MB2623 PHILIPS | Alldatasheet
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Technical content
/C0109 /C0110 /C0114 MB2623 16-bit transceiver with dual enable, non-inverting (3-State) Product specification Supersedes data of 1993 Aug 24 IC23 Data Handbook
1998 Jan 16
Philips Semiconductors Product specification MB262316-bit transceiver with dual enable, non-inverting (3-State)
21998 Jan 16 853–1575 18869
FEATURES
- Two 8-bit bidirectional bus interfaces
- 3-State buffers
- Power-up 3-State
- Multiple VCC and GND pins minimize switching noise
- Output capability: +64mA/–32mA
- Latch-up protection exceeds 500mA per Jedec Std 17
- ESD protection exceeds 2000 V per MIL STD 883 Method 3015 and 200 V per Machine Model
- Inputs are disabled during 3-State mode
DESCRIPTION
The MB2623 high-performance BiCMOS device combines low static and dynamic power dissipation with high speed and high output drive. The MB2623 is a 16-bit transceiver featuring non-inverting 3-State bus compatible outputs in both send and receive directions. The MB2623 is designed for asynchronous two-way communication between data buses. The control function implementation allows for maximum flexibility in timing. This device allows data transmission from the A bus to the B bus or from the B bus to the A bus, depending upon the logic levels at the Enable inputs (nOEBA and nOEAB). The Enable inputs can be used to disable the device so that the buses are effectively isolated. QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS Tamb = 25°C; GND = 0V TYPICAL UNIT tPLH tPHL Propagation delay nAx to nBx, or nBx to nAx C L = 50pF; VCC = 5V 3.2 3.1 ns C IN Input capacitance VI = 0V or VCC 4 pF C I/O I/O capacitance VO = 0V or VCC ; 3-State 7 pF ICCZ Total supply current Outputs disabled; VCC =5.5V 50 µA
ORDERING INFORMATION
PACKAGES TEMPERATURE RANGE OUTSIDE NORTH AMERICA NORTH AMERICA DWG NUMBER 52–pin plastic Quad Flat Pack –40°C to +85°C MB2623 BB MB2623 BB SOT379-1 LOGIC SYMBOL È È 1B3 1B2 GND 1B1 1B0 1OEAB GND 1OEBA 1A0 1A1 GND 1A2 1A3 2B4 2B5 GND 2B6 2B7 2OEBA GND 2OEBA 2A7 2A6 GND 2A5 2A4 19 2220 231716 25 26 2A51514 21 18 1B7 2B1 GND GND GND 1B5 2B3 VCC 2B2 1B4 2B0 1B6 VCC 1 47 4446 434950 41 40 425152 45 48 1A7 2A1 GND GND GND 1A5 2A3 VCC 2A2 1A4 2A0 1A6 VCC39 52-pin PQFP SB00104 PIN DESCRIPTION PIN NUMBER SYMBOL FUNCTION 44, 43, 41, 40, 38, 37, 35, 34, 32, 31, 29, 28, 26, 25, 23, 22 1A0 – 1A7 2A0 – 2A7 Data inputs/outputs (A side) 48, 49, 51, 52, 2, 3, 5, 6, 8, 9, 11, 12, 14, 15, 17, 18 1B0 – 1B7 2B0 – 2B7 Data inputs/outputs (B side) 47, 19 1OEAB, 2OEAB Output enable inputs (active-High) 45, 21 1OEBA , 2OEBA Output enable inputs (active-Low) 4, 7, 10, 16, 20, 24, 30, 33, 36, 42, 46, 50 GND Ground (0V) 1, 13, 27, 39 VCC Positive supply voltage
Philips Semiconductors Product specification MB262316-bit transceiver with dual enable, non-inverting (3-State)
1998 Jan 16 3
L L A = B Inputs H H Inputs B = A H L Z Z L H A = B B = A H = High voltage level L = Low voltage level Z = High impedance “off” state PIN CONFIGURATION 1OEAB 1A0 1A1 1A2 1A3 1A4 1A5 1A6 1A7 1B0 1B1 1B2 1B3 1B4 1B5 1B6 1B7 1OEBA 2OEAB 2A0 2A1 2A2 2A3 2A4 2A5 2A6 2A7 2B0 2B1 2B2 2B3 2B4 2B5 2B6 2B7 2OEBA SB00105 LOGIC SYMBOL (IEEE/IEC) EN1 EN2 EN1 EN2 SB00106 2234
Philips Semiconductors Product specification MB262316-bit transceiver with dual enable, non-inverting (3-State)
1998 Jan 16 4
ABSOLUTE MAXIMUM RATINGS 1, 2 SYMBOL PARAMETER CONDITIONS RATING UNIT VCC DC supply voltage –0.5 to +7.0 V IIK DC input diode current VI < 0 –18 mA VI DC input voltage3 –1.2 to +7.0 V IOK DC output diode current VO < 0 –50 mA VOUT DC output voltage3 output in Off or High state –0.5 to +5.5 V IOUT DC output current output in Low state 128 mA Tstg Storage temperature range –65 to 150 °C NOTES: 1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 2. The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150°C. 3. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. RECOMMENDED OPERATING CONDITIONS SYMBOL PARAMETER LIMITS UNIT Min Max VCC DC supply voltage 4.5 5.5 V VI Input voltage 0 VCC V VIH High-level input voltage 2.0 V VIL Low-level Input voltage 0.8 V IOH High-level output current –32 mA IOL Low-level output current 64 mA Δt/Δv Input transition rise or fall rate 0 10 ns/V Tamb operating free-air temperature range –40 +85 °C
Philips Semiconductors Product specification MB262316-bit transceiver with dual enable, non-inverting (3-State)
1998 Jan 16 5
DC ELECTRICAL CHARACTERISTICS LIMITS SYMBOL PARAMETER TEST CONDITIONS Tamb = +25°C Tamb = –40°C to +85°C UNIT Min Typ Max Min Max VIK Input clamp voltage VCC = 4.5V; IIK = –18mA –0.9 –1.2 –1.2 V VCC = 4.5V; IOH = –3mA; VI = VIL or VIH 2.5 2.9 2.5 V VOH High-level output voltageVCC = 5.0V; IOH = –3mA; VI = VIL or VIH 3.0 3.4 3.0 V VCC = 4.5V; IOH = –32mA; VI = VIL or VIH 2.0 2.4 2.0 V VOL Low-level output voltage VCC = 4.5V; IOL = 64mA; VI = VIL or VIH 0.42 0.55 0.55 V current Data pins VCC = 5.5V; VI = GND or 5.5V ±5 ±100 ±100 µA IOFF Power-off leakage currentVCC = 0.0V; VO or VI ≤ 4.5V ±5.0 ±50 ±50 µA IPU/IPD Power-up/down 3-State output current VCC = 2.0V; VO = 0.5V; VI = GND or VCC ; VOE = VCC ; VOE = GND ±5.0 ±100 ±100 µA IIH + IOZH 3-State output High currentVCC = 5.5V; VO = 2.7V; VI = VIL or VIH 5.0 50 50 µA IIL + IOZL 3-State output Low currentVCC = 5.5V; VO = 0.5V; VI = VIL or VIH –5.0 –50 –50 µA ICEX Output High leakage currentVCC = 5.5V; VO = 5.5V; VI = GND or VCC 5.0 50 50 µA IO Output current1 VCC = 5.5V; VO = 2.5V –50 –100 –180 –50 –180 mA ICCH VCC = 5.5V; Outputs High, VI = GND or VCC 50 100 100 µA ICCL Quiescent supply current VCC = 5.5V; Outputs Low, VI = GND or VCC 48 60 60 mA ICCZ VCC = 5.5V; Outputs 3-State; VI = GND or VCC 50 100 100 µA ΔICC Additional supply current per input pin2 VCC = 5.5V; one input at 3.4V, other inputs at VCC or GND 0.5 1.5 1.5 mA NOTES: 1. Not more than one output should be tested at a time, and the duration of the test should not exceed one second. 2. This is the increase in supply current for each input at 3.4V. AC CHARACTERISTICS GND = 0V, tR = tF = 2.5ns, CL = 50pF, RL = 500Ω LIMITS SYMBOL PARAMETER WAVEFORM Tamb = +25oC VCC = +5.0V Tamb = -40 to +85oC VCC = +5.0V ±0.5V UNIT Min Typ Max Min Max tPLH tPHL Propagation delay An to Bn or Bn to An 1 1.2 1.2 3.2 3.1 4.5 4.5 1.2 1.2 5.1 5.1 ns tPZH tPZL Output enable time to High and Low level 2 1.5 1.7 4.8 5.4 6.5 6.8 1.5 1.7 7.2 7.8 ns tPHZ tPLZ Output disable time from High and Low level 2 1.5 1.4 4.7 4.2 6.5 5.8 1.5 1.4 7.2 6.5 ns
Philips Semiconductors Product specification MB262316-bit transceiver with dual enable, non-inverting (3-State)
1998 Jan 16 6
VM = 1.5V, VIN = GND to 3.0V INPUT VM VMOUTPUT VM VM tPHL tPLH SB00044 Waveform 1. Waveforms Showing the Input to Output Propagation Delays nOEAB INPUT VM VM tPZH tPHZ OUTPUT VOH VM VMOUTPUT VOL tPZL tPLZ 3.5V VOL + 0.3V VOH – 0.3V nOEBA INPUT SB00107 Waveform 2. Waveforms Showing the 3-State Output Enable and Disable Times TEST CIRCUIT AND WAVEFORM PULSE GENERATOR R T VIN D.U.T. VOUT C L R L VCC R L 7.0V Test Circuit for 3-State Outputs VM VM tW AMP (V) NEGATIVE PULSE 10% 10% 90% 90% VM VM tW AMP (V) POSITIVE PULSE 90% 90% 10% 10% tTHL (tF) tTLH (tR )t THL (tF) tTLH (tR ) VM = 1.5V Input Pulse Definition DEFINITIONS R L = Load resistor; see AC CHARACTERISTICS for value. C L = Load capacitance includes jig and probe capacitance; see AC CHARACTERISTICS for value. R T = Termination resistance should be equal to ZOUT of pulse generators. INPUT PULSE REQUIREMENTS FAMILY Amplitude Rep. Rate t W tR tF MB 3.0V 1MHz 500ns 2.5ns 2.5ns SWITCH POSITION TEST SWITCH tPLZ closed tPZL closed All other open SB00010
Philips Semiconductors Product specification MB262316-bit transceiver with dual enable, non-inverting (3-State)
1998 Jan 16 7
Load Capacitance and # of Outputs Switching nAx to nBx tPLH vs Temperature (Tamb ) C L = 50pF, 1 Output Switching nAx to nBx MAX 4.5VCC 5.5VCC MIN ns –55 –35 –15 5 25 45 65 85 105 125 0 50 100 150 200 Offset in ns Adjustment of tPLH for Load Capacitance and # of Outputs Switching nAx to nBx pF 16 switching 8 switching 1 switching ns –55 –35 –15 5 25 45 65 85 105 125 0 50 100 150 200 Offset in ns tPHL vs Temperature (Tamb ) C L = 50pF, 1 Output Switching nAx to nBx MAX 4.5VCC 5.5VCC MIN 16 switching 8 switching 1 switching ns –55 –35 –15 5 25 45 65 85 105 125 0 50 100 150 200 Offset in ns tPZH vs Temperature (Tamb ) C L = 50pF, 1 Output Switching nOEAB to nBx or nOEBA to nAx MAX 4.5VCC 5.5VCC MIN Adjustment of tPZH for Load Capacitance and # of Outputs Switching nOEAB to nBx or nOEBA to nAx pF 16 switching 8 switching 1 switching pF SB00108
Philips Semiconductors Product specification MB262316-bit transceiver with dual enable, non-inverting (3-State)
1998 Jan 16 8
tPZL vs Temperature (Tamb ) C L = 50pF, 1 Output Switching nOEAB to nBx or nOEBA to nAx MAX 4.5VCC 5.5VCC MIN ns –55 –35 –15 5 25 45 65 85 105 125 0 50 100 150 200 Offset in ns Adjustment of tPZL for Load Capacitance and # of Outputs Switching nOEAB to nBx or nOEBA to nAx pF 16 switching 8 switching 1 switching ns –55 –35 –15 5 25 45 65 85 105 125 0 50 100 150 200 Offset in ns tPHZ vs Temperature (Tamb ) C L = 50pF, 1 Output Switching nOEAB to nBx or nOEBA to nAx MAX 4.5VCC 5.5VCC MIN Adjustment of tPHZ for Load Capacitance and # of Outputs Switching nOEAB to nBx or nOEBA to nAx pF 16 switching 8 switching 1 switching ns –55 –35 –15 5 25 45 65 85 105 125 0 50 100 150 200 Offset in ns tPLZ vs Temperature (Tamb ) C L = 50pF, 1 Output Switching nOEAB to nBx or nOEBA to nAx MAX 4.5VCC 5.5VCC MIN Adjustment of tPLZ for Load Capacitance and # of Outputs Switching nOEAB to nBx or nOEBA to nAx pF 16 switching 8 switching 1 switching SB00109
Philips Semiconductors Product specification MB262316-bit transceiver with dual enable, non-inverting (3-State)
1998 Jan 16 9
tTLH vs Temperature (Tamb ) C L = 50pF, 1 Output Switching 4.5VCC 5.5VCC Adjustment of tTLH for Load Capacitance and # of Outputs Switching pF –55 –35 –15 5 25 45 65 85 105 125 16 switching 8 switching 1 switching V OHV and VOLP vs Load Capacitance VCC = 5V, VIN = 0 to 3V 125°C 25°C –55°C VOHP and VOLV vs Load Capacitance VCC = 5V, VIN = 0 to 3V 125°C 25°C –55°C 125°C 25°C –55°C 125°C 25°C –55°C tTHL vs Temperature (Tamb ) C L = 50pF, 1 Output Switching 4.5VCC 5.5VCC ns 1.5 2.0 2.5 3.0 –55 –35 –15 5 25 45 65 85 105 125 0 50 100 150 200 Offset in ns Adjustment of tTHL for Load Capacitance and # of Outputs Switching pF 16 switching 8 switching 1 switching volts –0.5 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0 50 100 150 200 0 50 100 150 200 volts pF pF SB00110
Philips Semiconductors Product specification MB262316-bit transceiver with dual enable, non-inverting (3-State)
1998 Jan 16 10
QFP52: plastic quad flat package; 52 leads (lead length 1.6 mm); body 10 x 10 x 2.0 mm SOT379-1
Philips Semiconductors Product specification MB262316-bit transceiver with dual enable, non-inverting (3-State)
1998 Jan 16 11
Philips Semiconductors Product specification MB262316-bit transceiver with dual enable, non-inverting (3-State) yyyy mmm dd 12 Definitions Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Disclaimers Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Philips Semiconductors
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P.O. Box 3409 Sunnyvale, California 94088–3409 Telephone 800-234-7381 Copyright Philips Electronics North America Corporation 1998 All rights reserved. Printed in U.S.A. print code Date of release: 05-96 Document order number: 9397-750-03513 /C0109 /C0110 /C0114 Data sheet status Objective specification Preliminary specification Product specification Product status Development Qualification Production Definition [1] This data sheet contains the design target or goal specifications for product development. Specification may change in any manner without notice. This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make chages at any time without notice in order to improve design and supply the best possible product. This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. Data sheet status [1] Please consult the most recently issued datasheet before initiating or completing a design.