MB9A120L

DATASHEET SEARCH SITE | WWW.ALLDATASHEET.COM

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 93

Technical content

The following document contains information on Cypress products.

32-bit ARM® Cortex®-M3 based Microcontroller MB9AF121K/L Data Sheet (Full Production) Publication Number MB9A120L_DS706-00064 Revision 2.0 Issue Date March 31, 2015 CONFIDENTIAL Notice to Readers: This document states the current technical specifications regarding the Spansion product(s) described herein. Spansion Inc. deems the products to have been in sufficient production volume such that subsequent versions of this document are not expected to change. However, typographical or specification corrections, or modifications to the valid combinations offered may occur.

MB9A120L_DS706-00064-2v0-E, March 31, 2015 CONFIDENTIAL Notice On Data Sheet Designations Spansion Inc. issues data sheets with Advance Information or Preliminary designations to advise readers of product information or intended specifications throughout the product life cycle, including development, qualification, initial production, and full production. In all cases, however, readers are encouraged to verify that they have the latest information before finalizing their design. The following descriptions of Spansion data sheet designations are presented here to highlight their presence and definitions. Advance Information The Advance Information designation indicates that Spansion Inc. is developing one or more specific products, but has not committed any design to production. Information presented in a document with this designation is likely to change, and in some cases, development on the product may discontinue. Spansion Inc. therefore places the following conditions upon Advance Information content: “This document contains information on one or more products under development at Spansion Inc. The information is intended to help you evaluate this product. Do not design in this product without contacting the factory. Spansion Inc. reserves the right to change or discontinue work on this proposed product without notice.” Preliminary The Preliminary designation indicates that the product development has progressed such that a commitment to production has taken place. This designation covers several aspects of the product life cycle, including product qualification, initial production, and the subsequent phases in the manufacturing process that occur before full production is achieved. Changes to the technical specifications presented in a Preliminary document should be expected while keeping these aspects of production under consideration. Spansion places the following conditions upon Preliminary content: “This document states the current technical specifications regarding the Spansion product(s) described herein. The Preliminary status of this document indicates that product qualification has been completed, and that initial production has begun. Due to the phases of the manufacturing process that require maintaining efficiency and quality, this document may be revised by subsequent versions or modifications due to changes in technical specifications.” Combination Some data sheets contain a combination of products with different designations (Advance Information, Preliminary, or Full Production). This type of document distinguishes these products and their designations wherever necessary, typically on the first page, the ordering information page, and pages with the DC Characteristics table and the AC Erase and Program table (in the table notes). The disclaimer on the first page refers the reader to the notice on this page. Full Production (No Designation on Document) When a product has been in production for a period of time such that no changes or only nominal changes are expected, the Preliminary designation is removed from the data sheet. Nominal changes may include those affecting the number of ordering part numbers available, such as the addition or deletion of a speed option, temperature range, package type, or VIO range. Changes may also include those needed to clarify a description or to correct a typographical error or incorrect specification. Spansion Inc. applies the following conditions to documents in this category: “This document states the current technical specifications regarding the Spansion product(s) described herein. Spansion Inc. deems the products to have been in sufficient production volume such that subsequent versions of this document are not expected to change. However, typographical or specification corrections, or modifications to the valid combinations offered may occur.” Questions regarding these document designations may be directed to your local sales office.

32-bit ARM® Cortex®-M3 based Microcontroller MB9AF121K/L Data Sheet (Full Production) Publication Number MB9A120L_DS706-00064 Revision 2.0 Issue Date March 31, 2015 CONFIDENTIAL This document states the current technical specifications regarding the Spansion product(s) described herein. Spansion Inc. deems the products to have been in sufficient production volume such that subsequent versions of this document are not expected to change. However, typographical or specification corrections, or modifications to the valid combinations offered may occur.  Description The MB9A120L Series are highly integrated 32-bit microcontrollers dedicated for embedded controllers with low-power consumption mode and competitive cost. These series are based on the ARM Cortex-M3 Processor with on-chip Flash memory and SRAM, and have peripheral functions such as various timers, ADCs, DACs and Communication Interfaces ( UART, CSIO, I2C, LIN). The products which are described in this data sheet are placed into TYPE11 product categories in FM3 Family Peripheral Manual. Note: ARM and Cortex are the registered trademarks of ARM Limited in the EU and other countries.

2 MB9A120L_DS706-00064-2v0-E, March 31, 2015

 Features  32-bit ARM Cortex-M3 Core  Processor version: r2p1  Up to 40 MHz Frequency Operation  Integrated Nested Vectored Interrupt Controller (NVIC): 1 NMI (non-maskable interrupt) and 48 peripheral interrupts and 16 priority levels  24-bit System timer (Sys Tick): System timer for OS task management  On-chip Memories [Flash memory]  64 Kbytes  Read cycle: 0 wait-cycle  Security function for code protection [SRAM] This series contains 4 Kbyte on-chip SRAM memories that is connected to System bus of Cortex-M3 core.  SRAM1: 4 Kbyte  Multi-function Serial Interface (Max four channels)  4 channels without FIFO (ch.0, ch.1, ch.3, ch.5)  Operation mode is selectable from the followings for each channel.  UART  CSIO  LIN  I2C [UART]  Full duplex double buffer  Selection with or without parity supported  Built-in dedicated baud rate generator  External clock available as a serial clock  Various error detection functions available (parity errors, framing errors, and overrun errors) [CSIO]  Full duplex double buffer  Built-in dedicated baud rate generator  Overrun error detection function available [LIN]  LIN protocol Rev.2.1 supported  Full duplex double buffer  Master/Slave mode supported  LIN break field generation (can be changed to 13-bit to 16-bit length)  LIN break delimiter generation (can be changed to 1-bit to 4-bit length)  Various error detection functions available (parity errors, framing errors, and overrun errors) [I2C] Standard-mode (Max 100 kbps) / Fast-mode (Max 400 kbps) supported

March 31, 2015, MB9A120L_DS706-00064-2v0-E 3 CONFIDENTIAL  A/D Converter (Max eight channels) [12-bit A/D Converter]  Successive Approximation type  Conversion time: 0.8 μs @ 5 V  Priority conversion available (priority at 2 levels)  Scanning conversion mode  Built-in FIFO for conversion data storage (for SCAN conversion: 16 steps, for Priority conversion: 4 steps)  D/A Converter (Max one channel)  R-2R type  10-bit resolution  Base Timer (Max eight channels) Operation mode is selectable from the followings for each channel.  16-bit PWM timer  16-bit PPG timer  16-/32-bit reload timer  16-/32-bit PWC timer  General-Purpose I/O Port This series can use its pins as general-purpose I/O ports when they are not used for peripherals. Moreover, the port relocate function is built-in. It can set which I/O port the peripheral function can be allocated to.  Capable of pull-up control per pin  Capable of reading pin level directly  Built-in the port relocate function  Up to 51 high-speed general-purpose I/O Ports@64 pin Package  Some ports are 5V tolerant See List of Pin Functions and I/O Circuit Type to confirm the corresponding pins.  Dual Timer (32-/16-bit Down Counter) The Dual Timer consists of two programmable 32-/16-bit down counters. Operation mode is selectable from the followings for each channel.  Free-running  Periodic (=Reload)  One-shot

4 MB9A120L_DS706-00064-2v0-E, March 31, 2015

 Multi-function Timer The Multi-function timer is composed of the following blocks.  16-bit free-run timer × 3ch.  Input capture × 3ch.  Output compare × 6ch.  A/D activation compare × 1ch.  Waveform generator × 3ch.  16-bit PPG timer × 3ch. IGBT mode is contained The following function can be used to achieve the motor control.  PWM signal output function  DC chopper waveform output function  Dead time function  Input capture function  A/D convertor activate function  DTIF (Motor emergency stop) interrupt function  Real-time clock (RTC) The Real-time clock can count Year/Month/Day/Hour/Minute/Second/A day of the week from 01 to 99.  The interrupt function with specifying date and time (Year/Month/Day/Hour/Minute/Second/A day of the week.) is available. This function is also available by specifying only Year, Month, Day, Hour or Minute.  Timer interrupt function after set time or each set time.  Capable of rewriting the time with continuing the time count.  Leap year automatic count is available.  External Interrupt Controller Unit  Up to 19 external interrupt input pins @ 64 pin Package  Include one non-maskable interrupt (NMI) input pin  Watchdog Timer (Two channels) A watchdog timer can generate interrupts or a reset when a time-out value is reached. This series consists of two different watchdogs, a Hardware watchdog and a Software watchdog. The Hardware watchdog timer is clocked by the built-in low-speed CR oscillator. Therefore, the Hardware watchdog is active in any low-power consumption modes except RTC, Stop modes.  Clock and Reset [Clocks] Selectable from five clock sources (2 external oscillators, 2 built-in CR oscillators, and Main PLL).  Main Clock: 4 MHz to 48 MHz  Sub Clock: 32.768 kHz  Built-in high-speed CR Clock: 4 MHz  Built-in low-speed CR Clock: 100 kHz  Main PLL Clock [Resets]  Reset requests from INITX pin  Power-on reset  Software reset  Watchdog timers reset  Low-voltage detection reset  Clock Super Visor reset

March 31, 2015, MB9A120L_DS706-00064-2v0-E 5 CONFIDENTIAL  Clock Super Visor (CSV) Clocks generated by built-in CR oscillators are used to supervise abnormality of the external clocks.  If external clock failure (clock stop) is detected, reset is asserted.  If external frequency anomaly is detected, interrupt or reset is asserted.  Low-Voltage Detector (LVD) This Series includes 2-stage monitoring of voltage on the VCC pins. When the voltage falls below the voltage that has been set, Low-V oltage Detector generates an interrupt or reset.  LVD1: error reporting via interrupt  LVD2: auto-reset operation  Low-Power Consumption Mode Four low-power consumption modes supported.  Sleep  Timer  RTC  Stop  Debug Serial Wire JTAG Debug Port (SWJ-DP)  Unique ID Unique value of the device (41-bit) is set.  Power Supply Wide range voltage: VCC = 2.7 V to 5.5 V

6 MB9A120L_DS706-00064-2v0-E, March 31, 2015

 Product Lineup  Memory size Product name MB9AF121K/L On-chip Flash memory 64 Kbytes On-chip SRAM SRAM1 4 Kbytes  Function Product name MB9AF121K MB9AF121L Pin count 48/52 64 CPU Cortex-M3 Freq. 40 MHz Power supply voltage range 2.7 V to 5.5 V Multi-function Serial Interface (UART/CSIO/LIN/I2C) 4ch. (Max) ch.0, ch.1, ch.3, ch.5: No FIFO (In ch.5, only UART and LIN are available.) 4ch. (Max) ch.0, ch.1, ch.3, ch.5: No FIFO Base Timer (PWC/Reload timer/PWM/PPG) 8ch. (Max) MF- Timer A/D activation compare 1ch. 1 unit Input capture 3ch. Free-run timer 3ch. Output compare 6ch. Waveform generator 3ch. PPG (IGBT mode) 3ch. Dual Timer 1 unit Real-Time Clock 1 unit Watchdog timer 1ch. (SW) + 1ch. (HW) External Interrupts 14 pins (Max) + NMI × 1 19 pins (Max) + NMI × 1 I/O ports 36 pins (Max) 51 pins (Max) 12-bit A/D converter 8ch. (1 unit) 10-bit D/A converter 1ch. (Max) CSV (Clock Super Visor) Yes LVD (Low-V oltage Detector) 2ch. Built-in CR High-speed 4 MHz Low-speed 100 kHz Debug Function SWJ-DP Unique ID Yes Note: All signals of the peripheral function in each product cannot be allocated by limiting the pins of package. It is necessary to use the port relocate function of the I/O port according to your function use. See Electrical Characteristics 4.AC Characteristics (3)Built-in CR Oscillation Characteristics for accuracy of built-in CR.

March 31, 2015, MB9A120L_DS706-00064-2v0-E 7 CONFIDENTIAL  Packages Product name LQFP: FPT-48P-M49 (0.5 mm pitch)  - QFN: LCC-48P-M74 (0.5 mm pitch)  - LQFP: FPT-52P-M02 (0.65 mm pitch)  - LQFP: FPT-64P-M38 (0.5 mm pitch) -  LQFP: FPT-64P-M39 (0.65 mm pitch) -  QFN: LCC-64P-M25 (0.5 mm pitch) -  : Supported Note: See Package Dimensions for detailed information on each package.

8 MB9A120L_DS706-00064-2v0-E, March 31, 2015

 Pin Assignment ・FPT-64P-M38/M39 (TOP VIEW) VSS P82 P81/INT17_1 P80/INT16_1 P60/SIN5_0/TIOA2_2/INT15_1/IGTRG_1 P61/SOT5_0/TIOB2_2/DTTI0X_2 P62/SCK5_0/ADTG_3 P0F/NMIX/SUBOUT_0/CROUT_1/RTCCO_0 P0C/TIOA6_1/INT19_0 P0B/TIOB6_1/INT18_0 P0A/INT00_2 P04/TDO/SWO P03/TMS/SWDIO P02/TDI P01/TCK/SWCLK P00/TRSTX VCC 1 48 P21/AN14/SIN0_0/INT06_1 P50/INT00_0/SIN3_1 2 47 P22/AN13/SOT0_0/TIOB7_1 P51/INT01_0/SOT3_1 3 46 P23/AN12/SCK0_0/TIOA7_1 P52/INT02_0/SCK3_1 4 45 P19 P30/TIOB0_1/INT03_2 5 44 P18 P31/TIOB1_1/INT04_2 6 43 AVRL P32/TIOB2_1/INT05_2 7 42 AVRH P33/INT04_0/TIOB3_1/ADTG_6 8 41 AVCC P39/DTTI0X_0/INT06_0/ADTG_2 9 40 P17/INT04_1 P3A/RTO00_0/TIOA0_1/INT07_0/SUBOUT_2/RTCCO_2 10 39 P15/AN05/SOT0_1/INT14_0/IC03_2 P3B/RTO01_0/TIOA1_1 11 38 P14/AN04/SIN0_1/INT03_1/IC02_2 P3C/RTO02_0/TIOA2_1/INT18_2 12 37 AVSS P3D/RTO03_0/TIOA3_1 13 36 P12/AN02/SOT1_1/IC00_2 P3E/RTO04_0/TIOA4_1/INT19_2 14 35 P11/AN01/SIN1_1/INT02_1/FRCK0_2 P3F/RTO05_0/TIOA5_1 15 34 P10/AN00/SCK1_1 VSS 16 33 VCC C VCC P46/X0A P47/X1A INITX P49/TIOB0_0/SOT3_2/INT20_1/DA0_0 P4A/TIOB1_0/SCK3_2/INT21_1 P4B/TIOB2_0/INT22_1/IGTRG_0 P4C/TIOB3_0/INT12_0 P4D/TIOB4_0/INT13_0 P4E/TIOB5_0/INT06_2 PE0/MD1 MD0 PE2/X0 PE3/X1 VSS LQFP - 64 <Note> The number after the underscore ("_") in pin names such as XXX_1 and XXX_2 indicates the relocated port number. For these pins, there are multiple pins that provide the same function for the same channel. Use the extended port function register (EPFR) to select the pin.

March 31, 2015, MB9A120L_DS706-00064-2v0-E 9 CONFIDENTIAL ・LCC-64P-M25 (TOP VIEW) VSS P82 P81/INT17_1 P80/INT16_1 P60/SIN5_0/TIOA2_2/INT15_1/IGTRG_1 P61/SOT5_0/TIOB2_2/DTTI0X_2 P62/SCK5_0/ADTG_3 P0F/NMIX/SUBOUT_0/CROUT_1/RTCCO_0 P0C/TIOA6_1/INT19_0 P0B/TIOB6_1/INT18_0 P0A/INT00_2 P04/TDO/SWO P03/TMS/SWDIO P02/TDI P01/TCK/SWCLK P00/TRSTX VCC 1 48 P21/AN14/SIN0_0/INT06_1 P50/INT00_0/SIN3_1 2 47 P22/AN13/SOT0_0/TIOB7_1 P51/INT01_0/SOT3_1 3 46 P23/AN12/SCK0_0/TIOA7_1 P52/INT02_0/SCK3_1 4 45 P19 P30/TIOB0_1/INT03_2 5 44 P18 P31/TIOB1_1/INT04_2 6 43 AVRL P32/TIOB2_1/INT05_2 7 42 AVRH P33/INT04_0/TIOB3_1/ADTG_6 8 41 AVCC P39/DTTI0X_0/INT06_0/ADTG_2 9 40 P17/INT04_1 P3A/RTO00_0/TIOA0_1/INT07_0/SUBOUT_2/RTCCO_2 10 39 P15/AN05/SOT0_1/INT14_0/IC03_2 P3B/RTO01_0/TIOA1_1 11 38 P14/AN04/SIN0_1/INT03_1/IC02_2 P3C/RTO02_0/TIOA2_1/INT18_2 12 37 AVSS P3D/RTO03_0/TIOA3_1 13 36 P12/AN02/SOT1_1/IC00_2 P3E/RTO04_0/TIOA4_1/INT19_2 14 35 P11/AN01/SIN1_1/INT02_1/FRCK0_2 P3F/RTO05_0/TIOA5_1 15 34 P10/AN00/SCK1_1 VSS 16 33 VCC C VCC P46/X0A P47/X1A INITX P49/TIOB0_0/SOT3_2/INT20_1/DA0_0 P4A/TIOB1_0/SCK3_2/INT21_1 P4B/TIOB2_0/INT22_1/IGTRG_0 P4C/TIOB3_0/INT12_0 P4D/TIOB4_0/INT13_0 P4E/TIOB5_0/INT06_2 PE0/MD1 MD0 PE2/X0 PE3/X1 VSS QFN - 64 <Note> The number after the underscore ("_") in pin names such as XXX_1 and XXX_2 indicates the relocated port number. For these pins, there are multiple pins that provide the same function for the same channel. Use the extended port function register (EPFR) to select the pin.

10 MB9A120L_DS706-00064-2v0-E, March 31, 2015

・FPT-48P-M49 (TOP VIEW) VSS P82 P81/INT17_1 P80/INT16_1 P60/SIN5_0/TIOA2_2/INT15_1/IGTRG_1 P61/SOT5_0/TIOB2_2/DTTI0X_2 P0F/NMIX/SUBOUT_0/CROUT_1/RTCCO_0 P04/TDO/SWO P03/TMS/SWDIO P02/TDI P01/TCK/SWCLK P00/TRSTX VCC 1 36 P21/AN14/SIN0_0/INT06_1 P50/INT00_0/SIN3_1 2 35 P22/AN13/SOT0_0/TIOB7_1 P51/INT01_0/SOT3_1 3 34 P23/AN12/SCK0_0/TIOA7_1 P52/INT02_0/SCK3_1 4 33 AVRL P39/DTTI0X_0/INT06_0/ADTG_2 5 32 AVRH P3A/RTO00_0/TIOA0_1/INT07_0/SUBOUT_2/RTCCO_2 6 31 AVCC P3B/RTO01_0/TIOA1_1 7 30 P15/AN05/SOT0_1/INT14_0/IC03_2 P3C/RTO02_0/TIOA2_1/INT18_2 8 29 P14/AN04/SIN0_1/INT03_1/IC02_2 P3D/RTO03_0/TIOA3_1 9 28 AVSS P3E/RTO04_0/TIOA4_1/INT19_2 10 27 P12/AN02/SOT1_1/IC00_2 P3F/RTO05_0/TIOA5_1 11 26 P11/AN01/SIN1_1/INT02_1/FRCK0_2 VSS 12 25 P10/AN00/SCK1_1 C VCC P46/X0A P47/X1A INITX P49/TIOB0_0/INT20_1/DA0_0 P4A/TIOB1_0/INT21_1 PE0/MD1 MD0 PE2/X0 PE3/X1 VSS LQFP - 48 <Note> The number after the underscore ("_") in pin names such as XXX_1 and XXX_2 indicates the relocated port number. For these pins, there are multiple pins that provide the same function for the same channel. Use the extended port function register (EPFR) to select the pin.

March 31, 2015, MB9A120L_DS706-00064-2v0-E 11 CONFIDENTIAL ・LCC-48P-M74 (TOP VIEW) VSS P82 P81/INT17_1 P80/INT16_1 P60/SIN5_0/TIOA2_2/INT15_1/IGTRG_1 P61/SOT5_0/TIOB2_2/DTTI0X_2 P0F/NMIX/SUBOUT_0/CROUT_1/RTCCO_0 P04/TDO/SWO P03/TMS/SWDIO P02/TDI P01/TCK/SWCLK P00/TRSTX VCC 1 36 P21/AN14/SIN0_0/INT06_1 P50/INT00_0/SIN3_1 2 35 P22/AN13/SOT0_0/TIOB7_1 P51/INT01_0/SOT3_1 3 34 P23/AN12/SCK0_0/TIOA7_1 P52/INT02_0/SCK3_1 4 33 AVRL P39/DTTI0X_0/INT06_0/ADTG_2 5 32 AVRH P3A/RTO00_0/TIOA0_1/INT07_0/SUBOUT_2/RTCCO_2 6 31 AVCC P3B/RTO01_0/TIOA1_1 7 30 P15/AN05/SOT0_1/INT14_0/IC03_2 P3C/RTO02_0/TIOA2_1/INT18_2 8 29 P14/AN04/SIN0_1/INT03_1/IC02_2 P3D/RTO03_0/TIOA3_1 9 28 AVSS P3E/RTO04_0/TIOA4_1/INT19_2 10 27 P12/AN02/SOT1_1/IC00_2 P3F/RTO05_0/TIOA5_1 11 26 P11/AN01/SIN1_1/INT02_1/FRCK0_2 VSS 12 25 P10/AN00/SCK1_1 C VCC P46/X0A P47/X1A INITX P49/TIOB0_0/INT20_1/DA0_0 P4A/TIOB1_0/INT21_1 PE0/MD1 MD0 PE2/X0 PE3/X1 VSS QFN - 48 <Note> The number after the underscore ("_") in pin names such as XXX_1 and XXX_2 indicates the relocated port number. For these pins, there are multiple pins that provide the same function for the same channel. Use the extended port function register (EPFR) to select the pin.

12 MB9A120L_DS706-00064-2v0-E, March 31, 2015

・FPT-52P-M02 (TOP VIEW) VSS P82 P81/INT17_1 P80/INT16_1 P60/SIN5_0/TIOA2_2/INT15_1/IGTRG_1 P61/SOT5_0/TIOB2_2/DTTI0X_2 P0F/NMIX/SUBOUT_0/CROUT_1/RTCCO_0 P04/TDO/SWO P03/TMS/SWDIO P02/TDI P01/TCK/SWCLK P00/TRSTX NC VCC 1 39 P21/AN14/SIN0_0/INT06_1 P50/INT00_0/SIN3_1 2 38 P22/AN13/SOT0_0/TIOB7_1 P51/INT01_0/SOT3_1 3 37 P23/AN12/SCK0_0/TIOA7_1 P52/INT02_0/SCK3_1 4 36 NC NC 5 35 AVRL P39/DTTI0X_0/INT06_0/ADTG_2 6 34 AVRH P3A/RTO00_0/TIOA0_1/INT07_0/SUBOUT_2/RTCCO_2 7 33 AVCC P3B/RTO01_0/TIOA1_1 8 32 P15/AN05/SOT0_1/INT14_0/IC03_2 P3C/RTO02_0/TIOA2_1/INT18_2 9 31 P14/AN04/SIN0_1/INT03_1/IC02_2 P3D/RTO03_0/TIOA3_1 10 30 AVSS P3E/RTO04_0/TIOA4_1/INT19_2 11 29 P12/AN02/SOT1_1/IC00_2 P3F/RTO05_0/TIOA5_1 12 28 P11/AN01/SIN1_1/INT02_1/FRCK0_2 VSS 13 27 P10/AN00/SCK1_1 C VCC P46/X0A P47/X1A INITX P49/TIOB0_0/INT20_1/DA0_0 P4A/TIOB1_0/INT21_1 NC PE0/MD1 MD0 PE2/X0 PE3/X1 VSS LQFP - 52 <Note> The number after the underscore ("_") in pin names such as XXX_1 and XXX_2 indicates the relocated port number. For these pins, there are multiple pins that provide the same function for the same channel. Use the extended port function register (EPFR) to select the pin.

March 31, 2015, MB9A120L_DS706-00064-2v0-E 13 CONFIDENTIAL  List of Pin Functions  List of pin numbers The number after the underscore ("_") in pin names such as XXX_1 and XXX_2 indicates the relocated port number. For these pins, there are multiple pins that provide the same function for the same channel. Use the extended port function register (EPFR) to select the pin. Pin No Pin Name I/O circuit type Pin state type LQFP-64 QFN-64 LQFP-52 LQFP-48 QFN-48 1 1 1 VCC - 2 2 2 P50 H*1 K INT00_0 SIN3_1 3 3 3 P51 H*2 K INT01_0 SOT3_1 (SDA3_1) 4 4 4 P52 H*2 K INT02_0 SCK3_1 (SCL3_1) 5 - - P30 E K TIOB0_1 INT03_2 6 - - P31 E K TIOB1_1 INT04_2 7 - - P32 E K TIOB2_1 INT05_2 8 - - P33 E K INT04_0 TIOB3_1 ADTG_6 9 6 5 P39 E K DTTI0X_0 INT06_0 ADTG_2 10 7 6 P3A G K RTO00_0 (PPG00_0) TIOA0_1 INT07_0 SUBOUT_2 RTCCO_2 11 8 7 P3B G J RTO01_0 (PPG00_0) TIOA1_1

14 MB9A120L_DS706-00064-2v0-E, March 31, 2015

RTO02_0 (PPG02_0) TIOA2_1 INT18_2 13 10 9 P3D G J RTO03_0 (PPG02_0) TIOA3_1 14 11 10 P3E G K RTO04_0 (PPG04_0) TIOA4_1 INT19_2 15 12 11 P3F G J RTO05_0 (PPG04_0) TIOA5_1 16 13 12 VSS - 17 14 13 C - 18 15 14 VCC - 19 16 15 P46 D F X0A 20 17 16 P47 D G X1A 21 18 17 INITX B C 19 18 P49 K K TIOB0_0 INT20_1 DA0_0 - - SOT3_2 (SDA3_2) 20 19 P4A E K TIOB1_0 INT21_1 - - SCK3_2 (SCL3_2) 24 - - P4B E K TIOB2_0 INT22_1 IGTRG_0 25 - - P4C E K TIOB3_0 INT12_0 26 - - P4D E K TIOB4_0 INT13_0

March 31, 2015, MB9A120L_DS706-00064-2v0-E 15 CONFIDENTIAL Pin No Pin Name I/O circuit type Pin state type LQFP-64 QFN-64 LQFP-52 LQFP-48 QFN-48 27 - - P4E E K TIOB5_0 INT06_2 28 22 20 PE0 C E MD1 29 23 21 MD0 J D 30 24 22 PE2 A A X0 31 25 23 PE3 A B X1 32 26 24 VSS - 33 - - VCC - 34 27 25 P10 F L AN00 SCK1_1 (SCL1_1) 35 28 26 P11 F M AN01 SIN1_1 INT02_1 FRCK0_2 36 29 27 P12 F L AN02 SOT1_1 (SDA1_1) IC00_2 37 30 28 AVSS - 38 31 29 P14 F M AN04 SIN0_1 INT03_1 IC02_2 39 32 30 P15 F M AN05 SOT0_1 (SDA0_1) INT14_0 IC03_2 40 - - P17 E K INT04_1 41 33 31 AVCC - 42 34 32 AVRH - 43 35 33 AVRL - 44 - - P18 E J 45 - - P19 E J

16 MB9A120L_DS706-00064-2v0-E, March 31, 2015

I*2 M AN12 SCK0_0 (SCL0_0) TIOA7_1 47 38 35 P22 I*2 M AN13 SOT0_0 (SDA0_0) TIOB7_1 48 39 36 P21 I*1 M AN14 SIN0_0 INT06_1 49 41 37 P00 E I TRSTX 50 42 38 P01 E I TCK SWCLK 51 43 39 P02 E I TDI 52 44 40 P03 E I TMS SWDIO 53 45 41 P04 E I TDO SWO 54 - - P0A E K INT00_2 55 - - P0B E K TIOB6_1 INT18_0 56 - - P0C E K TIOA6_1 INT19_0 57 46 42 P0F E H NMIX SUBOUT_0 CROUT_1 RTCCO_0 58 - - P62 E J SCK5_0 (SCL5_0) ADTG_3

March 31, 2015, MB9A120L_DS706-00064-2v0-E 17 CONFIDENTIAL Pin No Pin Name I/O circuit type Pin state type LQFP-64 QFN-64 LQFP-52 LQFP-48 QFN-48 59 47 43 P61 E J SOT5_0 (SDA5_0) TIOB2_2 DTTI0X_2 60 48 44 P60 I*2 K SIN5_0 TIOA2_2 INT15_1 IGTRG_1 61 49 45 P80 L K INT16_1 62 50 46 P81 L K INT17_1 63 51 47 P82 L J 64 52 48 VSS - *1: 5 V tolerant I/O, without PZR function *2: 5 V tolerant I/O, with PZR function

18 MB9A120L_DS706-00064-2v0-E, March 31, 2015

 List of pin functions The number after the underscore ("_") in pin names such as XXX_1 and XXX_2 indicates the relocated port number. For these pins, there are multiple pins that provide the same function for the same channel. Use the extended port function register (EPFR) to select the pin. Pin function Pin name Function description Pin No LQFP-64 QFN-64 LQFP-52 LQFP-48 QFN-48 ADC ADTG_2 A/D converter external trigger input pin 9 6 5 ADTG_3 58 - - ADTG_6 8 - - AN00 A/D converter analog input pin. ANxx describes ADC ch.xx. 34 27 25 AN01 35 28 26 AN02 36 29 27 AN04 38 31 29 AN05 39 32 30 AN12 46 37 34 AN13 47 38 35 AN14 48 39 36 Base Timer TIOA0_1 Base timer ch.0 TIOA pin 10 7 6 TIOB0_0 Base timer ch.0 TIOB pin 22 19 18 TIOB0_1 5 - - Base Timer TIOA1_1 Base timer ch.1 TIOA pin 11 8 7 TIOB1_0 Base timer ch.1 TIOB pin 23 20 19 TIOB1_1 6 - - Base Timer TIOA2_1 Base timer ch.2 TIOA pin 12 9 8 TIOA2_2 60 48 44 TIOB2_0 Base timer ch.2 TIOB pin 24 - - TIOB2_1 7 - - TIOB2_2 59 47 43 Base Timer TIOA3_1 Base timer ch.3 TIOA pin 13 10 9 TIOB3_0 Base timer ch.3 TIOB pin 25 - - TIOB3_1 8 - - Base Timer TIOA4_1 Base timer ch.4 TIOA pin 14 11 10 TIOB4_0 Base timer ch.4 TIOB pin 26 - - Base Timer TIOA5_1 Base timer ch.5 TIOA pin 15 12 11 TIOB5_0 Base timer ch.5 TIOB pin 27 - - Base Timer TIOA6_1 Base timer ch.6 TIOA pin 56 - - TIOB6_1 Base timer ch.6 TIOB pin 55 - - Base Timer TIOA7_1 Base timer ch.7 TIOA pin 46 37 34 TIOB7_1 Base timer ch.7 TIOB pin 47 38 35 Debugger SWCLK Serial wire debug interface clock input pin 50 42 38 SWDIO Serial wire debug interface data input / output pin 52 44 40 SWO Serial wire viewer output pin 53 45 41 TCK J-TAG test clock input pin 50 42 38 TDI J-TAG test data input pin 51 43 39 TDO J-TAG debug data output pin 53 45 41 TMS J-TAG test mode state input/output pin 52 44 40 TRSTX J-TAG test reset input pin 49 41 37

March 31, 2015, MB9A120L_DS706-00064-2v0-E 19 CONFIDENTIAL Pin function Pin name Function description Pin No LQFP-64 QFN-64 LQFP-52 LQFP-48 QFN-48 External Interrupt INT00_0 External interrupt request 00 input pin 2 2 2 INT00_2 54 - - INT01_0 External interrupt request 01 input pin 3 3 3 INT02_0 External interrupt request 02 input pin 4 4 4 INT02_1 35 28 26 INT03_1 External interrupt request 03 input pin 38 31 29 INT03_2 5 - - INT04_0 External interrupt request 04 input pin 8 - - INT04_1 40 - - INT04_2 6 - - INT05_2 External interrupt request 05 input pin 7 - - INT06_0 External interrupt request 06 input pin 9 6 5 INT06_1 48 39 36 INT06_2 27 - - INT07_0 External interrupt request 07 input pin 10 7 6 INT12_0 External interrupt request 12 input pin 25 - - INT13_0 External interrupt request 13 input pin 26 - - INT14_0 External interrupt request 14 input pin 39 32 30 INT15_1 External interrupt request 15 input pin 60 48 44 INT16_1 External interrupt request 16 input pin 61 49 45 INT17_1 External interrupt request 17 input pin 62 50 46 INT18_0 External interrupt request 18 input pin 55 - - INT18_2 12 9 8 INT19_0 External interrupt request 19 input pin 56 - - INT19_2 14 11 10 INT20_1 External interrupt request 20 input pin 22 19 18 INT21_1 External interrupt request 21 input pin 23 20 19 INT22_1 External interrupt request 22 input pin 24 - - NMIX Non-Maskable Interrupt input pin 57 46 42

20 MB9A120L_DS706-00064-2v0-E, March 31, 2015

function Pin name Function description Pin No LQFP-64 QFN-64 LQFP-52 LQFP-48 QFN-48 GPIO P00 General-purpose I/O port 0 49 41 37 P01 50 42 38 P02 51 43 39 P03 52 44 40 P04 53 45 41 P0A 54 - - P0B 55 - - P0C 56 - - P0F 57 46 42 P10 General-purpose I/O port 1 34 27 25 P11 35 28 26 P12 36 29 27 P14 38 31 29 P15 39 32 30 P17 40 - - P18 44 - - P19 45 - - P21 General-purpose I/O port 2 48 39 36 P22 47 38 35 P23 46 37 34 P30 General-purpose I/O port 3 5 - - P31 6 - - P32 7 - - P33 8 - - P39 9 6 5 P3A 10 7 6 P3B 11 8 7 P3C 12 9 8 P3D 13 10 9 P3E 14 11 10 P3F 15 12 11 P46 General-purpose I/O port 4 19 16 15 P47 20 17 16 P49 22 19 18 P4A 23 20 19 P4B 24 - - P4C 25 - - P4D 26 - - P4E 27 - - P50 General-purpose I/O port 5 2 2 2 P51 3 3 3 P52 4 4 4 P60 General-purpose I/O port 6 60 48 44 P61 59 47 43 P62 58 - - P80 General-purpose I/O port 8 61 49 45 P81 62 50 46 P82 63 51 47 PE0 General-purpose I/O port E 28 22 20 PE2 30 24 22 PE3 31 25 23

March 31, 2015, MB9A120L_DS706-00064-2v0-E 21 CONFIDENTIAL Pin function Pin name Function description Pin No LQFP-64 QFN-64 LQFP-52 LQFP-48 QFN-48 Multi- function Serial SIN0_0 Multi-function serial interface ch.0 input pin 48 39 36 SIN0_1 38 31 29 SOT0_0 (SDA0_0) Multi-function serial interface ch.0 output pin. This pin operates as SOT0 when it is used in a UART/CSIO/LIN (operation modes 0 to 3) and as SDA0 when it is used in an I2C (operation mode 4). 47 38 35 SOT0_1 (SDA0_1) 39 32 30 SCK0_0 (SCL0_0) Multi-function serial interface ch.0 clock I/O pin. This pin operates as SCK0 when it is used in a CSIO (operation mode 2) and as SCL0 when it is used in an I2C (operation mode 4). 46 37 34 Multi- function Serial SIN1_1 Multi-function serial interface ch.1 input pin 35 28 26 SOT1_1 (SDA1_1) Multi-function serial interface ch.1 output pin. This pin operates as SOT1 when it is used in a UART/CSIO/LIN (operation modes 0 to 3) and as SDA1 when it is used in an I2C (operation mode 4). 36 29 27 SCK1_1 (SCL1_1) Multi-function serial interface ch.1 clock I/O pin. This pin operates as SCK1 when it is used in a CSIO (operation mode 2) and as SCL1 when it is used in an I2C (operation mode 4). 34 27 25 Multi- function Serial SIN3_1 Multi-function serial interface ch.3 input pin 2 2 2 SOT3_1 (SDA3_1) Multi-function serial interface ch.3 output pin. This pin operates as SOT3 when it is used in a UART/CSIO/LIN (operation modes 0 to 3) and as SDA3 when it is used in an I2C (operation mode 4). 3 3 3 SOT3_2 (SDA3_2) 22 - - SCK3_1 (SCL3_1) Multi-function serial interface ch.3 clock I/O pin. This pin operates as SCK3 when it is used in a CSIO (operation mode 2) and as SCL3 when it is used in an I2C (operation mode 4). 4 4 4 SCK3_2 (SCL3_2) 23 - -

22 MB9A120L_DS706-00064-2v0-E, March 31, 2015

function Pin name Function description Pin No LQFP-64 QFN-64 LQFP-52 LQFP-48 QFN-48 Multi- function Serial SIN5_0 Multi-function serial interface ch.5 input pin 60 48 44 SOT5_0 (SDA5_0) Multi-function serial interface ch.5 output pin. This pin operates as SOT5 when it is used in a UART/CSIO/LIN (operation modes 0 to 3) and as SDA5 when it is used in an I2C (operation mode 4). 59 47 43 SCK5_0 (SCL5_0) Multi-function serial interface ch.5 clock I/O pin. This pin operates as SCK5 when it is used in a CSIO (operation mode 2) and as SCL5 when it is used in an I2C (operation mode 4). 58 - - Multi- function Timer DTTI0X_0 Input signal of waveform generator to control outputs RTO00 to RTO05 of Multi-function timer 0. 9 6 5 DTTI0X_2 59 47 43 FRCK0_2 16-bit free-run timer ch.0 external clock input pin 35 28 26 IC00_2 16-bit input capture input pin of Multi-function timer 0. ICxx describes channel number. 36 29 27 IC02_2 38 31 29 IC03_2 39 32 30 RTO00_0 (PPG00_0) Waveform generator output pin of Multi-function timer 0. This pin operates as PPG00 when it is used in PPG0 output mode. 10 7 6 RTO01_0 (PPG00_0) Waveform generator output pin of Multi-function timer 0. This pin operates as PPG00 when it is used in PPG0 output mode. 11 8 7 RTO02_0 (PPG02_0) Waveform generator output pin of Multi-function timer 0. This pin operates as PPG02 when it is used in PPG0 output mode. 12 9 8 RTO03_0 (PPG02_0) Waveform generator output pin of Multi-function timer 0. This pin operates as PPG02 when it is used in PPG0 output mode. 13 10 9 RTO04_0 (PPG04_0) Waveform generator output pin of Multi-function timer 0. This pin operates as PPG04 when it is used in PPG0 output mode. 14 11 10 RTO05_0 (PPG04_0) Waveform generator output pin of Multi-function timer 0. This pin operates as PPG04 when it is used in PPG0 output mode. 15 12 11 IGTRG_0 PPG IGBT mode external trigger input pin 24 - - IGTRG_1 60 48 44

March 31, 2015, MB9A120L_DS706-00064-2v0-E 23 CONFIDENTIAL Pin function Pin name Function description Pin No LQFP-64 QFN-64 LQFP-52 LQFP-48 QFN-48 Real-time clock RTCCO_0 0.5 seconds pulse output pin of Real-time clock 57 46 42 RTCCO_2 10 7 6 SUBOUT_0 Sub clock output pin 57 46 42 SUBOUT_2 10 7 6 DAC DA0_0 D/A converter ch.0 analog output pin 22 19 18 Reset INITX External Reset Input pin. A reset is valid when INITX="L". 21 18 17 Mode MD0 Mode 0 pin. During normal operation, MD0="L" must be input. During serial programming to Flash memory, MD0="H" must be input. 29 23 21 MD1 Mode 1 pin. During serial programming to Flash memory, MD1="L" must be input. 28 22 20 Power VCC Power supply Pin 1 1 1 18 15 14 33 - - GND VSS GND Pin 16 13 12 32 26 24 64 52 48 Clock X0 Main clock (oscillation) input pin 30 24 22 X0A Sub clock (oscillation) input pin 19 16 15 X1 Main clock (oscillation) I/O pin 31 25 23 X1A Sub clock (oscillation) I/O pin 20 17 16 CROUT_1 Built-in high-speed CR-osc clock output port 57 46 42 Analog Power AVCC A/D converter and D/A converter analog power supply pin 41 33 31 AVRH A/D converter analog reference voltage input pin 42 34 32 Analog GND AVSS A/D converter and D/A converter GND pin 37 30 28 AVRL A/D converter analog reference voltage input pin 43 35 33 C pin C Power supply stabilization capacity pin 17 14 13

24 MB9A120L_DS706-00064-2v0-E, March 31, 2015

 I/O Circuit Type Type Circuit Remarks A It is possible to select the main oscillation / GPIO function When the main oscillation is selected.  Oscillation feedback resistor : Approximately 1 MΩ  With Standby mode control When the GPIO is selected.  CMOS level output.  CMOS level hysteresis input  With pull-up resistor control  With standby mode control  Pull-up resistor : Approximately 50 kΩ  IOH= -4 mA, IOL= 4 mA B  CMOS level hysteresis input  Pull-up resistor : Approximately 50 kΩ P-ch P-ch N-ch R R P-ch P-ch N-ch X0A X1A Pull-up resistor Feedback resistor Pull-up resistor Pull-up resistor Digital input Digital output Digital output Pull-up resistor control Digital input Standby mode control Clock input Standby mode control Digital input Standby mode control Digital output Digital output Pull-up resistor control

March 31, 2015, MB9A120L_DS706-00064-2v0-E 25 CONFIDENTIAL Type Circuit Remarks C N-ch  Open drain output  CMOS level hysteresis input D It is possible to select the sub oscillation / GPIO function When the sub oscillation is selected.  Oscillation feedback resistor : Approximately 5 MΩ  With Standby mode control When the GPIO is selected.  CMOS level output.  CMOS level hysteresis input  With pull-up resistor control  With standby mode control  Pull-up resistor : Approximately 50 kΩ  IOH= -4 mA, IOL= 4 mA P-ch P-ch N-ch R R P-ch P-ch N-ch X0A X1A Pull-up resistor Feedback resistor Pull-up resistor Digital input Digital output Digital output Digital output Pull-up resistor control Digital input Standby mode control Clock input Standby mode control Digital input Standby mode control Digital output Digital output Pull-up resistor control

26 MB9A120L_DS706-00064-2v0-E, March 31, 2015

E P-chP-ch N-ch R  CMOS level output  CMOS level hysteresis input  With pull-up resistor control  With standby mode control  Pull-up resistor : Approximately 50 kΩ  IOH= -4 mA, IOL= 4 mA  When this pin is used as an I2C pin, the digital output P-ch transistor is always off  +B input is available F P-chP-ch N-ch R  CMOS level output  CMOS level hysteresis input  With input control  Analog input  With pull-up resistor control  With standby mode control  Pull-up resistor : Approximately 50 kΩ  IOH= -4 mA, IOL= 4 mA  When this pin is used as an I2C pin, the digital output P-ch transistor is always off  +B input is available Digital output Digital output Pull-up resistor control Digital input Standby mode control Digital output Digital output Pull-up resistor control Digital input Standby mode control Analog input Input control

March 31, 2015, MB9A120L_DS706-00064-2v0-E 27 CONFIDENTIAL Type Circuit Remarks G P-chP-ch N-ch R  CMOS level output  CMOS level hysteresis input  With pull-up resistor control  With standby mode control  Pull-up resistor : Approximately 50 kΩ  IOH= -12 mA, IOL= 12 mA  +B input is available H P-chP-ch N-ch R  CMOS level output  CMOS level hysteresis input  5 V tolerant  With pull-up resistor control  With standby mode control  Pull-up resistor : Approximately 50 kΩ  IOH= -4 mA, IOL= 4 mA  Available to control PZR registers. Only P51, P52.  When this pin is used as an I2C pin, the digital output P-ch transistor is always off Digital output Digital output Pull-up resistor control Digital input Standby mode control Digital output Digital output Pull-up resistor control Digital input Standby mode control

28 MB9A120L_DS706-00064-2v0-E, March 31, 2015

I P-chP-ch N-ch R  CMOS level output  CMOS level hysteresis input  With input control  Analog input  5 V tolerant  With pull-up resistor control  With standby mode control  Pull-up resistor : Approximately 50 kΩ  IOH= -4 mA, IOL= 4 mA  Available to control PZR registers. Only P23, P22, P60.  When this pin is used as an I2C pin, the digital output P-ch transistor is always off J CMOS level hysteresis input K P-chP-ch N-ch R ・ CMOS level output ・ CMOS level hysteresis input ・ With input control ・ Analog output ・ With pull-up resistor control ・ With standby mode control ・ Pull-up resistor : Approximately 50 kΩ ・ IOH = -4 mA, IOL = 4 mA ・ When this pin is used as an I2C pin, the digital output P-ch transistor is always off Digital output Digital output Pull-up resistor control Digital input Standby mode control Analog input Input control Mode input Digital output Digital output Digital input Standby mode control Pull-up resistor control Analog output

March 31, 2015, MB9A120L_DS706-00064-2v0-E 29 CONFIDENTIAL Type Circuit Remarks L P-ch N-ch R  CMOS level output  CMOS level hysteresis input  With standby mode control  IOH= -4 mA, IOL= 4 mA Digital output Digital output Digital input Standby mode control

30 MB9A120L_DS706-00064-2v0-E, March 31, 2015

 Handling Precautions Any semiconductor devices have inherently a certain rate of failure. The possibility of failure is greatly affected by the conditions in which they are used (circuit conditions, environmental conditions, etc.). This page describes precautions that must be observed to minimize the chance of failure and to obtain higher reliability from your Spansion semiconductor devices. 1. Precautions for Product Design This section describes precautions when designing electronic equip ment using semiconductor devices.  Absolute Maximum Ratings Semiconductor devices can be permanently damaged by application of stress (voltage, current, temperature, etc.) in excess of certain established limits, called absolute maximum ratings. Do not exce ed these ratings.  Recommended Operating Conditions Recommended operating conditions are normal operating ranges for the semiconductor device. All the device's electrical characteristics are warranted when operated within these ranges. Always use semiconductor devices within the recommended operating conditions. Operation outside these ranges may adversely affect reliability and could result in device failure. No warranty is made with respect to uses, operating conditions, or combinations not represented on the data sheet. Users considering application outside the listed conditions are advised to contact their sales representative beforehand.  Processing and Protection of Pins These precautions must be followed when handling the pins which connect semiconducto r devices to power supply and input/output functions. (1) Preventing Over-V oltage and Over-Current Conditions Exposure to voltage or current levels in excess of maximum ratings at any pin is likely to cause deterioration within the device, and in extreme cases leads to permanent damage of the device. Try to prevent such overvoltage or over-current conditions at the design stage. (2) Protection of Output Pins Shorting of output pins to supply pins or other output pins, or connection to large capacitance ca n cause large current flows. Such conditions if present for extended periods of time can damage the device. Therefore, avoid this type of connection. (3) Handling of Unused Input Pins Unconnected input pins with very high impedance levels can adversely affect stability of operation. Such pins should be connected through an appropriate resistance to a power supply pin or ground pin.  Latch-up Semiconductor devices are constructed by the formation of P-type and N-type areas on a substrate. When subjected to abnormally high voltages, internal parasitic PNPN junctions (called thyristor structures) may be formed, causing large current levels in excess of several hundred mA to flow continuously at the power supply pin. This condition is called latch-up. CAUTION: The occurrence of latch-up not only causes loss of reliability in the semiconductor device, but can cause injury or damage from high heat, smoke or flame. To prevent this from happening, do the following: (1) Be sure that voltages applied to pins do not exceed the absolute maximum ratings. This should include attention to abnormal noise, surge levels, etc. (2) Be sure that abnormal current flows do not occur during the power-on sequence. Code: DS00-00004-3E

March 31, 2015, MB9A120L_DS706-00064-2v0-E 31 CONFIDENTIAL  Observance of Safety Regulations and Standards Most countries in the world have established standards and regulations regarding safety, protection from electromagnetic interference, etc. Customers are requested to observe applicable regulations and standards in the design of products.  Fail-Safe Design Any semiconductor devices have inherently a certain rate of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions.  Precautions Related to Usage of Devices Spansion semiconductor devices are intended for use in standard applications (computers, office automation and other office equipment, industrial, communications, and measurement equipment, personal or household devices, etc.). CAUTION: Customers considering the use of our products in special applications where failure or abnormal operation may directly affect human lives or cause physical injury or property damage, or where extremely high levels of reliability are demanded (such as aerospace systems, atomic energy controls, sea floor repeaters, vehicle operating controls, medical devices for life support, etc.) are requested to consult with sales representatives before such use. The company will not be responsible for damages arising from such use without prior approval. 2. Precautions for Package Mounting Package mounting may be either lead insertion type or surface mount type. In either case, for heat resistance during soldering, you should only mount under Spansion's recommended conditions. For detailed information about mount conditions, contact your sales representative.  Lead Insertion Type Mounting of lead insertion type packages onto printed circuit boards may be done by two methods: direct soldering on the board, or mounting by using a socket. Direct mounting onto boards normally involves processes for inserting leads into through -holes on the board and using the flow soldering (wave soldering) method of applying liquid solder. In this case, the soldering process usually causes leads to be subjected to thermal stress in excess of the absolute ratings for storage temperature. Mounting processes should conform to Spansion recommended mounting conditions. If socket mounting is used, differences in surface treatment of the socket contacts and IC lead surfaces can lead to contact deterioration after long periods. For this reason it is recommended that the surface treatment of socket contacts and IC leads be verified before mounting.  Surface Mount Type Surface mount packaging has longer and thinner leads than lead-insertion packaging, and therefore leads are more easily deformed or bent. The use of packages with higher pin counts and narrower pin pitch resu lts in increased susceptibility to open connections caused by deformed pins, or shorting due to solder bridges. You must use appropriate mounting techniques. Spansion recommends the solder reflow method, and has established a ranking of mounting conditions for each product. Users are advised to mount packages in accordance with Spansion ranking of recommended conditions.

32 MB9A120L_DS706-00064-2v0-E, March 31, 2015

 Lead-Free Packaging CAUTION: When ball grid array (BGA) packages with Sn-Ag-Cu balls are mounted using Sn-Pb eutectic soldering, junction strength may be reduced under some conditions of use.  Storage of Semiconductor Devices Because plastic chip packages are formed from plastic resins, exposure to natural environmental conditions will cause absorption of moisture. During mounting, the application of heat to a package that has absorbed moisture can cause surfaces to peel, reducing moisture resistance and causing packages to crack. To prevent, do the following: (1) Avoid exposure to rapid temperature changes, which cause moisture to condense inside the product. Store products in locations where temperature changes are slight. (2) Use dry boxes for product storage. Products should be stored below 70% relative humidity, and at temperatures between 5°C and 30°C. When you open Dry Package that recommends humidity 40% to 70% relative humidity. (3) When necessary, Spansion packages semiconductor devices in highly moisture-resistant aluminum laminate bags, with a silica gel desiccant. Devices should be sealed in their aluminum laminate bags for storage. (4) Avoid storing packages where they are exposed to corrosive gases or high levels of dust.  Baking Packages that have absorbed moisture may be de-moisturized by baking (heat drying). Follow the Spansion recommended conditions for baking. Condition: 125°C/24 h  Static Electricity Because semiconductor devices are particularly susceptible to damage by static electricity, you must take the following precautions: (1) Maintain relative humidity in the working environment between 40% and 70%. Use of an apparat us for ion generation may be needed to remove electricity. (2) Electrically ground all conveyors, solder vessels, soldering irons and peripheral equipment. (3) Eliminate static body electricity by the use of rings or bracelets connected to ground through h igh resistance (on the level of 1 MΩ). Wearing of conductive clothing and shoes, use of conductive floor mats and other measures to minimize shock loads is recommended. (4) Ground all fixtures and instruments, or protect with anti-static measures. (5) Avoid the use of styrofoam or other highly static-prone materials for storage of completed board assemblies.

March 31, 2015, MB9A120L_DS706-00064-2v0-E 33 CONFIDENTIAL 3. Precautions for Use Environment Reliability of semiconductor devices depends on ambient temperature and other conditions as described above. For reliable performance, do the following: (1) Humidity Prolonged use in high humidity can lead to leakage in devices as well as printed circuit boards. If high humidity levels are anticipated, consider anti-humidity processing. (2) Discharge of Static Electricity When high-voltage charges exist close to semiconductor devices, discharges can cause abnormal operation. In such cases, use anti-static measures or processing to prevent discharges. (3) Corrosive Gases, Dust, or Oil Exposure to corrosive gases or contact with dust or oil may lead to c hemical reactions that will adversely affect the device. If you use devices in such conditions, consider ways to prevent such exposure or to protect the devices. (4) Radiation, Including Cosmic Radiation Most devices are not designed for environments involving exposure to radiation or cosmic radiation. Users should provide shielding as appropriate. (5) Smoke, Flame CAUTION: Plastic molded devices are flammable, and therefore should not be used near combustible substances. If devices begin to smoke or burn, there is danger of the release of toxic gases. Customers considering the use of Spansion products in other special environmental conditions should consult with sales representatives. Please check the latest handling precautions at the following URL. http://www.spansion.com/fjdocuments/fj/datasheet/e-ds/DS00-00004.pdf

34 MB9A120L_DS706-00064-2v0-E, March 31, 2015

 Handling Devices  Power supply pins In products with multiple VCC and VSS pins, respective pins at the same potential are interconnected within the device in order to prevent malfunctions such as latch-up. However, all of these pins should be connected externally to the power supply or ground lines in order to reduce electromagnetic emission levels, to prevent abnormal operation of strobe signals caused by the rise in the ground level, and to conform to the total output current rating. Moreover, connect the current supply source with each Power supply pin and GND pin of this device at low impedance. It is also advisable that a ceramic capacitor of approximately 0.1 µF be conne cted as a bypass capacitor between each Power supply pin and GND pin, between A VCC pin and A VSS pin, between A VRH pin and A VRL pin near this device.  Stabilizing power supply voltage A malfunction may occur when the power supply voltage fluctuates rapidly even though the fluctuation is within the recommended operating conditions of the VCC power supply voltage. As a rule, with voltage stabilization, suppress the voltage fluctuation so that the fluctuation in VCC ripple (peak-to-peak value) at the commercial frequency (50 Hz/60 Hz) does not exceed 10% of the VCC value in the recommended operating conditions, and the transient fluctuation rate does not exceed 0.1 V/μs when there is a momentary fluctuation on switching the power supply.  Crystal oscillator circuit Noise near the X0/X1 and X0A/X1A pins may cause the device to malfunction. Design the printed circuit board so that X0/X1, X0A/X1A pins, the crystal oscillator, and the bypass capacitor to ground are located as close to the device as possible. It is strongly recommended that the PC board artwork be designed such that the X0 /X1 and X0A/X1A pins are surrounded by ground plane as this is expected to produce stable operation. Evaluate oscillation of your using crystal oscillator by your mount board.  Sub crystal oscillator This series sub oscillator circuit is low gain to keep the low current consumption. The crystal oscillator to fill the following conditions is recommended for sub crystal oscillator to stabilize the oscillation. ・ Surface mount type Size : More than 3.2 mm × 1.5 mm Load capacitance : Approximately 6 pF to 7 pF ・ Lead type Load capacitance : Approximately 6 pF to 7 pF

March 31, 2015, MB9A120L_DS706-00064-2v0-E 35 CONFIDENTIAL  Using an external clock When using an external clock as an input of the main clock, set X0/X1 to the external clock input, and input the clock to X0. X1(PE3) can be used as a general-purpose I/O port. Similarly, when using an external clock as an input of the sub clock, set X0A/X1A to the external clock input, and input the clock to X0A. X1A (P47) can be used as a general-purpose I/O port.  Handling when using Multi-function serial pin as I2C pin If it is using the multi-function serial pin as I2C pins, P-ch transistor of digital output is always disabled. However, I2C pins need to keep the electrical characteristic like other pins and not to connect to the external I2C bus system with power OFF.  C Pin This series contains the regulator. Be sure to connect a smoothing capacitor (CS) for the regulator between the C pin and the GND pin. Please use a ceramic capacitor or a capacitor of equivalent frequency characteristics as a smoothing capacitor. However, some laminated ceramic capacitors have the characteristics of capacitance variation due to thermal fluctuation (F characteristics and Y5V characteristics). Please select the capacitor that meets the specifications in the operating conditions to use by evaluating the temperature characteristics of a capacitor. A smoothing capacitor of about 4.7μF would be recommended for this series.  Mode pins (MD0) Connect the MD pin (MD0) directly to VCC or VSS pins. Design the printed circuit board such that the pull-up/down resistance stays low, as well as the distance between the mode pins and VCC pins or VSS pins is as short as possible and the connection impedance is low, when the pins are pulled-up/down such as for switching the pin level and rewriting the Flash memory data. It is because of preventing the device erroneously switching to test mode due to noise.

• Example of Using an External Clock Device X0(X0A) X1(PE3), X1A (P47) Can be used as general-purpose I/O ports. Device C VSS CS GND Set as External clock input

36 MB9A120L_DS706-00064-2v0-E, March 31, 2015

 Notes on power-on Turn power on/off in the following order or at the same time. If not using the A/D converter and D/A converter, connect A VCC = VCC and A VSS = VSS. Turning on : VCC → AVCC → AVRH Turning off : AVRH → AVCC → VCC  Serial Communication There is a possibility to receive wrong data due to the noise or other causes on the serial communication. Therefore, design a printed circuit board so as to avoid noise. Consider the case of receiving wrong data due to noise, perform error detection such as by applying a checksum of data at the end. If an error is detected, retransmit the data.  Differences in features among the products with different memory sizes and between Flash memory products and MASK products The electric characteristics including power consumption, ESD, latch-up, noise characteristics, and oscillation characteristics among the products with different memory sizes and between Flash memory products and MASK products are different because chip layout and memory structures are different. If you are switching to use a different product of the same series, please make sure to evaluate the electric characteristics.  Pull-Up function of 5 V tolerant I/O Please do not input the signal more than VCC voltage at the time of Pull-Up function use of 5 V tolerant I/O.

March 31, 2015, MB9A120L_DS706-00064-2v0-E 37 CONFIDENTIAL  Block Diagram Cortex-M3 Core @40MHz (Max) Flash I/F Clock Reset Generator Dual-Timer WatchDog Timer ( Hardware) CSV External Interrupt Controller 19 pin + NMI Power-On Reset AHB-APB Bridge : APB1 (Max 40MHz) SRAM1

4 Kbytes

AHB-APB Bridge: APB0(Max 40MHz) I D Sys CLK MB9AF121K/L AHB-APB Bridge : APB2 (Max 40MHz) NVIC WatchDog Timer ( Software) Security 12-bit A /D Converter TRSTX,TCK, TDI,TMS AVCC, AVSS, AVRH, AVRL ANxx TIOAx T IOBx C TDO X0A X1A SCKx SINx SOTx INTx NMIX P0x, P1x, Pxx INITX MODE-Ctrl IRQ - Monitor MD0, MD1 Regulator ADTG_x On- Chip Flash

64 Kbytes

Multi - function Serial I /F 4ch. (without FIFO ch.0/1/3/5) GPIO PIN-Function-Ctrl LVD Multi-layer AHB (Max 40MHz) ROM Table SWJ-DP Main Osc PLL Sub Osc CR 4MHz CR 100kHz LVD Ctrl Base Timer 16-bit 8ch./ 32 -bit 4ch. Real -Time Colck RTCCO_x, SUBOUT_x Unit 0 10-bit D/A Converter 1unitsDAx Multi -function Timer 16-bit Free-run Timer 3ch. 16 - bit Output Compare 6ch. 16-bit Input Capture 3ch. Waveform Generator 3ch. A/D Activation Compare 1ch. 16- bit PPG 3ch. IC0x DTTI0X RTO0x FRCKx IGTRG_x CROUT Source clock  Memory Size See Memory size in Product Lineup to confirm the memory size.

38 MB9A120L_DS706-00064-2v0-E, March 31, 2015

 Memory Map  Memory Map (1) Peripherals Area 0x41FF_FFFF 0xFFFF_FFFF 0xE010_0000 0x4006_4000 0xE000_0000 0x4006_3000 Reserved 0x4006_1000 0x4006_0000 Reserved 0x4005_0000 Reserved 0x4004_0000 Reserved 0x4003_C000 Reserved 0x4003_B000 RTC 0x4003_A000 Reserved 0x6000_0000 0x4003_9000 Reserved 0x4003_8000 MFS 0x4003_7000 Reserved 0x4400_0000 0x4003_6000 Reserved 0x4003_5800 Reserved 0x4200_0000 0x4003_5000 LVD 0x4003_4000 Reserved 0x4000_0000 0x4003_3000 GPIO 0x4003_2000 Reserved 0x2400_0000 0x4003_1000 Int-Req.Read 0x4003_0000 EXTI 0x2200_0000 0x4002_F000 Reserved 0x4002_E000 CR Trim 0x2008_0000 0x4002_9000 Reserved 0x2000_0000 SRAM1 0x4002_8000 D/AC 0x1FF8_0000 Reserved 0x4002_7000 A/DC 0x4002_6000 Reserved 0x0020_8000 0x4002_5000 Base Timer 0x0020_0000 Reserved 0x4002_4000 PPG 0x0010_0008 Reserved 0x0010_0000 Security/CR Trim 0x4002_1000 0x4002_0000 MFT unit0 0x4001_6000 0x4001_5000 Dual Timer 0x0000_0000 0x4001_3000 0x4001_2000 SW WDT 0x4001_1000 HW WDT 0x4001_0000 Clock/Reset 0x4000_1000 0x4000_0000 Flash I/F Cortex-M3 Private Peripherals Reserved Reserved See "  Memory Map (2)" for the memory size details. Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Flash 32Mbytes Bit band alias Reserved 32Mbytes Bit band alias Reserved Peripherals

March 31, 2015, MB9A120L_DS706-00064-2v0-E 39 CONFIDENTIAL  Memory Map (2) MB9AF121L 0x2008_0000 0x2000_1000 0x2000_0000 0x0010_0008 0x0010_0004 CR trimming 0x0010_0000 Security 0x0000_FFF8 0x0000_0000 Reserved SRAM1 4Kbytes Reserved SA0-7 (8KBx8) Reserved Flash 64Kbytes * *: See MB9A420L/120L/MB9B120J Series Flash Programming Manual to confirm the detail of Flash memory.

40 MB9A120L_DS706-00064-2v0-E, March 31, 2015

 Peripheral Address Map Start address End address Bus Peripherals 0x4000_0000 0x4000_0FFF AHB Flash Memory I/F register 0x4000_1000 0x4000_FFFF Reserved 0x4001_0000 0x4001_0FFF APB0 Clock/Reset Control 0x4001_1000 0x4001_1FFF Hardware Watchdog timer 0x4001_2000 0x4001_2FFF Software Watchdog timer 0x4001_3000 0x4001_4FFF Reserved 0x4001_5000 0x4001_5FFF Dual-Timer 0x4001_6000 0x4001_FFFF Reserved 0x4002_0000 0x4002_0FFF APB1 Multi-function timer unit0 0x4002_1000 0x4002_3FFF Reserved 0x4002_4000 0x4002_4FFF PPG 0x4002_5000 0x4002_5FFF Base Timer 0x4002_6000 0x4002_6FFF Reserved 0x4002_7000 0x4002_7FFF A/D Converter 0x4002_8000 0x4002_8FFF D/A Converter 0x4002_9000 0x4002_DFFF Reserved 0x4002_E000 0x4002_EFFF Built-in CR trimming 0x4002_F000 0x4002_FFFF Reserved 0x4003_0000 0x4003_0FFF APB2 External Interrupt 0x4003_1000 0x4003_1FFF Interrupt Source Check Resister 0x4003_2000 0x4003_2FFF Reserved 0x4003_3000 0x4003_3FFF GPIO 0x4003_4000 0x4003_4FFF Reserved 0x4003_5000 0x4003_57FF Low-V oltage Detector 0x4003_5800 0x4003_5FFF Reserved 0x4003_6000 0x4003_6FFF Reserved 0x4003_7000 0x4003_7FFF Reserved 0x4003_8000 0x4003_8FFF Multi-function serial Interface 0x4003_9000 0x4003_9FFF Reserved 0x4003_A000 0x4003_AFFF Reserved 0x4003_B000 0x4003_BFFF Real-time clock 0x4003_C000 0x4003_FFFF Reserved 0x4004_0000 0x4004_FFFF AHB Reserved 0x4005_0000 0x4005_FFFF Reserved 0x4006_0000 0x4006_0FFF Reserved 0x4006_1000 0x4006_2FFF Reserved 0x4006_3000 0x4006_3FFF Reserved 0x4006_4000 0x41FF_FFFF Reserved

March 31, 2015, MB9A120L_DS706-00064-2v0-E 41 CONFIDENTIAL  Pin Status in Each CPU State The terms used for pin status have the following meanings.  INITX=0 This is the period when the INITX pin is the L level.  INITX=1 This is the period when the INITX pin is the H level.  SPL=0 This is the status that the standby pin level setting bit (SPL) in the standby mode control register (STB_CTL) is set to 0.  SPL=1 This is the status that the standby pin level setting bit (SPL) in the standby mode control register (STB_CTL) is set to 1.  Input enabled Indicates that the input function can be used.  Internal input fixed at 0 This is the status that the input function cannot be used. Internal input is fixed at L.  Hi-Z Indicates that the pin drive transistor is disabled and the pin is put in the Hi-Z state.  Setting disabled Indicates that the setting is disabled.  Maintain previous state Maintains the state that was immediately prior to entering the current mode. If a built-in peripheral function is operating, the output follows the peripheral function. If the pin is being used as a port, that output is maintained.  Analog input is enabled Indicates that the analog input is enabled.

42 MB9A120L_DS706-00064-2v0-E, March 31, 2015

 List of Pin Status Pin status type Function group Power-on reset or low-voltage detection state INITX input state Device internal reset state Run mode or Sleep mode state Timer mode, RTC mode, or Stop mode state Power supply unstable Power supply stable Power supply stable Power supply stable - INITX = 0 INITX = 1 INITX = 1 INITX = 1 - - - - SPL = 0 SPL = 1 A GPIO selected Setting disabled Setting disabled Setting disabled Maintain previous state Maintain previous state Hi-Z / Internal input fixed at 0 Main crystal oscillator input pin/ External main clock input selected Input enabled Input enabled Input enabled Input enabled Input enabled Input enabled B GPIO selected Setting disabled Setting disabled Setting disabled Maintain previous state Maintain previous state Hi-Z / Internal input fixed at 0 External main clock input selected Setting disabled Setting disabled Setting disabled Maintain previous state Maintain previous state Hi-Z / Internal input fixed at 0 Main crystal oscillator output pin Hi-Z / Internal input fixed at 0/ or Input enable Hi-Z / Internal input fixed at 0 Hi-Z / Internal input fixed at 0 Maintain previous state / When oscillation stops*1, Hi-Z / Internal input fixed at 0 Maintain previous state / When oscillation stops*1, Hi-Z / Internal input fixed at 0 Maintain previous state / When oscillation stops*1, Hi-Z / Internal input fixed at 0 C INITX input pin Pull-up / Input enabled Pull-up / Input enabled Pull-up / Input enabled Pull-up / Input enabled Pull-up / Input enabled Pull-up / Input enabled D Mode input pin Input enabled Input enabled Input enabled Input enabled Input enabled Input enabled E Mode input pin Input enabled Input enabled Input enabled Input enabled Input enabled Input enabled GPIO selected Setting disabled Setting disabled Setting disabled Maintain previous state Maintain previous state Hi-Z / Input enabled

March 31, 2015, MB9A120L_DS706-00064-2v0-E 43 CONFIDENTIAL Pin status type Function group Power-on reset or low-voltage detection state INITX input state Device internal reset state Run mode or Sleep mode state Timer mode, RTC mode, or Stop mode state Power supply unstable Power supply stable Power supply stable Power supply stable - INITX = 0 INITX = 1 INITX = 1 INITX = 1 - - - - SPL = 0 SPL = 1 F GPIO selected Setting disabled Setting disabled Setting disabled Maintain previous state Maintain previous state Hi-Z / Internal input fixed at 0 Sub crystal oscillator input pin / External sub clock input selected Input enabled Input enabled Input enabled Input enabled Input enabled Input enabled G GPIO selected Setting disabled Setting disabled Setting disabled Maintain previous state Maintain previous state Hi-Z / Internal input fixed at 0 External sub clock input selected Setting disabled Setting disabled Setting disabled Maintain previous state Maintain previous state Hi-Z / Internal input fixed at 0 Sub crystal oscillator output pin Hi-Z / Internal input fixed at 0/ or Input enable Hi-Z / Internal input fixed at 0 Hi-Z / Internal input fixed at 0 Maintain previous state Maintain previous state/When oscillation stops*2, Hi-Z / Internal input fixed at 0 Maintain previous state/When oscillation stops*2, Hi-Z / Internal input fixed at 0 H NMIX selected Setting disabled Setting disabled Setting disabled Maintain previous state Maintain previous state Maintain previous state Resource other than above selected Hi-Z Hi-Z / Input enabled Hi-Z / Input enabled Hi-Z / Internal input fixed at 0 GPIO selected I JTAG selected Hi-Z Pull-up / Input enabled Pull-up / Input enabled Maintain previous state Maintain previous state Maintain previous state GPIO selected Setting disabled Setting disabled Setting disabled Hi-Z / Internal input fixed at 0

44 MB9A120L_DS706-00064-2v0-E, March 31, 2015

Timer mode, RTC mode, or Stop mode state Power supply unstable Power supply stable Power supply stable Power supply stable - INITX = 0 INITX = 1 INITX = 1 INITX = 1 - - - - SPL = 0 SPL = 1 J Resource selected Hi-Z Hi-Z / Input enabled Hi-Z / Input enabled Maintain previous state Maintain previous state Hi-Z / Internal input fixed at 0 GPIO selected K External interrupt enabled selected Setting disabled Setting disabled Setting disabled Maintain previous state Maintain previous state Maintain previous state Resource other than above selected Hi-Z Hi-Z / Input enabled Hi-Z / Input enabled Hi-Z / Internal input fixed at 0 GPIO selected L Analog input selected Hi-Z Hi-Z / Internal input fixed at 0 / Analog input enabled Hi-Z / Internal input fixed at 0 / Analog input enabled Hi-Z / Internal input fixed at 0 / Analog input enabled Hi-Z / Internal input fixed at 0 / Analog input enabled Hi-Z / Internal input fixed at 0 / Analog input enabled Resource other than above selected Setting disabled Setting disabled Setting disabled Maintain previous state Maintain previous state Hi-Z / Internal input fixed at 0 GPIO selected M Analog input selected Hi-Z Hi-Z / Internal input fixed at 0 / Analog input enabled Hi-Z / Internal input fixed at 0 / Analog input enabled Hi-Z / Internal input fixed at 0 / Analog input enabled Hi-Z / Internal input fixed at 0 / Analog input enabled Hi-Z / Internal input fixed at 0 / Analog input enabled External interrupt enabled selected Setting disabled Setting disabled Setting disabled Maintain previous state Maintain previous state Maintain previous state Resource other than above selected Hi-Z / Internal input fixed at 0 GPIO selected

March 31, 2015, MB9A120L_DS706-00064-2v0-E 45 CONFIDENTIAL Pin status type Function group Power-on reset or low-voltage detection state INITX input state Device internal reset state Run mode or Sleep mode state Timer mode, RTC mode, or Stop mode state Power supply unstable Power supply stable Power supply stable Power supply stable - INITX = 0 INITX = 1 INITX = 1 INITX = 1 - - - - SPL = 0 SPL = 1 N Analog output selected Setting disabled Setting disabled Setting disabled Maintain previous state *3 *4 External interrupt enabled selected Setting disabled Setting disabled Setting disabled Maintain previous state Maintain previous state Resource other than above selected Hi-Z Hi-Z / Input enabled Hi-Z / Input enabled Hi-Z / Internal input fixed at 0 GPIO selected *1: Oscillation is stopped at Sub timer mode, sub CR timer mode, RTC mode, Stop mode. *2: Oscillation is stopped at Stop mode. *3: Maintain previous state at timer mode. GPIO selected Internal input fixed at 0 at RTC mode, Stop mode. *4: Maintain previous state at timer mode. Hi-Z/Internal input fixed at 0 at RTC mode, Stop mode.

46 MB9A120L_DS706-00064-2v0-E, March 31, 2015

 Electrical Characteristics 1. Absolute Maximum Ratings Parameter Symbol Rating Unit Remarks Min Max Power supply voltage*1, *2 VCC VSS - 0.5 VSS + 6.5 V Analog power supply voltage*1, *3 AVCC VSS - 0.5 VSS + 6.5 V Analog reference voltage*1, *3 A VRH VSS - 0.5 VSS + 6.5 V Input voltage*1 VI VSS - 0.5 VCC + 0.5 (≤ 6.5 V) V VSS - 0.5 VSS + 6.5 V 5 V tolerant Analog pin input voltage*1 VIA VSS - 0.5 AVCC + 0.5 (≤ 6.5 V) V Output voltage*1 VO VSS - 0.5 VCC + 0.5 (≤ 6.5 V) V Clamp maximum current ICLAMP -2 +2 mA *7 Clamp total maximum current Σ[ICLAMP] +20 mA *7 L level maximum output current*4 IOL - 10 mA 4 mA type 20 mA 12 mA type L level average output current*5 IOLA V - 4 mA 4 mA type 12 mA 12 mA type L level total maximum output current ∑IOL - 100 mA L level total average output current*6 ∑IOLA V - 50 mA H level maximum output current*4 IOH - - 10 mA 4 mA type - 20 mA 12 mA type H level average output current*5 IOHA V - - 4 mA 4 mA type - 12 mA 12 mA type H level total maximum output current ∑IOH - - 100 mA H level total average output current*6 ∑IOHA V - - 50 mA Power consumption PD - 350 mW Storage temperature TSTG - 55 + 150 °C *1: These parameters are based on the condition that VSS = AVSS = 0.0 V. *2: VCC must not drop below VSS - 0.5 V. *3: Ensure that the voltage does not exceed VCC + 0.5 V, for example, when the power is turned on. *4: The maximum output current is defined as the value of the peak current flowing through any one of the corresponding pins. *5: The average output current is defined as the average current value flowing through any one of the corresponding pins for a 100 ms period. *6: The total average output current is defined as the average current value flowing through all of corresponding pins for a 100 ms.

March 31, 2015, MB9A120L_DS706-00064-2v0-E 47 CONFIDENTIAL *7: ・ See List of Pin Functions and I/O Circuit Type about +B input available pin. ・ Use within recommended operating conditions. ・ Use at DC voltage (current) the +B input. ・ The +B signal should always be applied a limiting resistance placed between the +B signal a nd the device. ・ The value of the limiting resistance should be set so that when the +B signal is applied the input current to the device pin does not exceed rated values, either instantaneously or for prolonged periods. ・ Note that when the device drive current is low, such as in the low-power consumpsion modes, the +B input potential may pass through the protective diode and increase the potential at the VCC and A VCC pin, and this may affect other devices. ・ Note that if a +B signal is input when the device power supply is off (not fixed at 0V), the power supply is provided from the pins, so that incomplete operation may result. ・ The following is a recommended circuit example (I/O equivalent circuit). <WARNING> Semiconductor devices may be permanently damaged by application of stress ( including, without limitation, voltage, current or temperature) in excess of absolute maximum ratings. Do not exceed any of these ratings. R +B input (0V to 16V) Protection Diode P-ch VCC VCC Limiting resistor N-ch AVCC Analog input Digital input Digital output

48 MB9A120L_DS706-00064-2v0-E, March 31, 2015

1. Recommended Operating Conditions (VSS = A VSS = A VRL = 0.0V) Parameter Symbol Conditions Value Unit Remarks Min Max Power supply voltage VCC - 2.7*2 5.5 V Analog power supply voltage AVCC - 2.7 5.5 V AVCC = VCC Analog reference voltage A VRH - 2.7 AVCC V A VRL - AVSS AVSS V Smoothing capacitor CS - 1 10 μF For Regulator*1 Operating temperature FPT-64P-M39, FPT-52P-M02, FPT-64P-M38, FPT-48P-M49, LCC-64P-M25, LCC-48P-M74 TA When mounted on four-layer PCB - 40 + 105 °C When mounted on double-sided single-layer PCB - 40 + 85 °C *1: See C Pin in Handling Devices for the connection of the smoothing capacitor. *2: In between less than the minimum power supply voltage and low voltage reset/interrupt detection voltage or more, instruction execution and low voltage detection function by built-in High-speed CR(including Main PLL is used) or built-in Low-speed CR is possible to operate only. <WARNING> The recommended operating conditions are required in order to ensure the normal operation of the semiconductor device. All of the device's electrical characteristics are warranted when the device is operated under these conditions. Any use of semiconductor devices will be under their recommended operating condition. Operation under any conditions other than these conditions may adversely affect reliability of device and could result in device failure. No warranty is made with respect to any use, operating conditions, or combinations not represented on this data sheet. If you are considering application under any conditions other than listed herein, please contact sales representatives beforehand.

March 31, 2015, MB9A120L_DS706-00064-2v0-E 49 CONFIDENTIAL 3. DC Characteristics (1) Current Rating (VCC = A VCC = 2.7V to 5.5V, VSS = A VSS = A VRL = 0V, TA = - 40°C to + 105°C) Parameter Symbol Pin name Conditions Value Unit Remarks Typ Max Run mode current ICC VCC PLL Run mode CPU: 40 MHz, Peripheral: 40 MHz Instruction on Flash 15.5 16 mA *1, *5 CPU: 40 MHz, Peripheral: the clock stops NOP operation Instruction on Flash 9 10.6 mA *1, *5 CPU: 40 MHz, Peripheral: 40 MHz Instruction on RAM 14 15 mA *1 High-speed CR Run mode CPU/ Peripheral: 4 MHz*2 Instruction on Flash 1.7 3.0 mA *1 Sub Run mode CPU/ Peripheral: 32 kHz Instruction on Flash 63 900 μA *1, *6 Low-speed CR Run mode CPU/ Peripheral: 100 kHz Instruction on Flash 88 920 μA *1 Sleep mode current ICCS PLL Sleep mode Peripheral: 40 MHz 9 12 mA *1, *5 High-speed CR Sleep mode Peripheral: 4 MHz*2 1 2.1 mA *1 Sub Sleep mode Peripheral: 32 kHz 58 880 μA *1, *6 Low-speed CR Sleep mode Peripheral: 100 kHz 71 890 μA *1 *1: When all ports are fixed. *2: When setting it to 4 MHz by trimming. *3: TA=+25°C, VCC=5.5 V *4: TA=+105°C, VCC=5.5 V *5: When using the crystal oscillator of 4 MHz(Including the current consumption of the oscillation circuit) *6: When using the crystal oscillator of 32 kHz(Including the current consumption of the oscillation circuit)

50 MB9A120L_DS706-00064-2v0-E, March 31, 2015

(VCC = A VCC = 2.7V to 5.5V, VSS = A VSS = A VRL = 0V, TA = - 40°C to + 105°C) Parameter Symbol Pin name Conditions Value Unit Remarks Typ Max Timer mode current ICCT VCC Main Timer mode TA = + 25°C, When LVD is off mA *1 TA = + 85°C, When LVD is off - mA *1 ICCT Sub Timer mode TA = + 25°C, When LVD is off 13 44 μA *1 TA = + 85°C, When LVD is off - 730 μA *1 RTC mode current ICCR RTC mode TA = + 25°C, When LVD is off 10 38 μA *1 TA = + 85°C, When LVD is off - 570 μA *1 Stop mode current ICCH Stop mode TA = + 25°C, When LVD is off 9 32 μA *1 TA = + 85°C, When LVD is off - 540 μA *1 *1: When all ports are fixed. *2: VCC=5.5 V *3: When using the crystal oscillator of 4 MHz(Including the current consumption of the oscillation circuit) *4: When using the crystal oscillator of 32 kHz(Including the current consumption of the oscillation circuit) ・ LVD current (VCC = A VCC = 2.7V to 5.5V , VSS = A VSS = A VRL = 0V , TA = - 40°C to + 105°C) Parameter Symbol Pin name Conditions Value Unit Remarks Typ Max Low-Voltage detection circuit (LVD) power supply current ICCLVD VCC At operation for reset Vcc = 5.5 V 0.13 0.3 μA At not detect At operation for interrupt Vcc = 5.5 V 0.13 0.3 μA At not detect ・ Flash memory current (VCC = A VCC = 2.7V to 5.5V , VSS = A VSS = A VRL = 0V , TA = - 40°C to + 105°C) Parameter Symbol Pin name Conditions Value Unit Remarks Typ Max Flash memory write/erase current ICCFLASH VCC At Write/Erase 9.5 11.2 mA ・ A/D convertor current (VCC = A VCC = 2.7V to 5.5V , VSS = A VSS = A VRL = 0V , TA = - 40°C to + 105°C) Parameter Symbol Pin name Conditions Value Unit Remarks Typ Max Power supply current ICCAD AVCC At operation 0.7 0.9 mA At stop 0.13 13 μA Reference power supply current ICCA VRH A VRH At operation 1.1 1.97 mA A VRH=5.5V At stop 0.1 1.7 μA A VRH=5.5V

March 31, 2015, MB9A120L_DS706-00064-2v0-E 51 CONFIDENTIAL ・ D/A convertor current (VCC = A VCC = 2.7V to 5.5V , VSS = A VSS = A VRL = 0V , TA = - 40°C to + 105°C) Parameter Symbol Pin name Conditions Value Unit Remarks Typ Max Power supply current IDDA A VCC At operation AVCC = 3.3 V 315 380 μA * IDSA At operation AVCC = 5.0 V 475 580 μA * At stop - 8 μA * *: No-load

52 MB9A120L_DS706-00064-2v0-E, March 31, 2015

(2) Pin Characteristics (VCC = A VCC = 2.7V to 5.5V , VSS = AVSS = A VRL = 0V , TA = - 40°C to + 105°C) Parameter Symbol Pin name Conditions Value Unit Remarks Min Typ Max H level input voltage (hysteresis input) VIHS CMOS hysteresis input pin, MD0, MD1 - VCC × 0.8 - VCC + 0.3 V 5V tolerant input pin - VCC × 0.8 - VSS + 5.5 V L level input voltage (hysteresis input) VILS CMOS hysteresis input pin, MD0, MD1 - VSS - 0.3 - VCC × 0.2 V 5V tolerant input pin - VSS - 0.3 - VCC × 0.2 V H level output voltage VOH 4mA type VCC ≥ 4.5 V, IOH = - 4 mA VCC - 0.5 - VCC V VCC < 4.5 V, IOH = - 2 mA 12mA type VCC ≥ 4.5 V, IOH = - 12 mA VCC - 0.5 - VCC V VCC < 4.5 V, IOH = - 8 mA L level output voltage VOL 4mA type VCC ≥ 4.5 V, IOL = 4 mA VSS - 0.4 V VCC < 4.5 V, IOL = 2 mA 12mA type VCC ≥ 4.5 V, IOL = 12 mA VSS - 0.4 V VCC < 4.5 V, IOL = 8 mA Input leak current IIL - - - 5 - + 5 μA Pull-up resistance value RPU Pull-up pin VCC ≥ 4.5 V 33 50 90 kΩ VCC < 4.5 V - - 180 Input capacitance CIN Other than VCC, VSS, A VCC, A VSS, A VRH, A VRL - - 5 15 pF

March 31, 2015, MB9A120L_DS706-00064-2v0-E 53 CONFIDENTIAL 4. AC Characteristics (1) Main Clock Input Characteristics (VCC = 2.7V to 5.5V, VSS = 0V, TA = - 40°C to + 105°C) Parameter Symbol Pin name Conditions Value Unit Remarks Min Max Input frequency fCH X0, VCC ≥ 4.5 V 4 48 MHz When crystal oscillator is connected VCC < 4.5 V 4 20 - 4 48 MHz When using external Clock Input clock cycle tCYLH - 20.83 250 ns When using external Clock Input clock pulse width - PWH/tCYLH, PWL/tCYLH 45 55 % When using external Clock Input clock rising time and falling time tCF, tCR - - 5 ns When using external Clock Internal operating clock frequency*1 fCM - - - 40 MHz Master clock fCC - - - 40 MHz Base clock (HCLK/FCLK) fCP0 - - - 40 MHz APB0 bus clock*2 fCP1 - - - 40 MHz APB1 bus clock*2 fCP2 - - - 40 MHz APB2 bus clock*2 Internal operating clock cycle time*1 tCYCC - - 25 - ns Base clock (HCLK/FCLK) tCYCP0 - - 25 - ns APB0 bus clock*2 tCYCP1 - - 25 - ns APB1 bus clock*2 tCYCP2 - - 25 - ns APB2 bus clock*2 *1: For more information about each internal operating clock, see Chapter 2-1: Clock in FM3 Family Peripheral Manual. *2: For about each APB bus which each peripheral is connected to, see Block Diagram in this data sheet.

54 MB9A120L_DS706-00064-2v0-E, March 31, 2015

(2) Sub Clock Input Characteristics (VCC = 2.7V to 5.5V, VSS = 0V, TA = - 40°C to + 105°C) Parameter Symbol Pin name Conditions Value Unit Remarks Min Typ Max Input frequency fCL X0A, X1A - - 32.768 - kHz When crystal oscillator is connected - 32 - 100 kHz When using external clock Input clock cycle tCYLL - 10 - 31.25 μs When using external clock Input clock pulse width - PWH/tCYLL, PWL/tCYLL 45 - 55 % When using external clock *: See Sub crystal oscillator in Handling Devices for the crystal oscillator used. X0A

March 31, 2015, MB9A120L_DS706-00064-2v0-E 55 CONFIDENTIAL (3) Built-in CR Oscillation Characteristics ・ Built-in High-speed CR (VCC = 2.7V to 5.5V, VSS = 0V, TA = - 40°C to + 105°C) Parameter Symbol Conditions Value Unit Remarks Min Typ Max Clock frequency fCRH TA = + 25°C, 3.6 V < VCC ≤ 5.5 V 3.92 4 4.08 MHz When trimming*1 TA =0°C to + 85°C, 3.6 V < VCC ≤ 5.5 V 3.9 4 4.1 TA = - 40°C to + 105°C, 3.6 V < VCC ≤ 5.5 V 3.88 4 4.12 TA = + 25°C, 2.7 V ≤ VCC ≤ 3.6 V 3.94 4 4.06 TA = - 20°C to + 85°C, 2.7 V ≤ VCC ≤ 3.6 V 3.92 4 4.08 TA = - 20°C to + 105°C, 2.7 V ≤ VCC ≤ 3.6 V 3.9 4 4.1 TA = - 40°C to + 105°C, 2.7 V ≤ VCC ≤ 3.6 V 3.88 4 4.12 TA = - 40°C to + 105°C 2.8 4 5.2 When not trimming Frequency stabilization time tCRWT - - - 30 μs *2 *1: In the case of using the values in CR trimming area of Flash memory at shipment for frequency trimming/temperature trimming. *2: This is time from the trim value setting to stable of the frequency of the High-speed CR clock. After setting the trim value, the period when the frequency stability time passes can use the High-speed CR clock as a source clock. ・ Built-in Low-speed CR (VCC = 2.7V to 5.5V, VSS = 0V, TA = - 40°C to + 105°C) Parameter Symbol Conditions Value Unit Remarks Min Typ Max Clock frequency fCRL - 50 100 150 kHz

56 MB9A120L_DS706-00064-2v0-E, March 31, 2015

(4-1) Operating Conditions of Main PLL (In the case of using main clock for input of Main PLL) (VCC = 2.7V to 5.5V, VSS = 0V, TA = - 40°C to + 105°C) Parameter Symbol Value Unit Remarks Min Typ Max PLL oscillation stabilization wait time*1 (LOCK UP time) tLOCK 100 - - μs PLL input clock frequency fPLLI 4 - 16 MHz PLL multiplication rate - 5 - 37 multiplier PLL macro oscillation clock frequency fPLLO 75 - 150 MHz Main PLL clock frequency*2 fCLKPLL - - 40 MHz *1: Time from when the PLL starts operating until the oscillation stabilizes. *2: For more information about Main PLL clock (CLKPLL), see Chapter 2-1: Clock in FM3 Family Peripheral Manual. (4-2) Operating Conditions of Main PLL (In the case of using built-in high-speed CR for input clock of Main PLL) (VCC = 2.7V to 5.5V, VSS = 0V, TA = - 40°C to + 105°C) Parameter Symbol Value Unit Remarks Min Typ Max PLL oscillation stabilization wait time*1 (LOCK UP time) tLOCK 100 - - μs PLL input clock frequency fPLLI 3.8 4 4.2 MHz PLL multiplication rate - 19 - 35 multiplier PLL macro oscillation clock frequency fPLLO 72 - 150 MHz Main PLL clock frequency*2 fCLKPLL - - 40 MHz *1: Time from when the PLL starts operating until the oscillation stabilizes. *2: For more information about Main PLL clock (CLKPLL), see Chapter 2-1: Clock in FM3 Family Peripheral Manual. Note: Make sure to input to the main PLL source clock, the high-speed CR clock (CLKHC) that the frequency/temperature has been trimmed. When setting PLL multiple rate, please take the accuracy of the built-in high-speed CR clock into account and prevent the master clock from exceeding the maximum frequency. K divider PLL input clock Main PLL PLL macro oscillation clock M divider Main PLL clock (CLKPLL) N divider Main PLL connection

March 31, 2015, MB9A120L_DS706-00064-2v0-E 57 CONFIDENTIAL (5) Reset Input Characteristics (VCC = 2.7V to 5.5V, VSS = 0V, TA = - 40°C to + 105°C) Parameter Symbol Pin name Conditions Value Unit Remarks Min Max Reset input time tINITX INITX - 500 - ns (6) Power-on Reset Timing (VCC = 2.7V to 5.5V, VSS = 0V, TA = - 40°C to + 105°C) Parameter Symbol Pin name Value Unit Remarks Min Max Power supply rising time tVCCR VCC 0 - ms Power supply shut down time tOFF 1 - ms Time until releasing Power-on reset tPRT 0.34 3.15 ms 0.2V VDH_minimum VCC_minimum tPRT Internal reset VCC CPU Operation start Reset active Release tVCCR 0.2V 0.2V tOFF Glossary ・VCC_minimum: Minimum VCC of recommended operating conditions. ・VDH_minimum: Minimum detection voltage (when SVHR=00000) of Low-Voltage detection reset. See 7. Low-Voltage Detection Characteristics.

58 MB9A120L_DS706-00064-2v0-E, March 31, 2015

(7) Base Timer Input Timing ・ Timer input timing (VCC = 2.7V to 5.5V, VSS = 0V, TA = - 40°C to + 105°C) Parameter Symbol Pin name Conditions Value Unit Remarks Min Max Input pulse width tTIWH, tTIWL TIOAn/TIOBn (when using as ECK, TIN) - 2tCYCP - ns tTIWH VIHS VIHS VILS VILS tTIWL ・ Trigger input timing (VCC = 2.7V to 5.5V, VSS = 0V, TA = - 40°C to + 105°C) Parameter Symbol Pin name Conditions Value Unit Remarks Min Max Input pulse width tTRGH, tTRGL TIOAn/TIOBn (when using as TGIN) - 2tCYCP - ns tTRGH VIHS VIHS VILS VILS tTRGL Note: tCYCP indicates the APB bus clock cycle time. About the APB bus number which the Base Timer is connected to, see Block Diagram in this data sheet. ECK TIN TGIN

March 31, 2015, MB9A120L_DS706-00064-2v0-E 59 CONFIDENTIAL (8) CSIO/UART Timing ・ CSIO (SPI = 0, SCINV = 0) (VCC = 2.7V to 5.5V, VSS = 0V, TA = - 40°C to + 105°C) Parameter Symbol Pin name Conditions VCC < 4.5 V VCC ≥ 4.5 V Unit Min Max Min Max Serial clock cycle time tSCYC SCKx Master mode 4tCYCP - 4tCYCP - ns SCK ↓ → SOT delay time tSLOVI SCKx, SOTx - 30 + 30 - 20 + 20 ns SIN → SCK ↑ setup time tIVSHI SCKx, SINx 50 - 30 - ns SCK ↑ → SIN hold time tSHIXI SCKx, SINx 0 - 0 - ns Serial clock L pulse width tSLSH SCKx Slave mode 2tCYCP - 10 - 2tCYCP - 10 - ns Serial clock H pulse width tSHSL SCKx tCYCP + 10 - tCYCP + 10 - ns SCK ↓ → SOT delay time tSLOVE SCKx, SOTx - 50 - 30 ns SIN → SCK ↑ setup time tIVSHE SCKx, SINx 10 - 10 - ns SCK ↑ → SIN hold time tSHIXE SCKx, SINx 20 - 20 - ns SCK falling time tF SCKx - 5 - 5 ns SCK rising time tR SCKx - 5 - 5 ns Notes: ・ The above characteristics apply to clock synchronous mode. ・ tCYCP indicates the APB bus clock cycle time. ・ About the APB bus number which Multi-function serial is connected to, see ■Block Diagram in this data sheet. ・ These characteristics only guarantee the same relocate port number. For example, the combination of SCKx_0 and SOTx_1 is not guaranteed. ・ When the external load capacitance CL = 30 pF.

60 MB9A120L_DS706-00064-2v0-E, March 31, 2015

March 31, 2015, MB9A120L_DS706-00064-2v0-E 61 CONFIDENTIAL ・ CSIO (SPI = 0, SCINV = 1) (VCC = 2.7V to 5.5V, VSS = 0V, TA = - 40°C to + 105°C) Parameter Symbol Pin name Conditions VCC < 4.5 V VCC ≥ 4.5 V Unit Min Max Min Max Serial clock cycle time tSCYC SCKx Master mode 4tCYCP - 4tCYCP - ns SCK ↑ → SOT delay time tSHOVI SCKx, SOTx - 30 + 30 - 20 + 20 ns SIN → SCK ↓ setup time tIVSLI SCKx, SINx 50 - 30 - ns SCK ↓ → SIN hold time tSLIXI SCKx, SINx 0 - 0 - ns Serial clock L pulse width tSLSH SCKx Slave mode 2tCYCP - 10 - 2tCYCP - 10 - ns Serial clock H pulse width tSHSL SCKx tCYCP + 10 - tCYCP + 10 - ns SCK ↑ → SOT delay time tSHOVE SCKx, SOTx - 50 - 30 ns SIN → SCK ↓ setup time tIVSLE SCKx, SINx 10 - 10 - ns SCK ↓ → SIN hold time tSLIXE SCKx, SINx 20 - 20 - ns SCK falling time tF SCKx - 5 - 5 ns SCK rising time tR SCKx - 5 - 5 ns Notes: ・ The above characteristics apply to clock synchronous mode. ・ tCYCP indicates the APB bus clock cycle time. ・ About the APB bus number which Multi-function serial is connected to, see■Block Diagram in this data sheet. ・ These characteristics only guarantee the same relocate port number. For example, the combination of SCKx_0 and SOTx_1 is not guaranteed. ・ When the external load capacitance CL = 30 pF.

62 MB9A120L_DS706-00064-2v0-E, March 31, 2015

March 31, 2015, MB9A120L_DS706-00064-2v0-E 63 CONFIDENTIAL ・ CSIO (SPI = 1, SCINV = 0) (VCC = 2.7V to 5.5V, VSS = 0V, TA = - 40°C to + 105°C) Parameter Symbol Pin name Conditions VCC < 4.5 V VCC ≥ 4.5 V Unit Min Max Min Max Serial clock cycle time tSCYC SCKx Master mode 4tCYCP - 4tCYCP - ns SCK ↑ → SOT delay time tSHOVI SCKx, SOTx - 30 + 30 - 20 + 20 ns SIN → SCK ↓ setup time tIVSLI SCKx, SINx 50 - 30 - ns SCK ↓→ SIN hold time tSLIXI SCKx, SINx 0 - 0 - ns SOT → SCK ↓ delay time tSOVLI SCKx, SOTx 2tCYCP - 30 - 2tCYCP - 30 - ns Serial clock L pulse width tSLSH SCKx Slave mode 2tCYCP - 10 - 2tCYCP - 10 - ns Serial clock H pulse width tSHSL SCKx tCYCP + 10 - tCYCP + 10 - ns SCK ↑ → SOT delay time tSHOVE SCKx, SOTx - 50 - 30 ns SIN → SCK ↓ setup time tIVSLE SCKx, SINx 10 - 10 - ns SCK ↓→ SIN hold time tSLIXE SCKx, SINx 20 - 20 - ns SCK falling time tF SCKx - 5 - 5 ns SCK rising time tR SCKx - 5 - 5 ns Notes: ・ The above characteristics apply to clock synchronous mode. ・ tCYCP indicates the APB bus clock cycle time. ・ About the APB bus number which Multi-function serial is connected to, see ■Block Diagram in this data sheet. ・ These characteristics only guarantee the same relocate port number. For example, the combination of SCKx_0 and SOTx_1 is not guaranteed. ・ When the external load capacitance CL = 30 pF.

64 MB9A120L_DS706-00064-2v0-E, March 31, 2015

*: Changes when writing to TDR register tSOVLI tSCYC tSHOVI VOL VOL VOH VOH VOL VOH VOL VIH VIL VIH VIL tIVSLI tSLIXI SCK SOT SIN tF tR tSLSH tSHSL tSHOVE VIL VIL VIH VIH VIH VOH VOL VOH VOL VIH VIL VIH VIL tIVSLE tSLIXE SCK SOT SIN

March 31, 2015, MB9A120L_DS706-00064-2v0-E 65 CONFIDENTIAL ・ CSIO (SPI = 1, SCINV = 1) (VCC = 2.7V to 5.5V, VSS = 0V, TA = - 40°C to + 105°C) Parameter Symbol Pin name Conditions VCC < 4.5 V VCC ≥ 4.5 V Unit Min Max Min Max Serial clock cycle time tSCYC SCKx Master mode 4tCYCP - 4tCYCP - ns SCK ↓ → SOT delay time tSLOVI SCKx, SOTx - 30 + 30 - 20 + 20 ns SIN → SCK ↑ setup time tIVSHI SCKx, SINx 50 - 30 - ns SCK ↑ → SIN hold time tSHIXI SCKx, SINx 0 - 0 - ns SOT → SCK ↑ delay time tSOVHI SCKx, SOTx 2tCYCP - 30 - 2tCYCP - 30 - ns Serial clock L pulse width tSLSH SCKx Slave mode 2tCYCP - 10 - 2tCYCP - 10 - ns Serial clock H pulse width tSHSL SCKx tCYCP + 10 - tCYCP + 10 - ns SCK ↓ → SOT delay time tSLOVE SCKx, SOTx - 50 - 30 ns SIN → SCK ↑ setup time tIVSHE SCKx, SINx 10 - 10 - ns SCK ↑ → SIN hold time tSHIXE SCKx, SINx 20 - 20 - ns SCK falling time tF SCKx - 5 - 5 ns SCK rising time tR SCKx - 5 - 5 ns Notes: ・ The above characteristics apply to clock synchronous mode. ・ tCYCP indicates the APB bus clock cycle time. ・ About the APB bus number which Multi-function serial is connected to, see ■Block Diagram in this data sheet. ・ These characteristics only guarantee the same relocate port number. For example, the combination of SCKx_0 and SOTx_1 is not guaranteed. ・ When the external load capacitance CL = 30 pF.

66 MB9A120L_DS706-00064-2v0-E, March 31, 2015

・ UART external clock input (EXT = 1) (VCC = 2.7V to 5.5V, VSS = 0V, TA = - 40°C to + 105°C) Parameter Symbol Conditions Value Unit Remarks Min Max Serial clock L pulse width tSLSH CL = 30 pF tCYCP + 10 - ns Serial clock H pulse width tSHSL tCYCP + 10 - ns SCK falling time tF - 5 ns SCK rising time tR - 5 ns tSHSL VIL VIL VIL VIH VIH tR tF tSLSH SCK tSCYC tSLOVI VOL VOH VOH VOH VOL VOH VOL VIH VIL VIH VIL tIVSHI tSHIXI tSOVHI SCK SOT SIN tSHSL tR tSLSH tF tSLOVE VIL VIL VIL VIH VIH VOH VOL VOH VOL VIH VIL VIH VIL tIVSHE tSHIXE SCK SOT SIN

March 31, 2015, MB9A120L_DS706-00064-2v0-E 67 CONFIDENTIAL (9) External Input Timing (VCC = 2.7V to 5.5V, VSS = 0V, TA = - 40°C to + 105°C) Parameter Symbol Pin name Conditions Value Unit Remarks Min Max Input pulse width tINH, tINL ADTG - 2tCYCP*1 - ns A/D converter trigger input FRCKx Free-run timer input clock ICxx Input capture DTTIxX - 2tCYCP*1 - ns Waveform enerator IGTRG - 2tCYCP*1 - ns PPG IGBT mode INTxx, NMIX *2 2tCYCP + 100*1 - ns External interrupt, NMI *3 500 - ns *1: tCYCP indicates the APB bus clock cycle time. About the APB bus number which the A/D converter, Multi-function Timer, External interrupt are connected to, see Block Diagram in this data sheet. *2: When in Run mode, in Sleep mode. *3: When in stop mode, in RTC mode, in timer mode.

68 MB9A120L_DS706-00064-2v0-E, March 31, 2015

(10) I2C Timing (VCC = 2.7V to 5.5V , VSS = 0V , TA = - 40°C to + 105°C) Parameter Symbol Conditions Standard-mode Fast-mode Unit Remarks Min Max Min Max SCL clock frequency fSCL CL = 30 pF, R = (Vp/IOL)*1 0 100 0 400 kHz (Repeated) Start condition hold time SDA ↓ → SCL ↓ tHDSTA 4.0 - 0.6 - μs SCLclock L width tLOW 4.7 - 1.3 - μs SCLclock H width tHIGH 4.0 - 0.6 - μs (Repeated) Start condition setup time SCL ↑ → SDA ↓ tSUSTA 4.7 - 0.6 - μs Data hold time SCL ↓ → SDA ↓ ↑ tHDDA T 0 3.45*2 0 0.9*3 μs Data setup time SDA ↓ ↑ → SCL ↑ tSUDA T 250 - 100 - ns STOP condition setup time SCL ↑ → SDA ↑ tSUSTO 4.0 - 0.6 - μs Bus free time between Stop condition and Start condition tBUF 4.7 - 1.3 - μs Noise filter tSP - 2 tCYCP*4 - 2 tCYCP*4 - ns *1:R and CL represent the pull-up resistor and load capacitance of the SCL and SDA lines, respectively. Vp indicates the power supply voltage of the pull-up resistor and IOL indicates VOL guaranteed current. *2:The maximum tHDDA T must satisfy that it does not extend at least L period (tLOW) of device's SCL signal. *3:A Fast-mode I2C bus device can be used on a Standard-mode I2C bus system as long as the device satisfies the requirement of tSUDA T ≥ 250 ns. *4:tCYCP is the APB bus clock cycle time. About the APB bus number that I2C is connected to, see Block Diagram in this data sheet. To use Standard-mode, set the APB bus clock at 2 MHz or more. To use Fast-mode, set the APB bus clock at 8 MHz or more. SDA SCL

March 31, 2015, MB9A120L_DS706-00064-2v0-E 69 CONFIDENTIAL (11) JTAG Timing (VCC = 2.7V to 5.5V, VSS = 0V, TA = - 40°C to + 105°C) Parameter Symbol Pin name Conditions Value Unit Remarks Min Max TMS, TDI setup time tJTAGS TCK, TMS, TDI VCC ≥ 4.5 V 15 - ns VCC < 4.5 V TMS, TDI hold time tJTAGH TCK, TMS, TDI VCC ≥ 4.5 V 15 - ns VCC < 4.5 V TDO delay time tJTAGD TCK, TDO VCC ≥ 4.5 V - 25 ns VCC < 4.5 V - 45 Note: When the external load capacitance CL = 30 pF. TCK TMS/TDI TDO

70 MB9A120L_DS706-00064-2v0-E, March 31, 2015

1. 12-bit A/D Converter ・Electrical characteristics for the A/D converter (VCC = A VCC = 2.7V to 5.5V, VSS = A VSS = A VRL = 0V, TA = - 40°C to + 105°C) Parameter Symbol Pin name Value Unit Remarks Min Typ Max Resolution - - - - 12 bit Integral Nonlinearity - - - ± 2.0 ± 4.5 LSB A VRH = 2.7 V to 5.5 V Differential Nonlinearity - - - ± 1.5 ± 2.5 LSB Zero transition voltage VZT ANxx - ± 8 ± 15 mV Full-scale transition voltage VFST ANxx - A VRH ± 8 A VRH ± 15 mV Conversion time - - 0.8*1 - - μs AVCC ≥ 4.5 V 1.0*1 - - μs AVCC < 4.5 V Sampling time*2 tS - 0.24 - 10 μs Compare clock cycle*3 tCCK - 40 - 1000 ns State transition time to operation permission tSTT - - - 1.0 μs Analog input capacity CAIN - - - 9.7 pF Analog input resistor RAIN - - - 1.5 kΩ AVCC ≥ 4.5 V 2.2 AVCC < 4.5 V Interchannel disparity - - - - 4 LSB Analog port input leak current - ANxx - - 5 μA Analog input voltage - ANxx AVRL - A VRH V Reference voltage - A VRH 2.7 - AVCC V A VRL AVSS - AVSS *1: The conversion time is the value of sampling time (tS) + compare time (tC). The condition of the minimum conversion time is the following. AVCC ≥ 4.5 V , HCLK=25 MHz sampling time: 240 ns, compare time: 560 ns AVCC < 4.5 V , HCLK=40 MHz sampling time: 300 ns, compare time: 700 ns Ensure that it satisfies the value of the sampling time (tS) and compare clock cycle (tCCK). For setting of the sampling time and compare clock cycle, see Chapter 1-1: A/D Converter in FM3 Family Peripheral Manual Analog Macro Part. The register settings of the A/D Converter are reflected in the operation according to the APB bus clock timing. For the number of the APB bus to which the A/D Converter is connected, see Block Diagram. The Base clock (HCLK) is used to generate the sampling time and the compare clock cycle. *2: A necessary sampling time changes by external impedance. Ensure that it sets the sampling time to satisfy (Equation 1). *3: The compare time (tC) is the value of (Equation 2).

March 31, 2015, MB9A120L_DS706-00064-2v0-E 71 CONFIDENTIAL (Equation 1) tS ≥ ( RAIN + REXT ) × CAIN × 9 tS: Sampling time CAIN: Input capacity of A/D = 9.7 pF at 2.7 V < AVCC < 5.5 V REXT: Output impedance of external circuit (Equation 2) tC = tCCK × 14 tC: Compare time tCCK: Compare clock cycle REXT CAIN RAIN Analog signal source ANxx Comparator

72 MB9A120L_DS706-00064-2v0-E, March 31, 2015

・Definition of 12-bit A/D Converter Terms ・ Resolution: Analog variation that is recognized by an A/D converter. ・ Integral Nonlinearity: Deviation of the line between the zero-transition point (0b000000000000 ←→ 0b000000000001) and the full-scale transition point (0b111111111110 ←→ 0b111111111111) from the actual conversion characteristics. ・ Differential Nonlinearity: Deviation from the ideal value of the input voltage that is required to change the output code by 1 LSB. Integral Nonlinearity of digital output N = VNT - {1LSB × (N - 1) + VZT} [LSB] 1LSB Differential Nonlinearity of digital output N = V(N + 1) T - VNT - 1 [LSB] 1LSB 1LSB = VFST - VZT 4094 N: A/D converter digital output value. VZT: Voltage at which the digital output changes from 0x000 to 0x001. VFST: Voltage at which the digital output changes from 0xFFE to 0xFFF. VNT: Voltage at which the digital output changes from 0x(N − 1) to 0xN. Integral Nonlinearity Differential Nonlinearity Digital output Digital output Actual conversion characteristics Actual conversion characteristics Ideal characteristics (Actually- measured value) Actual conversion characteristics Actual conversion characteristics (Actually-measured value) (Actually-measured value) Ideal characteristics (Actually-measured value) Analog input Analog input (Actually-measured value) 0x001 0x002 0x003 0x004 0xFFD 0xFFE 0xFFF AVRL AVRH AVRL AVRH 0x(N-2) 0x(N-1) 0x(N+1) 0xN {1 LSB(N-1) + VZT} VNT VFST VZT VNT V(N+1)T

March 31, 2015, MB9A120L_DS706-00064-2v0-E 73 CONFIDENTIAL 6. 10-bit D/A Converter ・Electrical Characteristics for the D/A Converter (VCC = A VCC = 2.7V to 5.5V , VSS = A VSS = A VRL = 0V , TA = - 40°C to + 105°C) Parameter Symbol Pin name Value Unit Remarks Min Typ Max Resolution - DAx - - 10 bit Conversion time tC20 0.47 0.58 0.69 μs Load 20 pF tC100 2.37 2.90 3.43 μs Load 100 pF Integral Nonlinearity INL - 4.0 - + 4.0 LSB * Differential Nonlinearity DNL - 0.9 - + 0.9 LSB * Output V oltage offset VOFF - - 10.0 mV Code is 0x000 - 20.0 - + 5.4 mV Code is 0x3FF Analog output impedance RO 3.10 3.80 4.50 kΩ D/A operation 2.0 - - MΩ D/A stop Output undefined period tR - - 70 ns *: No-load

74 MB9A120L_DS706-00064-2v0-E, March 31, 2015

1. Low-Voltage Detection Characteristics (1) Low-Voltage Detection Reset (TA = - 40°C to + 105°C) Parameter Symbol Conditions Value Unit Remarks Min Typ Max Detected voltage VDL SVHR*1 = 00000 2.25 2.45 2.65 V When voltage drops Released voltage VDH 2.30 2.50 2.70 V When voltage rises Detected voltage VDL SVHR*1 = 00001 2.39 2.60 2.81 V When voltage drops Released voltage VDH Same as SVHR = 0000 value V When voltage rises Detected voltage VDL SVHR*1 = 00010 2.48 2.70 2.92 V When voltage drops Released voltage VDH Same as SVHR = 0000 value V When voltage rises Detected voltage VDL SVHR*1 = 00011 2.58 2.80 3.02 V When voltage drops Released voltage VDH Same as SVHR = 0000 value V When voltage rises Detected voltage VDL SVHR*1 = 00100 2.76 3.00 3.24 V When voltage drops Released voltage VDH Same as SVHR = 0000 value V When voltage rises Detected voltage VDL SVHR*1 = 00101 2.94 3.20 3.46 V When voltage drops Released voltage VDH Same as SVHR = 0000 value V When voltage rises Detected voltage VDL SVHR*1 = 00110 3.31 3.60 3.89 V When voltage drops Released voltage VDH Same as SVHR = 0000 value V When voltage rises Detected voltage VDL SVHR*1 = 00111 3.40 3.70 4.00 V When voltage drops Released voltage VDH Same as SVHR = 0000 value V When voltage rises Detected voltage VDL SVHR*1 = 01000 3.68 4.00 4.32 V When voltage drops Released voltage VDH Same as SVHR = 0000 value V When voltage rises Detected voltage VDL SVHR*1 = 01001 3.77 4.10 4.43 V When voltage drops Released voltage VDH Same as SVHR = 0000 value V When voltage rises Detected voltage VDL SVHR*1 = 01010 3.86 4.20 4.54 V When voltage drops Released voltage VDH Same as SVHR = 0000 value V When voltage rises LVD stabilization wait time tLVDW - - - 8160 × tCYCP *2 μs LVD detection delay time tLVDDL - - - 200 μs *1: SVHR bit of Low-V oltage Detection V oltage Control Register (LVD_CTL) is reset to SVHR = 00000 by low voltage detection reset. *2: tCYCP indicates the APB2 bus clock cycle time.

March 31, 2015, MB9A120L_DS706-00064-2v0-E 75 CONFIDENTIAL (2) Interrupt of Low-Voltage Detection (TA = - 40°C to + 105°C) Parameter Symbol Conditions Value Unit Remarks Min Typ Max Detected voltage VDL SVHI = 00011 2.58 2.80 3.02 V When voltage drops Released voltage VDH 2.67 2.90 3.13 V When voltage rises Detected voltage VDL SVHI = 00100 2.76 3.00 3.24 V When voltage drops Released voltage VDH 2.85 3.10 3.35 V When voltage rises Detected voltage VDL SVHI = 00101 2.94 3.20 3.46 V When voltage drops Released voltage VDH 3.04 3.30 3.56 V When voltage rises Detected voltage VDL SVHI = 00110 3.31 3.60 3.89 V When voltage drops Released voltage VDH 3.40 3.70 4.00 V When voltage rises Detected voltage VDL SVHI = 00111 3.40 3.70 4.00 V When voltage drops Released voltage VDH 3.50 3.80 4.10 V When voltage rises Detected voltage VDL SVHI = 01000 3.68 4.00 4.32 V When voltage drops Released voltage VDH 3.77 4.10 4.43 V When voltage rises Detected voltage VDL SVHI = 01001 3.77 4.10 4.43 V When voltage drops Released voltage VDH 3.86 4.20 4.54 V When voltage rises Detected voltage VDL SVHI = 01010 3.86 4.20 4.54 V When voltage drops Released voltage VDH 3.96 4.30 4.64 V When voltage rises LVD stabilization wait time tLVDW - - - 8160 × tCYCP* μs LVD detection delay time tLVDDL - - - 200 μs *: tCYCP indicates the APB2 bus clock cycle time.

76 MB9A120L_DS706-00064-2v0-E, March 31, 2015

1. Flash Memory Write/Erase Characteristics (1) Write / Erase time (VCC = 2.7V to 5.5V, TA = - 40°C to + 105°C) Parameter Value Unit Remarks Typ Max Sector erase time 0.3 0.7 s Includes write time prior to internal erase Half word (16-bit) write time 16 282 μs Not including system-level overhead time Chip erase time 2.4 5.6 s Includes write time prior to internal erase *: The typical value is immediately after shipment, the maximam value is guarantee value under 10,000 cycle of erase/write. (2) Write cycles and data hold time Erase/write cycles (cycle) Data hold time (year) Remarks 1,000 20* 10,000 10* *: At average + 85C

March 31, 2015, MB9A120L_DS706-00064-2v0-E 77 CONFIDENTIAL 9. Return Time from Low-Power Consumption Mode (1) Return Factor: Interrupt The return time from Low-Power consumption mode is indicated as follows. It is from receiving the return factor to starting the program operation. ・ Return Count Time (VCC = 2.7V to 5.5V, TA = - 40°C to + 105°C) Parameter Symbol Value Unit Remarks Typ Max* Sleep mode tICNT tCYCC μs High-speed CR Timer mode, Main Timer mode, PLL Timer mode 43 83 μs Low-speed CR Timer mode 310 620 μs Sub Timer mode 534 724 μs RTC mode, Stop mode 278 479 μs *: The maximum value depends on the accuracy of built-in CR. ・ Operation example of return from Low-Power consumption mode (by external interrupt*) External interrupt tICNT Interrupt factor accept CPU Operation Start Active Interrupt factor clear by CPU *: External interrupt is set to detecting fall edge.

78 MB9A120L_DS706-00064-2v0-E, March 31, 2015

・ Operation example of return from Low-Power consumption mode (by internal resource interrupt*) Internal resource interrupt tICNT Interrupt factor accept CPU Operation Start Active Interrupt factor clear by CPU *: Internal resource interrupt is not included in return factor by the kind of Low-Power consumption mode. Notes: ・ The return factor is different in each Low-Power consumption modes. See Chapter 6: Low Power Consumption Mode and Operations of Standby Modes in FM3 Family Peripheral Manual. ・ When interrupt recoveries, the operation mode that CPU recoveries depends on the state before the Low-Power consumption mode transition. See Chapter 6: Low Power Consumption Mode in FM3 Family Peripheral Manual.

March 31, 2015, MB9A120L_DS706-00064-2v0-E 79 CONFIDENTIAL (2) Return Factor: Reset The return time from Low-Power consumption mode is indicated as follows. It is from releasing rese t to starting the program operation. ・ Return Count Time (VCC = 2.7V to 5.5V, TA = - 40°C to + 105°C) Parameter Symbol Value Unit Remarks Typ Max* Sleep mode tRCNT 149 264 μs High-speed CR Timer mode, Main Timer mode, PLL Timer mode 149 264 μs Low-speed CR Timer mode 318 603 μs Sub Timer mode 308 583 μs RTC/Stop mode 248 443 μs *: The maximum value depends on the accuracy of built-in CR. ・ Operation example of return from Low-Power consumption mode (by INITX) INITX tRCNT Internal reset CPU Operation Start Reset active Release

80 MB9A120L_DS706-00064-2v0-E, March 31, 2015

・ Operation example of return from low power consumption mode (by internal resource reset*) Internal Resource RST Trcnt Internal RST CPU Operation Start RST Active Release *: Internal resource reset is not included in return factor by the kind of Low-Power consumption mode. Notes: ・ The return factor is different in each Low-Power consumption modes. See Chapter 6: Low Power Consumption Mode and Operations of Standby Modes in FM3 Family Peripheral Manual. ・ When interrupt recoveries, the operation mode that CPU recoveries depends on the state before the Low-Power consumption mode transition. See Chapter 6: Low Power Consumption Mode in FM3 Family Peripheral Manual. ・ The time during the power-on reset/low-voltage detection reset is excluded. See (6) Power-on Reset Timing in 4. AC Characteristics in Electrical Characteristics for the detail on the time during the power-on reset/low -voltage detection reset. ・ When in recovery from reset, CPU changes to the high-speed CR run mode. When using the main clock or the PLL clock, it is necessary to add the main clock oscillation stabilization wait time or the main PLL clock stabilization wait time. ・ The internal resource reset means the watchdog reset and the CSV reset.

March 31, 2015, MB9A120L_DS706-00064-2v0-E 81 CONFIDENTIAL  Ordering Information Part number On-chip Flash memory On-chip MB9AF121KWQN-G-JNE2 64 Kbyte 4 Kbyte Plastic・QFN (0.5 mm pitch), 48-pin (LCC-48P-M74) Tray MB9AF121KPMC-G-JNE2 64 Kbyte 4 Kbyte Plastic・LQFP (0.5 mm pitch), 48-pin (FPT-48P-M49) MB9AF121KPMC1-G-JNE2 64 Kbyte 4 Kbyte Plastic・LQFP (0.65 mm pitch), 52-pin (FPT-52P-M02) MB9AF121LPMC1-G-JNE2 64 Kbyte 4 Kbyte Plastic・LQFP (0.5 mm pitch), 64-pin (FPT-64P-M38) MB9AF121LPMC-G-JNE2 64 Kbyte 4 Kbyte Plastic・LQFP (0.65 mm pitch), 64-pin (FPT-64P-M39) MB9AF121LWQN-G-JNE2 64 Kbyte 4 Kbyte Plastic・QFN (0.5 mm pitch), 64-pin (LCC-64P-M25)

82 MB9A120L_DS706-00064-2v0-E, March 31, 2015

 Package Dimensions 64-pin plastic LQFP Lead pitch 0.50 mm Package width × package length 10.00 mm × 10.00 mm Lead shape Gullwing Lead bend direction Normal bend Sealing method Plastic mold Mounting height 1.70 mm MAX Weight 0.32 g 64-pin plastic LQFP (FPT-64P-M38) (FPT-64P-M38) "A" 0.08(.003) 0.145 ± 0.055 (.006 ± .002) INDEX 3348 161

2010 FUJITSU SEMICONDUCTOR LIMITED F64038S-c-1-2

(Stand off) Details of "A" part 0.10 ± 0.10 (.004±.004) 0.60 ± 0.15 0.25(.010) C 0.50±0.20 (.020±.008) (Mounting height) .059–.004 +.008 –0.10 +0.20 1.50 0~8° Dimensions in mm (inches). Note: The values in parentheses are reference values. Note 1) * : These dimensions do not include resin protrusion. Note 2) Pins width and pins thickness include plating thickness. Note 3) Pins width do not include tie bar cutting remainder. (.009±.002) (.024±.006)

March 31, 2015, MB9A120L_DS706-00064-2v0-E 83 CONFIDENTIAL 64-pin plastic LQFP Lead pitch 0.65 mm Package width × package length 12.00 mm × 12.00 mm Lead shape Gullwing Sealing method Plastic mold Mounting height 1.70 mm MAX Weight 0.47 g 64-pin plastic LQFP (FPT-64P-M39) (FPT-64P-M39) "A" 0.10(.004) (.006±. 002) 0.145± 0.055 0.13(.005) M (.013±.002) INDEX 3348 161 2010-2013 FUJITSU SEMICONDUCTOR LIMITED HMbF64-39Sc-4-3 Details of "A" part (.004±.004) 0.10±0.10 (.024±.006) 0.60±0.15 0.25(.010)BSC C .059–.004 +.008 –0.10 +0.20 1.50 0~8˚ (.020±.008) 0.50±0.20 Dimensions in mm (inches). Note: The values in parentheses are reference values. Note 1) * : These dimensions do not include resin protrusion. Note 2) Pins width and pins thickness include plating thickness. Note 3) Pins width do not include tie bar cutting remainder.

84 MB9A120L_DS706-00064-2v0-E, March 31, 2015

48-pin plastic LQFP Lead pitch 0.50 mm Package width × package length 7.00 mm × 7.00 mm Lead shape Gullwing Lead bend direction Normal bend Sealing method Plastic mold Mounting height 1.70 mm MAX Weight 0.17 g 48-pin plastic LQFP (FPT-48P-M49) (FPT-48P-M49) C 2010 FUJITSU SEMICONDUCTOR LIMITED HMbF48-49Sc-1-2 36 25 INDEX 0.145± 0.055 (.006± .002) 0.08(.003) "A" 0°~8° .059–.004 +.008 –0.10 +0.20 1.50 0.60± 0.15 (.024± .006) 0.10± 0.10 (.004± .004) (Stand off) 0.25(.010) Details of "A" part 1 12 0.08(.003) M (.008± .002) (Mounting height) Dimensions in mm (inches). Note: The values in parentheses are reference values. Note 1) * : These dimensions do not include resin protrusion. Note 2) Pins width and pins thickness include plating thickness. Note 3) Pins width do not include tie bar cutting remainder.

March 31, 2015, MB9A120L_DS706-00064-2v0-E 85 CONFIDENTIAL 52-pin plastic LQFP Lead pitch 0.65 mm Package width × package length 10.00 × 10.00 mm Lead shape Gullwing Sealing method Plastic mold Mounting height 1.70 mm MAX Weight 0.32 g Code (Reference) P-LFQFP52-10 × 10-0.65 52-pin plastic LQFP (FPT-52P-M02) (FPT-52P-M02) C 2010 FUJITSU SEMICONDUCTOR LIMITED F52002Sc-2-1 0.65(.026) 0.10(.004) 11 3 2640 2739 INDEX M0.13(.005) 0.145±0.055 (.006±.002) "A" .059–.004 +.008 –0.10 +0.20 1.50 0~8˚ 0.25(.010) (Mounting height) 0.50±0.20 (.020±.008) 0.60±0.15 (.024±.006) 0.10±0.10 (.004±.004) Details of "A" part (Stand off) .012–.0014 +.0026 –0.035 +0.065 0.30 Dimensions in mm (inches). Note: The values in parentheses are reference values Note 1) * : These dimensions do not include resin protrusion. Note 2) Pins width and pins thickness include plating thickness. Note 3) Pins width do not include tie bar cutting remainder.

86 MB9A120L_DS706-00064-2v0-E, March 31, 2015

48-pin plastic QFN Lead pitch 0.50 mm Package width× package length 7.00 mm × 7.00 mm Sealing method Plastic mold Mounting height 0.80 mm MAX Weight 0.12 g 48-pin plastic QFN (LCC-48P-M74) (LCC-48P-M74) C 2013 FUJITSU SEMICONDUCTOR LIMITED HMbC48-74Sc-1-1 4.65±0.15 0.50±0.05 (.020±.002)(TYP) 0.50(.020) 1PIN CORNER C0.30(C.020) (.010 ) 0.25 (.183±.006) 4.65±0.15 (.276±.004) 7.00±0.10 (.030±.002) INDEX AREA (0.20) 0.02 (.276±.004) 7.00±0.10 +0.03 -0.02 +.0012 -.0008 0.75±0.05 ((.008)) (.0008 ) (.183±.006) +0.05 -0.07 +.002 -.003 Dimensions in mm (inches). Note: The values in parentheses are reference values.

March 31, 2015, MB9A120L_DS706-00064-2v0-E 87 CONFIDENTIAL 64-pin plastic QFN Lead pitch 0.50 mm Package width × package length 9.00 mm × 9.00 mm Sealing method Plastic mold Mounting height 0.80 mm MAX Weight 0.21 g 64-pin plastic QFN (LCC-64P-M25) (LCC-64P-M25) C 2013 FUJITSU SEMICONDUCTOR LIMITED HMbC64-25Sc-1-1 7.20±0.15 0.40±0.05 (.016±.002)(TYP) 0.50(.020) 1PIN CORNER C0.50(C.020) (.010±.002) 0.25±0.05 (.283±.006) 7.20±0.15 (.354±.004) 9.00±0.10 (.030±.002) INDEX AREA (0.20) 0.02 (.354±.004) 9.00±0.10 +0.03 -0.02 +.0012 -.0008 0.75±0.05 ((.008)) (.0008 ) (.283±.006) Dimensions in mm (inches). Note: The values in parentheses are reference values.

88 MB9A120L_DS706-00064-2v0-E, March 31, 2015

 Major Changes Page Section Change Results Revision 0.1 - - Initial release Revision 0.2 - - Company name and layout design change Revision 1.0 - - Preliminary → Full Production 2 FEATURES Revised I2C operation mode name 3 FEATURES Revised the value of A/D conversion time 4 FEATURES Revised Channel number of MFT A/D activation compare 6 PRODUCT LINEUP ・Added notes of Built-in high speed CR accuracy ・Revised channel number of MFT A/D activation compare 17 LIST OF PIN FUNCTION ・List of pin numbers Corrected I/O circuit type of P80,P81,P82 29 I/O CIRCUIT TYPE Added the remarks of type L 37 BLOCK DIAGRAM Revised Channel number of MFT A/D activation compare 47 ELECTRICAL CHARACTERISTICS 2. Recommended Operating Conditions Corrected the minimum value of A VRH voltage 48,49 ELECTRICAL CHARACTERISTICS 3.DC Characteristics (1) Current Rating Revised the values of “TBD” ELECTRICAL CHARACTERISTICS 3.DC Characteristics (1) Current Rating ・A/D converter current ・Corrent the pin name of power supply current ・Added the at stop condition of power supply current ・Added the remark of reference power supply current 55 ELECTRICAL CHARACTERISTICS 3.AC Characteristics (6)Power-on Reset Timing  Revised the values of “TBD” 66 ELECTRICAL CHARACTERISTICS 3.AC Characteristics (10) I2C Timing ・Revised I2C operation mode name ・Revised the value of noise filter 68 ELECTRICAL CHARACTERISTICS 5. 12-bit A/D Converter ・Revised the value of zero transition valtage and full-scale transiton valtage ・Revised the value of conversion time, sampling time, compare clock cycle ・Corrected the value of state transition time to operation permission ・Corrected the minimum value of A VRH voltage ・Revised the notes explanation ・Delete (Preliminary value) description 71 ELECTRICAL CHARACTERISTICS 6. 10-bit D/A Converter ・Delete (Preliminary value) description 72,73 ELECTRICAL CHARACTERISTICS 7. Low-V oltage Detection Characteristics ・Corrected the values of SVHR and SVHI 74 ELECTRICAL CHARACTERISTICS 8. Flash Memory Write/Erase Characteristics ・Revised the values of “TBD” ・Revised the values of typical ・Revised the notes of Erase/write cycles and data hold time ・Delete (target value) description 75,77 ELECTRICAL CHARACTERISTICS 9. Return Time from Low-Power Consumption Mode Revised the values of “TBD” 84,85 PACKAGE DIMENSIONS Added the figures of LCC-48P-M74 and LCC-64P-M25 Revision 2.0 26 I/O Circuit Type Added about +B input 39 Memory Map

• Memory map(2) Added the summary of Flash memory sector and the note 46, 47 Electrical Characteristics 1. Absolute Maximum Ratings
• Added the Clamp maximum current
• Added about +B input 48 Electrical Characteristics 2. Recommended Operation Conditions Added the note about less than the minimum power supply voltage 49, 50 Electrical Characteristics 3. DC Characteristics (1) Current rating
• Changed the table format
• Added Main TIMER mode current Electrical Characteristics 4. AC Characteristics (4-1) Operating Conditions of Main PLL (4-2) Operating Conditions of Main PLL Added the figure of Main PLL connection Electrical Characteristics 4. AC Characteristics (6) Power-on Reset Timing Changed the figure of timing 59-66 Electrical Characteristics 4. AC Characteristics (8) CSIO/UART Timing
• Modified from UART Timing to CSIO/UART Timing
• Changed from Internal shift clock operation to Master mode
• Changed from External shift clock operation to Slave mode 70 Electrical Characteristics 5. 12bit A/D Converter Added the typical value of Integral Nonlinearity, Differential Nonlinearity, Zero transition voltage and Full-scale transition voltage

March 31, 2015, MB9A120L_DS706-00064-2v0-E 89 CONFIDENTIAL Page Section Change Results 81 Ordering Information Changed notation of part number

90 MB9A120L_DS706-00064-2v0-E, March 31, 2015

The products described in this document are designed, developed and manufactured as contemplated for general use, including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as contemplated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion will not be liable to you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country, the prior authorization by the respective government entity will be required for export of those products. Trademarks and Notice The contents of this document are subject to change without notice. This document may contain information on a Spansion product under development by Spansion. Spansion reserves the right to change or discontinue work on any product without notice. The information in this document is provided as is without warranty or guarantee of any kind as to its accuracy, completeness, operability, fitness for particular purpose, merchantability, non-infringement of third-party rights, or any other warranty, express, implied, or statutory. Spansion assumes no liability for any damages of any kind arising out of the use of the information in this document. Copyright © 2013-2015 Cypress All rights reserved. Spansion®, the Spansion logo, MirrorBit®, MirrorBit® EclipseTM, ORNANDTM, Easy DesignSimTM, TraveoTM and combinations thereof, are trademarks and registered trademarks of Spansion LLC in the United States and other countries. Other names used are for informational purposes only and may be trademarks of their respective owners.