MAZY-SZHG DOMINANT | Alldatasheet

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15/05/2017 V1.01 Features: > Super high brightness surface mount LED > 120° viewing angle. > Compact package outline (LxW) of 3.7 x 3.5 mm. > Ultra low height profile - 0.8mm. > Low thermal resistance. > Compatible to IR reflow soldering. > Environmental friendly; RoHS compliance. > Superior corrosion resistance. > Compliance to automotive standard; AEC-Q101. Primax Synonymous with function and performance, enter the Primax, the new era of high intensity illumination in LED. With its high flux output and high luminous intensity, Primax transcends today LED lightings technology and how we perceive it. The small package outline (3.7 x 3.5 x 0.8 mm) and high intensity make it an ideal choice for backlighting, signage, exterior automotive lighting and decorative lighting. DATA SHEET : PrimaxPlus

150 InGaN Yellow : MAZY-SZHG

All rights reserved. Product specifications are subject to change without notice. Applications: > Automotive: Exterior application: eg: Turn Indicator, Signal Lighting. DOMINANT Opto Technologies Innovating Illumination TM

15/05/2017 V1.02 Part Ordering Number Color Viewing Angle˚ Luminous Flux @ 150mA (lm) Appx. 1.2 MAZY-SZHG-N3Q-1 InGaN Yellow 120 20.6 Electrical Characteristics at Tj=250C Vf @ If = 150 mA Appx. 3.1 3.25 Part Number Min. (V) Typ. (V) Max. (V) MAZY-SZHG 2.90 3.45 Unit Absolute Maximum Ratings Maximum Value DC forward current Peak pulse current (tp<=10μs, Duty cycle=0.1) Reverse voltage ESD threshold (HBM) LED junction temperature Operating temperature Storage temperature Thermal resistance - Real Thermal Resistance Junction / solder point, R th JS real (typ = 35) - Electrical Thermal Resistance Junction / solder point, R th JS el (typ = 25) (Mounted on dual sided FR4 in house PCB, total Cu area >900mm 2) 200 300 Not designed for reverse bias 150 -40 … +125 -40 … +125 mA mA V kV K/W K/W Optical Characteristics at Tj=250C Min. Typ. Max. 30.6 39.8

150 InGaN Yellow: MAZY-SZHG

15/05/2017 V1.03 MAZY-SZHG, Color Grouping Appx. 2.1 Color Bin Structure Bin 0.5606 0.4250 Cx Cy 0.5705 0.4289 0.5883 0.4111 0.5780 0.4080 1 2 3 4 B i n 12341 0.450 0 410 0.420 0.430 0.440 0.380 0.390 0.400 0.410 0.380

15/05/2017 V1.04 Brightness Group Luminous Flux (lm) Appx. 1.2 Luminous Intensity Group at Tj=250C Group Wavelength distribution (nm)Forward Voltage (V) Appx. 3.1 Vf Binning (Optional) Vf Bin @ 150mA Please consult sales and marketing for special part number to incorporate Vf binning. VM6 VM7 VM8

15/05/2017 V1.05 Forward Current I F (mA) Relative Luminous Flux Ф rel Forward Current I F (mA) Temperature T(°C) Maximum Current Vs Temperature IF=f(T) Forward Current IF (mA) Relative Luminous Flux Ф rel Wavelength λ (nm) Duty Ratio, % Allowable Forward Current Vs Duty Ratio ( Tj = 25°C; tp ≤ 10μs ) ∆Cx, ∆Cy Forward Current IF (mA) Relative Luminous Flux Vs Forward Current ФV/ФV(150mA) = f(IF); Tj = 25°C Forward Current Vs Forward Voltage IF = f(VF); Tj = 25°C Forward Voltage VF (V) Chromaticity Coordinate Shift Vs Forward Current ∆Cx, ∆Cy = f(IF);Tj = 25°C 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 0 20 40 60 80 100 120 140 160 180 200 100 120 140 160 180 200 Relative Luminous Flux Фrel Forward Current IF Forward Current IF (mA) Relative Lumionous Flux Vs Forward Current ФV/ФV(150mA) = f(IF); Tj = 25°C Forward Current Vs Forward Voltage IF = f(VF); Tj = 25°C Forward Voltage VF (V) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 350 400 450 500 550 600 650 700 750 800 850 Relative Luminous Flux Фrel Relative Spectral Emission Фrel = f(λ); Tj = 25°C; IF = 150mA Wavelength λ (nm) Forward Current IF (mA) Maximum Current Vs Temperature IF = f (T) Temperature T(°C) Allowable Forward Current IF( mA ) Allowable Forward Current Vs Duty Ratio ( Tj = 25°C; tp ≤ 1ms ) Duty Ratio, % 100 1000 0.1 1 10 100 TS 100 150 200 250 0 20 40 60 80 100 120 140 TS = Solder Point Temperature 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 0 20 40 60 80 100 120 140 160 180 200 100 120 140 160 180 200 Relative Luminous Flux Фrel Forward Current IF Forward Current IF (mA) Relative Lumionous Flux Vs Forward Current ФV/ФV(150mA) = f(IF); Tj = 25°C Forward Current Vs Forward Voltage IF = f(VF); Tj = 25°C Forward Voltage VF (V) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 350 400 450 500 550 600 650 700 750 800 850 Relative Luminous Flux Фrel Relative Spectral Emission Фrel = f(λ); Tj = 25°C; IF = 150mA Wavelength λ (nm) Forward Current IF (mA) Maximum Current Vs Temperature IF = f (T) Temperature T(°C) Allowable Forward Current IF( mA ) Allowable Forward Current Vs Duty Ratio ( Tj = 25°C; tp ≤ 1ms ) Duty Ratio, % 100 1000 0.1 1 10 100 TS 100 150 200 250 0 20 40 60 80 100 120 140 TS = Solder Point Temperature 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 0 20 40 60 80 100 120 140 160 180 200 100 120 140 160 180 200 Relative Luminous Flux Фrel Forward Current IF Forward Current IF (mA) Relative Lumionous Flux Vs Forward Current ФV/ФV(150mA) = f(IF); Tj = 25°C Forward Current Vs Forward Voltage IF = f(VF); Tj = 25°C Forward Voltage VF (V) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 350 400 450 500 550 600 650 700 750 800 850 Relative Luminous Flux Фrel Relative Spectral Emission Фrel = f(λ); Tj = 25°C; IF = 150mA Wavelength λ (nm) Forward Current IF (mA) Maximum Current Vs Temperature IF = f (T) Temperature T(°C) Allowable Forward Current IF( mA ) Allowable Forward Current Vs Duty Ratio ( Tj = 25°C; tp ≤ 1ms ) Duty Ratio, % 100 1000 0.1 1 10 100 TS 100 150 200 250 0 20 40 60 80 100 120 140 TS = Solder Point Temperature 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 0 20 40 60 80 100 120 140 160 180 200 100 120 140 160 180 200 Relative Luminous Flux Фrel Forward Current IF Forward Current IF (mA) Relative Lumionous Flux Vs Forward Current ФV/ФV(150mA) = f(IF); Tj = 25°C Forward Current Vs Forward Voltage IF = f(VF); Tj = 25°C Forward Voltage VF (V) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 350 400 450 500 550 600 650 700 750 800 850 Relative Luminous Flux Фrel Relative Spectral Emission Фrel = f(λ); Tj = 25°C; IF = 150mA Wavelength λ (nm) Forward Current IF (mA) Maximum Current Vs Temperature IF = f (T) Temperature T(°C) Allowable Forward Current IF( mA ) Allowable Forward Current Vs Duty Ratio ( Tj = 25°C; tp ≤ 1ms ) Duty Ratio, % 100 1000 0.1 1 10 100 TS 100 150 200 250 0 20 40 60 80 100 120 140 TS = Solder Point Temperature 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 0 20 40 60 80 100 120 140 160 180 200 100 120 140 160 180 200 Relative Luminous Flux Фrel Forward Current IF Forward Current IF (mA) Relative Lumionous Flux Vs Forward Current ФV/ФV(150mA) = f(IF); Tj = 25°C Forward Current Vs Forward Voltage IF = f(VF); Tj = 25°C Forward Voltage VF (V) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 350 400 450 500 550 600 650 700 750 800 850 Relative Luminous Flux Фrel Relative Spectral Emission Фrel = f(λ); Tj = 25°C; IF = 150mA Wavelength λ (nm) Forward Current IF (mA) Maximum Current Vs Temperature IF = f (T) Temperature T(°C) Allowable Forward Current IF( mA ) Allowable Forward Current Vs Duty Ratio ( Tj = 25°C; tp ≤ 1ms ) Duty Ratio, % 100 1000 0.1 1 10 100 TS 100 150 200 250 0 20 40 60 80 100 120 140 TS = Solder Point Temperature Relative Spectral Emission Фrel = f(λ); Tj = 25°C; IF = 150mA Allowable Forward Current I F( mA ) ∆Cx ∆Cy -0.05 -0.04 -0.03 -0.02 -0.01 0.00 0.01 0.02 0.03 0.04 0.05 0 20 40 60 80 100 120 140 160 180 200 Blue -0.80 -0.60 -0.40 -0.20 0.00 0.20 0.40 0.60 0.80 0 10 20 30 40 50 60 70 80 Relative Wavelength λrel Relative Wavelength Shift Vs Forward Current Forward Current IF (mA) ∆Cx, ∆Cy Chromaticity Coordinate Shift Vs Forward Current ∆Cx, ∆Cy = f(IF);Tj = 25°C Forward Current IF (mA)

15/05/2017 V1.06 Radiation Pattern Junction Temperature Tj(°C) Relative Forward Voltage ∆V F (V) Relative Forward Voltage Vs Junction Temperature ∆VF = VF - VF(25°C) = f(Tj); IF =150mA Junction Temperature Tj(°C) Relative Luminious Flux Ф rel Junction Temperature Tj(°C) ∆Cx , ∆Cy Relative Luminious Flux Vs Junction Temperature ФV/ФV(25°C) = f(Tj); IF = 150mA 08/12/2016 V7.09 InGaN Warm White: DDF-LJG DOMINANT Opto Technologies Innovating Illumination TM Radiation Pattern Junction Temperature Tj(°C) Relative Forward Voltage ∆V F (V) Junction Temperature Tj(°C) Relative Luminous Intensity I rel Relative Luminous Intensity Vs Junction Temperature IV/IV(25°C) = f(Tj); IF = 20mA Junction Temperature Tj(°C) ∆Cx , ∆Cy Chromaticity Coordinate Shift Vs Junction Temperature ∆Cx, ∆Cy = f(Tj); IF = 20mA 0.270° 90° 80° 60° 50° 40° 30° 20° 0.6 0.4 1.0 0.8 10° 0° -0.5 -0.4 -0.3 -0.2 -0.1 0.0 0.1 0.2 0.3 0.4 0.5 -50 -30 -10 10 30 50 70 90 110 130 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 -50 -30 -10 10 30 50 70 90 110 130 Relative Forward Voltage ∆VF (V) Relative Forward Voltage Vs Junction Temperature ∆VF = VF -V F(25°C) = f(Tj); IF = 20mA Junction Temperature Tj(°C) Junction Temperature Tj(°C) Relative Luminous Intensity Vs Junction Temperature IV /IV (25°C) = f(Tj); IV = 20mA Relative Luminous Intensity Irel -0.5 -0.4 -0.3 -0.2 -0.1 0.0 0.1 0.2 0.3 0.4 0.5 -50 -30 -10 10 30 50 70 90 110 130 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 -50 -30 -10 10 30 50 70 90 110 130 Relative Forward Voltage ∆VF (V) Relative Forward Voltage Vs Junction Temperature ∆VF = VF -V F(25°C) = f(Tj); IF = 20mA Junction Temperature Tj(°C) Junction Temperature Tj(°C) Relative Luminous Intensity Vs Junction Temperature IV /IV (25°C) = f(Tj); IV = 20mA Relative Luminous Intensity Irel Relative Forward Voltage Vs Junction Temperature ∆VF = VF - VF(25°C) = f(Tj); IF =20mA -10.0 -8.0 -6.0 -4.0 -2.0 0.0 2.0 4.0 6.0 8.0 10.0 -50 -30 -10 10 30 50 70 90 110 130 ∆Cx ∆Cy -0.030 -0.025 -0.020 -0.015 -0.010 -0.005 0.000 0.005 0.010 0.015 0.020 0.025 0.030 -50 -30 -10 10 30 50 70 90 110 130 Relative Wavelength ∆λdom(nm) Relative Wavelength Vs Junction Temperature ∆λdom = λdom - λdom (25°C) = f(Tj); IF = 20mA ∆Cx, ∆Cy Chromaticity Coordinate Shift Vs Junction Temperature ∆Cx, ∆Cy = f(Tj); IF = 20mA Junction Temperature Tj(°C) Junction Temperature Tj(°C) -0.5 -0.4 -0.3 -0.2 -0.1 0.0 0.1 0.2 0.3 0.4 0.5 -50 -30 -10 10 30 50 70 90 110 130 150 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 -50 -30 -10 10 30 50 70 90 110 130 150 Relative Forward Voltage ∆VF (V) Relative Forward Voltage Vs Junction Temperature Junction Temperature Tj(°C) Relative Luminious Flux Фrel Relative Luminious Flux Vs Junction Temperature ФV/ФV(25°C) = f(Tj); IF = 150mA Junction Temperature Tj(°C) -0.5 -0.4 -0.3 -0.2 -0.1 0.0 0.1 0.2 0.3 0.4 0.5 -50 -30 -10 10 30 50 70 90 110 130 150 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 -50 -30 -10 10 30 50 70 90 110 130 150 Relative Forward Voltage ∆VF (V) Relative Forward Voltage Vs Junction Temperature Junction Temperature Tj(°C) Relative Luminious Flux Фrel Relative Luminious Flux Vs Junction Temperature ФV/ФV(25°C) = f(Tj); IF = 150mA Junction Temperature Tj(°C) -10.0 -8.0 -6.0 -4.0 -2.0 0.0 2.0 4.0 6.0 8.0 10.0 -50 -30 -10 10 30 50 70 90 110 130 150 ∆Cx ∆Cy -0.05 -0.04 -0.03 -0.02 -0.01 0.00 0.01 0.02 0.03 0.04 0.05 -50 -30 -10 10 30 50 70 90 110 130 150 Relative Wavelength ∆λdom(nm) Relative Wavelength Vs Junction Temperature ∆λdom = λdom - λdom (25°C) = f(Tj); IF = 100mA ∆Cx, ∆Cy Chromaticity Coordinate Shift Vs Junction Temperature ∆Cx, ∆Cy = f(Tj); IF = 150mA Junction Temperature Tj(°C) Junction Temperature Tj(°C) Chromaticity Coordinate Shift Vs Junction Temperature ∆Cx, ∆Cy = f(Tj); IF = 150mA

15/05/2017 V1.07 PrimaxPlus • 150 InGaN Yellow: MAZY-SZHG Package Outlines Material Material Lead-frame Package Encapsulant Soldering Leads Cu Alloy With Au Plating High Temperature Resistant Plastic Silicone Au Plating Note: This product is Pb free 14/06/2016 V3.08 PrimaxPlus • 180 InGaN White: MBWW-KZHG Package Outlines Material Material Lead-frame Package Encapsulant Soldering Leads Cu Alloy With Au Plating High Temperature Resistant Plastic Silicone Resin Au Plating Note: This product is Pb free

180 InGaN White: MBWW-KZHG

Note : Primary thermal path is through Cathode lead of LED package. 12/10/2016 V3.0 7 PrimaxPlus • 350 InGaN Yellow: MAZY-YZHG Package Outlines Material Material Lead-frame Package Encapsulant Soldering Leads Cu Alloy With Au Plating High Temperature Resistant Plastic Silicone Au Plating DOMINANT Opto TechnologiesInnovating Illumination TM Note: This product is Pb free

350 InGaN Yellow: MAZY-YZHG

Note : Primary thermal path is through Cathode lead of LED package. DOMINANT Opto Technologies 09/05/14 PrimaxPlus 350 InGaN White MAW-YZHG -pv3.docx Page 1 of 9 PRELIMINARY UNDER DEVELOPMENT Engineering reference data are not verified. The specifications are subject to change without notice.  Super high brightness surface mount LED for automotive applications.  120 viewing angle.  Compact package outline (LxW) of 3.7 x 3.5 mm.  Ultra low height profile – 0.8 mm.  Low thermal resistance;  Superior corrosion robustness.  Compatible to IR reflow soldering. PrimaxPlus 350mA White: MAW-YZHG 31/05/2013 V1.0 7 Primax • 175 InGaN White: MBWW-FSC Package Outlines Material Material Lead-frame Package Encapsulant Soldering Leads Cu Alloy With Ag Plating High Temperature Resistant Plastic Silicone Resin Ag Plating DOMINANT Opto TechnologiesInnovating Illumination TM Note: This product is Pb free

175 InGaN White: MBWW-FSC

18/04/2016 V1.0 8 PrimaxPlus 100 InGaN White: PQW-SSG Package Outlines InGaN White: PQW-SSG DOMINANT Opto TechnologiesInnovating Illumination TM Material Material Lead-frame Package Encapsulant Soldering Leads Cu Alloy With Ag Plating High Temperature Resistant Plastic Silicone Resin Sn Plating Note: This product is Pb free DOMINANT Opto Technologies 24/09/13 PrimaxPlus 100 InGaN Warm White MAF-PSC -pv3.docx Page 1 of 14 PRELIMINARY UNDER DEVELOPMENT Engineering reference data are not verified. The specifications are subject to change without notice.  Super high brightness surface mount LED.  120 viewing angle.  Compact package outline (LxW) of 3.7 x 3.5 mm.  Ultra low height profile – 0.8 mm.  Low thermal resistance.  Compatible to IR reflow soldering. PrimaxPlus 100mA Warm White: MAF-PSC Note : Primary thermal path is through Cathode lead of LED package InGaN Warm White: DDF-LJG 08/12/2016 V7.0 10 DomiLED • InGaN Warm White: DDF-LJG Package Outlines Material Material Lead-frame Package Encapsulant Soldering Leads Cu Alloy With Ag Plating High Temperature Resistant Plastic, PPA Silicone Resin Sn-Sn Plating DOMINANT Opto TechnologiesInnovating Illumination TM Note : Primary thermal path is through Cathode lead of LED package. 07/07/2011 V4.0 6 SPNova TM

  • InGaN White : NPW-RSZ Package Outlines InGaN White : NPW-RSZ Material Material Lead-frame Package Encapsulant Soldering Leads Cu Alloy With Ag Plating High Temperature Resistant Plastic, PPA Silicone Resin Sn-Sn Plating DOMINANT Opto TechnologiesInnovating Illumination TM 07/07/2011 V4.0 6 SPNova TM
  • InGaN White : NPW-RSZ Package Outlines InGaN White : NPW-RSZ Material Material Lead-frame Package Encapsulant Soldering Leads Cu Alloy With Ag Plating High Temperature Resistant Plastic, PPA Silicone Resin Sn-Sn Plating DOMINANT Opto TechnologiesInnovating Illumination TM 12/10/2016 V3.07 PrimaxPlus • 350 InGaN Yellow: MAZY-YZHG Package Outlines Material Material Lead-frame Package Encapsulant Soldering Leads Cu Alloy With Au Plating High Temperature Resistant Plastic Silicone Au Plating DOMINANT Opto Technologies Innovating Illumination TM Note: This product is Pb free

Note : Primary thermal path is through Cathode lead of LED package. DOMINANT Opto Technologies 09/05/14 PrimaxPlus 350 InGaN White MAW-YZHG -pv3.docx Page 1 of 9 PRELIMINARY UNDER DEVELOPMENT Engineering reference data are not verified. The specifications are subject to change without notice.  Super high brightness surface mount LED for automotive applications.  120 viewing angle.  Compact package outline (LxW) of 3.7 x 3.5 mm.  Ultra low height profile – 0.8 mm.  Low thermal resistance;  Superior corrosion robustness.  Compatible to IR reflow soldering. PrimaxPlus 350mA White: MAW-YZHG 31/05/2013 V1.07 Primax • 175 InGaN White: MBWW-FSC Package Outlines Material Material Lead-frame Package Encapsulant Soldering Leads Cu Alloy With Ag Plating High Temperature Resistant Plastic Silicone Resin Ag Plating DOMINANT Opto Technologies Innovating Illumination TM Note: This product is Pb free 18/04/2016 V1.08 PrimaxPlus 100 InGaN White: PQW-SSG Package Outlines InGaN White: PQW-SSG DOMINANT Opto Technologies Innovating Illumination TM Material Material Lead-frame Package Encapsulant Soldering Leads Cu Alloy With Ag Plating High Temperature Resistant Plastic Silicone Resin Sn Plating Note: This product is Pb free DOMINANT Opto Technologies 24/09/13 PrimaxPlus 100 InGaN Warm White MAF-PSC -pv3.docx Page 1 of 14 PRELIMINARY UNDER DEVELOPMENT Engineering reference data are not verified. The specifications are subject to change without notice.  Super high brightness surface mount LED.  120 viewing angle.  Compact package outline (LxW) of 3.7 x 3.5 mm.  Ultra low height profile – 0.8 mm.  Low thermal resistance.  Compatible to IR reflow soldering. PrimaxPlus 100mA Warm White: MAF-PSC Note : Primary thermal path is through Cathode lead of LED package InGaN Warm White: DDF-LJG 08/12/2016 V7.010 DomiLED • InGaN Warm White: DDF-LJG Package Outlines Material Material Lead-frame Package Encapsulant Soldering Leads Cu Alloy With Ag Plating High Temperature Resistant Plastic, PPA Silicone Resin Sn-Sn Plating DOMINANT Opto Technologies Innovating Illumination TM Note : Primary thermal path is through Cathode lead of LED package. 07/07/2011 V4.06 SPNova TM

  • InGaN White : NPW-RSZ Package Outlines InGaN White : NPW-RSZ Material Material Lead-frame Package Encapsulant Soldering Leads Cu Alloy With Ag Plating High Temperature Resistant Plastic, PPA Silicone Resin Sn-Sn Plating DOMINANT Opto Technologies Innovating Illumination TM 07/07/2011 V4.06 SPNova TM
  • InGaN White : NPW-RSZ Package Outlines InGaN White : NPW-RSZ Material Material Lead-frame Package Encapsulant Soldering Leads Cu Alloy With Ag Plating High Temperature Resistant Plastic, PPA Silicone Resin Sn-Sn Plating DOMINANT Opto Technologies Innovating Illumination TM 12/10/2016 V3.07 PrimaxPlus • 350 InGaN Yellow: MAZY-YZHG Package Outlines Material Material Lead-frame Package Encapsulant Soldering Leads Cu Alloy With Au Plating High Temperature Resistant Plastic Silicone Au Plating DOMINANT Opto Technologies Innovating Illumination TM Note: This product is Pb free

Note : Primary thermal path is through Cathode lead of LED package. DOMINANT Opto Technologies 09/05/14 PrimaxPlus 350 InGaN White MAW-YZHG -pv3.docx Page 1 of 9 PRELIMINARY UNDER DEVELOPMENT Engineering reference data are not verified. The specifications are subject to change without notice.  Super high brightness surface mount LED for automotive applications.  120 viewing angle.  Compact package outline (LxW) of 3.7 x 3.5 mm.  Ultra low height profile – 0.8 mm.  Low thermal resistance;  Superior corrosion robustness.  Compatible to IR reflow soldering. PrimaxPlus 350mA White: MAW-YZHG 31/05/2013 V1.07 Primax • 175 InGaN White: MBWW-FSC Package Outlines Material Material Lead-frame Package Encapsulant Soldering Leads Cu Alloy With Ag Plating High Temperature Resistant Plastic Silicone Resin Ag Plating DOMINANT Opto Technologies Innovating Illumination TM Note: This product is Pb free 18/04/2016 V1.08 PrimaxPlus 100 InGaN White: PQW-SSG Package Outlines InGaN White: PQW-SSG DOMINANT Opto Technologies Innovating Illumination TM Material Material Lead-frame Package Encapsulant Soldering Leads Cu Alloy With Ag Plating High Temperature Resistant Plastic Silicone Resin Sn Plating Note: This product is Pb free DOMINANT Opto Technologies 24/09/13 PrimaxPlus 100 InGaN Warm White MAF-PSC -pv3.docx Page 1 of 14 PRELIMINARY UNDER DEVELOPMENT Engineering reference data are not verified. The specifications are subject to change without notice.  Super high brightness surface mount LED.  120 viewing angle.  Compact package outline (LxW) of 3.7 x 3.5 mm.  Ultra low height profile – 0.8 mm.  Low thermal resistance.  Compatible to IR reflow soldering. PrimaxPlus 100mA Warm White: MAF-PSC Note : Primary thermal path is through Cathode lead of LED package InGaN Warm White: DDF-LJG 08/12/2016 V7.010 DomiLED • InGaN Warm White: DDF-LJG Package Outlines Material Material Lead-frame Package Encapsulant Soldering Leads Cu Alloy With Ag Plating High Temperature Resistant Plastic, PPA Silicone Resin Sn-Sn Plating DOMINANT Opto Technologies Innovating Illumination TM Note : Primary thermal path is through Cathode lead of LED package. 07/07/2011 V4.06 SPNova TM

  • InGaN White : NPW-RSZ Package Outlines InGaN White : NPW-RSZ Material Material Lead-frame Package Encapsulant Soldering Leads Cu Alloy With Ag Plating High Temperature Resistant Plastic, PPA Silicone Resin Sn-Sn Plating DOMINANT Opto Technologies Innovating Illumination TM 07/07/2011 V4.06 SPNova TM
  • InGaN White : NPW-RSZ Package Outlines InGaN White : NPW-RSZ Material Material Lead-frame Package Encapsulant Soldering Leads Cu Alloy With Ag Plating High Temperature Resistant Plastic, PPA Silicone Resin Sn-Sn Plating DOMINANT Opto Technologies Innovating Illumination TM 12/10/2016 V3.07 PrimaxPlus • 350 InGaN Yellow: MAZY-YZHG Package Outlines Material Material Lead-frame Package Encapsulant Soldering Leads Cu Alloy With Au Plating High Temperature Resistant Plastic Silicone Au Plating DOMINANT Opto Technologies Innovating Illumination TM Note: This product is Pb free

Note : Primary thermal path is through Cathode lead of LED package. DOMINANT Opto Technologies 09/05/14 PrimaxPlus 350 InGaN White MAW-YZHG -pv3.docx Page 1 of 9 PRELIMINARY UNDER DEVELOPMENT Engineering reference data are not verified. The specifications are subject to change without notice.  Super high brightness surface mount LED for automotive applications.  120 viewing angle.  Compact package outline (LxW) of 3.7 x 3.5 mm.  Ultra low height profile – 0.8 mm.  Low thermal resistance;  Superior corrosion robustness.  Compatible to IR reflow soldering. PrimaxPlus 350mA White: MAW-YZHG 31/05/2013 V1.07 Primax • 175 InGaN White: MBWW-FSC Package Outlines Material Material Lead-frame Package Encapsulant Soldering Leads Cu Alloy With Ag Plating High Temperature Resistant Plastic Silicone Resin Ag Plating DOMINANT Opto Technologies Innovating Illumination TM Note: This product is Pb free 18/04/2016 V1.08 PrimaxPlus 100 InGaN White: PQW-SSG Package Outlines InGaN White: PQW-SSG DOMINANT Opto Technologies Innovating Illumination TM Material Material Lead-frame Package Encapsulant Soldering Leads Cu Alloy With Ag Plating High Temperature Resistant Plastic Silicone Resin Sn Plating Note: This product is Pb free DOMINANT Opto Technologies 24/09/13 PrimaxPlus 100 InGaN Warm White MAF-PSC -pv3.docx Page 1 of 14 PRELIMINARY UNDER DEVELOPMENT Engineering reference data are not verified. The specifications are subject to change without notice.  Super high brightness surface mount LED.  120 viewing angle.  Compact package outline (LxW) of 3.7 x 3.5 mm.  Ultra low height profile – 0.8 mm.  Low thermal resistance.  Compatible to IR reflow soldering. PrimaxPlus 100mA Warm White: MAF-PSC Note : Primary thermal path is through Cathode lead of LED package InGaN Warm White: DDF-LJG 08/12/2016 V7.010 DomiLED • InGaN Warm White: DDF-LJG Package Outlines Material Material Lead-frame Package Encapsulant Soldering Leads Cu Alloy With Ag Plating High Temperature Resistant Plastic, PPA Silicone Resin Sn-Sn Plating DOMINANT Opto Technologies Innovating Illumination TM Note : Primary thermal path is through Cathode lead of LED package. 07/07/2011 V4.06 SPNova TM

  • InGaN White : NPW-RSZ Package Outlines InGaN White : NPW-RSZ Material Material Lead-frame Package Encapsulant Soldering Leads Cu Alloy With Ag Plating High Temperature Resistant Plastic, PPA Silicone Resin Sn-Sn Plating DOMINANT Opto Technologies Innovating Illumination TM 07/07/2011 V4.06 SPNova TM
  • InGaN White : NPW-RSZ Package Outlines InGaN White : NPW-RSZ Material Material Lead-frame Package Encapsulant Soldering Leads Cu Alloy With Ag Plating High Temperature Resistant Plastic, PPA Silicone Resin Sn-Sn Plating DOMINANT Opto Technologies Innovating Illumination TM 12/10/2016 V3.0 7 PrimaxPlus • 350 InGaN Yellow: MAZY-YZHG Package Outlines Material Material Lead-frame Package Encapsulant Soldering Leads Cu Alloy With Au Plating High Temperature Resistant Plastic Silicone Au Plating DOMINANT Opto TechnologiesInnovating Illumination TM Note: This product is Pb free

Note : Primary thermal path is through Cathode lead of LED package. DOMINANT Opto Technologies 09/05/14 PrimaxPlus 350 InGaN White MAW-YZHG -pv3.docx Page 1 of 9 PRELIMINARY UNDER DEVELOPMENT Engineering reference data are not verified. The specifications are subject to change without notice.  Super high brightness surface mount LED for automotive applications.  120 viewing angle.  Compact package outline (LxW) of 3.7 x 3.5 mm.  Ultra low height profile – 0.8 mm.  Low thermal resistance;  Superior corrosion robustness.  Compatible to IR reflow soldering. PrimaxPlus 350mA White: MAW-YZHG 31/05/2013 V1.0 7 Primax • 175 InGaN White: MBWW-FSC Package Outlines Material Material Lead-frame Package Encapsulant Soldering Leads Cu Alloy With Ag Plating High Temperature Resistant Plastic Silicone Resin Ag Plating DOMINANT Opto TechnologiesInnovating Illumination TM Note: This product is Pb free 18/04/2016 V1.0 8 PrimaxPlus 100 InGaN White: PQW-SSG Package Outlines InGaN White: PQW-SSG DOMINANT Opto TechnologiesInnovating Illumination TM Material Material Lead-frame Package Encapsulant Soldering Leads Cu Alloy With Ag Plating High Temperature Resistant Plastic Silicone Resin Sn Plating Note: This product is Pb free DOMINANT Opto Technologies 24/09/13 PrimaxPlus 100 InGaN Warm White MAF-PSC -pv3.docx Page 1 of 14 PRELIMINARY UNDER DEVELOPMENT Engineering reference data are not verified. The specifications are subject to change without notice.  Super high brightness surface mount LED.  120 viewing angle.  Compact package outline (LxW) of 3.7 x 3.5 mm.  Ultra low height profile – 0.8 mm.  Low thermal resistance.  Compatible to IR reflow soldering. PrimaxPlus 100mA Warm White: MAF-PSC Note : Primary thermal path is through Cathode lead of LED package InGaN Warm White: DDF-LJG 08/12/2016 V7.0 10 DomiLED • InGaN Warm White: DDF-LJG Package Outlines Material Material Lead-frame Package Encapsulant Soldering Leads Cu Alloy With Ag Plating High Temperature Resistant Plastic, PPA Silicone Resin Sn-Sn Plating DOMINANT Opto TechnologiesInnovating Illumination TM Note : Primary thermal path is through Cathode lead of LED package. 07/07/2011 V4.0 6 SPNova TM

  • InGaN White : NPW-RSZ Package Outlines InGaN White : NPW-RSZ Material Material Lead-frame Package Encapsulant Soldering Leads Cu Alloy With Ag Plating High Temperature Resistant Plastic, PPA Silicone Resin Sn-Sn Plating DOMINANT Opto TechnologiesInnovating Illumination TM 07/07/2011 V4.0 6 SPNova TM
  • InGaN White : NPW-RSZ Package Outlines InGaN White : NPW-RSZ Material Material Lead-frame Package Encapsulant Soldering Leads Cu Alloy With Ag Plating High Temperature Resistant Plastic, PPA Silicone Resin Sn-Sn Plating DOMINANT Opto TechnologiesInnovating Illumination TM 12/10/2016 V3.07 PrimaxPlus • 350 InGaN Yellow: MAZY-YZHG Package Outlines Material Material Lead-frame Package Encapsulant Soldering Leads Cu Alloy With Au Plating High Temperature Resistant Plastic Silicone Au Plating DOMINANT Opto Technologies Innovating Illumination TM Note: This product is Pb free

Note : Primary thermal path is through Cathode lead of LED package. DOMINANT Opto Technologies 09/05/14 PrimaxPlus 350 InGaN White MAW-YZHG -pv3.docx Page 1 of 9 PRELIMINARY UNDER DEVELOPMENT Engineering reference data are not verified. The specifications are subject to change without notice.  Super high brightness surface mount LED for automotive applications.  120 viewing angle.  Compact package outline (LxW) of 3.7 x 3.5 mm.  Ultra low height profile – 0.8 mm.  Low thermal resistance;  Superior corrosion robustness.  Compatible to IR reflow soldering. PrimaxPlus 350mA White: MAW-YZHG 31/05/2013 V1.07 Primax • 175 InGaN White: MBWW-FSC Package Outlines Material Material Lead-frame Package Encapsulant Soldering Leads Cu Alloy With Ag Plating High Temperature Resistant Plastic Silicone Resin Ag Plating DOMINANT Opto Technologies Innovating Illumination TM Note: This product is Pb free 18/04/2016 V1.08 PrimaxPlus 100 InGaN White: PQW-SSG Package Outlines InGaN White: PQW-SSG DOMINANT Opto Technologies Innovating Illumination TM Material Material Lead-frame Package Encapsulant Soldering Leads Cu Alloy With Ag Plating High Temperature Resistant Plastic Silicone Resin Sn Plating Note: This product is Pb free DOMINANT Opto Technologies 24/09/13 PrimaxPlus 100 InGaN Warm White MAF-PSC -pv3.docx Page 1 of 14 PRELIMINARY UNDER DEVELOPMENT Engineering reference data are not verified. The specifications are subject to change without notice.  Super high brightness surface mount LED.  120 viewing angle.  Compact package outline (LxW) of 3.7 x 3.5 mm.  Ultra low height profile – 0.8 mm.  Low thermal resistance.  Compatible to IR reflow soldering. PrimaxPlus 100mA Warm White: MAF-PSC Note : Primary thermal path is through Cathode lead of LED package InGaN Warm White: DDF-LJG 08/12/2016 V7.010 DomiLED • InGaN Warm White: DDF-LJG Package Outlines Material Material Lead-frame Package Encapsulant Soldering Leads Cu Alloy With Ag Plating High Temperature Resistant Plastic, PPA Silicone Resin Sn-Sn Plating DOMINANT Opto Technologies Innovating Illumination TM Note : Primary thermal path is through Cathode lead of LED package. 07/07/2011 V4.06 SPNova TM

  • InGaN White : NPW-RSZ Package Outlines InGaN White : NPW-RSZ Material Material Lead-frame Package Encapsulant Soldering Leads Cu Alloy With Ag Plating High Temperature Resistant Plastic, PPA Silicone Resin Sn-Sn Plating DOMINANT Opto Technologies Innovating Illumination TM 07/07/2011 V4.06 SPNova TM
  • InGaN White : NPW-RSZ Package Outlines InGaN White : NPW-RSZ Material Material Lead-frame Package Encapsulant Soldering Leads Cu Alloy With Ag Plating High Temperature Resistant Plastic, PPA Silicone Resin Sn-Sn Plating DOMINANT Opto Technologies Innovating Illumination TM 12/10/2016 V3.07 PrimaxPlus • 350 InGaN Yellow: MAZY-YZHG Package Outlines Material Material Lead-frame Package Encapsulant Soldering Leads Cu Alloy With Au Plating High Temperature Resistant Plastic Silicone Au Plating DOMINANT Opto Technologies Innovating Illumination TM Note: This product is Pb free

Note : Primary thermal path is through Cathode lead of LED package. DOMINANT Opto Technologies 09/05/14 PrimaxPlus 350 InGaN White MAW-YZHG -pv3.docx Page 1 of 9 PRELIMINARY UNDER DEVELOPMENT Engineering reference data are not verified. The specifications are subject to change without notice.  Super high brightness surface mount LED for automotive applications.  120 viewing angle.  Compact package outline (LxW) of 3.7 x 3.5 mm.  Ultra low height profile – 0.8 mm.  Low thermal resistance;  Superior corrosion robustness.  Compatible to IR reflow soldering. PrimaxPlus 350mA White: MAW-YZHG 31/05/2013 V1.07 Primax • 175 InGaN White: MBWW-FSC Package Outlines Material Material Lead-frame Package Encapsulant Soldering Leads Cu Alloy With Ag Plating High Temperature Resistant Plastic Silicone Resin Ag Plating DOMINANT Opto Technologies Innovating Illumination TM Note: This product is Pb free 18/04/2016 V1.08 PrimaxPlus 100 InGaN White: PQW-SSG Package Outlines InGaN White: PQW-SSG DOMINANT Opto Technologies Innovating Illumination TM Material Material Lead-frame Package Encapsulant Soldering Leads Cu Alloy With Ag Plating High Temperature Resistant Plastic Silicone Resin Sn Plating Note: This product is Pb free DOMINANT Opto Technologies 24/09/13 PrimaxPlus 100 InGaN Warm White MAF-PSC -pv3.docx Page 1 of 14 PRELIMINARY UNDER DEVELOPMENT Engineering reference data are not verified. The specifications are subject to change without notice.  Super high brightness surface mount LED.  120 viewing angle.  Compact package outline (LxW) of 3.7 x 3.5 mm.  Ultra low height profile – 0.8 mm.  Low thermal resistance.  Compatible to IR reflow soldering. PrimaxPlus 100mA Warm White: MAF-PSC Note : Primary thermal path is through Cathode lead of LED package InGaN Warm White: DDF-LJG 08/12/2016 V7.010 DomiLED • InGaN Warm White: DDF-LJG Package Outlines Material Material Lead-frame Package Encapsulant Soldering Leads Cu Alloy With Ag Plating High Temperature Resistant Plastic, PPA Silicone Resin Sn-Sn Plating DOMINANT Opto Technologies Innovating Illumination TM Note : Primary thermal path is through Cathode lead of LED package. 07/07/2011 V4.06 SPNova TM

  • InGaN White : NPW-RSZ Package Outlines InGaN White : NPW-RSZ Material Material Lead-frame Package Encapsulant Soldering Leads Cu Alloy With Ag Plating High Temperature Resistant Plastic, PPA Silicone Resin Sn-Sn Plating DOMINANT Opto Technologies Innovating Illumination TM 07/07/2011 V4.06 SPNova TM
  • InGaN White : NPW-RSZ Package Outlines InGaN White : NPW-RSZ Material Material Lead-frame Package Encapsulant Soldering Leads Cu Alloy With Ag Plating High Temperature Resistant Plastic, PPA Silicone Resin Sn-Sn Plating DOMINANT Opto Technologies Innovating Illumination TM

Notes: Primary thermal path is through Cathode lead of LED package. General tolerance: +/- 0.1mm.

15/05/2017 V1.08 Recommended Solder Pad

15/05/2017 V1.09 Taping and orientation

  • Reels come in quantity of 1000 units.
  • Reel diameter is 180 mm.

15/05/2017 V1.010 Packaging Specification 26/01/2015 V2.011 Packaging Specification DOMINANT Opto Technologies Innovating Illumination TM

350 InGaN White: MAW-YZHG

15/05/2017 V1.011 Packaging Specification Average 1pc PrimaxPlus 1 completed bag (1000pcs) 0.034 190 ± 10Weight (gram) Cardboard Box Dimensions (mm) Empty Box Weight (kg) Super Small Small Medium Large For PrimaxPlus Reel / BoxCardboard Box Size Weight (gram) 0.034 230 ± 10 DOMINANT TM Moisture sensitivity level Moisture absorbent material + Moisture indicator The reel, moisture absorbent material and moisture indicator are sealed inside the moisture proof foil bag Reel Barcode label Label (L) Lot No : lotno (P) Part No : partno (C) Cust No : partno (G) Grouping : group (Q) Quantity : quantity (D) D/C : date code (S) S/N : serial no DOMINANT Opto Technologies ML TEMP 2 260˚C RoHS Compliant Made in Malaysia 325 x 225 x 190 325 x 225 x 280 570 x 440 x 230 570 x 440 x 460 0.38 0.54 1.46 1.92 7 reels MAX 11 reels MAX 48 reels MAX 96 reels MAX

15/05/2017 V1.012 Time (sec) 0 50 100 150 200 300 250 225 200 175 150 125 100 275Temperature (˚C) Classification Reflow Profile (JEDEC J-STD-020C) Ramp-up 3˚C/sec max. 255-260˚C 10-30s 60-150s Ramp- down 6˚C/sec max. Preheat 60-180s 480s max 217˚C Recommended Pb-free Soldering Profile

15/05/2017 V1.013 Appendix 1) Brightness: 1.1 Luminous intensity is measured with an internal reproducibility of ± 8 % and an expanded uncertainty of ± 11 % (according to GUM with a coverage factor of k=3). 1.2 Luminous flux is measured with an internal reproducibility of ± 8 % and an expanded uncertainty of ± 11 % (according to GUM with a coverage factor of k=3). 2) Color: 2.1 Chromaticity coordinate groups are measured with an internal reproducibility of ± 0.005 and an expanded uncertainty of ± 0.01 (accordingly to GUM with a coverage factor of k=3). 2.2 DOMINANT wavelength is measured with an internal reproducibility of ± 0.5nm and an expanded uncertainty of ± 1nm (accordingly to GUM with a coverage factor of k=3). 3) Voltage: 3.1 Forward Voltage, Vf is measured with an internal reproducibility of ± 0.05V and an expanded uncertainty of ± 0.1V (accordingly to GUM with a coverage factor of k=3).

Revision History

All the information contained in this document is considered to be reliable at the time of publishing. However, DOMINANT Opto Technologies does not assume any liability arising out of the application or use of any product described herein. DOMINANT Opto Technologies reserves the right to make changes to any products in order to improve reliability, function or design. DOMINANT Opto Technologies products are not authorized for use as critical components in life support devices or sys - tems without the express written approval from the Managing Director of DOMINANT Opto Technologies . Page Subjects Initial Release Date of Modification

15 May 2017

15/05/2017 V1.014

DOMINANT Opto Technologies is a dynamic company that is amongst the world’s leading automotive LED manu- facturers. With an extensive industry experience and relentless pursuit of innovation, DOMINANT’s state-of-art manufacturing and development capabilities have become a trusted and reliable brand across the globe. More in- formation about DOMINANT Opto Technologies, a ISO/TS 16949 and ISO 14001 certified company, can be found under http://www.dominant-semi.com. Please contact us for more information: DOMINANT Opto Technologies Sdn. Bhd Lot 6, Batu Berendam, FTZ Phase III, 75350 Melaka, Malaysia. Tel: +606 283 3566 Fax: +606 283 0566 E-mail: sales@dominant-semi.com