MB05F GXELECTRONICS | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 2
Technical content
Features
- Low profile space
- Ideal for automated placement
- Glass passivated chip junction
- Low forward voltage drop
- Low leakage current
- High forward surge capability
- High temperature soldering： 260℃/10 seconds at terminals
- Component in accordance to RoHS 2002/95/1 and WEEE 2002/96/EC Mechanical Date
- Case: MBF Molded plastic over glass passivated chip
- Terminals: Solder plated, solderable per J-STD-002B and JESD22-B102D
- Polarity: Polarity symbols marked on body Maximum Ratings & Thermal Characteristics & Electrical Characteristics (TA = 25 °C unless otherwise noted) Symbol MB05FMB1FMB2FMB4FMB6FMB8F MB10F UNIT VRRM 50 100 200 400 600 800 1000 V VRMS 35 70 140 280 420 560 700 V VDC 50 100 200 400 600 800 1000 V Maximum average forward output rectified current at TA=30℃ -on glass-epoxy P.C.B(NOTE 1) -on aluminum substrate(NOTE 2) IFSM A VF V IR μA CJ p F (NOTE 1) RθJA (NOTE 2) RθJA (NOTE 1) RθJL TJ, TSTG ℃ on 0.05×0.05″(1.3×1.3mm) solder pad ℃/ W A0.5 0.8 5.0 100 –55 to +150 Maximum DC blocking voltage Operating junction and storage temperature range Typical junction capacitance per leg at 4.0 V ,1MHz Maximum instantaneous forwad voltage drop per leg at 0.4A Thermal resistance per leg Peak forward surge current 8.3 ms single half sine-wave superimposed on rated load(JEDEC Method) IF(AV) Maximum DC reverse current at rated DC blocking voltage per leg TA = 25 ℃ TA = 125℃ Maximum RMS voltage IF(AV) 0.5A , 0.8A VRRM IFSM 35 A IR 5.0 μA 50-1000V 1.0V Maximum repetitive peak reverse voltage VF Tj max. 150 °C 星合电子 XINGHE ELECTRONICS GAOMI XINGHE ELECTRONICS CO.,LTD. WWW.SDDZG.COM
Characteristic Curves (TA=25 ℃ unless otherwise noted) GAOMI XINGHE ELECTRONICS CO.,LTD. WWW.SDDZG.COM MB05F~MB10F Miniature Glass Passivated Single-Phase Surface Mount Flat Bridge Rectifier 星合电子 XINGHE ELECTRONICS