (8KBx4) 0x2000_8000 Reserved 0x2000_0000 SRAM1 32Kbyte 0x1FFF_8000 SRAM0 32Kbyte 0x0010_2000 Reserved 0x0010_1000 CR trimming 0x0010_0000 Security 0x0008_0000 Reserved 0x0000_0000 SA10-15 (64KBx6) MainFlash 512Kbyte SA8-9 (48KBx2) SA4-7 (8KBx4) MB9BF415N/R 0x200E_0000 Reserved WorkFlash 32Kbyte 0x200C_8000 0x200C_0000 SA0-3 (8KBx4) 0x2000_6000 Reserved 0x2000_0000 SRAM1 24Kbyte 0x1FFF_A000 SRAM0 24Kbyte 0x0010_2000 Reserved 0x0010_1000 CR trimming 0x0010_0000 Security 0x0006_0000 Reserved 0x0000_0000 SA10-13 (64KBx4) MainFlash 384Kbyte SA8-9 (48KBx2) SA4-7 (8KBx4)

March 11, 2015, MB9B410R-DS706-00026-3v0-E 59 CONFIDENTIAL  Memory Map (3) *: See "MB9B510R/410R/310R/110R Series Flash programming Manual" for sector structure of Flash. MB9BF414N/R 0x200E_0000 Reserved WorkFlash 32Kbyte 0x200C_8000 0x200C_0000 SA0-3 (8KBx4) 0x2000_4000 Reserved 0x2000_0000 SRAM1 16Kbyte 0x1FFF_C000 SRAM0 16Kbyte 0x0010_2000 Reserved 0x0010_1000 CR trimming 0x0010_0000 Security 0x0004_0000 Reserved 0x0000_0000 SA10-11 (64KBx2) MainFlash 256Kbyte SA8-9 (48KBx2) SA4-7 (8KBx4) MB9BF412N/R 0x200E_0000 Reserved WorkFlash 32Kbyte 0x200C_8000 0x200C_0000 SA0-3 (8KBx4) 0x2000_2000 Reserved 0x2000_0000 SRAM1 8Kbyte 0x1FFF_E000 SRAM0 8Kbyte 0x0010_2000 Reserved 0x0010_1000 CR trimming 0x0010_0000 Security 0x0002_0000 Reserved 0x0000_0000 SA8-9 (48KBx2) MainFlash 128Kbyte SA4-7 (8KBx4)

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 Peripheral Address Map Start address End address Bus Peripherals 0x4000_0000 0x4000_0FFF AHB MainFlash I/F register 0x4000_1000 0x4000_FFFF Reserved 0x4001_0000 0x4001_0FFF APB0 Clock/Reset Control 0x4001_1000 0x4001_1FFF Hardware Watchdog timer 0x4001_2000 0x4001_2FFF Software Watchdog timer 0x4001_3000 0x4001_4FFF Reserved 0x4001_5000 0x4001_5FFF Dual-Timer 0x4001_6000 0x4001_FFFF Reserved 0x4002_0000 0x4002_0FFF APB1 Multi-function timer unit0 0x4002_1000 0x4002_1FFF Multi-function timer unit1 0x4002_2000 0x4002_3FFF Multi-function timer unit2 0x4002_4000 0x4002_4FFF PPG 0x4002_5000 0x4002_5FFF Base Timer 0x4002_6000 0x4002_6FFF Quadrature Position/Revolution Counter 0x4002_7000 0x4002_7FFF A/D Converter 0x4002_8000 0x4002_DFFF Reserved 0x4002_E000 0x4002_EFFF Internal CR trimming 0x4002_F000 0x4002_FFFF Reserved 0x4003_0000 0x4003_0FFF APB2 External Interrupt Controller 0x4003_1000 0x4003_1FFF Interrupt Request Batch-Read Function 0x4003_2000 0x4003_2FFF Reserved 0x4003_3000 0x4003_3FFF GPIO 0x4003_4000 0x4003_4FFF Reserved 0x4003_5000 0x4003_5FFF Low-V oltage Detector 0x4003_6000 0x4003_6FFF Reserved 0x4003_7000 0x4003_7FFF CAN prescaler 0x4003_8000 0x4003_8FFF Multi-function serial Interface 0x4003_9000 0x4003_9FFF CRC 0x4003_A000 0x4003_AFFF Watch Counter 0x4003_B000 0x4003_BFFF Real-time clock 0x4003_C000 0x4003_EFFF Reserved 0x4003_F000 0x4003_FFFF External Memory interface 0x4004_0000 0x4005_FFFF AHB Reserved 0x4006_0000 0x4006_0FFF DMAC register 0x4006_1000 0x4006_1FFF Reserved 0x4006_2000 0x4006_2FFF CAN ch.0 0x4006_3000 0x4006_3FFF CAN ch.1 0x4006_4000 0x41FF_FFFF Reserved 0x200E_0000 0x200E_FFFF WorkFlash I/F register

March 11, 2015, MB9B410R-DS706-00026-3v0-E 61 CONFIDENTIAL  Pin Status in Each CPU State The terms used for pin status have the following meanings. ・ INITX=0 This is the period when the INITX pin is the "L" level. ・ INITX=1 This is the period when the INITX pin is the "H" level. ・ SPL=0 This is the status that standby pin level setting bit (SPL) in standby mode control register (STB_CTL) is set to "0". ・ SPL=1 This is the status that standby pin level setting bit (SPL) in standby mode control register (STB_CTL) is set to "1". ・ Input enabled Indicates that the input function can be used. ・ Internal input fixed at "0" This is the status that the input function cannot be used. Internal input is fixed at "L". ・ Hi-Z Indicates that the output drive transistor is disabled and the pin is put in the Hi-Z state. ・ Setting disabled Indicates that the setting is disabled. ・ Maintain previous state Maintains the state that was immediately prior to entering the current mode. If a built-in peripheral function is operating, the output follows the peripheral function. If the pin is being used as a port, that output is maintained. ・ Analog input is enabled Indicates that the analog input is enabled. ・ Trace output Indicates that the trace function can be used.

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 List of Pin Status Pin status type Function group Power-on reset or low-voltage detection state INITX input state Device internal reset state Run mode or sleep mode state Timer mode or sleep mode state Power supply unstable Power supply stable Power supply stable Power supply stable - INITX=0 INITX=1 INITX=1 INITX=1 - - - - SPL=0 SPL=1 A GPIO selected Setting disabled Setting disabled Setting disabled Maintain previous state Maintain previous state Hi-Z/ Internal input fixed at "0" Main crystal oscillator input pin Input enabled Input enabled Input enabled Input enabled Input enabled Input enabled B GPIO selected Setting disabled Setting disabled Setting disabled Maintain previous state Maintain previous state Hi-Z/ Internal input fixed at "0" Main crystal oscillator output pin Hi-Z/ Internal input fixed at "0"/ or Input enable Hi-Z/ Internal input fixed at "0" Hi-Z/ Internal input fixed at "0" Maintain previous state Maintain previous state/ Hi-Z at oscillation stop*1/ Internal input fixed at "0" Maintain previous state/ Hi-Z at oscillation stop*1/ Internal input fixed at "0" C INITX input pin Pull-up/ Input enabled Pull-up/ Input enabled Pull-up/ Input enabled Pull-up/ Input enabled Pull-up/ Input enabled Pull-up/ Input enabled D Mode input pin Input enabled Input enabled Input enabled Input enabled Input enabled Input enabled E JTAG selected Hi-Z Pull-up/ Input enabled Pull-up/ Input enabled Maintain previous state Maintain previous state Maintain previous state GPIO selected Setting disabled Setting disabled Setting disabled Hi-Z/ Internal input fixed at "0" F Trace selected Setting disabled Setting disabled Setting disabled Maintain previous state Maintain previous state Trace output External interrupt enabled selected Maintain previous state GPIO selected, or other than above resource selected Hi-Z Hi-Z/ Input enabled Hi-Z/ Input enabled Hi-Z/ Internal input fixed at "0"

March 11, 2015, MB9B410R-DS706-00026-3v0-E 63 CONFIDENTIAL Pin status type Function group Power-on reset or low-voltage detection state INITX input state Device internal reset state Run mode or sleep mode state Timer mode or sleep mode state Power supply unstable Power supply stable Power supply stable Power supply stable - INITX=0 INITX=1 INITX=1 INITX=1 - - - - SPL=0 SPL=1 G Trace selected Setting disabled Setting disabled Setting disabled Maintain previous state Maintain previous state Trace output GPIO selected, or other than above resource selected Hi-Z Hi-Z/ Input enabled Hi-Z/ Input enabled Hi-Z/ Internal input fixed at "0" H External interrupt enabled selected Setting disabled Setting disabled Setting disabled Maintain previous state Maintain previous state Maintain previous state GPIO selected, or other than above resource selected Hi-Z Hi-Z/ Input enabled Hi-Z/ Input enabled Hi-Z/ Internal input fixed at "0" I GPIO selected, resource selected Hi-Z Hi-Z/ Input enabled Hi-Z/ Input enabled Maintain previous state Maintain previous state Hi-Z/ Internal input fixed at "0" J NMIX selected Setting disabled Setting disabled Setting disabled Maintain previous state Maintain previous state Maintain previous state GPIO selected, or other than above resource selected Hi-Z Hi-Z/ Input enabled Hi-Z/ Input enabled Hi-Z/ Internal input fixed at "0"

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unstable Power supply stable Power supply stable Power supply stable - INITX=0 INITX=1 INITX=1 INITX=1 - - - - SPL=0 SPL=1 K Analog input selected Hi-Z Hi-Z/ Internal input fixed at "0"/ Analog input enabled Hi-Z/ Internal input fixed at "0"/ Analog input enabled Hi-Z/ Internal input fixed at "0"/ Analog input enabled Hi-Z/ Internal input fixed at "0"/ Analog input enabled Hi-Z/ Internal input fixed at "0"/ Analog input enabled GPIO selected, or other than above resource selected Setting disabled Setting disabled Setting disabled Maintain previous state Maintain previous state Hi-Z/ Internal input fixed at "0" L External interrupt enabled selected Setting disabled Setting disabled Setting disabled Maintain previous state Maintain previous state Maintain previous state Analog input selected Hi-Z Hi-Z/ Internal input fixed at "0"/ Analog input enabled Hi-Z/ Internal input fixed at "0"/ Analog input enabled Hi-Z/ Internal input fixed at "0"/ Analog input enabled Hi-Z/ Internal input fixed at "0"/ Analog input enabled Hi-Z/ Internal input fixed at "0"/ Analog input enabled GPIO selected, or other than above resource selected Setting disabled Setting disabled Setting disabled Maintain previous state Maintain previous state Hi-Z/ Internal input fixed at "0" M GPIO selected Setting disabled Setting disabled Setting disabled Maintain previous state Maintain previous state Hi-Z/ Internal input fixed at "0" Sub crystal oscillator input pin Input enabled Input enabled Input enabled Input enabled Input enabled Input enabled

March 11, 2015, MB9B410R-DS706-00026-3v0-E 65 CONFIDENTIAL Pin status type Function group Power-on reset or low-voltage detection state INITX input state Device internal reset state Run mode or sleep mode state Timer mode or sleep mode state Power supply unstable Power supply stable Power supply stable Power supply stable - INITX=0 INITX=1 INITX=1 INITX=1 - - - - SPL=0 SPL=1 N GPIO selected Setting disabled Setting disabled Setting disabled Maintain previous state Maintain previous state Hi-Z/ Internal input fixed at "0" Sub crystal oscillator output pin Hi-Z/ Internal input fixed at "0"/ or Input enable Hi-Z/ Internal input fixed at "0" Hi-Z/ Internal input fixed at "0" Maintain previous state Maintain previous state/ Hi-Z at oscillation stop*2/ Internal input fixed at "0" Maintain previous state/ Hi-Z at oscillation stop*2/ Internal input fixed at "0" O GPIO selected Hi-Z Hi-Z/ Input enabled Hi-Z/ Input enabled Maintain previous state Maintain previous state Hi-Z/ Internal input fixed at "0" P Mode input pin Input enabled Input enabled Input enabled Input enabled Input enabled Input enabled GPIO selected Setting disabled Setting disabled Setting disabled Maintain previous state Maintain previous state Hi-Z/ Input enabled *1: Oscillation is stopped at Sub Timer mode, Low-speed CR Timer mode, and Stop mode. *2: Oscillation is stopped at Stop mode.

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 Electrical Characteristics 1. Absolute Maximum Ratings Parameter Symbol Rating Unit Remarks Min Max Power supply voltage*1, *2 VCC VSS - 0.5 VSS + 6.5 V Analog power supply voltage*1, *3 AVCC VSS - 0.5 VSS + 6.5 V Analog reference voltage*1, *3 AVRH VSS - 0.5 VSS + 6.5 V Input voltage*1 VI VSS - 0.5 VCC + 0.5 (≤ 6.5 V) V Except for USB pin VSS - 0.5 VSS + 6.5 V 5 V tolerant Analog pin input voltage*1 VIA VSS - 0.5 AVCC + 0.5 (≤ 6.5 V) V Output voltage*1 VO VSS - 0.5 VCC + 0.5 (≤ 6.5 V) V Clamp maximum current ICLAMP -2 +2 mA *7 Clamp total maximum current Σ[ICLAMP] +20 mA *7 L level maximum output current*4 IOL - 10 mA 4 mA type 20 mA 12 mA type 39 mA P80, P81 L level average output current*6 IOLA V - 4 mA 4 mA type 12 mA 12 mA type 18.5 mA P80, P81 L level total maximum output current ∑IOL - 100 mA L level total average output current*6 ∑IOLA V - 50 mA H level maximum output current*4 IOH - - 10 mA 4 mA type - 20 mA 12 mA type - 39 mA P80, P81 H level average output current*5 IOHA V - - 4 mA 4 mA type - 12 mA 12 mA type - 20.5 mA P80, P81 H level total maximum output current ∑IOH - - 100 mA H level total average output current*6 ∑IOHA V - - 50 mA Power consumption PD - 1000 mW Storage temperature TSTG - 55 + 150 °C *1: These parameters are based on the condition that VSS = AVSS = 0.0 V. *2: VCC must not drop below VSS - 0.5 V. *3: Ensure that the voltage does not to exceed VCC + 0.5 V, for example, when the power is turned on. *4: The maximum output current is the peak value for a single pin. *5: The average output is the average current for a single pin over a period of 100 ms. *6: The total average output current is the average current for all pins over a period of 100 ms.

March 11, 2015, MB9B410R-DS706-00026-3v0-E 67 CONFIDENTIAL *7: ・ See "■ List of Pin Functions" and "■ I/O Circuit Type" about +B input available pin. ・ Use within recommended operating conditions. ・ Use at DC voltage (current) the +B input. ・ The +B signal should always be applied a limiting resistance placed between the +B signal and the device. ・ The value of the limiting resistance should be set so that when the +B signal is applied the input current to the device pin does not exceed rated values, either instantaneously or for prolonged periods. ・ Note that when the device drive current is low, such as in the low-power consumpsion modes, the +B input potential may pass through the protective diode and increase the potential at the VCC and A VCC pin, and this may affect other devices. ・ Note that if a +B signal is input when the device power supply is off (not fixed at 0V), the power supply is provided from the pins, so that incomplete operation may result. ・ The following is a recommended circuit example (I/O equivalent circuit). <WARNING> Semiconductor devices can be permanently damaged by application of stress (voltage, current, temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings. R +B input (0V to 16V) Protection Diode P-ch VCC VCC Limiting resistor N-ch AVCC Analog input Digital input Digital output

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1. Recommended Operating Conditions (VSS = AVSS = 0.0V) Parameter Symbol Conditions Value Unit Remarks Min Max Power supply voltage VCC - 2.7*2 5.5 V Analog power supply voltage AVCC - 2.7 5.5 V AVCC = VCC Analog reference voltage A VRH - 2.7 AVCC V Smoothing capacitor CS - 1 10 μF For built-in regulator*1 Operating temperature FPT-100P-M20/M23 FPT-120P-M21/M37 TA When mounted on four-layer PCB - 40 + 85 °C FPT-100P-M36 BGA-112P-M04 TA - - 40 + 85 °C *1: See " · C Pin" in "■ Handling Devices" for the connection of the smoothing capacitor. *2: In between less than the minimum power supply voltage and low voltage reset/interrupt detection voltage or more, instruction execution and low voltage detection function by built-in High-speed CR(including Main PLL is used) or built-in Low-speed CR is possible to operate only. <WARNING> The recommended operating conditions are required in order to ensure the normal operation of the semiconductor device. All of the device's electrical characteristics are warranted when the device is operated within these ranges. Always use semiconductor devices within their recommended operating condition ranges. Operation outside these ranges may adversely affect reliability and could result in device failure. No warranty is made with respect to uses, operating conditions, or combinations not represented on the data sheet. Users considering application outside the listed conditions are advised to contact their representatives beforehand.

March 11, 2015, MB9B410R-DS706-00026-3v0-E 69 CONFIDENTIAL 3. DC Characteristics (1) Current Rating (VCC = AVCC = 2.7V to 5.5V, VSS = AVSS = 0V, TA = - 40°C to + 85°C) Parameter Symbol Pin name Conditions Value Unit Remarks Typ*3 Max*4 Run mode current ICC VCC PLL Run mode CPU : 144 MHz, Peripheral : 72 MHz, Main Flash 2 Wait TraceBuffer : ON FRWTR.RWT = 10 FSYNDN.SD = 000 FBFCR.BE = 1 85 117 mA *1, *5 CPU : 72 MHz, Peripheral : 72 MHz, Main Flash 0 Wait TraceBuffer : OFF FRWTR.RWT = 00 FSYNDN.SD = 000 FBFCR.BE = 0 52 70 mA *1, *5 High-speed CR Run mode CPU/ Peripheral :

4 MHz*2

FRWTR.RWT = 00 FSYNDN.SD = 000 5 17 mA *1 Sub Run mode CPU/ Peripheral : 32 kHz Main Flash 0 Wait FRWTR.RWT = 00 FSYNDN.SD = 000 1.3 14 mA *1, *6 Low-speed CR Run mode CPU/ Peripheral : 100 kHz Main Flash 0 Wait FRWTR.RWT = 00 FSYNDN.SD = 000 1.3 14 mA *1 Sleep mode current ICCS PLL Sleep mode Peripheral : 72 MHz 28 43 mA *1, *5 High-speed CR Sleep mode Peripheral : 4 MHz*2 3 16 mA *1 Sub Sleep mode Peripheral : 32 kHz 1 14 mA *1, *6 Low-speed CR Sleep mode Peripheral : 100 kHz 1 14 mA *1 *1: When all ports are fixed. *2: When setting it to 4 MHz by trimming. *3: TA=+25°C, VCC=5.5 V *4: TA=+85°C, VCC=5.5 V *5: When using the crystal oscillator of 4 MHz(Including the current consumption of the oscillation circuit) *6: When using the crystal oscillator of 32 kHz(Including the current consumption of the oscillation circuit)

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name Conditions Value Unit Remarks Typ*2 Max*2 Timer mode current ICCT VCC Main Timer mode TA = + 25°C, When LVD is off 3.2 6 mA *1, *3 TA = + 85°C, When LVD is off - 15 mA *1, *3 Sub Timer mode TA = + 25°C, When LVD is off 0.9 3 mA *1, *4 TA = + 85°C, When LVD is off - 12 mA *1, *4 Stop mode current ICCH Stop mode TA = + 25°C, When LVD is off 0.8 3 mA *1 TA = + 85°C, When LVD is off - 12 mA *1 *1: When all ports are fixed. *2: VCC=5.5 V *3: When using the crystal oscillator of 4 MHz(Including the current consumption of the oscillation circuit) *4: When using the crystal oscillator of 32 kHz(Including the current consumption of the oscillation circuit)

• Low-Voltage Detection Current (VCC = 2.7V to 5.5V , VSS = 0V , TA = - 40°C to + 85°C) Parameter Symbol Pin name Conditions Value Unit Remarks Typ Max Low voltage detection circuit (LVD) power supply current ICCLVD VCC At operation for interrupt VCC = 5.5 V 4 7 μA At not detect
• Flash Memory Current (VCC = 2.7V to 5.5V , VSS = 0V , TA = - 40°C to + 85°C) Parameter Symbol Pin name Conditions Value Unit Remarks Typ Max Flash memory write/erase current ICCFLASH VCC MainFlash At Write/Erase 11.4 13.1 mA * WorkFlash At Write/Erase 11.4 13.1 mA *: The current at which to write or erase Flash memory, ICCFLASH is added to ICC.
• A/D Converter Current (VCC = AVCC = 2.7V to 5.5V , VSS = AVSS = A VRL = 0V , TA = - 40°C to + 85°C) Parameter Symbol Pin name Conditions Value Unit Remarks Typ Max Power supply current ICCAD A VCC At 1unit operation 0.47 0.62 mA At stop 0.06 25 μA Reference power supply current ICCA VRH A VRH At 1unit operation A VRH=5.5 V 1.1 1.96 mA At stop 0.06 4 μA

March 11, 2015, MB9B410R-DS706-00026-3v0-E 71 CONFIDENTIAL (2) Pin Characteristics (VCC = AVCC = 2.7V to 5.5V, VSS = AVSS = 0V, TA = - 40°C to + 85°C) Parameter Symbol Pin name Conditions Value Unit Remarks Min Typ Max H level input voltage (hysteresis input) VIHS CMOS hysteresis input pin, MD0, MD1 - VCC × 0.8 - VCC + 0.3 V

5 V tolerant

input pin - VCC × 0.8 - VSS + 5.5 V L level input voltage (hysteresis input) VILS CMOS hysteresis input pin, MD0, MD1 - VSS - 0.3 - VCC × 0.2 V input pin - VSS - 0.3 - VCC × 0.2 V H level output voltage VOH 4 mA type VCC ≥ 4.5 V IOH = - 4 mA VCC - 0.5 - VCC V VCC < 4.5 V IOH = - 2 mA 12 mA type VCC ≥ 4.5 V IOH = - 12 mA VCC - 0.5 - VCC V VCC < 4.5 V IOH = - 8 mA P80, P81 VCC ≥ 4.5 V IOH = - 20.5 mA VCC - 0.4 - VCC V VCC < 4.5 V IOH = - 13.0 mA

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VCC ≥ 4.5 V IOL = 4 mA VSS - 0.4 V VCC < 4.5 V IOL = 2 mA 12 mA type VCC ≥ 4.5 V IOL = 12 mA VSS - 0.4 V VCC < 4.5 V IOL = 8 mA P80, P81 VCC ≥ 4.5 V IOL = 18.5 mA VSS - 0.4 V VCC < 4.5 V IOL = 10.5 mA Input leak current IIL - - - 5 - +5 μA Pull-up resistance value RPU Pull-up pin VCC ≥ 4.5 V 25 50 100 kΩ VCC < 4.5 V 30 80 200 Input capacitance CIN Other than VCC, VSS, AVCC, AVSS, A VRH - - 5 15 pF

March 11, 2015, MB9B410R-DS706-00026-3v0-E 73 CONFIDENTIAL 4. AC Characteristics (1) Main Clock Input Characteristics (VCC = 2.7V to 5.5V, VSS = 0V, TA = - 40°C to + 85°C) Parameter Symbol Pin name Conditions Value Unit Remarks Min Max Input frequency fCH VCC ≥ 4.5 V 4 48 MHz When crystal oscillator is connected VCC < 4.5 V 4 20 VCC ≥ 4.5 V 4 48 MHz When using external clock VCC < 4.5 V 4 20 Input clock cycle tCYLH VCC ≥ 4.5 V 20.83 250 ns When using external clock VCC < 4.5 V 50 250 Input clock pulse width - PWH/tCYLH PWL/tCYLH 45 55 % When using external clock Input clock rise time and fall time tCF, tCR - - 5 ns When using external clock Internal operating clock*1 frequency fCM - - - 144 MHz Master clock fCC - - - 144 MHz Base clock (HCLK/FCLK) fCP0 - - - 72 MHz APB0 bus clock*2 fCP1 - - - 72 MHz APB1 bus clock*2 fCP2 - - - 72 MHz APB2 bus clock*2 Internal operating clock*1 cycle time tCYCC - - 6.94 - ns Base clock (HCLK/FCLK) tCYCP0 - - 13.8 - ns APB0 bus clock*2 tCYCP1 - - 13.8 - ns APB1 bus clock*2 tCYCP2 - - 13.8 - ns APB2 bus clock*2 *1: For more information about each internal operating clock, see "CHAPTER 2-1: Clock" in "FM3 Family PERIPHERAL MANUAL". *2: For about each APB bus which each peripheral is connected to, see "■ Block Diagram" in this data sheet.

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(2) Sub Clock Input Characteristics (VCC = 2.7V to 5.5V, VSS = 0V, TA = - 40°C to + 85°C) Parameter Symbol Pin name Conditions Value Unit Remarks Min Typ Max Input frequency 1/ tCYLL X0A X1A - - 32.768 - kHz When crystal oscillator is connected - 32 - 100 kHz When using external clock Input clock cycle tCYLL - 10 - 31.25 μs When using external clock Input clock pulse width - PWH/tCYLL PWL/tCYLL 45 - 55 % When using external clock (3) Internal CR Oscillation Characteristics ・ High-speed Internal CR (VCC = 2.7V to 5.5V, VSS = 0V, TA = - 40°C to + 85°C) Parameter Symbol Conditions Value Unit Remarks Min Typ Max Clock frequency fCRH TA = + 25°C 3.96 4 4.04 MHz When trimming*1 TA = 0°C to + 70°C 3.84 4 4.16 TA = - 40°C to + 85°C 3.8 4 4.2 TA = - 40°C to + 85°C 3 4 5 When not trimming Frequency stability time tCRWT - - - 90 μs *2 *1: In the case of using the values in CR trimming area of Flash memory at shipment for frequency trimming. *2: Frequency stable time is time to stable of the frequency of the High-speed CR. clock after the trim value is set. After setting the trim value, the period when the frequency stability time passes can use the High-speed CR clock as a source clock. ・ Low-speed Internal CR (VCC = 2.7V to 5.5V, VSS = 0V, TA = - 40°C to + 85°C) Parameter Symbol Conditions Value Unit Remarks Min Typ Max Clock frequency fCRL - 50 100 150 kHz X0A

March 11, 2015, MB9B410R-DS706-00026-3v0-E 75 CONFIDENTIAL (4-1) Operating Conditions of Main PLL (In the case of using main clock for input of PLL) (VCC = 2.7V to 5.5V, VSS = 0V, TA = - 40°C to + 85°C) Parameter Symbol Value Unit Remarks Min Typ Max PLL oscillation stabilization wait time*1 (LOCK UP time) tLOCK 100 - - μs PLL input clock frequency fPLLI 4 - 16 MHz PLL multiple rate - 13 - 75 multiple PLL macro oscillation clock frequency fPLLO 200 - 300 MHz Main PLL clock frequency*2 fCLKPLL - - 40 MHz *1: Time from when the PLL starts operating until the oscillation stabilizes. *2: For more information about Main PLL clock (CLKPLL), see "CHAPTER 2-1: Clock" in "FM3 Family PERIPHERAL MANUAL". (4-2) Operating Conditions of Main PLL (In the case of using high-speed internal CR) (VCC = 2.7V to 5.5V, VSS = 0V, TA = - 40°C to + 85°C) Parameter Symbol Value Unit Remarks Min Typ Max PLL oscillation stabilization wait time*1 (LOCK UP time) tLOCK 100 - - μs PLL input clock frequency fPLLI 3.8 4 4.2 MHz PLL multiple rate - 50 - 71 multiple PLL macro oscillation clock frequency fPLLO 190 - 300 MHz Main PLL clock frequency*2 fCLKPLL - - 40 MHz *1: Time from when the PLL starts operating until the oscillation stabilizes. *2: For more information about Main PLL clock (CLKPLL), see "CHAPTER 2-1: Clock" in "FM3 Family PERIPHERAL MANUAL". When setting PLL multiple rate, please take the accuracy of the built-in high-speed CR clock into account and prevent the master clock from exceeding the maximum frequency. K divider PLL input clock Main PLL PLL macro oscillation clock M divider Main PLL clock (CLKPLL) N divider Main PLL connection High-speed CR clock (CLKHC) Main clock (CLKMO)

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(5) Reset Input Characteristics (VCC = 2.7V to 5.5V, VSS = 0V, TA = - 40°C to + 85°C) Parameter Symbol Pin name Conditions Value Unit Remarks Min Max Reset input time tINITX INITX - 500 - ns (6) Power-on Reset Timing (VCC = 2.7V to 5.5V, VSS = 0V, TA = - 40°C to + 85°C) Parameter Symbol Pin name Value Unit Remarks Min Max Power supply rising time tVCCR VCC 0 - ms Power supply shut down time tOFF 1 - ms Time until releasing Power-on reset tPRT 0.57 0.76 ms 0.2V VDH_minimum VCC_minimum tPRT Internal reset VCC CPU Operation start Reset active Release tVCCR 0.2V 0.2V tOFF Glossary ・ VCC_minimum : Minimum VCC of recommended operating conditions ・ VDH_minimum : Minimum release voltage of Low-V oltage detection reset. See "6. Low-Voltage Detection Characteristics"

March 11, 2015, MB9B410R-DS706-00026-3v0-E 77 CONFIDENTIAL (7) External Bus Timing ・ External bus clock output characteristics (VCC = 2.7V to 5.5V, VSS = 0V, TA = - 40°C to + 85°C) Parameter Symbol Pin name Conditions Value Unit Min Max Output frequency tCYCLE MCLKOUT*1 VCC ≥ 4.5 V - 50*2 MHz VCC < 4.5 V - 32*3 MHz *1: External bus clock (MCLKOUT) is divided clock of HCLK. For more information about setting of clock divider, see "CHPATER 12: External Bus Interface" in "FM3 Family PERIPHERAL MANUAL". When external bus clock is not output, this characteristic does not give any effect on external bus operation. *2: When AHB bus clock frequency is more than 100MHz, the divider setting for MCLKOUT must be more than 4. *3: When AHB bus clock frequency is more than 64MHz, the divider setting for MCLKOUT must be more than 4. ・ External bus signal input/output Characteristics (VCC = 2.7V to 5.5V, VSS = 0V, TA = - 40°C to + 85°C) Parameter Symbol Conditions Value Unit Remarks Signal input characteristics VIH 0.8 × VCC V VIL 0.2 × VCC V Signal output characteristics VOH 0.8 × VCC V VOL 0.2 × VCC V VIH VIL VIL VIH VOH VOL VOL VOH Input signal Output signal MCLKOUT

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・ Separate Bus Access Asynchronous SRAM Mode (VCC = 2.7V to 5.5V, VSS = 0V, TA = - 40°C to + 85°C) Parameter Symbol Pin name Conditions Value Unit Min Max MOEX Min pulse width tOEW MOEX VCC ≥ 4.5 V MCLK×n-3 - ns VCC < 4.5 V MCSX ↓ → Address output delay time tCSL – AV MCSX[7:0] MAD[24:0] VCC ≥ 4.5 V -9 +9 ns VCC < 4.5 V -12 +12 MOEX ↑ → Address hold time tOEH - AX MOEX MAD[24:0] VCC ≥ 4.5 V 0 MCLK×m+9 ns VCC < 4.5 V MCLK×m+12 MCSX ↓ → MOEX ↓ delay time tCSL - OEL MOEX MCSX[7:0] VCC ≥ 4.5 V MCLK×m-9 MCLK×m+9 ns VCC < 4.5 V MCLK×m-12 MCLK×m+12 MOEX ↑ → MCSX ↑ time tOEH - CSH VCC ≥ 4.5 V 0 MCLK×m+9 ns VCC < 4.5 V MCLK×m+12 MCSX ↓ → MDQM ↓ delay time tCSL - RDQML MCSX MDQM[1:0] VCC ≥ 4.5 V MCLK×m-9 MCLK×m+9 ns VCC < 4.5 V MCLK×m-12 MCLK×m+12 Data set up → MOEX ↑ time tDS - OE MOEX MADATA[15:0] VCC ≥ 4.5 V 20 - ns VCC < 4.5 V 38 - MOEX ↑ → Data hold time tDH - OE MOEX MADATA[15:0] VCC ≥ 4.5 V 0 - ns VCC < 4.5 V MWEX Min pulse width tWEW MWEX VCC ≥ 4.5 V MCLK×n-3 - ns VCC < 4.5 V MWEX ↑ → Address output delay time tWEH - AX MWEX MAD[24:0] VCC ≥ 4.5 V 0 MCLK×m+9 ns VCC < 4.5 V MCLK×m+12 MCSX ↓ → MWEX ↓ delay time tCSL - WEL MWEX MCSX[7:0] VCC ≥ 4.5 V MCLK×n-9 MCLK×n+9 ns VCC < 4.5 V MCLK×n-12 MCLK×n+12 MWEX ↑ → MCSX ↑ delay time tWEH - CSH VCC ≥ 4.5 V 0 MCLK×m+9 ns VCC < 4.5 V MCLK×m+12 MCSX ↓→ MDQM ↓ delay time tCSL-WDQML MCSX MDQM[1:0] VCC ≥ 4.5 V MCLK×n-9 MCLK×n+9 ns VCC < 4.5 V MCLK×n-12 MCLK×n+12 MCSX ↓→ Data output time tCSL - DV MCSX MADATA[15:0] VCC ≥ 4.5 V MCLK-9 MCLK+9 ns VCC < 4.5 V MCLK-12 MCLK+12 MWEX ↑ → Data hold time tWEH - DX MWEX MADATA[15:0] VCC ≥ 4.5 V 0 MCLK×m+9 ns VCC < 4.5 V MCLK×m+12 Note: When the external load capacitance = 30 pF. (m = 0 to 15, n = 1 to 16)

March 11, 2015, MB9B410R-DS706-00026-3v0-E 79 CONFIDENTIAL Invalid Address tCSL-OEL tCSL-AV RD Address WD tDH-OEtDS-OE tWEH-DX tOEW tOEH-AX tOEH-CSH tWEW tCYCLE tCSL-WEL tCSL-AV tWEH-CSH tWEH-AX tCSL-WDQMLtCSL-RDQML tCSL-DV MCLK MCSX[7:0] MAD[24:0] MDQM[1:0] MWEX MADATA[15:0] MOEX

80 MB9B410R-DS706-00026-3v0-E, March 11, 2015

・ Separate Bus Access Synchronous SRAM Mode (VCC = 2.7V to 5.5V, VSS = 0V, TA = - 40°C to + 85°C) Parameter Symbol Pin name Conditions Value Unit Min Max Address delay time tAV MCLK MAD[24:0] VCC ≥ 4.5 V 1 9 ns VCC < 4.5 V 12 MCSX delay time tCSL MCLK MCSX[7:0] VCC ≥ 4.5 V 1 9 ns VCC < 4.5 V 12 tCSH VCC ≥ 4.5 V 1 9 ns VCC < 4.5 V 12 MOEX delay time tREL MCLK MOEX VCC ≥ 4.5 V 1 9 ns VCC < 4.5 V 12 tREH VCC ≥ 4.5 V 1 9 ns VCC < 4.5 V 12 Data set up → MCLK ↑ time tDS MCLK MADATA[15:0] VCC ≥ 4.5 V 19 - ns VCC < 4.5 V 37 MCLK ↑ → Data hold time tDH MCLK MADATA[15:0] VCC ≥ 4.5 V 0 - ns VCC < 4.5 V MWEX delay time tWEL MCLK MWEX VCC ≥ 4.5 V 1 9 ns VCC < 4.5 V 12 tWEH VCC ≥ 4.5 V 1 9 ns VCC < 4.5 V 12 MDQM[1:0] delay time tDQML MCLK MDQM[1:0] VCC ≥ 4.5 V 1 9 ns VCC < 4.5 V 12 tDQMH VCC ≥ 4.5 V 1 9 ns VCC < 4.5 V 12 MCLK ↑ → Data output time tODS MCLK, MADATA[15:0] VCC ≥ 4.5 V MCLK+1 MCLK+18 ns VCC < 4.5 V MCLK+24 MCLK ↑ → Data hold time tOD MCLK MADATA[15:0] VCC ≥ 4.5 V 1 18 ns VCC < 4.5 V 24 Note: When the external load capacitance = 30 pF. Invalid tDQML tREH Address tCSL tAV tREL RD Address WD tDQMH tWEHtWEL tDHtDS tOD tAV tCSH tCYCLE tDQML tDQMH tODS MCLK MCSX[7:0] MAD[24:0] MDQM[1:0] MWEX MADATA[15:0] MOEX

March 11, 2015, MB9B410R-DS706-00026-3v0-E 81 CONFIDENTIAL ・ Multiplexed Bus Access Asynchronous SRAM Mode (VCC = 2.7V to 5.5V, VSS = 0V, TA = - 40°C to + 85°C) Parameter Symbol Pin name Conditions Value Unit Min Max Multiplexed address delay time tALE-CHMADV MALE MADATA[15:0] VCC ≥ 4.5 V 0 10 ns VCC < 4.5 V 20 Multiplexed address hold time tCHMADH VCC ≥ 4.5 V MCLK×n+0 MCLK×n+10 ns VCC < 4.5 V MCLK×n+0 MCLK×n+20 Note: When the external load capacitance = 30 pF. (m = 0 to 15, n = 1 to 16) MCLK MCSX[7:0] MALE MOEX MWEX MADATA[15:0] MAD [24:0] MDQM [1:0]

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・ Multiplexed Bus Access Synchronous SRAM Mode (VCC = 2.7V to 5.5V, VSS = 0V, TA = - 40°C to + 85°C) Parameter Symbol Pin name Conditions Value Unit Remarks Min Max MALE delay time tCHAL MCLK ALE VCC ≥ 4.5 V 1 9 ns VCC < 4.5 V 12 ns tCHAH VCC ≥ 4.5 V 1 9 ns VCC < 4.5 V 12 ns MCLK ↑ → Multiplexed Address delay time tCHMADV MCLK MADATA[15:0] VCC ≥ 4.5 V 1 tOD ns VCC < 4.5 V MCLK ↑ → Multiplexed Data output time tCHMADX VCC ≥ 4.5 V 1 tOD ns VCC < 4.5 V Note: When the external load capacitance = 30 pF. MCLK MCSX[7:0] MALE MOEX MWEX MADATA[15:0] MAD [24:0] MDQM [1:0]

March 11, 2015, MB9B410R-DS706-00026-3v0-E 83 CONFIDENTIAL ・ NAND Flash Mode (VCC = 2.7V to 5.5V, VSS = 0V, TA = -40°C to +85°C) Parameter Symbol Pin name Conditions Value Unit Min Max MNREX Min pulse width tNREW MNREX VCC ≥ 4.5 V MCLK×n-3 - ns VCC < 4.5 V Data setup → MNREX ↑ time tDS – NRE MNREX MADATA[15:0] VCC ≥ 4.5 V 20 - ns VCC < 4.5 V 38 - MNREX ↑ → Data hold time tDH – NRE MNREX MADATA[15:0] VCC ≥ 4.5 V 0 - ns VCC < 4.5 V MNALE ↑ → MNWEX delay time tALEH - NWEL MNALE MNWEX VCC ≥ 4.5 V MCLK×m-9 MCLK×m+9 ns VCC < 4.5 V MCLK×m-12 MCLK×m+12 MNALE ↓ → MNWEX delay time tALEL - NWEL MNALE MNWEX VCC ≥ 4.5 V MCLK×m-9 MCLK×m+9 ns VCC < 4.5 V MCLK×m-12 MCLK×m+12 MNCLE ↑ → MNWEX delay time tCLEH - NWEL MNCLE MNWEX VCC ≥ 4.5 V MCLK×m-9 MCLK×m+9 ns VCC < 4.5 V MCLK×m-12 MCLK×m+12 MNWEX ↑ → MNCLE delay time tNWEH - CLEL MNCLE MNWEX VCC ≥ 4.5 V 0 MCLK×m+9 ns VCC < 4.5 V MCLK×m+12 MNWEX Min pulse width tNWEW MNWEX VCC ≥ 4.5 V MCLK×n-3 - ns VCC < 4.5 V MNWEX ↓ → Data delay time tNWEL – DV MNWEX MADATA[15:0] VCC ≥ 4.5 V - 9 + 9 ns VCC < 4.5 V -12 +12 MNWEX ↑ → Data hold time tNWEH – DX MNWEX MADATA[15:0] VCC ≥ 4.5 V 0 MCLK×m+9 ns VCC < 4.5 V MCLK×m+12 Note: When the external load capacitance = 30 pF. (m=0 to 15, n=1 to 16)

84 MB9B410R-DS706-00026-3v0-E, March 11, 2015

MADATA[15:0] Read

March 11, 2015, MB9B410R-DS706-00026-3v0-E 85 CONFIDENTIAL NAND Flash Address Write NAND Flash Command Write MCLK MNALE MNCLE MADATA[15:0] MNWEX Write MCLK MNALE MNCLE MADATA[15:0] MNWEX Write

86 MB9B410R-DS706-00026-3v0-E, March 11, 2015

・ External Ready Input Timing (VCC = 2.7V to 5.5V, VSS = 0V, TA = - 40°C to + 85°C) Parameter Symbol Pin name Conditions Value Unit Remarks Min Max MCLK ↑ MRDY input setup time tRDYI MCLK MRDY VCC ≥ 4.5 V 19 - ns VCC < 4.5 V 37 ・ When RDY is input

• · · Over 2cycle tRDYI ・ When RDY is released 2 cycle tRDYI 0.5×VCC MCLK Original MOEX MWEX MRDY MCLK Extended MOEX MWEX MRDY

March 11, 2015, MB9B410R-DS706-00026-3v0-E 87 CONFIDENTIAL (8) Base Timer Input Timing ・ Timer input timing (VCC = 2.7V to 5.5V, VSS = 0V, TA = - 40°C to + 85°C) Parameter Symbol Pin name Conditions Value Unit Remarks Min Max Input pulse width tTIWH tTIWL TIOAn/TIOBn (when using as ECK, TIN) - 2tCYCP - ns tTIWH VIHS VIHS VILS VILS tTIWL ・ Trigger input timing (VCC = 2.7V to 5.5V, VSS = 0V, TA = - 40°C to + 85°C) Parameter Symbol Pin name Conditions Value Unit Remarks Min Max Input pulse width tTRGH tTRGL TIOAn/TIOBn (when using as TGIN) - 2tCYCP - ns tTRGH VIHS VIHS VILS VILS tTRGL Note: tCYCP indicates the APB bus clock cycle time. About the APB bus number which Base Timer is connected to, see "■ Block Diagram" in this data sheet. ECK TIN TGIN

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(9) CSIO/UART Timing ・ CSIO (SPI = 0, SCINV = 0) (VCC = 2.7V to 5.5V, VSS = 0V, TA = - 40°C to + 85°C) Parameter Symbol Pin name Conditions VCC < 4.5 V VCC ≥ 4.5 V Unit Min Max Min Max Serial clock cycle time tSCYC SCKx Master mode 4tCYCP - 4tCYCP - ns SCK ↓ → SOT delay time tSLOVI SCKx SOTx -30 +30 - 20 + 20 ns SIN → SCK ↑ setup time tIVSHI SCKx SINx 50 - 30 - ns SCK ↑ → SIN hold time tSHIXI SCKx SINx 0 - 0 - ns Serial clock L pulse width tSLSH SCKx Slave mode 2tCYCP - 10 - 2tCYCP - 10 - ns Serial clock H pulse width tSHSL SCKx tCYCP + 10 - tCYCP + 10 - ns SCK ↓ → SOT delay time tSLOVE SCKx SOTx - 50 - 30 ns SIN → SCK ↑ setup time tIVSHE SCKx SINx 10 - 10 - ns SCK ↑ → SIN hold time tSHIXE SCKx SINx 20 - 20 - ns SCK fall time tF SCKx - 5 - 5 ns SCK rise time tR SCKx - 5 - 5 ns Notes: ・ The above characteristics apply to CLK synchronous mode. ・ tCYCP indicates the APB bus clock cycle time. About the APB bus number which Multi-function Serial is connected to, see "■ Block Diagram" in this data sheet. ・ These characteristics only guarantee the same relocate port number. For example, the combination of SCKx_0 and SOTx_1 is not guaranteed. ・ When the external load capacitance = 30 pF.

March 11, 2015, MB9B410R-DS706-00026-3v0-E 89 CONFIDENTIAL Master mode Slave mode tSLSH tSHSL VIH tF tR VIH VOH VIH VIL VIL VOL VIH VIL VIH VIL tSLOVE tIVSHE tSHIXE SCK SOT SIN tSCYC VOH VOH VOL VOL VOL VIH VIL VIH VIL tSLOVI tIVSHI tSHIXI SCK SOT SIN

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・ CSIO (SPI = 0, SCINV = 1) (VCC = 2.7V to 5.5V, VSS = 0V, TA = - 40°C to + 85°C) Parameter Symbol Pin name Conditions VCC < 4.5 V VCC ≥ 4.5 V Unit Min Max Min Max Serial clock cycle time tSCYC SCKx Master mode 4tCYCP - 4tCYCP - ns SCK ↑ → SOT delay time tSHOVI SCKx SOTx -30 +30 - 20 + 20 ns SIN → SCK ↓ setup time tIVSLI SCKx SINx 50 - 30 - ns SCK ↓ → SIN hold time tSLIXI SCKx SINx 0 - 0 - ns Serial clock L pulse width tSLSH SCKx Slave mode 2tCYCP - 10 - 2tCYCP - 10 - ns Serial clock H pulse width tSHSL SCKx tCYCP + 10 - tCYCP + 10 - ns SCK ↑ → SOT delay time tSHOVE SCKx SOTx - 50 - 30 ns SIN → SCK ↓ setup time tIVSLE SCKx SINx 10 - 10 - ns SCK ↓ → SIN hold time tSLIXE SCKx SINx 20 - 20 - ns SCK fall time tF SCKx - 5 - 5 ns SCK rise time tR SCKx - 5 - 5 ns Notes: ・ The above characteristics apply to CLK synchronous mode. ・ tCYCP indicates the APB bus clock cycle time. About the APB bus number which Multi-function Serial is connected to, see "■ Block Diagram" in this data sheet. ・ These characteristics only guarantee the same relocate port number. For example, the combination of SCKx_0 and SOTx_1 is not guaranteed. ・ When the external load capacitance = 30 pF.

March 11, 2015, MB9B410R-DS706-00026-3v0-E 91 CONFIDENTIAL Master mode Slave mode tSHSL tSLSH VIH tF tR VIH VOH VIL VIL VIL VOL VIH VIL VIH VIL tIVSLE tSLIXE SCK SOT SIN tSHOVE tSCYC VOH VOH VOH VOL VOL VIH VIL VIH VIL tSHOVI tIVSLI tSLIXI SCK SOT SIN

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・ CSIO (SPI = 1, SCINV = 0) (VCC = 2.7V to 5.5V, VSS = 0V, TA = - 40°C to + 85°C) Parameter Symbol Pin name Conditions VCC < 4.5 V VCC ≥ 4.5 V Unit Min Max Min Max Serial clock cycle time tSCYC SCKx Master mode 4tCYCP - 4tCYCP - ns SCK ↑ → SOT delay time tSHOVI SCKx SOTx -30 +30 - 20 + 20 ns SIN → SCK ↓ setup time tIVSLI SCKx SINx 50 - 30 - ns SCK ↓→ SIN hold time tSLIXI SCKx SINx 0 - 0 - ns SOT → SCK ↓ delay time tSOVLI SCKx SOTx 2tCYCP - 30 - 2tCYCP - 30 - ns Serial clock L pulse width tSLSH SCKx Slave mode 2tCYCP - 10 - 2tCYCP - 10 - ns Serial clock H pulse width tSHSL SCKx tCYCP + 10 - tCYCP + 10 - ns SCK ↑ → SOT delay time tSHOVE SCKx SOTx - 50 - 30 ns SIN → SCK ↓ setup time tIVSLE SCKx SINx 10 - 10 - ns SCK ↓→ SIN hold time tSLIXE SCKx SINx 20 - 20 - ns SCK fall time tF SCKx - 5 - 5 ns SCK rise time tR SCKx - 5 - 5 ns Notes: ・ The above characteristics apply to CLK synchronous mode. ・ tCYCP indicates the APB bus clock cycle time. About the APB bus number which Multi-function Serial is connected to, see "■ Block Diagram" in this data sheet. ・ These characteristics only guarantee the same relocate port number. For example, the combination of SCKx_0 and SOTx_1 is not guaranteed. ・ When the external load capacitance = 30 pF.

March 11, 2015, MB9B410R-DS706-00026-3v0-E 93 CONFIDENTIAL Master mode Slave mode *: Changes when writing to TDR register tF tR tSLSH tSHSL tSHOVE VIL VIL VIH VIH VIH VOH VOL VOH VOL VIH VIL VIH VIL tIVSLE tSLIXE SCK SOT SIN tSOVLI tSCYC tSHOVI VOL VOL VOH VOH VOL VOH VOL VIH VIL VIH VIL tIVSLI tSLIXI SCK SOT SIN

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・ CSIO (SPI = 1, SCINV = 1) (VCC = 2.7V to 5.5V, VSS = 0V, TA = - 40°C to + 85°C) Parameter Symbol Pin name Conditions VCC < 4.5 V VCC ≥ 4.5 V Unit Min Max Min Max Serial clock cycle time tSCYC SCKx Master mode 4tCYCP - 4tCYCP - ns SCK ↓ → SOT delay time tSLOVI SCKx SOTx -30 +30 - 20 + 20 ns SIN → SCK ↑ setup time tIVSHI SCKx SINx 50 - 30 - ns SCK ↑ → SIN hold time tSHIXI SCKx SINx 0 - 0 - ns SOT → SCK ↑ delay time tSOVHI SCKx SOTx 2tCYCP - 30 - 2tCYCP - 30 - ns Serial clock L pulse width tSLSH SCKx Slave mode 2tCYCP - 10 - 2tCYCP - 10 - ns Serial clock H pulse width tSHSL SCKx tCYCP + 10 - tCYCP + 10 - ns SCK ↓ → SOT delay time tSLOVE SCKx SOTx - 50 - 30 ns SIN → SCK ↑ setup time tIVSHE SCKx SINx 10 - 10 - ns SCK ↑ → SIN hold time tSHIXE SCKx SINx 20 - 20 - ns SCK fall time tF SCKx - 5 - 5 ns SCK rise time tR SCKx - 5 - 5 ns Notes: ・ The above characteristics apply to CLK synchronous mode. ・ tCYCP indicates the APB bus clock cycle time. About the APB bus number which Multi-function Serial is connected to, see "■ Block Diagram" in this data sheet. ・ These characteristics only guarantee the same relocate port number. For example, the combination of SCKx_0 and SOTx_1 is not guaranteed. ・ When the external load capacitance = 30 pF.

March 11, 2015, MB9B410R-DS706-00026-3v0-E 95 CONFIDENTIAL Master mode Slave mode ・ UART external clock input (EXT = 1) (VCC = 2.7V to 5.5V, VSS = 0V, TA = - 40°C to + 85°C) Parameter Symbol Conditions Min Max Unit Remarks Serial clock L pulse width tSLSH CL = 30 pF tCYCP + 10 - ns Serial clock H pulse width tSHSL tCYCP + 10 - ns SCK fall time tF - 5 ns SCK rise time tR - 5 ns tSHSL tR tSLSH tF tSLOVE VIL VIL VIL VIH VIH VOH VOL VOH VOL VIH VIL VIH VIL tIVSHE tSHIXE SCK SOT SIN tSCYC tSLOVI VOL VOH VOH VOH VOL VOH VOL VIH VIL VIH VIL tIVSHI tSHIXI tSOVHI SCK SOT SIN tSHSL VIL VIL VIL VIH VIH tR tF tSLSH SCK

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(10) External input timing (VCC = 2.7V to 5.5V, VSS = 0V, TA = - 40°C to + 85°C) Parameter Symbol Pin name Conditions Value Unit Remarks Min Max Input pulse width tINH, tINL ADTG - 2tCYCP* - ns A/D converter trigger input FRCKx Free-run timer input clock ICxx Input capture DTTIxX - 2tCYCP* - ns Wave form generator INTxx, NMIX Except Timer mode, Stop mode 2tCYCP + 100* - ns External interrupt NMI Timer mode, Stop mode 500 - ns *1: tCYCP indicates the APB bus clock cycle time. About the APB bus number which A/D converter, Multi-function Timer, External interrupt is connected to, see "■ Block Diagram" in this data sheet.

March 11, 2015, MB9B410R-DS706-00026-3v0-E 97 CONFIDENTIAL (11) Quadrature Position/Revolution Counter timing (VCC = 2.7V to 5.5V, VSS = 0V, TA = - 40°C to + 85°C) Parameter Symbol Conditions Value Unit Min Max AIN pin H width tAHL - 2tCYCP* - ns AIN pin L width tALL - BIN pin H width tBHL - BIN pin L width tBLL - BIN rise time from AIN pin H level tAUBU PC_Mode2 or PC_Mode3 AIN fall time from BIN pin H level tBUAD PC_Mode2 or PC_Mode3 BIN fall time from AIN pin L level tADBD PC_Mode2 or PC_Mode3 AIN rise time from BIN pin L level tBDAU PC_Mode2 or PC_Mode3 AIN rise time from BIN pin H level tBUAU PC_Mode2 or PC_Mode3 BIN fall time from AIN pin H level tAUBD PC_Mode2 or PC_Mode3 AIN fall time from BIN pin L level tBDAD PC_Mode2 or PC_Mode3 BIN rise time from AIN pin L level tADBU PC_Mode2 or PC_Mode3 ZIN pin H width tZHL QCR:CGSC=0 ZIN pin L width tZLL QCR:CGSC=0 AIN/BIN rise and fall time from determined ZIN level tZABE QCR:CGSC=1 Determined ZIN level from AIN/BIN rise and fall time tABEZ QCR:CGSC=1 *: tCYCP indicates the APB bus clock cycle time. About the APB bus number which Quadrature Position/Revolution Counter is connected to, see "■ Block Diagram" in this data sheet. AIN BIN tAUBU tBUAD tADBD tBDAU tAHL tALL tBHL tBLL

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March 11, 2015, MB9B410R-DS706-00026-3v0-E 99 CONFIDENTIAL (12) I2C timing (VCC = 2.7V to 5.5V, VSS = 0V, TA = - 40°C to + 85°C) Parameter Symbol Conditions Standard-mode Fast-mode Unit Remarks Min Max Min Max SCL clock frequency FSCL CL = 30 pF, R = (Vp/IOL)*1 0 100 0 400 kHz (Repeated) START condition hold time SDA ↓ → SCL ↓ tHDSTA 4.0 - 0.6 - μs SCLclock L width tLOW 4.7 - 1.3 - μs SCLclock H width tHIGH 4.0 - 0.6 - μs (Repeated) START setup time SCL ↑ → SDA ↓ tSUSTA 4.7 - 0.6 - μs Data hold time SCL ↓ → SDA ↓ ↑ tHDDAT 0 3.45*2 0 0.9*3 μs Data setup time SDA ↓ ↑ → SCL ↑ tSUDAT 250 - 100 - ns STOP condition setup time SCL ↑ → SDA ↑ tSUSTO 4.0 - 0.6 - μs Bus free time between STOP condition and START condition tBUF 4.7 - 1.3 - μs Noise filter tSP

8 MHz ≤

tCYCP ≤ 40 MHz 2 tCYCP*4 - 2 tCYCP*4 - ns *5

40 MHz <

tCYCP ≤ 60 MHz 3 tCYCP*4 - 3 tCYCP*4 - ns *5

60 MHz <

tCYCP ≤ 72 MHz 4 tCYCP*4 - 4 tCYCP*4 - ns *5 *1: R and C represent the pull-up resistance and load capacitance of the SCL and SDA lines, respectively. Vp indicates the power supply voltage of the pull-up resistance and IOL indicates VOL guaranteed current. *2: The maximum tHDDAT must satisfy that it doesn't extend at least L period (tLOW) of device's SCL signal. *3: Fast-mode I2C bus device can be used on Standard-mode I2C bus system as long as the device satisfies the requirement of tSUDAT ≥ 250 ns. *4: tCYCP is the APB bus clock cycle time. About the APB bus number that I2C is connected to, see "■ Block Diagram" in this data sheet. To use Standard-mode, set the APB bus clock at 2 MHz or more. To use Fast-mode, set the APB bus clock at 8 MHz or more. *5: The number of the steps of the noise filter can be changed by register settings. Change the number of the noise filter steps according to APB2 bus clock frequency. SDA SCL

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(13) ETM timing (VCC = 2.7V to 5.5V, VSS = 0V, TA = - 40°C to + 85°C) Parameter Symbol Pin name Conditions Value Unit Remarks Min Max Data hold tETMH TRACECLK TRACED[3:0] VCC ≥ 4.5 V 2 9 ns VCC < 4.5 V 2 15 TRACECLK frequency 1/ tTRACE TRACECLK VCC ≥ 4.5 V - 50 MHz VCC < 4.5 V - 32 MHz TRACECLK cycle time tTRACE VCC ≥ 4.5 V 20 - ns VCC < 4.5 V 31.25 - ns Note: When the external load capacitance = 30 pF. HCLK TRACECLK TRACED[3:0]

March 11, 2015, MB9B410R-DS706-00026-3v0-E 101 CONFIDENTIAL (14) JTAG timing (VCC = 2.7V to 5.5V, VSS = 0V, TA = - 40°C to + 85°C) Parameter Symbol Pin name Conditions Value Unit Remarks Min Max TMS, TDI setup time tJTAGS TCK, TMS, TDI VCC ≥ 4.5 V 15 - ns VCC < 4.5 V TMS, TDI hold time tJTAGH TCK, TMS, TDI VCC ≥ 4.5 V 15 - ns VCC < 4.5 V TDO delay time tJTAGD TCK, TDO VCC ≥ 4.5 V - 25 ns VCC < 4.5 V - 45 Note: When the external load capacitance = 30 pF. TCK TMS/TDI TDO

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1. 12-bit A/D Converter ・Electrical Characteristics for the A/D Converter (VCC = AVCC = 2.7V to 5.5V, VSS = AVSS = 0V, TA = - 40°C to + 85°C) Parameter Symbol Pin name Value Unit Remarks Min Typ Max Resolution - - - - 12 bit Integral Nonlinearity - - - ± 4.0 ± 4.5 LSB A VRH = 2.7 V to 5.5 V Differential Nonlinearity - - - ± 2.3 ± 2.5 LSB Zero transition voltage VZT ANxx - ± 10 ± 15 mV Full-scale transition voltage VFST ANxx - A VRH ± 10 A VRH ± 15 mV Conversion time - - 1.0*1 - - μs AVCC ≥ 4.5 V Sampling time tS - *2 - - ns AVCC ≥ 4.5 V *2 - - AVCC < 4.5 V Compare clock cycle*3 tCCK - 50 - 2000 ns AVCC ≥ 4.5 V AVCC < 4.5 V State transition time to operation permission tSTT - - - 1.0 μs Analog input capacity CAIN - - - 12.9 pF Analog input resistance RAIN - - - 2 kΩ AVCC ≥ 4.5 V 3.8 AVCC < 4.5 V Interchannel disparity - - - - 4 LSB Analog port input current - ANxx - - 5 μA Analog input voltage - ANxx AVSS - A VRH V Reference voltage - A VRH 2.7 - AVCC V *1: Conversion time is the value of sampling time (tS) + compare time (tC). The condition of the minimum conversion time is the following. AVCC ≥ 4.5 V , HCLK=120 Hz sampling time: 300 ns, compare time: 700 ns AVCC < 4.5 V , HCLK=120 Hz sampling time: 500 ns, compare time: 700 ns Ensure that it satisfies the value of sampling time (tS) and compare clock cycle (tCCK). For setting*4 of sampling time and compare clock cycle, see "CHAPTER 1-1: 12-bit A/D Converter" in "FM3 Family PERIPHERAL MANUAL Analog Macro Part". A/D Converter register is set at APB bus clock timing. Sampling and compare clock is set at Base clock (HCLK). About the APB bus number which the A/D Converter is connected to, see "■ Block Diagram" in this data sheet. *2: A necessary sampling time changes by external impedance. Ensure that it set the sampling time to satisfy (Equation 1). *3: Compare time (tC) is the value of (Equation 2).

March 11, 2015, MB9B410R-DS706-00026-3v0-E 103 CONFIDENTIAL (Equation 1) tS ≥ ( RAIN + REXT ) × CAIN × 9 tS: Sampling time RAIN: input resistance of A/D = 2 kΩ at 4.5 V < AVCC < 5.5 V input resistance of A/D = 3.8 kΩ at 2.7 V < AVCC < 4.5 V CAIN: input capacity of A/D = 12.9 pF at 2.7 V < AVCC < 5.5 V REXT: Output impedance of external circuit (Equation 2) tC = tCCK × 14 tC: Compare time tCCK: Compare clock cycle REXT RAIN CAIN Analog signal source ANxx Analog input pin Comparator

104 MB9B410R-DS706-00026-3v0-E, March 11, 2015

・Definition of 12-bit A/D Converter Terms ・ Resolution: Analog variation that is recognized by an A/D converter. ・ Integral Nonlinearity: Deviation of the line between the zero-transition point (0b000000000000 ←→ 0b000000000001) and the full-scale transition point (0b111111111110 ←→ 0b111111111111) from the actual conversion characteristics. ・ Differential Nonlinearity: Deviation from the ideal value of the input voltage that is required to change the output code by 1 LSB. Integral Nonlinearity of digital output N = VNT - {1LSB × (N - 1) + VZT} [LSB] 1LSB Differential Nonlinearity of digital output N = V(N + 1) T - VNT - 1 [LSB] 1LSB 1LSB = VFST - VZT 4094 N: A/D converter digital output value. VZT: Voltage at which the digital output changes from 0x000 to 0x001. VFST: Voltage at which the digital output changes from 0xFFE to 0xFFF. VNT: Voltage at which the digital output changes from 0x(N − 1) to 0xN. Integral Nonlinearity Differential Nonlinearity Digital output Digital output Actual conversion characteristics Actual conversion characteristics Ideal characteristics (Actually- measured value) Actual conversion characteristics Actual conversion characteristics (Actually-measured value) (Actually-measured value) Ideal characteristics (Actually-measured value) Analog input Analog input (Actually-measured value) 0x001 0x002 0x003 0x004 0xFFD 0xFFE 0xFFF AVSS AVRH AVSS AVRH 0x(N-2) 0x(N-1) 0x(N+1) 0xN {1 LSB(N-1) + VZT} VNT VFST VZT VNT V(N+1)T

March 11, 2015, MB9B410R-DS706-00026-3v0-E 105 CONFIDENTIAL 6. Low-Voltage Detection Characteristics (1) Low-Voltage Detection Reset (TA = - 40°C to + 85°C) Parameter Symbol Conditions Value Unit Remarks Min Typ Max Detected voltage VDL - 2.25 2.45 2.65 V When voltage drops Released voltage VDH - 2.30 2.50 2.70 V When voltage rises (2) Interrupt of Low-Voltage Detection (TA = - 40°C to + 85°C) Parameter Symbol Conditions Value Unit Remarks Min Typ Max Detected voltage VDL SVHI = 0000 2.58 2.8 3.02 V When voltage drops Released voltage VDH 2.67 2.9 3.13 V When voltage rises Detected voltage VDL SVHI = 0001 2.76 3.0 3.24 V When voltage drops Released voltage VDH 2.85 3.1 3.34 V When voltage rises Detected voltage VDL SVHI = 0010 2.94 3.2 3.45 V When voltage drops Released voltage VDH 3.04 3.3 3.56 V When voltage rises Detected voltage VDL SVHI = 0011 3.31 3.6 3.88 V When voltage drops Released voltage VDH 3.40 3.7 3.99 V When voltage rises Detected voltage VDL SVHI = 0100 3.40 3.7 3.99 V When voltage drops Released voltage VDH 3.50 3.8 4.10 V When voltage rises Detected voltage VDL SVHI = 0111 3.68 4.0 4.32 V When voltage drops Released voltage VDH 3.77 4.1 4.42 V When voltage rises Detected voltage VDL SVHI = 1000 3.77 4.1 4.42 V When voltage drops Released voltage VDH 3.86 4.2 4.53 V When voltage rises Detected voltage VDL SVHI = 1001 3.86 4.2 4.53 V When voltage drops Released voltage VDH 3.96 4.3 4.64 V When voltage rises LVD stabilization wait time tLVDW - - - 4032 × tCYCP * μs *: tCYCP indicates the APB2 bus clock cycle time.

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1. MainFlash Memory Write/Erase Characteristics (1) Write / Erase time (VCC = 2.7V to 5.5V, TA = - 40°C to + 85°C) Parameter Value Unit Remarks Typ* Max* Sector erase time Large Sector 0.7 3.7 s Includes write time prior to internal erase Small Sector 0.3 1.1 Half word (16-bit) write time 12 384 μs Not including system-level overhead time Chip erase time 8 38.4 s Includes write time prior to internal erase *: The typical value is immediately after shipment, the maximam value is guarantee value under 100,000 cycle of erase/write. (2) Erase/write cycles and data hold time Erase/write cycles (cycle) Data hold time (year) Remarks 1,000 20* 10,000 10* 100,000 5* *: At average + 85C 8. WorkFlash Memory Write/Erase Characteristics (1) Write / Erase time (VCC = 2.7V to 5.5V, TA = - 40°C to + 85°C) Parameter Value Unit Remarks Typ* Max* Sector erase time 0.3 1.5 s Includes write time prior to internal erase Half word (16-bit) write time 20 384 μs Not including system-level overhead time Chip erase time 1.2 6 s Includes write time prior to internal erase *: The typical value is immediately after shipment, the maximam value is guarantee value under 10,000 cycle of erase/write. (2) Erase/write cycles and data hold time Erase/write cycles (cycle) Data hold time (year) Remarks 1,000 20* 10,000 10* *: At average + 85C

March 11, 2015, MB9B410R-DS706-00026-3v0-E 107 CONFIDENTIAL 9. Return Time from Low-Power Consumption Mode (1) Return Factor: Interrupt The return time from Low-Power consumption mode is indicated as follows. It is from receiving the return factor to starting the program operation. ・ Return Count Time (VCC = 2.7V to 5.5V, TA = - 40°C to + 85°C) Parameter Symbol Value Unit Remarks Typ Max* Sleep mode tICNT tCYCC ns High-speed CR Timer mode, Main Timer mode, PLL Timer mode 40 80 μs Low-speed CR Timer mode 453 737 μs Sub Timer mode 453 737 μs Stop mode 453 737 μs *: The maximum value depends on the accuracy of built-in CR. ・ Operation example of return from Low-Power consumption mode (by external interrupt*) External interrupt tICNT Interrupt factor accept CPU Operation Start Active Interrupt factor clear by CPU *: External interrupt is set to detecting fall edge.

108 MB9B410R-DS706-00026-3v0-E, March 11, 2015

・ Operation example of return from Low-Power consumption mode (by internal resource interrupt*) Internal resource interrupt tICNT Interrupt factor accept CPU Operation Start Active Interrupt factor clear by CPU *: Internal resource interrupt is not included in return factor by the kind of Low-Power consumption mode. Notes: ・ The return factor is different in each Low-Power consumption modes. See "CHAPTER 6: Low Power Consumption Mode and Operations of Standby Modes" in "FM3 Family PERIPHERAL MANUAL" about the return factor from Low-Power consumption mode. ・ When interrupt recoveries, the operation mode that CPU recoveries depends on the state before the Low-Power consumption mode transition. See "CHAPTER 6: Low Power Consumption Mode" in "FM3 Family PERIPHERAL MANUAL".

March 11, 2015, MB9B410R-DS706-00026-3v0-E 109 CONFIDENTIAL (2) Return Factor: Reset The return time from Low-Power consumption mode is indicated as follows. It is from releasing reset to starting the program operation. ・ Return Count Time (VCC = 2.7V to 5.5V, TA = - 40°C to + 85°C) Parameter Symbol Value Unit Remarks Typ Max* Sleep mode tRCNT 321 461 μs High-speed CR Timer mode, Main Timer mode, PLL Timer mode 321 461 μs Low-speed CR Timer mode 441 701 μs Sub Timer mode 441 701 μs Stop mode 441 701 μs *: The maximum value depends on the accuracy of built-in CR. ・ Operation example of return from Low-Power consumption mode (by INITX) INITX tRCNT Internal reset CPU Operation Start Reset active Release

110 MB9B410R-DS706-00026-3v0-E, March 11, 2015

・ Operation example of return from low power consumption mode (by internal resource reset*) Internal resource reset tRCNT Internal reset CPU Operation Start Reset active Release *: Internal resource reset is not included in return factor by the kind of Low -Power consumption mode. Notes: ・ The return factor is different in each Low-Power consumption modes. See "CHAPTER 6: Low Power Consumption Mode and Operations of Standby Modes" in "FM3 Family PERIPHERAL MANUAL". ・ When interrupt recoveries, the operation mode that CPU recoveries depends on the state before the Low-Power consumption mode transition. See "CHAPTER 6: Low Power Consumption Mode" in "FM3 Family PERIPHERAL MANUAL". ・ The time during the power-on reset/low-voltage detection reset is excluded. See "(6) Power-on Reset Timing" in "4. AC Characteristics" in "■ Electrical Characteristics" for the detail on the time during the power-on reset/low -voltage detection reset. ・ When in recovery from reset, CPU changes to the High-speed CR Run mode. When using the main clock or the PLL clock, it is necessary to add the main clock oscillation stabilization wait time or the Main PLL clock stabilization wait time. ・ The internal resource reset means the watchdog reset and the CSV reset.

March 11, 2015, MB9B410R-DS706-00026-3v0-E 111 CONFIDENTIAL  Ordering Information Part number On-chip Flash memory On-chip MB9BF412NPQC-JNE2 Main: 128 Kbyte Work: 32 Kbyte 8 Kbyte Plastic  QFP 100-pin (0.65 mm pitch), (FPT-100P-M03) Tray MB9BF414NPQC-JNE2 Main: 256 Kbyte Work: 32 Kbyte 16 Kbyte MB9BF415NPQC-JNE2 Main: 384 Kbyte Work: 32 Kbyte 24 Kbyte MB9BF416NPQC-JNE2 Main: 512 Kbyte Work: 32 Kbyte 32 Kbyte MB9BF412NPMC-JNE2 Main: 128 Kbyte Work: 32 Kbyte 8 Kbyte Plastic  LQFP 100-pin (0.5 mm pitch), (FPT-100P-M23) MB9BF414NPMC-JNE2 Main: 256 Kbyte Work: 32 Kbyte 16 Kbyte MB9BF415NPMC-JNE2 Main: 384 Kbyte Work: 32 Kbyte 24 Kbyte MB9BF416NPMC-JNE2 Main: 512 Kbyte Work: 32 Kbyte 32 Kbyte MB9BF412RPMC-JNE2 Main: 128 Kbyte Work: 32 Kbyte 8 Kbyte Plastic  LQFP 120-pin (0.5 mm pitch), (FPT-120P-M37) MB9BF414RPMC-JNE2 Main: 256 Kbyte Work: 32 Kbyte 16 Kbyte MB9BF415RPMC-JNE2 Main: 384 Kbyte Work: 32 Kbyte 24 Kbyte MB9BF416RPMC-JNE2 Main: 512 Kbyte Work: 32 Kbyte 32 Kbyte MB9BF412NBGL-GE1 Main: 128 Kbyte Work: 32 Kbyte 8 Kbyte Plastic  PFBGA 112-pin (0.8 mm pitch), (BGA-112P-M04) MB9BF414NBGL-GE1 Main: 256 Kbyte Work: 32 Kbyte 16 Kbyte MB9BF415NBGL-GE1 Main: 384 Kbyte Work: 32 Kbyte 24 Kbyte MB9BF416NBGL-GE1 Main: 512 Kbyte Work: 32 Kbyte 32 Kbyte

112 MB9B410R-DS706-00026-3v0-E, February 27, 2015

 Package Dimensions 100-pin plastic LQFP Lead pitch 0.50 mm Package width × package length 14.00 mm × 14.00 mm Lead shape Gullwing Lead bend direction Normal bend Sealing method Plastic mold Mounting height 1.70 mm MAX Weight 0.65 g 100-pin plastic LQFP (FPT-100P-M23) (FPT-100P-M23) C 2009-2010 FUJITSU SEMICONDUCTOR LIMITED F100034S-c-3-4 12 5 100 0.145±0.055 (.006±.002) 0.08(.003) "A" INDEX 0°~8° 0.50±0.20 0.10±0.10 (Stand off) +.008 +0.20 (Mounting height) -0.101.50 .059 -.004( ) Dimensions in mm (inches). Note:The values in parentheses are reference values. Note 1) * : These dimensions do not include resin protrusion. Note 2) Pins width and pins thickness include plating thickness. Note 3) Pins width do not include tie bar cutting remainder. Details of "A" part (.004±.004) (.009±.002) (.020±.008) (.024±.006)

February 27, 2015, MB9B410R-DS706-00026-3v0-E 113 CONFIDENTIAL 120-pin plastic LQFP Lead pitch 0.50 mm Package width × package length 16.0 mm × 16.0 mm Lead shape Gullwing Sealing method Plastic mold Mounting height 1.70 mm Max Weight 0.88 g Code (Reference) P-LFQFP120-16 × 16-0.50 120-pin plastic LQFP (FPT-120P-M37) (FPT-120P-M37) C 2010 FUJITSU SEMICONDUCTOR LIMITED F120037Sc(1)-1-1 1 30 91 60 120 (.009± .002) M0.08(.003) ( ) 0.08(.003) "A" INDEX .059–.004 +.008 –0.10 +0.20 1.50 (Mounting height) 0˚~8˚ (.024± .006) 0.60± 0.15 0.25(.010) 0.10± 0.05 (.004± .002) Details of "A" part (Stand off) LEAD No. –0.03 +0.05 0.145 –.001 +.002 .006 Dimensions in mm (inches). Note: The values in parentheses are reference values Note 1) * : These dimensions do not include resin protrusion. Note 2) Pins width and pins thickness include plating thickness. Note 3) Pins width do not include tie bar cutting remainder.

114 MB9B410R-DS706-00026-3v0-E, February 27, 2015

100-pin plastic QFP Lead pitch 0.65 mm Package width × package length 14.00 mm × 20.00 mm Lead shape Gullwing Sealing method Plastic mold Mounting height 3.35 mm MAX Code (Reference) P-QFP100-14 × 20-0.65 100-pin plastic QFP (FPT-100P-M36) (FPT-100P-M36)

2011 FUJITSU SEMICONDUCTOR LIMITED HMbF100-36Sc-1-1C

(.551±.008) 17.90± 0.40 (.705±.016) INDEX (.013±.002) M0.13(.005) "A" 0.17 ± 0.06 (.007 ±. 002) 0.10(.004) Details of "A" part (.035 ±. 006) 0.88 ± 0.15 (.031 ±. 008) 0.80 ± 0.20 0.25(.010)3.00 +0.35 –0.20 +.014 –.008.118 (Mounting height) 0.25 ± 0.20 (.010 ±. 008) (Stand off) 0~8° *14.00±0.20 Dimensions in mm (inches). Note: The valuesin parentheses are referencevalues. Note 1) * : These dimensions do not include resin protrusion. Note 2) Pins width and pins thickness include plating thickness. Note 3) Pins width do not include tie bar cutting remainder.

February 27, 2015, MB9B410R-DS706-00026-3v0-E 115 CONFIDENTIAL 112-ball plastic PFBGA Ball pitch 0.80 mm Package width × package length 10.00 × 10.00 mm Lead shape Soldering ball Sealing method Plastic mold Ball size Ф 0.45 mm Mounting height 1.45 mm Max. Weight 0.22 g 112-ball plastic PFBGA (BGA-112P-M04) (BGA-112P-M04) C 2003-2010 FUJITSU SEMICONDUCTOR LIMITED B112004S-c-2-3 (.049±.008) 1.25±0.20 (Seated height) F INDEX (INDEX AREA) 10.00±0.10 (.394±.004) (112-Ф0.18±.004) 112-Ф0.45±010 0.35±0.10 (.014±.004) (Stand off) 0.10(.004) S B A GHJKLE D C B A 0.80(.031) REF REF 0.80(.031) Ф0.08(.003) B ASM 0.20(.008) S B S AS0.20(.008) Dimensions in mm (inches). Note: The values in parentheses are reference values.

116 MB9B410R-DS706-00026-3v0-E, March 11, 2015

 Major Changes Page Section Change Results Revision 1.0 - - Initial release Revision 2.0 5  FEATURES  External Interrupt Controller Unit Corrected the external interrupt input pin. 101  ELECTRICAL CHARACTERISTICS 5. 12-bit A/D Converter  Electrical Characteristics for the A/D Converter Corrected the value of "Compare clock cycle". Max: 10000 → 2000 106  ORDERING INFORMATION Corrected the part number. Revision 2.1 - - Company name and layout design change Revision 3.0 2 Features External Bus Interface Added the description of Maximum area size 9 Packages Deleted the description of ES 27, 28 List of Pin Functions

• List of pin numbers Modified I/O circuit type of P63 to P68 47, 49 I/O Circuit Type Added the description of I2C to the type of E, F and I 47, 48 I/O Circuit Type Added about +B input 54 Handling Devices Added " tabilizing power supply voltage" 54 Handling Devices Crystal oscillator circuit Added the following description "Evaluate oscillation of your using crystal oscillator by your mount board." 55 Handling Devices C Pin Changed the description 56 Block Diagram Modified the block diagram 57 Memory Map
• Memory map(1) Modified the area of "Extarnal Device Area" 58, 59 Memory Map
• Memory map(2)(3) Added the summary of Flash memory sector and the note 66, 67 Electrical Characteristics 1. Absolute Maximum Ratings
• Added the Clamp maximum current
• Added the output current of P80 and P81
• Added about +B input 68 Electrical Characteristics 2. Recommended Operation Conditions
• Modified the minimum value of Analog reference voltage
• Added Smoothing capacitor
• Added the note about less than the minimum power supply voltage 69, 70 Electrical Characteristics 3. DC Characteristics (1) Current rating
• Changed the table format
• Added Main TIMER mode current
• Added Flash Memory Current
• Moved A/D Converter Current
• Modified the unit of low voltage detection circuit (LVD) power supply current Electrical Characteristics 4. AC Characteristics (1) Main Clock Input Characteristics Added Master clock at Ingernal operating clock frequency Electrical Characteristics 4. AC Characteristics (3) Built-in CR Oscillation Characteristics Added Frequency stability time at Built-in high-speed CR Electrical Characteristics 4. AC Characteristics (4-1) Operating Conditions of Main PLL (4-2) Operating Conditions of Main PLL
• Added Main PLL clock frequency
• Added the figure of Main PLL connection Electrical Characteristics 4. AC Characteristics (6) Power-on Reset Timing
• Added Time until releasing Power-on reset
• Changed the figure of timing 78-80 Electrical Characteristics 4. AC Characteristics (7) External Bus Timing Modified Data output time 88-95 Electrical Characteristics 4. AC Characteristics (8) CSIO/UART Timing
• Modified from UART Timing to CSIO/UART Timing
• Changed from Internal shift clock operation to Master mode
• Changed from External shift clock operation to Slave mode 102 Electrical Characteristics 5. 12bit A/D Converter
• Added the typical value of Integral Nonlinearity, Differential Nonlinearity, Zero transition voltage and Full-scale transition voltage
• Modified Stage transition time to operation permission
• Modified the minimum value of Reference voltage

March 11, 2015, MB9B410R-DS706-00026-3v0-E 117 CONFIDENTIAL Page Section Change Results 105 Electrical Characteristics 7. Low-voltage Detection Characteristics (2) Interrupt of Low-voltage Detection Modified LVD stabilization wait time 106 Electrical Characteristics 8. WorkFlash Memory Write/Erase Characteristics (1) Write / Erase time

• Modified sector erase time
• Modified half word(16-bit) write time 107-110 Electrical Characteristics 9. Return Time from Low-Power Consumption Mode Added Return Time from Low-Power Consumption Mode 111 Ordering Information Change to full part number 112-115 Package Dimensions Deleted FPT-100P-M20 and FPT-120P-M21

118 MB9B410R-DS706-00026-3v0-E, March 11, 2015

The products described in this document are designed, developed and manufactured as contemplated for general use, including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as contemplated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion will not be liable to you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country, the prior authorization by the respective government entity will be required for export of those products. Trademarks and Notice The contents of this document are subject to change without notice. This document may contain information on a Spansion product under development by Spansion. Spansion reserves the right to change or discontinue work on any product without notice. The information in this document is provided as is without warranty or guarantee of any kind as to its accuracy, completeness, operability, fitness for particular purpose, merchantability, non-infringement of third-party rights, or any other warranty, express, implied, or statutory. Spansion assumes no liability for any damages of any kind arising out of the use of the information in this document. Copyright © 2012-2015 Spansion All rights reserved. Spansion®, the Spansion logo, MirrorBit®, MirrorBit® EclipseTM, ORNANDTM, Easy DesignSimTM, TraveoTM and combinations thereof, are trademarks and registered trademarks of Spansion LLC in the United States and other countries. Other names used are for informational purposes only and may be trademarks of their respective owners.