MB4F_15 BILIN | Alldatasheet

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Technical content

S I L I C O N B R I D G E R E C T I F I E R S MB4F--MB10F D o c u m e n t N u m b e r : M B F 7 0 1 A A w w w . g m i c r o e l e c . c o m

FEATURES

z Glass ：passivated chip junctions z High surge overload rating: 30A peak z Saves space on printed circuit boards z High temperature soldering guaranteed: 260° C/10 seconds at 5 lbs. (2.3kg) tension MECHANICAL DATA z Case: Molded plastic body over passivated junctions z Terminals: Plated leads solderable per MIL-STD-750, Method 2026 Maximum Ratings (@TA = 25°C unless otherwise specified) Characteristic Symbol MB4F MB6F MB8F MB10F UNITS Peak Repetitive Reverse Voltage V RRM 400 600 800 1000 V RMS Reverse Voltage V RMS 280 420 560 700 V DC Blocking Voltage V DC 400 600 800 1000 V Maximum average forward Output current @TA=25℃ IF(AV) 0.8 A Peak forward surge current 8.3ms single half-sine-wave superimposed on rated load I FSM 30 A Thermal Characteristics Characteristic Symbol MB4F MB6F MB8F MB10F UNITS Typical junction capacitance per leg (NOTE 1) C J 8 p F Operating junction temperature range T J - 55 ---- + 150 ℃ Storage temperature range T STG - 55 ---- + 150 ℃ Electrical Characteristics (@TA = 25°C unless otherwise specified) Characteristic Symbol MB4F MB6F MB8F MB10F UNITS Maximum instantaneous forward voltage at 0.4 A VF 1.0 V Maximum reverse current @TA=25℃ at rated DC blocking voltage @TA=100℃ IR 5 . 0 0.1 μ A m A NOTES: (1) Measured at 1.0 MHz and applied reverse voltage of 4.0 Volts Pb Lead-free

S I L I C O N B R I D G E R E C T I F I E R S MB4F--MB10F D o c u m e n t N u m b e r : M B F 7 0 1 A A w w w . g m i c r o e l e c . c o m PACKAGE OUTLINE DIMENSIONS

PACKAGE INFORMATION

MB4F--MB10F MBF 5000/Tape&Reel MBF Dim Min Max A 4.6 5 B 4.4 4.8 C 1.1 1.3 D 5.4 5.8 E 0.15 0.25 F 0.7 1.1 I 0.5 0.8 K 2.35 2.65 All Dimensions in mm

S I L I C O N B R I D G E R E C T I F I E R S MB4F--MB10F D o c u m e n t N u m b e r : M B F 7 0 1 A A w w w . g m i c r o e l e c . c o m