MB3221I

MAX3221_V01 TI | Alldatasheet

Document overview

Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
PDF pages: 27

Technical content

MAX3221 3-V to 5.5-V RS-232 Line Driver and Receiver With ±15-kV ESD Protection

1 Features

RS-232 Bus-pin ESD protection exceeds ±15 kV using human body model (HBM)
Meets or exceeds the requirements of TIA/EIA-232-F and ITU V.28 standards
Operates with 3-V to 5.5-V VCC supply
Operates up to 250 kbps
One driver and one receiver
Low standby current: 1 μA typical
External capacitors: 4 × 0.1 μF
Accepts 5-V logic input with 3.3-V supply
Alternative high-speed pin-compatible device (1 Mbps) – SNx5C3221
Automatic power-down feature automatically disables drivers for power savings

2 Applications

Industrial PCs
Wired networking
Data center and enterprise computing
Battery-powered systems
PDAs
Notebooks
Laptops
Palmtop PCs
Hand-held equipment

3 Description

The MAX3221 device consists of one line driver, one line receiver with dedicated enable pin, and a dual charge-pump circuit with ±15-kV ESD protection pin to pin (serial-port connection pins, including GND). The device meets the requirements of TIA/EIA-232- F and provides the electrical interface between an asynchronous communication controller and the serial-port connector. The charge pump and four small external capacitors allow operation from a single 3-V to 5.5-V supply. These devices operate at data signaling rates up to 250 kbps and a maximum of 30-V/μs driver output slew rate. Flexible control options for power management are available when the serial port is inactive. The automatic power-down feature functions when FORCEON is low and FORCEOFF is high. During this mode of operation, if the device does not sense a valid RS-232 signal on the receiver input, the driver output is disabled and the supply current is reduced to 1 μA. The INVALID output notifies the user if an RS-232 signal is present at the receiver input. Device Information PART NUMBER PACKAGE(1) BODY SIZE (NOM) MAX3221 SSOP (DB) (32) 6.20 mm × 5.30 mm TSSOP (PW) (32) 5.00 mm × 4.40 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. spacer RX TX POWER APD EN [RX] DIN ROUT DOUT RS232 RIN RS232 1 1 1 1 FORCEON FORCEOFF ST A TUSINV ALID

3.3 V , 5 V

SLLS348P – JUNE 1999 – REVISED JULY 2021 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.

13 Mechanical, Packaging, and Orderable

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision O (June 2015) to Revision P (July 2021) Page Changes from Revision N (January 2014) to Revision O (June 2015) Page

Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information Changes from Revision M (March 2004) to Revision N (January 2013) Page MAX3221 SLLS348P – JUNE 1999 – REVISED JULY 2021 www.ti.com

2 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated

Product Folder Links: MAX3221

5 Pin Configuration and Functions

C1− C2+ C2− RIN FORCEOFF VCC GND DOUT FORCEON DIN INV ALID ROUT Figure 5-1. DB or PW Package, 16-Pin SSOP or TSSOP, Top View Table 5-1. Pin Functions PIN I/O DESCRIPTION NAME NO. C1+ 2 — Positive terminals of the voltage-doubler charge-pump capacitors C2+ 5 C1– 4 — Negative terminals of the voltage-doubler charge-pump capacitors C2– 6 DIN 11 I Driver input DOUT 13 O RS-232 driver output EN 1 I Low input enables receiver ROUT output. High input sets ROUT to high impedance. FORCEOFF 16 I Automatic power-down control input FORCEON 12 I Automatic power-down control input GND 14 — Ground INVALID 10 O Invalid output pin. Output low when all RIN inputs are unpowered. RIN 8 I RS-232 receiver input ROUT 9 O Receiver output VCC 15 — 3-V to 5.5-V supply voltage V+ 3 O 5.5-V supply generated by the charge pump V– 7 O –5.5-V supply generated by the charge pump www.ti.com MAX3221 SLLS348P – JUNE 1999 – REVISED JULY 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 3 Product Folder Links: MAX3221

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1) MIN MAX UNIT VCC to GND –0.3 6 V V+ to GND –0.3 7 V– to GND 0.3 –7 V+ + |V–|(2) 13 VI Input voltage DIN, EN, FORCEOFF , and FORCEON to GND –0.3 6 V RIN to GND ±25 VO Output voltage DOUT to GND ±13.2 V ROUT to GND –0.3 VCC + 0.3 TJ Junction temperature(3) 150 Tstg Storage temperature range –65 150 (1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime. (2) V+ and V– can have maximum magnitudes of 7 V, but their absolute difference cannot exceed 13 V. (3) Maximum power dissipation is a function of TJ(max), RθJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA) / RθJA. Operating at the absolute maximum TJ of 150°C can affect reliability.

6.2 ESD Ratings

V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ ESDA/JEDEC JS-001(1) All pins except 8, 13 ±3000 VPins 8, 13 ±15,000 Charged-device model (CDM), per JEDEC specification JESD22- C101(2) ±1500 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

(see Figure 9-1)(1) MIN NOM MAX UNIT Supply voltage VCC = 3.3 V 3 3.3 3.6 V VCC = 5 V 4.5 5 5.5 VIH Driver high-level input voltage DIN, FORCEOFF, FORCEON, EN VCC = 3.3 V 2 V VCC = 5 V 2.4 VIL Driver low-level input voltage DIN, FORCEOFF, FORCEON, EN 0.8 V VI Driver input voltage DIN, FORCEOFF, FORCEON, EN 0 5.5 V Receiver input voltage –25 25 TA Operating free-air temperature MAX3221C 0 70 MAX3221I –40 85 MAX3221 SLLS348P – JUNE 1999 – REVISED JULY 2021 www.ti.com

4 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated

Product Folder Links: MAX3221

6.4 Thermal Information

THERMAL METRIC(1) MAX3221 UNITDB (SSOP) PW (TSSOP)

16 PINS 16 PINS

RθJA Junction-to-ambient thermal resistance 105.8 110.9 °C/W RθJC(top) Junction-to-case (top) thermal resistance 51.9 41.7 °C/W RθJB Junction-to-board thermal resistance 57.6 57.2 °C/W ψJT Junction-to-top characterization parameter 14.1 4.2 °C/W ψJB Junction-to-board characterization parameter 56.8 56.6 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics – Power

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(2) PARAMETER TEST CONDITIONS MIN TYP(1) MAX UNIT II Input leakage current FORCEOFF, FORCEON, EN ±0.01 ±1 µA ICC Supply current Automatic power-down disabled No load, VCC = 3.3 V to 5 V No load, FORCEOFF and FORCEON at VCC 0.3 1 mA Powered off No load, FORCEOFF at GND 1 10 µA Automatic power-down enabled No load, FORCEOFF at VCC, FORCEON at GND, All RIN are open or grounded 1 10 (1) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.

6.6 Electrical Characteristics – Driver

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(3) PARAMETER TEST CONDITIONS MIN TYP(1) MAX UNIT VOH High-level output voltage DOUT at RL = 3 kΩ to GND, DIN = GND 5 5.4 V VOL Low-level output voltage DOUT at RL = 3 kΩ to GND, DIN = VCC –5 –5.4 V IIH High-level input current VI = VCC ±0.01 ±1 μA IIL Low-level input current VI at GND ±0.01 ±1 μA IOS Short-circuit output current(2) VCC = 3.6 V VO = 0 V ±35 ±60 mA VCC = 5.5 V VO = 0 V ±35 ±60 rO Output resistance VCC, V+, and V– = 0 V VO = ±2 V 300 10M Ω Ioff Output leakage current FORCEOFF = GND VO = ±12 V, VCC = 3 V to 3.6 V ±25 µA VO = ±12 V, VCC = 4.5 V to 5.5 V ±25 (1) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. (2) Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one output should be shorted at a time. www.ti.com MAX3221 SLLS348P – JUNE 1999 – REVISED JULY 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 5 Product Folder Links: MAX3221

6.7 Electrical Characteristics – Receiver

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(2) PARAMETER TEST CONDITIONS MIN TYP(1) MAX UNIT VOH High-level output voltage IOH = –1 mA VCC – 0.6 VCC – 0.1 V VOL Low-level output voltage IOL = 1.6 mA 0.4 V VIT+ Positive-going input threshold voltage VCC = 3.3 V 1.5 2.4 V VCC = 5 V 1.8 2.4 VIT– Negative-going input threshold voltage VCC = 3.3 V 0.6 1.1 V VCC = 5 V 0.8 1.4 Vhys Input hysteresis (VIT+ – VIT–) 0.5 V Ioff Output leakage current FORCEOFF = 0 V ±0.05 ±10 µA ri Input resistance VI = ±3 V to ±25 V 3 5 7 kΩ (1) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.

6.8 Electrical Characteristics – Status

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(2) PARAMETER TEST CONDITIONS MIN TYP(1) MAX UNIT VT+(valid) Receiver input threshold for INVALID high- level output voltage FORCEON = GND, FORCEOFF = VCC 2.7 V VT–(valid) Receiver input threshold for INVALID high- level output voltage FORCEON = GND, FORCEOFF = VCC –2.7 V VT(invalid) Receiver input threshold for INVALID low- level output voltage FORCEON = GND, FORCEOFF = VCC –0.3 0.3 V VOH INVALID high-level output voltage IOH = –1 mA, FORCEON = GND, FORCEOFF = VCC VCC – 0.6 V VOL INVALID low-level output voltage IOH = –1 mA, FORCEON = GND, FORCEOFF = VCC 0.4 V (1) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.

6.9 Switching Characteristics – Driver

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(3) PARAMETER TEST CONDITIONS MIN TYP(1) MAX UNIT Maximum data rate CL = 1000 pF, RL = 3 kΩ, see Figure 7-1 150 250 kbps tsk(p) Pulse skew(2) CL = 150 to 2500 pF, RL = 3 kΩ to 7 kΩ, see Figure 7-2 100 ns SR(tr) Slew rate, transition region (see Figure 7-1) VCC = 3.3 V, RL = 3 kΩ to 7 kΩ CL = 150 to 1000 pF 6 30 V/μs CL = 150 to 2500 pF 4 30 (1) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. (2) Pulse skew is defined as |tPLH − tPHL| of each channel of the same device. MAX3221 SLLS348P – JUNE 1999 – REVISED JULY 2021 www.ti.com

6 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated

Product Folder Links: MAX3221

6.10 Switching Characteristics – Receiver

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(3) PARAMETER TEST CONDITIONS MIN TYP(1) MAX UNIT tPLH Propagation delay time, low- to high-level output CL = 150 pF, see Figure 7-3 150 ns tPHL Propagation delay time, high- to low-level output CL = 150 pF, see Figure 7-3 150 ns ten Output enable time CL = 150 pF, RL = 3 kΩ, see Figure 7-4 200 ns tdis Output disable time CL = 150 pF, RL = 3 kΩ, see Figure 7-4 200 ns tsk(p) Pulse skew(2) See Figure 7-3 50 ns (1) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. (2) Pulse skew is defined as |tPLH − tPHL| of each channel of the same device.

6.11 Switching Characteristics – Status

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(2) PARAMETER MIN TYP(1) MAX UNIT tvalid Propagation delay time, low- to high-level output 1 µs tinvalid Propagation delay time, high- to low-level output 30 µs ten Supply enable time 100 µs (1) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.

6.12 Typical Characteristics

VCC = 3.3 V 0 5 10 15 20 25 DOUT Voltage (V) DOUT Current (mA) VOH C001 Figure 6-1. DOUT VOH vs Load Current 0 5 10 15 20 25 DOUT Voltage (V) DOUT Current (mA) VOL C001 Figure 6-2. DOUT VOL vs Load Current www.ti.com MAX3221 SLLS348P – JUNE 1999 – REVISED JULY 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 7 Product Folder Links: MAX3221

7 Parameter Measurement Information

50 Ω TEST CIRCUIT VOLTAGE WAVEFORMS −3 V−3 V

3 V3 V

(see Note B) RL 3 V FORCEOFF RS-232 Output tTHLCL (see Note A) SR(tr) = 6 V tTHL or tTLH A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: PRR = 250 kbps, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Figure 7-1. Driver Slew Rate 50 Ω TEST CIRCUIT VOLTAGE WAVEFORMS 0 V 3 V Output Input VOL VOH tPLH Generator (see Note B) RL 3 V FORCEOFF RS-232 Output tPHLCL (see Note A) 50% 50% 1.5 V 1.5 V A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: PRR = 250 kbps, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Figure 7-2. Driver Pulse Skew TEST CIRCUIT VOLTAGE WAVEFORMS 50 Ω −3 V 3 V Output Input VOL VOH tPHLGenerator (see Note B) tPLH Output CL (see Note A)

3 V or 0 V

1.5 V 1.5 V 50% 50% A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Figure 7-3. Receiver Propagation Delay Times MAX3221 SLLS348P – JUNE 1999 – REVISED JULY 2021 www.ti.com

8 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated

Product Folder Links: MAX3221

TEST CIRCUIT VOLTAGE WAVEFORMS 50 ΩGenerator (see Note B) (S1 at GND) 3 V 0 V 0.3 V Output Input 0.3 V 1.5 V 1.5 V 50% tPHZ (S1 at GND) tPLZ (S1 at VCC) 50% tPZL (S1 at VCC) RL VCC GND CL (see Note A) Output A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. C. tPLZ and tPHZ are the same as tdis. D. tPZL and tPZH are the same as ten. Figure 7-4. Receiver Enable and Disable Times www.ti.com MAX3221 SLLS348P – JUNE 1999 – REVISED JULY 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 9 Product Folder Links: MAX3221

50 ΩGenerator (see Note B) FORCEOFF ROUT FORCEON Auto- powerdown INVALID DOUTDIN CL = 30 pF (see Note A) 2.7 V −2.7 V 0.3 V −0.3 V 0 V Valid RS-232 Level, INVALIDHigh Indeterminate Indeterminate If Signal Remains Within This Region For More Than 30 µs, INVALID Is Low† Valid RS-232 Level, INVALIDHigh † Auto-powerdown disables drivers and reduces supply current to 1 µA. VOLTAGE WAVEFORMS 3 V2.7 V −2.7 V INVALID Output Receiver Input tvalid 0 V 0 V −3 V VCC 0 V ≈ V+ 0 V ≈ V− VCC ten 50% VCC 50% VCC 2.7 V −2.7 V 0.3 V 0.3 V tinvalid Supply Voltages Figure 7-5. INVALID Propagation Delay Times and Driver Enabling Time MAX3221 SLLS348P – JUNE 1999 – REVISED JULY 2021 www.ti.com

10 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated

Product Folder Links: MAX3221

8 Detailed Description

8.1 Overview

The MAX3221 device is a one-driver and one-receiver RS-232 interface device. All RS-232 inputs and outputs are protected to ±15 kV using the Human Body Model. The charge pump requires only four small 0.1- μF capacitors for operation from a 3.3-V supply. The MAX3221 is capable of running at data rates up to 250 kbps, while maintaining RS-232-compliant output levels. Automatic power-down can be disabled when FORCEON and FORCEOFF are high. With automatic power- down plus enabled, the device activates automatically when a valid signal is applied to any receiver input. The device can automatically power down the driver to save power when the RIN input is unpowered. INVALID is high (valid data) if receiver input voltage is greater than 2.7 V or less than –2.7 V, or has been between –0.3 V and 0.3 V for less than 30 μs. INVALID is low (invalid data) if receiver input voltages are between –0.3 V and 0.3 V for more than 30 μs. Refer to Figure 7-5 for receiver input levels.

8.2 Functional Block Diagram

EN [RX] DIN ROUT DOUT RS232 RIN RS232 1 1 1 1 FORCEON FORCEOFF STATUSINVALID 3.3V, 5V

8.3 Feature Description

8.3.1 Power

The power block increases, inverts, and regulates voltage at V+ and V- pins using a charge pump that requires four external capacitors. Auto-power-down feature for driver is controlled by FORCEON and FORCEOFF inputs. Receiver is controlled by EN input. See Table 8-1 and Table 8-2 When MAX3221 is unpowered, it can be safely connected to an active remote RS232 device.

8.3.2 RS232 Driver

One driver interfaces standard logic level to RS232 levels. DIN input must be valid high or low.

8.3.3 RS232 Receiver

One receiver interfaces RS232 levels to standard logic levels. An open input will result in a high output on ROUT. RIN input includes an internal standard RS232 load. A logic high input on the EN pin will shutdown the receiver output.

8.3.4 RS232 Status

The INVALID output goes low when RIN input is unpowered for more than 30 μs. The INVALID output goes high when receiver has a valid input. The INVALID output is active when V cc is powered irregardless of FORCEON and FORCEOFF inputs (see Table 8-3). www.ti.com MAX3221 SLLS348P – JUNE 1999 – REVISED JULY 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 11 Product Folder Links: MAX3221

8.4 Device Functional Modes

Table 8-1, Table 8-2, and Table 8-3 show the behavior of the driver, receiver, and INVALID(activelow) features under all possible relevant combinations of inputs. Table 8-1. Driver(1) INPUTS OUTPUT DRIVER STATUS DIN FORCEON FORCEOFF VALID RIN RS-232 LEVEL DOUT X X L X Z Powered off L H H X H Normal operation with automatic power down disabledH H H X L L L H Yes H Normal operation with automatic power down enabledH L H Yes L L L H No Z Powered off by automatic power down featureH L H No Z (1) H = high level, L = low level, X = irrelevant, Z = high impedance, Yes = |RIN| > 2.7 V, No = |RIN| <0.3 V Table 8-2. Receiver(1) INPUTS OUTPUT RECEIVER STATUS RIN EN VALID RIN RS-232 LEVEL ROUT X H X Z Output off L L X H Normal operationH L X L Open L No H (1) H = high level, L = low level, X = irrelevant, Z = high impedance (off), Open = input disconnected or connected driver off Table 8-3. INVALID (1) INPUTS OUTPUT RIN FORCEON FORCEOFF EN INVALID L X X X H H X X X H Open X X X L (1) H = high level, L = low level, X = irrelevant, Z = high impedance (off), Open = input disconnected or connected driver off DIN DOUT Auto-powerdown INV ALID RIN FORCEOFF FORCEON ROUT EN 1 1 Figure 8-1. Logic Diagram MAX3221 SLLS348P – JUNE 1999 – REVISED JULY 2021 www.ti.com

12 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated

Product Folder Links: MAX3221

9 Application and Implementation

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes, as well as validating and testing their design implementation to confirm system functionality.

9.1 Application Information

The MAX3221 line driver and receiver is a specialized device for 3-V to 5.5-V RS-232 communication applications. This application is a generic implementation of this device with all required external components. For proper operation, add capacitors as shown in Figure 9-1.

9.2 Typical Application

ROUT and DIN connect to UART or general purpose logic lines. FORCEON and FORCEOFF may be connected general purpose logic lines or tied to ground or V CC. INVALID may be connected to a general purpose logic line or left unconnected. RIN and DOUT lines connect to a RS232 connector or cable. DIN, FORCEON, and FORCEOFF inputs must not be left unconnected. CBYPASS = 0.1 µF Auto- powerdown VCC C1 C2, C3, and C4 3.3 V ± 0.3 V 5 V ± 0.5 V 3 V to 5.5 V 0.1 µF 0.047 µF 0.1 µF 0.1 µF 0.33 µF 0.47 µF VCC vs CAPACITOR VALUES FORCEOFF VCC GND C1+ C2+ C1− C2− DOUT FORCEON DIN INVALID ROUT EN RIN 5 kΩ C3† † C3 can be connected to VCC or GND. NOTES: A. Resistor values shown are nominal. B. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be connected as shown. Figure 9-1. Typical Operating Circuit and Capacitor Values www.ti.com MAX3221 SLLS348P – JUNE 1999 – REVISED JULY 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 13 Product Folder Links: MAX3221

9.2.1 Design Requirements

Recommended VCC is 3.3 V or 5 V. – 3 V to 5.5 V is also possible
Maximum recommended bit rate is 250 kbps.
Use capacitors as shown in Figure 9-1.

9.2.2 Detailed Design Procedure

DIN, FORCEOFF and FORCEON inputs must be connected to valid low or high logic levels.
Select capacitor values based on VCC level for best performance.

9.2.3 Application Curve

Curves for VCC of 3.3 V and 250 kbps alternative bit data stream. 0 1 2 3 4 5 6 7 8 9 10 Voltage (V) Time ( DIN DOUT to RIN ROUT C001 Figure 9-2. 250-kbps Driver to Receiver Loopback Timing Waveform, VCC = 3.3 V

10 Power Supply Recommendations

TI recommends a 0.1-μF capacitor to filter noise on the power supply pin. For additional filter capability, a 0.01-μF capacitor may be added in parallel as well. Power supply input voltage is recommended to be any valid level in Recommended Operating Conditions. MAX3221 SLLS348P – JUNE 1999 – REVISED JULY 2021 www.ti.com

14 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated

Product Folder Links: MAX3221

11 Layout

11.1 Layout Guidelines

Keep the external capacitor traces short. This is more important on C1 and C2 nodes that have the fastest rise and fall times.

11.2 Layout Example

12 Device and Documentation Support

12.1 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

12.2 Trademarks

TI E2E™ is a trademark of Texas Instruments. All trademarks are the property of their respective owners.

12.3 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

12.4 Glossary

TI Glossary This glossary lists and explains terms, acronyms, and definitions.

13 Mechanical, Packaging, and Orderable Information

The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser based versions of this data sheet, refer to the left hand navigation. MAX3221 SLLS348P – JUNE 1999 – REVISED JULY 2021 www.ti.com

Product Folder Links: MAX3221

www.ti.com 22-Jul-2023 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead finish/ Ball material (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples MAX3221CDBR ACTIVE SSOP DB 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 MA3221C Samples MAX3221CDBRG4 ACTIVE SSOP DB 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 MA3221C Samples MAX3221CPWR ACTIVE TSSOP PW 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 MA3221C Samples MAX3221CPWRE4 ACTIVE TSSOP PW 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 MA3221C Samples MAX3221CPWRG4 ACTIVE TSSOP PW 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 MA3221C Samples MAX3221IDBR ACTIVE SSOP DB 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 MB3221I Samples MAX3221IDBRE4 ACTIVE SSOP DB 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 MB3221I Samples MAX3221IDBRG4 ACTIVE SSOP DB 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 MB3221I Samples MAX3221IPWR ACTIVE TSSOP PW 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 MB3221I Samples MAX3221IPWRG4 ACTIVE TSSOP PW 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 MB3221I Samples (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. Addendum-Page 1

www.ti.com 22-Jul-2023 (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF MAX3221 :

Enhanced Product : MAX3221-EP NOTE: Qualified Version Definitions:
Enhanced Product - Supports Defense, Aerospace and Medical Applications Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 22-Jul-2023 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION www.ti.com 22-Jul-2023 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) MAX3221CDBR SSOP DB 16 2000 356.0 356.0 35.0 MAX3221CPWR TSSOP PW 16 2000 356.0 356.0 35.0 MAX3221CPWR TSSOP PW 16 2000 356.0 356.0 35.0 MAX3221IDBR SSOP DB 16 2000 356.0 356.0 35.0 MAX3221IPWR TSSOP PW 16 2000 356.0 356.0 35.0 MAX3221IPWR TSSOP PW 16 2000 356.0 356.0 35.0 MAX3221IPWRG4 TSSOP PW 16 2000 356.0 356.0 35.0 MAX3221IPWRG4 TSSOP PW 16 2000 356.0 356.0 35.0 Pack Materials-Page 2

www.ti.com PACKAGE OUTLINE C 14X 0.65 4.55 16X 0.30 0.19 TYP6.6 6.2

1.2 MAX

0.15 0.05 0.25 GAGE PLANE -80 B NOTE 4 4.5 4.3 A NOTE 3 5.1 4.9 0.75 0.50 (0.15) TYP TSSOP - 1.2 mm max heightPW0016A SMALL OUTLINE PACKAGE 4220204/A 02/2017

0.1 C A B

0.1 C NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side. 5. Reference JEDEC registration MO-153. SEATING PLANE A 20 DETAIL A TYPICAL SCALE 2.500

www.ti.com EXAMPLE BOARD LAYOUT

0.05 MAX

0.05 MIN

16X (1.5) 16X (0.45) 14X (0.65) (5.8) (R0.05) TYP TSSOP - 1.2 mm max heightPW0016A SMALL OUTLINE PACKAGE 4220204/A 02/2017 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 10X SYMM SYMM 8 9 15.000 METALSOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK OPENING EXPOSED METALEXPOSED METAL SOLDER MASK DETAILS NON-SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED

www.ti.com EXAMPLE STENCIL DESIGN 16X (1.5) 16X (0.45) 14X (0.65) (5.8) (R0.05) TYP TSSOP - 1.2 mm max heightPW0016A SMALL OUTLINE PACKAGE 4220204/A 02/2017 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE: 10X SYMM SYMM 8 9

www.ti.com PACKAGE OUTLINE C 14X 0.65 4.55 16X 0.38 0.22 8.2

7.4 TYP

0.25 GAGE PLANE 0 -8

2 MAX

0.25 0.09 B 5.6 5.0 NOTE 4 A 6.5 5.9 NOTE 3 0.95 0.55 SSOP - 2 mm max heightDB0016A SMALL OUTLINE PACKAGE 4220763/A 05/2022 0.1 C NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. Reference JEDEC registration MO-150. A 15 DETAIL A TYPICAL SCALE 1.500

www.ti.com EXAMPLE BOARD LAYOUT 16X (1.85) 16X (0.45) 14X (0.65) (7) (R0.05) TYP SSOP - 2 mm max heightDB0016A SMALL OUTLINE PACKAGE 4220763/A 05/2022 NOTES: (continued) 5. Publication IPC-7351 may have alternate designs. 6. Solder mask tolerances between and around signal pads can vary based on board fabrication site. LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 10X SYMM SYMM 8 9 15.000 METALSOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK OPENING EXPOSED METALEXPOSED METAL SOLDER MASK DETAILS NON-SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED

www.ti.com EXAMPLE STENCIL DESIGN 16X (1.85) 16X (0.45) 14X (0.65) (7) (R0.05) TYP SSOP - 2 mm max heightDB0016A SMALL OUTLINE PACKAGE 4220763/A 05/2022 NOTES: (continued) 7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 8. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE: 10X SYMM SYMM 8 9

IMPORTANT NOTICE AND DISCLAIMER TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, regulatory or other requirements. These resources are subject to change without notice. TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these resources. TI’s products are provided subject to TI’s Terms of Sale or other applicable terms available either on ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for TI products. TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2023, Texas Instruments Incorporated

Summary

MAX3221 3-V to 5.5-V RS-232 Line Driver and Receiver With ±15-kV ESD Protection REVISED JULY 2021

Description

MAX3221 3-V to 5.5-V RS-232 Line Driver and Receiver With ±15-kV ESD Protection REVISED JULY 2021

Source title MB3221I Datasheet(PDF) - Texas Instruments

Read MB3221I online.

MAX3221_V01 TI | Alldatasheet

Document overview

Technical content

1 Features

2 Applications

3 Description

3.3 V , 5 V

13 Mechanical, Packaging, and Orderable

4 Revision History

2 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated

5 Pin Configuration and Functions

6 Specifications

6.1 Absolute Maximum Ratings

6.2 ESD Ratings

6.3 Recommended Operating Conditions

4 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated

6.4 Thermal Information

16 PINS 16 PINS

6.5 Electrical Characteristics – Power

6.6 Electrical Characteristics – Driver

6.7 Electrical Characteristics – Receiver

6.8 Electrical Characteristics – Status

6.9 Switching Characteristics – Driver

6 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated

6.10 Switching Characteristics – Receiver

6.11 Switching Characteristics – Status

6.12 Typical Characteristics

7 Parameter Measurement Information

3 V3 V

3 V or 0 V

8 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated

10 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated

8 Detailed Description

8.1 Overview

8.2 Functional Block Diagram

8.3 Feature Description

8.3.1 Power

8.3.2 RS232 Driver

8.3.3 RS232 Receiver

8.3.4 RS232 Status

8.4 Device Functional Modes

12 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated

9 Application and Implementation

9.1 Application Information

9.2 Typical Application

9.2.1 Design Requirements

9.2.2 Detailed Design Procedure

9.2.3 Application Curve

10 Power Supply Recommendations

14 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated

11 Layout

11.1 Layout Guidelines

11.2 Layout Example

12 Device and Documentation Support

12.1 Support Resources

12.2 Trademarks

12.3 Electrostatic Discharge Caution

12.4 Glossary

13 Mechanical, Packaging, and Orderable Information

16 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated

1.2 MAX

0.1 C A B

0.05 MAX

0.05 MIN

7.4 TYP

2 MAX

MB3221I specifications and overview.

More parts from the same family.