NB100LVEP91_16 ONSEMI | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 11
Technical content
Features
- Maximum Input Clock Frequency > 2.0 GHz Typical
- Maximum Input Data Rate > 2.0 Gb/s Typical
- 500 ps Typical Propagation Delay
- Operating Range: ♦ VCC = 2.375 V to 3.8 V; VEE = −2.375 V to −3.8 V; GND = 0 V
- Q Output will Default LOW with Inputs Open or at GND
- These Devices are Pb-Free, Halogen Free and are RoHS Compliant MARKING DIAGRAMS* SOIC−20 WB DW SUFFIX CASE 751D−05 A = Assembly Location WL, L = Wafer Lot YY, Y = Year WW, W = Work Week G or /C0071= Pb-Free Package N100 VP91 ALYW/C0071 /C0071 QFN−24 MN SUFFIX CASE 485L−01 24 1 NB100LVEP91 AWLYYWWG www.onsemi.com (Note: Microdot may be in either location) *For additional marking information, refer to
ORDERING INFORMATION
Device Package Shipping † MB100LVEP91DWG SOIC−20 WB (Pb-Free)
38 Units/Tube
MB100LVEP91DWR2G SOIC−20 WB (Pb-Free) 1000/T ape & Reel QFN−24 (Pb-Free) MB100LVEP91MNR2G 3000/T ape & ReelQFN−24 (Pb-Free) MB100LVEP91MNG 92 Units/Tube †For information on tape and reel specifications, in- cluding part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D
Figure 1. Logic Diagram Table 1. PIN DESCRIPTION
- The thermally conductive exposed pad on the package bottom (see case drawing) must be attached to a heat sinking conduit and may
only be electrically connected to VEE (not GND).
Table 3. MAXIMUM RATINGS should not be assumed, damage may occur and reliability may be affected. Table 4. DC CHARACTERISTICS POSITIVE INPUTS (VCC = 2.5 V, VEE = −2.375 to −3.8 V, GND = 0 V (Note 1)) values are applied individually under normal operating conditions and not valid simultaneously.
- V IHCMR min varies 1:1 with GND. VIHCMR max varies 1:1 with VCC.
Table 5. DC CHARACTERISTICS POSITIVE INPUT (VCC = 3.3 V; VEE = −2.375 V to −3.8 V; GND = 0 V (Note 1)) values are applied individually under normal operating conditions and not valid simultaneously.
- V IHCMR min varies 1:1 with GND. VIHCMR max varies 1:1 with VCC.
values are applied individually under normal operating conditions and not valid simultaneously.
- Output parameters vary 1:1 with GND.
- All loading with 50 /C0087 resistor to GND − 2.0 V.
values are applied individually under normal operating conditions and not valid simultaneously.
- Skews are valid across specified voltage range, part-to-part skew is for a given temperature.
- RMS Jitter with 50% Duty Cycle Input Clock Signal.
- Peak-to-Peak Jitter with input NRZ PRBS 2
- Input voltage swing is a single-ended measurement operating in differential mode. The device has a DC gain of ≈ 50.
Figure 4. Output Voltage Amplitude (VOUTPP) / RMS Jitter vs.
Figure 5. AC Reference Measurement
Figure 12. Typical Termination for Output Driver and Device Evaluation
www.onsemi.com PACKAGE DIMENSIONS SOIC−20 WB CASE 751D−05 ISSUE H b20X H c L 18X A1 A SEATING PLANE /C0113 h X 45/C0095 E D M0.25 MB M0.25 SA SBT e T B A DIM MIN MAX MILLIMETERS A 2.35 2.65 A1 0.10 0.25 b 0.35 0.49 c 0.23 0.32 D 12.65 12.95 E 7.40 7.60 e 1.27 BSC H 10.05 10.55 h 0.25 0.75 L 0.50 0.90 /C01130 7 NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF B DIMENSION AT MAXIMUM MATERIAL CONDITION. /C0095/C0095 11.00 20X 0.52 20X 1.30 1.27 DIMENSIONS: MILLIMETERS PITCH *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* RECOMMENDED 20 11
www.onsemi.com PACKAGE DIMENSIONS ÉÉÉ ÉÉÉ ÉÉÉ QFN−24, 4x4, 0.5P CASE 485L ISSUE B NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 MM FROM THE TERMINAL TIP. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. SEATING PLANE D B 0.15 C A A E PIN 1 REFEENCE 2X 0.15 C 0.08 C 0.10 C C DIM MIN MAX MILLIMETERS A 0.80 1.00 A1 0.00 0.05 A3 0.20 REF b 0.20 0.30 D 4.00 BSC D2 2.70 2.90 E 4.00 BSC E2 2.70 2.90 e 0.50 BSC L 0.30 0.50 24X L b e/2 e 0.10 B 0.05 AC C DETAIL A L ALTERNATE CONSTRUCTIONS L ÉÉÉ ÉÉÉÇÇÇ DETAIL B MOLD CMPDEXPOSED Cu ALTERNATE TERMINAL CONSTRUCTIONS ÉÉ ÉÉÇÇ TOP VIEW SIDE VIEW DETAIL B BOTTOM VIEW DETAIL A SOLDERING FOOTPRINT DIMENSIONS: MILLIMETERS 2.90 4.30 4.30 0.50 0.55 0.32 24X 24X PITCH 2.90 RECOMMENDED NOTE 4 A1 24X NOTE 3 L1 0.05 0.15 *For additional information on our Pb-Free strategy and sol- dering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries i n the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property . A listing of ON Semiconductor’s product/patent ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, reg ulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the right s of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 NB100LVEP91/D ECLinPS is a registered trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor 19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative