MB2M MEI | Alldatasheet

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Features

 UL recognized under File #E197450  Glass passivated chip junction  High forward surge current capability  High temperature soldering guaranteed: 260℃/10 seconds  RoHS and REACH Compliance Mechanical Data Case: Transfer molded plastic Polarity Polarity symbols marked on case Terminals: Plated Leads solderable per MIL-STD-750 method 2026 Mounting torque / Mounting position: Any Weight: 0.0078 ounce, 0.22 gram Maximum Ratings (T Ambient=25º C unless noted otherwise) Symbol Description MB2M MB4M MB6M MB8M MB10M Unit Conditions VRRM Max Recurrent Peak Reverse Voltage 200 400 600 800 1000 V VRMS Max RMS Voltage 140 280 420 560 700 V VDC Max DC Blocking Voltage 200 400 600 800 1000 V I(AV) Max Average Forward Rectified Current 0.5/0.8 A @TA=30℃ On Glass-epoxy PCB (note1) On Aluminum substrate (Note2) IFSM Peak Forward Surge Current 30 A 8.3ms single half sine-wave (JEDEC method) TJ,TSTG Operating and Storage Temperature Range -55 to +150 ℃ I2t Rating for Fusing 5 A2s T<8.3mS Electrical Characteristics (T Ambient=25º C unless noted otherwise) Symbol Description MB2M MB4M MB6M MB8M MB10M Unit Conditions VF Max Instantaneous Forward Voltage 1.00 V Drop per Bridge element 0.4A IR Max DC Reverse Current at Rated DC Blocking Voltage 5.0 μA TA=25℃

100 Tc=125℃

Rθ-Ja Typical Thermal Resistance 85 ℃/W Note 1 CJ Typical Junction capacitance per leg 13 pF Measured at 1.0MHz/4.0V Note: 1． On glass epoxy PCB mounted on 0.05” x 0.05” (1.3mm x 1.3mm) copper pads 1.3mm) solder pad

Single Phase Glass Passivated Bridge Rectifier Rev. 0 2010-07-15 MB2M ~ MB10M MEI SEMI www.meisemi.com Page 2 of 3 RATINGS AND CHARACTERISTIC CURVES MB2M THRU MB10M

Single Phase Glass Passivated Bridge Rectifier Rev. 0 2010-07-15 MB2M ~ MB10M MEI SEMI www.meisemi.com Page 3 of 3 Dimensions in inches (mm) Contact us: US HEADQUARTERS MEI SEMI INC.

2902 Corvin Drive, Santa Clara, CA95051, USA

Tel: 1-408-733-0808 Fax: 1-408-733-2828