MB2241 PHILIPS | Alldatasheet

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Technical content

/C0109 /C0110 /C0114 MB2241 16-bit buffer/line driver (3-State) Product specification Supersedes data of 1993 Aug 18 IC23 Data Handbook

1998 Jan 16

Philips Semiconductors Product specification MB224116-bit buffer/line driver (3-State)

21998 Jan 16 853–1571 18869

FEATURES

  • 16–bit bus interface
  • Power 3-State
  • Multiple VCC and GND pins minimize switching noise
  • 3-State buffers
  • Output capability: +64mA/–32mA
  • Latch-up protection exceeds 500mA per Jedec Std 17
  • ESD protection exceeds 2000 V per MIL STD 883 Method 3015 and 200 V per Machine Model
  • Inputs are disabled during 3-State mode

DESCRIPTION

The MB2241 high-performance BiCMOS device combines low static and dynamic power dissipation with high speed and high output drive. The MB2241 device is a 16-bit buffer that is ideal for driving bus lines. The device features four Output Enables (1OE, 2OE, 3OE, 4OE), each controlling four of the 3-State outputs. QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS Tamb = 25°C; GND = 0V TYPICAL UNIT tPLH tPHL Propagation delay nAx to nYx C L = 50pF; VCC = 5V 3.0 3.1 ns C IN Input capacitance VI = 0V or VCC 4 pF C OUT Output capacitance VO = 0V or VCC; 3-State 7 pF ICCZ Total supply current Outputs disabled; VCC = 5.5V 65 µA

ORDERING INFORMATION

PACKAGES TEMPERATURE RANGE OUTSIDE NORTH AMERICA NORTH AMERICA DWG NUMBER 52–pin plastic Quad Flat Pack –40°C to +85°C MB2241 BB MB2241 BB SOT379-1 PIN CONFIGURATION È 1Y3 1Y2 GND 1Y1 1Y0 1OE GND 20E 1A0 1A1 GND 1A2 1A3 4Y0 4Y1 GND 4Y2 4Y3 3OE GND 4OE 4A3 4A2 GND 4A1 4A0 19 2220 231716 25 26 241514 21 18 47 4446 434950 41 40 425152 45 48 2A3 3A1 GND GND GND 2A1 3A3 VCC 3A2 2A0 3A0 2A2 VCC39 52-pin PQFP V CC 2Y0 2Y1 GND 2Y2 2Y3 GND 3Y0 3Y1 GND 3Y2 3Y3 V CC SB00024 PIN DESCRIPTION PIN NUMBER SYMBOL NAME AND FUNCTION 44, 43, 41, 40, 38, 37, 35, 34, 32, 31, 29, 28, 26, 25, 23, 22 1A0 – 1A3, 2A0 – 2A3, 3A0 – 3A3, 4A0 – 4A3 Data inputs 14, 15, 17, 18, 8, 9, 11, 12, 2, 3, 5, 6, 48, 49, 51, 52 4Y0 – 4Y3, 3Y0 – 3Y3, 2Y0 – 2Y3, 1Y0 – 1Y3 Data outputs 47, 45, 21, 19 1OE , 2OE, 3OE , 4OE Output enables 4, 7, 10, 16, 20, 24, 30, 33, 36, 42, 46, 50 GND Ground (0V) 1, 13, 27, 39 VCC Positive supply voltage

Philips Semiconductors Product specification MB224116-bit buffer/line driver (3-State)

1998 Jan 16 3

LOGIC SYMBOL (IEEE/IEC) 44 48 43 49 41 51 40 52 38 2 37 3 35 5 34 6 EN1 EN2 SB00026 32 8 31 9 29 11 28 12 26 14 25 15 23 17 22 18 EN3 EN4 SB00027 FUNCTION TABLE INPUTS OUTPUTS 1OE or 3OE 1An or 3An 2OE or 4OE 2An or 4An 1Yn or 3Yn 2Yn or 4Yn L L H L H X H H L L H X L H Z L H Z H = High voltage level L = Low voltage level Z = High voltage level-impedance ”OFF” state

Philips Semiconductors Product specification MB224116-bit buffer/line driver (3-State)

1998 Jan 16 4

ABSOLUTE MAXIMUM RATINGS 1, 2 SYMBOL PARAMETER CONDITIONS RATING UNIT VCC DC supply voltage –0.5 to +7.0 V IIK DC input diode current VI < 0 –18 mA VI DC input voltage3 –1.2 to +7.0 V IOK DC output diode current VO < 0 –50 mA VOUT DC output voltage3 output in Off or High state –0.5 to +5.5 V IOUT DC output current output in Low state 128 mA Tstg Storage temperature range –65 to 150 °C NOTES: 1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 2. The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150°C. 3. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. RECOMMENDED OPERATING CONDITIONS SYMBOL PARAMETER LIMITS UNIT Min Max VCC DC supply voltage 4.5 5.5 V VI Input voltage 0 VCC V VIH High-level input voltage 2.0 V VIL Low-level Input voltage 0.8 V IOH High-level output current –32 mA IOL Low-level output current 64 mA Δt/Δv Input transition rise or fall rate 0 10 ns/V Tamb Operating free-air temperature range –40 +85 °C

Philips Semiconductors Product specification MB224116-bit buffer/line driver (3-State)

1998 Jan 16 5

DC ELECTRICAL CHARACTERISTICS LIMITS SYMBOL PARAMETER TEST CONDITIONS Tamb = +25°C Tamb = –40°C to +85°C UNIT Min Typ Max Min Max VIK Input clamp voltage VCC = 4.5V; IIK = –18mA –0.9 –1.2 –1.2 V VCC = 4.5V; IOH = –3mA; VI = VIL or VIH 2.5 2.9 2.5 V VOH High-level output voltageVCC = 5.0V; IOH = –3mA; VI = VIL or VIH 3.0 3.4 3.0 V VCC = 4.5V; IOH = –32mA; VI = VIL or VIH 2.0 2.4 2.0 V VOL Low-level output voltage VCC = 4.5V; IOL = 64mA; VI = VIL or VIH 0.42 0.55 0.55 V IOFF Power-off leakage currentVCC = 0.0V; VO or VI ≤ 4.5V ±5.0 ±100 ±100 µA IPU /IPU Power-up/down 3-State output current VCC = 2.0V; VO = 0.5V; VI = GND or VCC ; V OE = VCC ; VOE = GND ±5.0 ±50 ±50 µA IOZH 3-State output High currentVCC = 5.5V; VO = 2.7V; VI = VIL or VIH 5.0 50 50 µA IOZL 3-State output Low currentVCC = 5.5V; VO = 0.5V; VI = VIL or VIH –5.0 –50 –50 µA ICEX Output high leakage currentVCC = 5.5V; VO = 5.5V; VI = GND or VCC 5.0 50 50 µA IO Output current1 VCC = 5.5V; VO = 2.5V –50 –70 –180 –50 –180 mA ICCH VCC = 5.5V; Outputs High, VI = GND or VCC 65 250 250 µA ICCL Quiescent supply current VCC = 5.5V; Outputs Low, VI = GND or VCC 48 60 60 mA ICCZ VCC = 5.5V; Outputs 3-State; VI = GND or VCC 65 250 250 µA ΔICC Additional supply current per input pin2 Outputs enabled, one input at 3.4V, other inputs at V CC or GND; VCC = 5.5V 0.5 1.5 1.5 mA NOTES: 1. Not more than one output should be tested at a time, and the duration of the test should not exceed one second. 2. This is the increase in supply current for each input at 3.4V. AC CHARACTERISTICS GND = 0V; tR = tF = 2.5ns; CL = 50pF, RL = 500Ω LIMITS SYMBOL PARAMETER WAVEFORM Tamb = +25°C VCC = +5.0V Tamb = –40°C to +85°C VCC = +5.0V ±0.5V UNIT Min Typ Max Min Max tPLH tPHL Propagation delay nAx to nYx 1 1.2 1.2 3.0 3.1 4.5 4.5 1.2 1.2 5.1 5.1 ns tPZH tPZL Output enable time to High and Low level 2 1.3 1.8 3.7 4.8 6.3 6.8 1.3 1.8 6.9 7.4 ns tPHZ tPLZ Output disable time from High and Low level 2 1.3 1.2 3.9 3.4 5.9 5.2 1.3 1.2 6.7 5.8 ns

Philips Semiconductors Product specification MB224116-bit buffer/line driver (3-State)

1998 Jan 16 6

VM = 1.5V, VIN = GND to 3.0V nAx INPUT VM VMnYx OUTPUT VM VM tPLH tPHL SB00028 Waveform 1. Waveforms Showing the Input (nAx) to Output (nYx) Propagation Delays nOE INPUT nOE INPUT VM VM tPZH tPHZ nYx OUTPUT VOH VM VMnYx OUTPUT VOL tPZL tPLZ 3.5V VOL + 0.3V VOH – 0.3V SB00029 Waveform 2. Waveforms Showing the 3-State Output Enable and Disable Times TEST CIRCUIT AND WAVEFORMS PULSE GENERATOR R T VIN D.U.T. VOUT C L R L VCC R L 7.0V Test Circuit for 3-State Outputs VM VM tW AMP (V) NEGATIVE PULSE 10% 10% 90% 90% VM VM tW AMP (V) POSITIVE PULSE 90% 90% 10% 10% tTHL (tF) tTLH (tR )t THL (tF) tTLH (tR ) VM = 1.5V Input Pulse Definition DEFINITIONS R L = Load resistor; see AC CHARACTERISTICS for value. C L = Load capacitance includes jig and probe capacitance; see AC CHARACTERISTICS for value. R T = Termination resistance should be equal to ZOUT of pulse generators. INPUT PULSE REQUIREMENTS FAMILY Amplitude Rep. Rate t W tR tF MB 3.0V 1MHz 500ns 2.5ns 2.5ns SWITCH POSITION TEST SWITCH tPLZ closed tPZL closed All other open SB00010

Philips Semiconductors Product specification MB224116-bit buffer/line driver (3-State)

1998 Jan 16 7

Load Capacitance and # of Outputs Switching nAx to nYx tPLH vs Temperature (Tamb ) C L = 50pF, 1 Output Switching nAx to nYx MAX 4.5VCC 5.5VCC MIN ns –55 –35 –15 5 25 45 65 85 105 125 0 50 100 150 200 Offset in ns Adjustment of tPLH for Load Capacitance and # of Outputs Switching nAx to nYx pF 16 switching 8 switching 1 switching ns –55 –35 –15 5 25 45 65 85 105 125 0 50 100 150 200 Offset in ns tPHL vs Temperature (Tamb ) C L = 50pF, 1 Output Switching nAx to nYx MAX 4.5VCC 5.5VCC MIN 16 switching 8 switching 1 switching ns –55 –35 –15 5 25 45 65 85 105 125 0 50 100 150 200 Offset in ns tPZH vs Temperature (Tamb ) C L = 50pF, 1 Output Switching nOE to nYx MAX 4.5VCC 5.5VCC MIN Adjustment of tPZH for Load Capacitance and # of Outputs Switching nOE to nYx pF 16 switching 8 switching 1 switching pF SB00030

Philips Semiconductors Product specification MB224116-bit buffer/line driver (3-State)

1998 Jan 16 8

tPZL vs Temperature (Tamb ) C L = 50pF, 1 Output Switching nOE to nYx MAX 4.5VCC 5.5VCC MIN ns –55 –35 –15 5 25 45 65 85 105 125 0 50 100 150 200 Offset in ns Adjustment of tPZL for Load Capacitance and # of Outputs Switching nOE to nYx pF 16 switching 8 switching 1 switching ns –55 –35 –15 5 25 45 65 85 105 125 0 50 100 150 200 Offset in ns tPHZ vs Temperature (Tamb ) C L = 50pF, 1 Output Switching nOE to nYx MAX 4.5VCC 5.5VCC MIN Adjustment of tPHZ for Load Capacitance and # of Outputs Switching nOE to nYx pF 16 switching 8 switching 1 switching ns –55 –35 –15 5 25 45 65 85 105 125 0 50 100 150 200 Offset in ns tPLZ vs Temperature (Tamb ) C L = 50pF, 1 Output Switching nOE to nYx MAX 4.5VCC 5.5VCC MIN Adjustment of tPLZ for Load Capacitance and # of Outputs Switching nOE to nYx pF 16 switching 8 switching 1 switching SB00031

Philips Semiconductors Product specification MB224116-bit buffer/line driver (3-State)

1998 Jan 16 9

tTLH vs Temperature (Tamb ) C L = 50pF, 1 Output Switching 4.5VCC 5.5VCC Adjustment of tTLH for Load Capacitance and # of Outputs Switching pF –55 –35 –15 5 25 45 65 85 105 125 16 switching 8 switching 1 switching V OHV and VOLP vs Load Capacitance VCC = 5V, VIN = 0 to 3V 125°C 25°C –55°C VOHP and VOLV vs Load Capacitance VCC = 5V, VIN = 0 to 3V 125°C 25°C –55°C 125°C 25°C –55°C 125°C 25°C –55°C tTHL vs Temperature (Tamb ) C L = 50pF, 1 Output Switching 4.5VCC 5.5VCC ns 1.5 2.0 2.5 3.0 –55 –35 –15 5 25 45 65 85 105 125 0 50 100 150 200 Offset in ns Adjustment of tTHL for Load Capacitance and # of Outputs Switching pF 16 switching 8 switching 1 switching volts –0.5 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0 50 100 150 200 0 50 100 150 200 volts pF pF SB00032

Philips Semiconductors Product specification MB224116-bit buffer/line driver (3-State)

1998 Jan 16 10

QFP52: plastic quad flat package; 52 leads (lead length 1.6 mm); body 10 x 10 x 2.0 mm SOT379-1

Philips Semiconductors Product specification MB224116-bit buffer/line driver (3-State)

1998 Jan 16 11

Philips Semiconductors Product specification MB224116-bit buffer/line driver (3-State)

1998 Jan 16 12

Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Disclaimers Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Philips Semiconductors

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P.O. Box 3409 Sunnyvale, California 94088–3409 Telephone 800-234-7381  Copyright Philips Electronics North America Corporation 1998 All rights reserved. Printed in U.S.A. print code Date of release: 05-96 Document order number: 9397-750-03804 /C0109 /C0110 /C0114 Data sheet status Objective specification Preliminary specification Product specification Product status Development Qualification Production Definition [1] This data sheet contains the design target or goal specifications for product development. Specification may change in any manner without notice. This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make chages at any time without notice in order to improve design and supply the best possible product. This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. Data sheet status [1] Please consult the most recently issued datasheet before initiating or completing a design.