MB223M

MAX3223-EP TI | Alldatasheet

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DB,□DW,□OR□PW□PACKAGE (TOP VIEW) 1 1 EN C1+ C1- C2+ C2- DOUT2 RIN2 ROUT2 FORCEOFF VCC GND DOUT1 RIN1 ROUT1 FORCEON DIN1 DIN2 INV ALID DESCRIPTION/ORDERING INFORMATION MAX3223-EP 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH 15-kV ESD PROTECTION SGLS368 SEPTEMBER 2006 Battery-Powered Systems Controlled Baseline PDAs One Assembly Notebooks One Test Site Laptops One Fabrication Site Palmtop PCs Extended Temperature Performance of up to Hand-Held Equipment C to 125 C Enhanced Diminishing Manufacturing Sources (DMS) Support Enhanced Product-Change Notification Qualification Pedigree (1) RS-232 Bus-Pin ESD Protection Exceeds kV Using Human-Body Model (HBM) Meets or Exceeds the Requirements of TIA/EIA-232-F and ITU v.28 Standards Operates With 3-V to 5.5-V V CC Supply Operates up to 250 kbit/s Two Drivers and Two Receivers Low Standby Current µ A Typical External Capacitors 0.1 µ F Accepts 5-V Logic Input With 3.3-V Supply Alternative High-Speed Pin-Compatible Device Mbit/s) SNx5C3223 (1) Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits. The MAX3223 consists of two line drivers, two line receivers, and a dual charge-pump circuit with 15-kV ESD protection pin to pin (serial-port connection pins, including GND). The device meets the requirements of TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and the serial-port connector. The charge pump and four small external capacitors allow operation from a single 3-V to 5.5-V supply. The device operates at typical data signaling rates up to 250 kbit/s and a maximum of 30-V/ µ s driver output slew rate. ORDERING INFORMATION T A PACKAGE (1) ORDERABLE PART NUMBER TOP-SIDE MARKING SOIC DW Reel of 2000 MAX3223MDWREP (2) MAX3223M C to 125 C SSOP DB Reel of 2000 MAX3223MDBREP MB223M TSSOP PW Reel of 2000 MAX3223MPWREP (2) MB223M (1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. (2) Product Preview Please be aware that an important notice concerning availability, standard warranty, and use in critical sheet. PRODUCTION DATA information is current as of publication date. Copyright 2006, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

www.ti.com DESCRIPTION/ORDERING INFORMATION (CONTINUED) MAX3223-EP 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH 15-kV ESD PROTECTION SGLS368 SEPTEMBER 2006 Flexible control options for power management are available when the serial port is inactive. The auto-powerdown feature functions when FORCEON is low and FORCEOFF is high. During this mode of operation, if the device does not sense a valid RS-232 signal, the driver outputs are disabled. If FORCEOFF is set low and EN is high, both drivers and receivers are shut off, and the supply current is reduced to µ Disconnecting the serial port or turning off the peripheral drivers causes auto-powerdown to occur. Auto-powerdown can be disabled when FORCEON and FORCEOFF are high. With auto-powerdown enabled, the device is activated automatically when a valid signal is applied to any receiver input. The INVALID output is used to notify the user if an RS-232 signal is present at any receiver input. INVALID is high (valid data) if any receiver input voltage is greater than 2.7 V or less than 2.7 or has been between 0.3 V and 0.3 V for less than µ INVALID is low (invalid data) if the receiver input voltage is between 0.3 V and 0.3 V for more than µ See Figure for receiver input levels. FUNCTION TABLES ABC EACH DRIVER (1) INPUTS OUTPUT DRIVER STATUS VALID RIN DOUT DIN FORCEON FORCEOFF RS-232 LEVEL X X L X Z Powered off L H H X H Normal operation with auto-powerdown disabled H H H X L L L H Yes H Normal operation with auto-powerdown enabled H L H Yes L L L H No Z Powered off by auto-powerdown feature H L H No Z (1) H high level, L low level, X irrelevant, Z high impedance EACH RECEIVER (1) INPUTS OUTPUT VALID RIN ROUT RIN EN RS-232 LEVEL L L X H H L X L X H X Z Open L No H (1) H high level, L low level, X irrelevant, Z high impedance (off), Open input disconnected or connected driver off Submit Documentation Feedback

www.ti.com DIN2 DOUT2 Auto-powerdown RIN1 INV ALID ROUT1 DIN1 DOUT1 RIN2ROUT2 EN FORCEON FORCEOFF Absolute Maximum Ratings (1) MAX3223-EP 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH 15-kV ESD PROTECTION SGLS368 SEPTEMBER 2006 LOGIC DIAGRAM (POSITIVE LOGIC) over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT V CC Supply voltage range 0.3 V Positive-output supply voltage range (2) 0.3 V V Negative-output supply voltage range (2) 0.3 V V Supply voltage difference (2) V Driver FORCEOFF FORCEON, EN 0.3 V I Input voltage range V Receiver Driver 13.2 13.2 V O Output voltage range V Receiver INVALID 0.3 V CC 0.3 DB package θ JA Package thermal impedance (3) (4) DW package C/W PW package T J Operating virtual junction temperature 150 C T stg Storage temperature range 150 C (1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltages are with respect to network GND. (3) Maximum power dissipation is a function of T J (max), θ JA and T A The maximum allowable power dissipation at any allowable ambient temperature is P D J (max) T A θ JA Operating at the absolute maximum T J of 150 C can affect reliability. (4) The package thermal impedance is calculated in accordance with JESD 51-7. Submit Documentation Feedback

www.ti.com Recommended Operating Conditions (1) Electrical Characteristics (1) MAX3223-EP 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH 15-kV ESD PROTECTION SGLS368 SEPTEMBER 2006 See Figure MIN NOM MAX UNIT V CC 3.3 V 3.3 3.6 Supply voltage V V CC V 4.5 5.5 V CC 3.3 V Driver and control V IH DIN, EN FORCEOFF FORCEON V high-level input voltage V CC V 2.4 Driver and control V IL DIN, EN FORCEOFF FORCEON 0.8 V low-level input voltage Driver and control input voltage DIN, EN FORCEOFF FORCEON 5.5 V V I Receiver input voltage V T A Operating free-air temperature 125 C (1) Test conditions are 0.1 µ F at V CC 3.3 V 0.3 0.047 µ 0.33 µ F at V CC V 0.5 over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure PARAMETER TEST CONDITIONS MIN TYP (2) MAX UNIT Input leakage EN FORCEOFF I I 0.01 µ A current FORCEON Auto-powerdown No load, FORCEOFF and 0.3 mA disabled FORCEON at V CC Powered off V CC 3.3 V or No load, FORCEOFF at GND I CC Supply current T A C No load, FORCEOFF at V CC µ A Auto-powerdown FORCEON at GND, enabled All RIN are open or grounded (1) Test conditions are 0.1 µ F at V CC 3.3 V 0.3 0.047 µ 0.33 µ F at V CC V 0.5 (2) All typical values are at V CC 3.3 V or V CC and T A Submit Documentation Feedback

www.ti.com DRIVER SECTION Electrical Characteristics (1) Switching Characteristics (1) MAX3223-EP 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH 15-kV ESD PROTECTION SGLS368 SEPTEMBER 2006 over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure PARAMETER TEST CONDITIONS MIN (2) TYP (3) MAX UNIT V OH High-level output voltage DOUT at R L k Ω to GND 5.4 V V CC V 5.4 DOUT at R L k Ω to V OL Low-level output voltage V GND V CC 3.3 V 4.9 I IH High-level input current V I V CC 0.01 µ A I IL Low-level input current V I at GND 0.01 µ A V CC 3.6 V O V I OS Short-circuit output current (4) mA V CC 5.5 V O V r o Output resistance V CC V+, and V V O V 300 10M Ω V CC V to 3.6 V O V I OZ Output leakage current FORCEOFF GND µ A V CC 4.5 V to 5.5 V O V (1) Test conditions are 0.1 µ F at V CC 3.3 V 0.3 0.047 µ 0.33 µ F at V CC V 0.5 (2) The minimum reading of 4.9 V at V CC 3.3 V falls outside the TIA/EIA-232 Standard. (3) All typical values are at V CC 3.3 V or V CC and T A (4) Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one output should be shorted at a time. over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure PARAMETER TEST CONDITIONS MIN TYP (2) MAX UNIT C L 1000 pF, R L k Ω Maximum data rate 250 kbit/s One DOUT switching, See Figure C L 150 pF to 2500 pF, R L k Ω to k Ω t sk(p) Pulse skew (3) 100 ns See Figure C L 150 pF to 1000 pF Slew rate, transition region V CC 3.3 SR(tr) µ s (see Figure R L k Ω to k Ω C L 150 pF to 2500 pF (1) Test conditions are 0.1 µ F at V CC 3.3 V 0.3 0.047 µ 0.33 µ F at V CC V 0.5 (2) All typical values are at V CC 3.3 V or V CC and T A (3) Pulse skew is defined as PLH t PHL of each channel of the same device. Submit Documentation Feedback

www.ti.com RECEIVER SECTION Electrical Characteristics (1) Switching Characteristics (1) MAX3223-EP 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH 15-kV ESD PROTECTION SGLS368 SEPTEMBER 2006 over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure PARAMETER TEST CONDITIONS MIN TYP (2) MAX UNIT V OH High-level output voltage I OH mA V CC 0.6 V CC 0.1 V V OL Low-level output voltage I OL 1.6 mA 0.4 V V CC 3.3 V 1.6 2.4 V IT+ Positive-going input threshold voltage V V CC V 1.9 2.4 V CC 3.3 V 0.6 1.1 V IT Negative-going input threshold voltage V V CC V 0.8 1.4 V hys Input hysteresis IT+ V IT 0.5 V I OZ Output leakage current EN V CC 0.05 µ A r i Input resistance V I V to V 8.3 k Ω (1) Test conditions are 0.1 µ F at V CC 3.3 V 0.3 0.047 µ 0.33 µ F at V CC V 0.5 (2) All typical values are at V CC 3.3 V or V CC and T A over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS TYP (2) UNIT t PLH Propagation delay time, low- to high-level output C L 150 pF, See Figure 150 ns t PHL Propagation delay time, high- to low-level output C L 150 pF, See Figure 150 ns t en Output enable time C L 150 pF, R L k Ω See Figure 200 ns t dis Output disable time C L 150 pF, R L k Ω See Figure 200 ns t sk(p) Pulse skew (3) See Figure ns (1) Test conditions are 0.1 µ F at V CC 3.3 V 0.3 0.047 µ 0.33 µ F at V CC V 0.5 (2) All typical values are at V CC 3.3 V or V CC and T A (3) Pulse skew is defined as PLH t PHL of each channel of the same device. Submit Documentation Feedback

www.ti.com AUTO-POWERDOWN SECTION Electrical Characteristics Switching Characteristics MAX3223-EP 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH 15-kV ESD PROTECTION SGLS368 SEPTEMBER 2006 over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure PARAMETER TEST CONDITIONS MIN MAX UNIT Receiver input threshold for V T+(valid) FORCEON GND, FORCEOFF V CC 2.7 V INVALID high-level output voltage Receiver input threshold for V T (valid) FORCEON GND, FORCEOFF V CC 2.7 V INVALID high-level output voltage Receiver input threshold for V T(invalid) FORCEON GND, FORCEOFF V CC 0.2 0.3 V INVALID low-level output voltage I OH mA, FORCEON GND, V OH INVALID high-level output voltage V CC 0.6 V FORCEOFF V CC I OL 1.6 mA, FORCEON GND, V OL INVALID low-level output voltage 0.4 V FORCEOFF V CC over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure PARAMETER TYP (1) UNIT t valid Propagation delay time, low- to high-level output µ s t invalid Propagation delay time, high- to low-level output µ s t en Supply enable time 100 µ s (1) All typical values are at V CC 3.3 V or V CC and T A Submit Documentation Feedback

www.ti.com PARAMETER MEASUREMENT INFORMATION TEST□CIRCUIT VOLTAGE□WAVEFORMS /c45 3□V/c45 3□V 3□V3□V 0□V 3□V 1.5□V1.5□V Output Input VOL VOH tTLHtTHL Generator (see□Note□B) RL 3□V FORCEOFF RS-232 Output CL (see□Note A) NOTES: A.□□□C includes□probe□and□jig□capacitance.L B. The□pulse□generator□has□the□following□characteristics:□PRR□=□250□kbit/s,□Z =□50 ,□50%□duty□cycle,□t 10□ns,□t 10□ns.O r f/c87 /c163 TEST□CIRCUIT VOLTAGE□WAVEFORMS 0□V 3□V Output Input VOL VOH tPLHtPHL NOTES: A.□□□C includes□probe□and□jig□capacitance.L B. The□pulse□generator□has□the□following□characteristics:□PRR□=□250□kbit/s,□Z =□50 ,□50%□duty□cycle,□t 10□ns,□t 10□ns.O r f/c87 /c163 /c163 50 /c87Generator (see□Note□B) RL 3□V FORCEOFF RS-232 Output CL (see□Note A) 50% 50% 1.5□V 1.5□V TEST□CIRCUIT VOLTAGE□WAVEFORMS 50 /c87 50%50% /c45 3□V 3□V 1.5□V1.5□V Output Input VOL VOH tPHL Generator (see□Note□B) tPLH Output EN 0□V CL (see□Note A) NOTES: A.□□□C includes□probe□and□jig□capacitance.L B. The□pulse□generator□has□the□following□characteristics:□Z =□50 ,□50%□duty□cycle,□t 10□ns,□t 10□ns.O r f/c87 /c163 /c163 0□V FORCEOFF MAX3223-EP 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH 15-kV ESD PROTECTION SGLS368 SEPTEMBER 2006 Figure Driver Slew Rate Figure Driver Pulse Skew Figure Receiver Propagation Delay Times Submit Documentation Feedback

www.ti.com TEST□CIRCUIT VOLTAGE□WAVEFORMS 50 /c87Generator (see□Note□B) 3□V□or□0□V Output VOL VOH tPHZ (S1□at□GND) tPLZ (S1□at□V )CC tPZL (S1□at□V )CC 1.5□V1.5□V 3□V 0□V 50% 0.3□V Output Input 50% 0.3□V EN FORCEON 3□V□or□0□V RL VCC GND CL (see□Note A) Output NOTES: A.□□□C includes□probe□and□jig□capacitance.L B. The□pulse□generator□has□the□following□characteristics:□Z =□50 ,□50%□duty□cycle,□t 10□ns,□t 10□ns.O r f/c87 /c163 /c163 tPHZ (S1□at□GND) MAX3223-EP 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH 15-kV ESD PROTECTION SGLS368 SEPTEMBER 2006 PARAMETER MEASUREMENT INFORMATION (continued) Figure Receiver Enable and Disable Times Submit Documentation Feedback

www.ti.com TEST□CIRCUIT VOLTAGE□WAVEFORMS 50 /c87 3□V2.7□V /c45 2.7□V INVALID Output Receiver Input tinvalid Generator (see□Note□B) FORCEOFF tvalid ROUT FORCEON Auto- powerdown INVALID DOUT 0□V 0□V /c45 3□V DIN C =□30□pFL (see□Note A) VCC 0□V 2.7□V -2.7□V 0.3□V -0.3□V 0□V Valid□RS-232□Level, HighINVALID Indeterminate Indeterminate If□Signal□Remains□Within□This□Region for□More□Than□30 s, Is□Low/c109 INVALID Valid□RS-232□Level, HighINVALID /c187 V+ 0□V /c187 /c45 V VCC ten V/c45 NOTES: A.□□□C includes□probe□and□jig□capacitance.L B. The□pulse□generator□has□the□following□characteristics:□PRR□=□5□kbit/s,□Z =□50 ,□50%□duty□cycle,□t 10□ns,□t 10□ns.O r f/c87 /c163 /c163 50%□VCC 50%□VCC 2.7□V /c45 2.7□V 0.3□V 0.3□V Supply Voltages Auto-powerdown□disables□drivers□and□reduces□supply current□to□1 A./c109 MAX3223-EP 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH 15-kV ESD PROTECTION SGLS368 SEPTEMBER 2006 PARAMETER MEASUREMENT INFORMATION (continued) Figure INVALID Propagation Delay Times and Supply Enabling Time Submit Documentation Feedback

www.ti.com APPLICATION INFORMATION DIN1 FORCEOFF FORCEON DOUT1 ROUT1 -C3 VCC C2+ C1+ GND C1- RIN1 C2- CBYPASS DOUT2 VCC C1 C2,□C3,□C4 3.3□V 0.3□V/c177 5□V 0.5□V/c177 3□V□to□5.5□V

0.1 F/c109

0.047 F/c109

0.33 F/c109

0.47 F/c109

V vs□CAPACITOR□VALUESCC EN C4+ Auto- powerdown DIN2 INVALID RIN2 ROUT2 C3□can□be□connected□to□V or□GND.CC NOTES: A.□□□Resistor□values□shown□are□nominal. B.□□□Non□polarized□ceramic□capacitors□are□acceptable.□If□polarized□tantalum□or electrolytic□capacitors□are□used,□they□should□be□connected□as□shown. =□0.1 F/c109 5□k/c87 5□k/c87 MAX3223-EP 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH 15-kV ESD PROTECTION SGLS368 SEPTEMBER 2006 Figure Typical Operating Circuit and Capacitor Values Submit Documentation Feedback

www.ti.com 23-May-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) MAX3223MDBREP Active Production SSOP (DB) | 20 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -55 to 125 MB3223M MAX3223MDBREP.A Active Production SSOP (DB) | 20 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -55 to 125 MB3223M V62/06635-01XE Active Production SSOP (DB) | 20 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -55 to 125 MB3223M (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF MAX3223-EP :

• Catalog : MAX3223 Addendum-Page 1

www.ti.com 23-May-2025 NOTE: Qualified Version Definitions:

• Catalog - TI's standard catalog product Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 13-May-2025 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION www.ti.com 13-May-2025 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) MAX3223MDBREP SSOP DB 20 2000 356.0 356.0 35.0 Pack Materials-Page 2

www.ti.com PACKAGE OUTLINE C 18X 0.65 5.85 20X 0.38 0.22 8.2

7.4 TYP

0.05 MIN

0.25 GAGE PLANE 0 -8

2 MAX

B 5.6 5.0 NOTE 4 A 7.5 6.9 NOTE 3 0.95 0.55 (0.15) TYP SSOP - 2 mm max heightDB0020A SMALL OUTLINE PACKAGE 4214851/B 08/2019

0.1 C A B

0.1 C NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side. 5. Reference JEDEC registration MO-150. A 15 DETAIL A TYPICAL SCALE 2.000

www.ti.com EXAMPLE BOARD LAYOUT

0.07 MAX

0.07 MIN

20X (1.85) 20X (0.45) 18X (0.65) (7) (R0.05) TYP SSOP - 2 mm max heightDB0020A SMALL OUTLINE PACKAGE 4214851/B 08/2019 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 10X SYMM SYMM 10 11 15.000 METALSOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK OPENING EXPOSED METALEXPOSED METAL SOLDER MASK DETAILS NON-SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED

www.ti.com EXAMPLE STENCIL DESIGN 20X (1.85) 20X (0.45) 18X (0.65) (7) (R0.05) TYP SSOP - 2 mm max heightDB0020A SMALL OUTLINE PACKAGE 4214851/B 08/2019 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE: 10X SYMM SYMM 10 11

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