MAX3023 | DigiCamel IC Datasheet

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MAX13013 MAXIM | Alldatasheet

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Features

♦ 100Mbps Guaranteed Data Rate ♦ Bidirectional Level Translation MAX13013 (Single) MAX13014 (Dual) MAX3023 (Quad) ♦ Unidirectional Level Translation MAX13015/MAX13016/MAX13017 (Dual) MAX3024–MAX3028 (Quad) ♦ V L Operation Down to +1.2V ♦ Ultra-Low 0.1µA Supply Current When Disabled ♦ Low-Quiescent Current (0.1µA) ♦ UCSP, SC70, SOT23, and TSSOP Packages MAX13013–MAX13017/MAX3023–MAX3028 +1.2V to +3.6V, 0.1µA, 100Mbps, Single-/Dual-/Quad-Level Translators MAX13014 +1.8V +3.3V I/O VCC1 I/O VCC2 I/O VL1 I/O VL2 CLK VL VCC DATA CLK DATA GNDGNDGND 0.1µF 0.1µF +1.8V SYSTEM CONTROLLER +3.3V SYSTEM Typical Operating Circuit GND I/O VL1I/O VCC1

16 E N

(BUMPS ON BOTTOM OF DIE) I/O VCC1VCC GND I/O VL1VL EN TOP VIEW A 123 B Pin Configurations 19-3266; Rev 1; 8/04 For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com. MICROWIRE is a trademark of National Semiconductor Corp. SPI is a trademark of Motorola, Inc. UCSP is a trademark of Maxim Integrated Products, Inc. Pin Configurations continued at end of data sheet. Ordering Information/Selector Guide continued at end of data sheet. Ordering Information/Selector Guide PART TEMP RANGE PIN-PACKAGE PACKAGE CODE TOP MARK NUMBER OF VL → VCC TRANSLATORS Number of VCC → VL TRANSLATORS EN EN MAX13013EXT -40°C to +85°C 6 SC70 — ACD 11 ✓ —

MAX13013–MAX13017/MAX3023–MAX3028 +1.2V to +3.6V, 0.1µA, 100Mbps, Single-/Dual-/Quad-Level Translators ABSOLUTE MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

(VCC = +1.65V to +3.6V, VL = +1.2V to (VCC - 0.4V), EN = VL, EN = open (MAX3023–MAX3028 TSSOP package only), CIOVL ≤ 15pF, CIOVCC ≤ 40pF, TA = TMIN to TMAX. Typical values are at TA = +25°C.) (Notes 1, 2) Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specificatio ns is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. All voltages are referenced to GND. Short-Circuit Duration I/O VL_, Continuous Power Dissipation (TA = +70°C) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS POWER SUPPLY VL Supply Range V L 1.2 VCC - 0.4 V VCC Supply Range V CC 1.65 3.60 V Supply Current from VCC IQVCC I/O V CC_ = 0, I/O V L_ = 0 or I/O V CC_ = VCC, I/O V L_ = VL 0.1 1 µA I/O V CC_ = 0, I/O V L_ = 0 or I/O V CC_ = VCC, I/O V L_ = VL 0.2 2 Supply Current from VL IQVL I/O V CC_ = 0, I/O V L_ = 0 or I/O V CC_ = VCC, I/O V L_ = VL, VL < VCC - 0.2V 10 100 µA VCC Tri-state Output-Mode Supply Current ITS-VCC TA = +25°C, EN = 0 0.03 1µ A TA = +25°C, EN = 0 0.1 0.2VL Tri-state Output-Mode Supply Current (MAX13013–MAX13017) ITS-VL TA = +25°C, EN = 0, VL = VCC - 0.2V 1 2 µA TA = +25°C, EN = 0 50 70VL Tri-state Output-Mode Supply Current (MAX3023–MAX3028 ITS-VL TA = +25°C, EN = 0, VL = VCC - 0.2V 55 74 µA TA = +25°C, EN = 0 0.15I/O Tri-state Output-Mode Leakage Current TA = +25°C, EN = 0, VL = VCC - 0.2V 20 µA

MAX13013–MAX13017/MAX3023–MAX3028 +1.2V to +3.6V, 0.1µA, 100Mbps, Single-/Dual-/Quad-Level Translators ELECTRICAL CHARACTERISTICS (continued) (VCC = +1.65V to +3.6V, VL = +1.2V to (VCC - 0.4V), EN = VL, EN = open (MAX3023–MAX3028 TSSOP package only), CIOVL ≤ 15pF, CIOVCC ≤ 40pF, TA = TMIN to TMAX. Typical values are at TA = +25°C.) (Notes 1, 2) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS LOGIC-LEVEL THRESHOLDS I/O V L_ Input-Voltage High V IHL 2/3 x VL V I/O V L_ Input-Voltage Low V ILL 1/3 x VL V Pullup Resistance on I/O VL_ 120 Ω Pulldown Resistance on I/O VL_7 5 Ω I/O V CC_ Input-Voltage High V IHC 2/3 x VCC V I/O V CC_ Input-Voltage Low V ILC 1/3 x VCC V Pullup Resistance on I/O VCC_ 2.5 k Ω Pulldown Resistance on I/O VCC_ 2.5 k Ω EN, EN Input-Voltage High V IH 2/3 x VL V EN, EN Input-Voltage Low V IL 1/3 x VL V EN Input Current MAX13013–MAX13017 -5 +5 µA Pullup Resistance on EN MAX3023–MAX3028 46 62 81 k Ω Pulldown Resistance on EN MAX3023–MAX3028, TSSOP package only 46 62 81 k Ω I/O V L_ Output-Voltage High V OHL I/O VL source current = 20µA 2/3 x VL V I/O V L_ Output-Voltage Low V OLL I/O VL sink current = 20µA 1/3 x VL V I/O V CC_ Output-Voltage High V OHC I/O VCC source current = 20µA 2/3 x VCC V I/O V CC_ Output-Voltage Low V OLC I/O VCC sink current = 20µA 1/3 x VCC V

MAX13013–MAX13017/MAX3023–MAX3028 +1.2V to +3.6V, 0.1µA, 100Mbps, Single-/Dual-/Quad-Level Translators Note 1: VL must be less than or equal to VCC - 0.4V during normal operation. However, VL can be greater than VCC during startup and shutdown conditions. Note 2: All units are 100% production tested at TA = +25°C. Limits over the operating temperature range are guaranteed by design and not production tested. Note 3: Not production tested. Guaranteed by design. TIMING CHARACTERISTICS (VCC = +1.65V to +3.6V, VL = +1.2V to (VCC - 0.4V), EN = VL, EN = open (MAX3023–MAX3028 TSSOP package only), CIOVL ≤ 15pF, CIOVCC ≤ 40pF, TA = TMIN to TMAX. Typical values are at TA = +25°C.) (Notes 1, 2) PARAMETER SYM B O L CONDITIONS MIN TYP MAX UNITS CIOVCC = 15pF, Figure 1 2.5 CIOVCC = 20pF, Figure 1 3I/O V CC_ Rise Time t RVCC CIOVCC = 40pF, Figure 1 4 ns CIOVCC = 15pF, Figure 1 2.5 CIOVCC = 20pF, Figure 1 3I/O V CC_ Fall Time t FVCC CIOVCC = 40pF, Figure 1 4 ns I/O V CC_ One- S hot Outp ut Im p ed ance 18.5 Ω I/O V L_ Rise Time t RVL CIOVL = 15pF, Figure 2 2.5 ns I/O V L_ Fall Time t FVL CIOVL = 15pF, Figure 2 2.5 ns I/O V L_ One- S hot Outp ut Im p ed ance 12.5 Ω Propagation Delay, Driving I/O VL_ I/OVL-VCC CIOVCC = 15pF, Figure 1 6.5 ns Propagation Delay, Driving I/O V CC_ I/OVCC-VL CIOVL = 15pF, Figure 2 6 ns Part-to-Part Skew ( N ote 3) tPPSKEW CIOVCC = 15pF, CIOVL = 15pF, VCC = 2.5V, VL = 1.8V 4n s Propagation Delay from I/O V L_ to I/O V CC_ after Enable tEN-VCC CIOVCC = 15pF, Figure 3 1000 ns Propagation Delay from I/O V CC_ to I/O V L_ after Enable tEN-VL CIOVL = 15pF, Figure 4 1000 ns C IOVCC = 15p F, C IOVL = 15p F, V L > 1.8V 100Maximum Data Rate C IOVCC = 15p F, C IOVL = 15p F, V L > 1.2V 80 Mbps

MAX13013–MAX13017/MAX3023–MAX3028 +1.2V to +3.6V, 0.1µA, 100Mbps, Single-/Dual-/Quad-Level Translators VL SUPPLY CURRENT vs. SUPPLY VOLTAGE MAX13013 toc01 VCC SUPPLY VOLTAGE (V) VL SUPPLY CURRENT (mA) 3.53.02.5 0.2 0.4 0.6 0.8 1.0 2.0 4.0 DRIVING I/O VL_ VL = 1.8V CIOVCC = 15pF VL SUPPLY CURRENT vs. SUPPLY VOLTAGE MAX13013 toc02 VCC SUPPLY VOLTAGE (V) VL SUPPLY CURRENT (mA) 3.53.02.52.0 0.1 0.2 0.3 0.4 0.5 0.6 1.5 4.0 DRIVING I/O VL_ VL = 1.2V CIOVCC = 15pF VCC SUPPLY CURRENT vs. SUPPLY VOLTAGE MAX13013 toc03 VCC SUPPLY VOLTAGE (V) VCC SUPPLY CURRENT (mA) 3.53.02.5 2.0 4.0 DRIVING I/O VL_ VL = 1.8V CIOVCC = 15pF VCC SUPPLY CURRENT vs. SUPPLY VOLTAGE MAX13013 toc04 VCC SUPPLY VOLTAGE (V) VCC SUPPLY CURRENT (mA) 3.53.02.52.0 1.5 4.0 DRIVING I/O VL_ VL = 1.2V CIOVCC = 15pF VL SUPPLY CURRENT vs. TEMPERATURE MAX13013 toc05 TEMPERATURE (°C) VL SUPPLY CURRENT (mA) 603510-15 2.4 2.8 3.2 3.6 4.0 2.0 -40 85 DRIVING I/O VCC_ CIOVL = 15pF VCC SUPPLY CURRENT vs. TEMPERATURE MAX13013 toc06 TEMPERATURE (°C) VCC SUPPLY CURRENT (mA) 603510-15 -40 85 DRIVING I/O VCC_ CIOVL = 15pF VL SUPPLY CURRENT vs. CAPACITIVE LOAD ON I/O VCC_ MAX13013 toc07 CAPACITIVE LOAD (pF) VL SUPPLY CURRENT (mA) 302010 0.2 0.4 0.6 0.8 1.0 04 0 DRIVING I/O VL_ VCC SUPPLY CURRENT vs. CAPACITIVE LOAD ON I/O VCC_ MAX13013 toc08 CAPACITIVE LOAD (pF) VCC SUPPLY CURRENT (mA) 302010 04 0 DRIVING I/O VL_ RISE/FALL TIME vs. CAPACITIVE LOAD ON I/O VCC_ MAX13013 toc09 CAPACITIVE LOAD (pF) RISE/FALL TIME (ns) 302010 0.3 0.6 0.9 1.2 1.5 04 0 DRIVING I/O VL_ tRISE tFALL Typical Operating Characteristics (Data rate = 100Mbps, VCC = 3.3V, VL = 1.8V, TA = +25°C, unless otherwise noted.)

MAX13013–MAX13017/MAX3023–MAX3028 +1.2V to +3.6V, 0.1µA, 100Mbps, Single-/Dual-/Quad-Level Translators Typical Operating Characteristics (continued) (Data rate = 100Mbps, VCC = 3.3V, VL = 1.8V, TA = +25°C, unless otherwise noted.) RISE/FALL TIME vs. CAPACITIVE LOAD ON I/O VL_ MAX13013 toc10 CAPACITIVE LOAD (pF) RISE/FALL TIME (ns) 15105 0.2 0.4 0.6 0.8 1.0 1.2 02 0 DRIVING I/O VCC_ tRISE tFALL PROPAGATION DELAY vs. CAPACITIVE LOAD ON I/O VCC_ MAX13013 toc11 CAPACITIVE LOAD (pF) PROPAGATION DELAY (ns) 302010 04 0 DRIVING I/O VL_ tPLH tPHL PROPAGATION DELAY vs. CAPACITIVE LOAD ON I/O VL_ MAX13013 toc12 CAPACITIVE LOAD (pF) PROPAGATION DELAY (ns) 15105 02 0 DRIVING I/O VCC_ tPLH tPHL tEN-VCC vs. TEMPERATURE (CIOVCC = 15pF) MAX13013 toc13 TEMPERATURE (°C) tEN-VCC (ns) 603510-15 170 190 210 230 250 150 -40 85 tEN-VL vs. TEMPERATURE (CIOVL = 15pF) MAX13013 toc14 TEMPERATURE (°C) tEN-VL (ns) 603510-15 100 -40 85 TYPICAL I/O VL_ DRIVING (CIOVCC = 40pF) MAX13013 toc15 4ns/div 2V/div 2V/div TYPICAL I/O VCC_ DRIVING (CIOVL = 15pF) MAX13013 toc16 4ns/div 2V/div 2V/div TYPICAL I/O VL_ DRIVING (VCC = 1.65V, VL = 1.2V, CIOVCC = 40pF) MAX13013 toc17 4ns/div 1V/div 1V/div TYPICAL I/O VCC_ DRIVING (VCC = 1.65V, VL = 1.2V, CIOVL = 15pF) MAX13013 toc18 4ns/div 1V/div 1V/div

MAX13013–MAX13017/MAX3023–MAX3028 +1.2V to +3.6V, 0.1µA, 100Mbps, Single-/Dual-/Quad-Level Translators Pin Description—MAX13013/MAX13014/ MAX3023 (Bidirectional Devices) PIN MAX3023 MAX13013 MAX13014 TSSOP 4 x 3 UCSP SC70 3 x 2 UCSP SOT23 3 x 3 UCSP NAME FUNCTION

1 A1 4 B2 7 A2 I/O VL1 Input/Output 1, Referenced to VL

2 B2 — — 6 A3 I/O VL2 Input/Output 2, Referenced to VL

3 A2 5 B1 8 A1 VL

VL Input Voltage, +1.2V ≤ VL ≤ VCC - 0.4V. Bypass VL to GND with a 0.1µF capacitor. 4 — — — — — N.C. No Connection

5 B3 — — — — I/O VL3 Input/Output 3, Referenced to VL

6 A3 — — — — I/O VL4 Input/Output 4, Referenced to VL

7 A4 6 B3 5 B1 EN Active-High Enable Input. If EN is pulled low, all inputs/outputs are in tristate. Drive EN high (VL) for normal operation. Active-Low Enable Input. If EN is pulled high (VL), all inputs/ outputs are in tri-state. Drive EN low for normal operation (MAX3023 TSSOP package only).

9 B4 — — — — I/O VCC4 Input/Output 4, Referenced to VCC

10 C4 — — — — I/O VCC3 Input/Output 3, Referenced to VCC

11 C3 2 A3 4 B3 GND Ground

12 C2 1 A1 1 C1 VCC

VCC Input Voltage, +1.65V ≤ VCC ≤ +3.6V. Bypass VCC to GND with a 0.1µF capacitor.

13 C1 — — 3 C3 I/O VCC2 Input/Output 2, Referenced to VCC

14 B1 3 A2 2 C2 I/O VCC1 Input/Output 1, Referenced to VCC

Pin Description—MAX13015/MAX13016/MAX13017/ MAX3024–MAX3028 (Unidirectional Devices) NAME FUNCTION (Note 4) GND Ground EN Active-High Enable Input. If EN is pulled low, all inputs/outputs are in tri-state. Drive EN high (VL) for normal operation. EN Active-Low Enable Input (MAX3024–MAX3028 TSSOP Package Only). If EN is pulled high (VL), all inputs/outputs are in tri-state. Drive EN low for normal operation. I VL1–I VL4I nputs Referenced to VL, Numbers 1 to 4 O VL1–O VL4 Outputs Referenced to VL, Numbers 1 to 4 I VCC1–I VCC4I nputs Referenced to VCC, Numbers 1 to 4 O VCC1–O VCC4 Outputs Referenced to VCC, Numbers 1 to 4 Note 4: For specific pin numbers, see the Pin Configurations for more information.

allow 100Mbps data transfer in a multivoltage system. sequencing, V L ≥ VCC does not damage the device. of the driver, and the operating voltage range (Table 1). the external source that is driving the translator. transition on the driven side. Table 1. Data Rate Figure 5. Simplified Functional Diagram (One I/O Line)

MAX13013–MAX13017/MAX3023–MAX3028 +1.2V to +3.6V, 0.1µA, 100Mbps, Single-/Dual-/Quad-Level Translators Pin Configurations (continued) TOP VIEW MAX13014 UCSP (BUMPS ON BOTTOM OF DIE) I/O VL2I/O VL1VL GNDEN I/O VCC2I/O VCC1VCC I/O VL2 ENGND VL I/O VL1I/O VCC1 I/O VCC2 VCC SOT23 MAX13014 A B C MAX13015 UCSP (BUMPS ON BOTTOM OF DIE) I VL2I VL1VL GNDEN O VCC2O VCC1VCC I VL2 ENGND VL I VL1O VCC1 O VCC2 VCC SOT23 MAX13015 A B C MAX13016 UCSP (BUMPS ON BOTTOM OF DIE) O VL1I VL2VL GNDEN O VCC2I VCC1VCC I VL2 ENGND VL O VL1I VCC1 O VCC2 VCC SOT23 MAX13016 A B C MAX13017 UCSP (BUMPS ON BOTTOM OF DIE) O VL2O VL1VL GNDEN I VCC2I VCC1VCC O VL2 ENGND VL O VL1I VCC1 I VCC2 VCC SOT23 MAX13017 A B C

MAX13013–MAX13017/MAX3023–MAX3028 +1.2V to +3.6V, 0.1µA, 100Mbps, Single-/Dual-/Quad-Level Translators Pin Configurations (continued) TOP VIEW UCSP (BUMPS ON BOTTOM OF DIE) I/O VL4 ENI/O VL1 A B C 234 VL I/O VL3 I/O VCC4I/O VCC1 I/O VL2 GND I/O VCC3I/O VCC2 VCC I/O VCC1 I/O VCC2 VCC GNDN.C. VL I/O VL2 I/O VL1 MAX3023 MAX3023 I/O VCC3 I/O VCC4 ENEN I/O VL4 I/O VL3 TSSOP UCSP (BUMPS ON BOTTOM OF DIE) I VL4 ENI VL1 A B C 234 VL I VL3 O VCC4O VCC1 I VL2 GND O VCC3O VCC2 VCC O VCC1 O VCC2 VCC GNDN.C. VL I VL2 I VL1 MAX3024 MAX3024 O VCC3 O VCC4 ENEN I VL4 I VL3 TSSOP UCSP (BUMPS ON BOTTOM OF DIE) I VL4 ENO VL1 A B C 234 VL I VL3 O VCC4I VCC1 I VL2 GND O VCC3O VCC2 VCC I VCC1 O VCC2 VCC GNDN.C. VL I VL2 O VL1 MAX3025 MAX3025 O VCC3 O VCC4 ENEN I VL4 I VL3 TSSOP

MAX13013–MAX13017/MAX3023–MAX3028 +1.2V to +3.6V, 0.1µA, 100Mbps, Single-/Dual-/Quad-Level Translators Pin Configurations (continued) TOP VIEW UCSP (BUMPS ON BOTTOM OF DIE) I VL4 ENO VL1 A B C 234 VL I VL3 O VCC4I VCC1 O VL2 GND O VCC3I VCC2 VCC I VCC1 I VCC2 VCC GNDN.C. VL O VL2 O VL1 MAX3026 MAX3026 O VCC3 O VCC4 ENEN I VL4 I VL3 TSSOP UCSP (BUMPS ON BOTTOM OF DIE) I VL4 ENO VL1 A B C 234 VL O VL3 O VCC4I VCC1 O VL2 GND I VCC3I VCC2 VCC I VCC1 I VCC2 VCC GNDN.C. VL O VL2 O VL1 MAX3027 MAX3027 I VCC3 O VCC4 ENEN I VL4 O VL3 TSSOP UCSP (BUMPS ON BOTTOM OF DIE) O VL4 ENO VL1 A B C 234 VL O VL3 I VCC4I VCC1 O VL2 GND I VCC3I VCC2 VCC I VCC1 I VCC2 VCC GNDN.C. VL O VL2 O VL1 MAX3028 MAX3028 I VCC3 I VCC4 ENEN O VL4 O VL3 TSSOP

MAX13013–MAX13017/MAX3023–MAX3028 +1.2V to +3.6V, 0.1µA, 100Mbps, Single-/Dual-/Quad-Level Translators Ordering Information/Selector Guide (continued) PART TEMP RANGE PIN-PACKAGE PACKAGE CODE TOP MARK NUMBER OF VL → VCC TRANSLATORS Number of VCC → VL TRANSLATORS EN EN MAX13013EBT-T -40°C to +85°C 3 x 2 UCSP-6 B6-1 ADF 11 ✓ — MAX13014EKA -40°C to +85°C 8 SOT23 — AEKB 22 ✓ — MAX13014EBL-T -40°C to +85°C 3 x 3 UCSP-9 B9-2 AEN 22 ✓ — MAX13015EKA* -40°C to +85°C 8 SOT23 — AEKC 20 ✓ — MAX13015EBL-T* -40°C to +85°C 3 x 3 UCSP-9 B9-2 AEO 20 ✓ — MAX13016EKA* -40°C to +85°C 8 SOT23 — AEKD 11 ✓ — MAX13016EBL-T* -40°C to +85°C 3 x 3 UCSP-9 B9-2 AEP 11 ✓ — MAX13017EKA* -40°C to +85°C 8 SOT23 — AEKE 02 ✓ — MAX13017EBL-T* -40°C to +85°C 3 x 3 UCSP-9 B9-2 AEQ 02 ✓ — MAX3023EUD -40°C to +85°C 14 TSSOP — — 4 4 ✓ ✓ MAX3023EBC-T -40°C to +85°C 4 x 3 UCSP-12 B12-1 ABW 44 ✓ — MAX3024EUD* -40°C to +85°C 14 TSSOP — — 4 0 ✓ ✓ MAX3024EBC-T* -40°C to +85°C 4 x 3 UCSP-12 B12-1 ABX 40 ✓ — MAX3025EUD* -40°C to +85°C 14 TSSOP — — 3 1 ✓ ✓ MAX3025EBC-T* -40°C to +85°C 4 x 3 UCSP-12 B12-1 ABY 31 ✓ — MAX3026EUD* -40°C to +85°C 14 TSSOP — — 2 2 ✓ ✓ MAX3026EBC-T* -40°C to +85°C 4 x 3 UCSP-12 B12-1 ABZ 22 ✓ — MAX3027EUD* -40°C to +85°C 14 TSSOP — — 1 3 ✓ ✓ MAX3027EBC-T* -40°C to +85°C 4 x 3 UCSP-12 B12-1 ACA 13 ✓ — MAX3028EUD* -40°C to +85°C 14 TSSOP — — 0 4 ✓ ✓ MAX3028EBC-T* -40°C to +85°C 4 x 3 UCSP-12 B12-1 ACB 04 ✓ — Chip Information TRANSISTOR COUNT: MAX13013: 261 MAX13014–MAX13017: 444 MAX3023–MAX3028: 791 PROCESS: BiCMOS *Future product—contact factory for availability.

MAX13013–MAX13017/MAX3023–MAX3028 +1.2V to +3.6V, 0.1µA, 100Mbps, Single-/Dual-/Quad-Level Translators

Package Information

(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline info rmation go to www.maxim-ic.com/packages.) SC70, 6L.EPS

MAX13013–MAX13017/MAX3023–MAX3028 +1.2V to +3.6V, 0.1µA, 100Mbps, Single-/Dual-/Quad-Level Translators Package Information (continued) (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline info rmation go to www.maxim-ic.com/packages.) 6L, UCSP.EPS G 1 121-0097 PACKAGE OUTLINE, 3x2 UCSP

MAX13013–MAX13017/MAX3023–MAX3028 +1.2V to +3.6V, 0.1µA, 100Mbps, Single-/Dual-/Quad-Level Translators Package Information (continued) (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline info rmation go to www.maxim-ic.com/packages.) SOT23, 8L .EPS REV.DOCUMENT CONTROL NO.APPROVAL PROPRIETARY INFORMATION TITLE: 3.002.60EC E1E BETWEEN 0.08mm AND 0.15mm FROM LEAD TIP. 8. MEETS JEDEC MO178. 0.60 1.75 0.30 e L 1.50E1 0.65 BSC. 1.95 REF. 0.25 BSC. GAUGE PLANE SEATING PLANE C C L PIN 1 I.D. DOT (SEE NOTE 6) LC LC D DETAIL "A" 5. COPLANARITY 4 MILS. MAX. NOTE: 7. SOLDER THICKNESS MEASURED AT FLAT SECTION OF LEAD 4. PACKAGE OUTLINE INCLUSIVE OF SOLDER PLATING. 3. PACKAGE OUTLINE EXCLUSIVE OF MOLD FLASH & METAL BURR. HEEL OF THE LEAD PARALLEL TO SEATING PLANE C. 2. FOOT LENGTH MEASURED FROM LEAD TIP TO UPPER RADIUS OF 1. ALL DIMENSIONS ARE IN MILLIMETERS. L A1A 0.45 1.30 0.15 1.45 MAX 0.28b 0.90A2 0.00A1 0.90A MINSYMBOL 3.00 0.20 2.80D 0.09C SEE DETAIL "A" LC b e D 121-0078 PACKAGE OUTLINE, SOT-23, 8L BODY

MAX13013–MAX13017/MAX3023–MAX3028 +1.2V to +3.6V, 0.1µA, 100Mbps, Single-/Dual-/Quad-Level Translators Package Information (continued) (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline info rmation go to www.maxim-ic.com/packages.) 9LUCSP, 3x3.EPS I 1 121-0093 PACKAGE OUTLINE, 3x3 UCSP

Package Information (continued) (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline info rmation go to www.maxim-ic.com/packages.) MAX13013–MAX13017/MAX3023–MAX3028 +1.2V to +3.6V, 0.1µA, 100Mbps, Single-/Dual-/Quad-Level Translators TSSOP4.40mm.EPS

MAX13013–MAX13017/MAX3023–MAX3028 +1.2V to +3.6V, 0.1µA, 100Mbps, Single-/Dual-/Quad-Level Translators Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circu it patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 21 © 2004 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products. Package Information (continued) (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline info rmation go to www.maxim-ic.com/packages.) 12L, UCSP 4x3.EPS F 1 121-0104 PACKAGE OUTLINE, 4x3 UCSP

Product Information

MAX3023 specifications and overview.

Summary

+1.2V to +3.6V, 0.1uA, 100Mbps, Single-/Dual-/Quad-Level Translators Rev 1; 8/04

Description

+1.2V to +3.6V, 0.1uA, 100Mbps, Single-/Dual-/Quad-Level Translators Rev 1; 8/04

Source title MAX3023 Datasheet(PDF) - Maxim Integrated Products

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