MB1M YINT | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 3
Technical content
Features
- GlassPassivatedDie Construction
- Low Forward VoltageDrop
- HighCurrentCapability
- HighSurgeCurrentCapability
- DesignedforSurfaceMount Application
- PlasticMaterial–UL Flammability94V-O MechanicalDate
- Case:MBM, MoldedPlastic
- Terminals: Plated Leads Solderable per MIL-STD-202, Method208
- Polarity: AsMarkedonCase
- Weight:0.22grams(approx.)
- Mounting Position:Any
- Marking:TypeNumber
- LeadFree:ForRoHS / Lead FreeVersion MajorRatingsandCharacteristics IO 05 A 08A VRRM 100V to1000V IFSM 30A IR 5 μA VF 1.0V Tj max. 150°C MaximumRatings&ThermalCharacteristics(TA=25°Cunlessotherwisenoted) Single Phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%. Items Symbol MB MB MB MB MB MB 10M UNIT PeakRepetitive ReverseVoltage WorkingPeakReverseVoltage DC BlockingVoltage VRRM VRWM VR 100 200 400 600 800 1000 V RMS ReverseVoltage VR(RMS) 70 140 280 420 560 700 V AverageRectifiedOutput Current (1)@TA = 40°C AverageRectifiedOutput Current (2)@TA = 40°C IO 0.5 0.8 A Non-Repetitive PeakForward SurgeCurrent8.3ms Singlehalfsine-wave superimposedonrated load(JEDECMethod) IFSM 30 A I2T RatingforFusing(t <8.3ms) I2T 5 A2S Thermalresistancefromjunctionto lead(1) RθJL 20 ℃/W Thermalresistancefromjunctionto ambient(1) RθJA 70 ℃/W Operatingjunctionandstoragetemperature range TJ, TSTG -55…150 ℃ Note 1: Mounted on glass epoxy PC board with 1.3mm2 solder pad. Note 2: Mounted on aluminum substrate PC board with 1.3mm2 solder pad. A ll data sheet.com
Trustworthy electronic circuit protection expert MB1M~MB10M www.yint.com.cn Rev:19.32 ElectricalCharacteristics(TA=25°Cunlessotherwisenoted) Items Test conditions Symbol Min Type Max UNIT Instantaneousforward voltage IF=0.5A(3) VF 1 V Reversecurrent VR=VDC TA=25℃ IR μA TA=125℃ 500 Typicaljunctioncapacitance 4.0V ,1MHz CJ 13 pF Note: 3.Pulse test:300μs pulse width,1% duty cycle. CharacteristicsCurves Figure1- OtputCrrentDerating Curves Figure 2-TypicalForward Characteristics(perleg) Figure3- Max. PeakForwardsurge Current(perleg) Figure5–Typical ReverseCharacteristics(perelement) Figure4 -TypicalJunctionCapacitance A ll data sheet.com
Trustworthy electronic circuit protection expert MB1M~MB10M www.yint.com.cn Rev:19.33 ACKAGEOUTLINEDIMENSIONS Disclaimer Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. DIM MIN MAX DIM MIN MAX A 3.65 (0.144) 4.10 (0.161) G 2.30 (0.091) 2.70 (0.106) B 4.95 (0.195) 5.21 (0.205) H 2.54 (0.100) C 0 10° J 0 43 (0 017) 0 74 (0 029) D 0.15 (0.006) 0.41 (0.016) K 2.41 (0.095) 2.67 (0.105) E 4.50 (0.177) 4.95 (0.195) A ll data sheet.com