MAPDCC0007 MA-COM | Alldatasheet

Document overview

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Technical content

Features

  • Low Cost
  • Small Size and Low Profile
  • Industry Standard SOW-16 SMT Plastic Package
  • Excellent Repeatability (Lot-to-Lot Variation)
  • Typical Isolation: 23 dB
  • Typical Amplitude Balance: 0.3 dB
  • Typical Insertion Loss: 1.0 dB
  • Lead-Free SOW-16 Package
  • 100% Matte Tin Plating over Copper
  • Halogen-Free “Green” Mold Compound
  • 260°C Reflow Compatible
  • RoHS* Compliant Version of DS54-0001

Description

M/A-COM’s MAPDCC0007 is an IC-based mono- lithic power splitter/combiner in a low cost SOW-16 plastic package. This device is ideally suited for ap- plications where PCB real estate is at a premium and standard packaging for automated assembly and low cost are critical. Typical applications include infrastructure, portables and peripheral devices (PCMCIA cards) for wireless standards such as GSM, AMPS, CDPD, RAM and ARDIS. Available in tape and reel. The MAPDCC0007 is fabricated using a passive- integrated circuit process. The process features full- chip passivation for increased performance and reli- ability.

Ordering Information

MAPDCC0007-TR 1000 piece reel MAPDCC0007-TB Sample Test Board Note: Reference Application Note M513 for reel size information. Functional Diagram Pin Configuration1 Pin No. Function Pin No. Function

1 GND 9 GND

2 GND 10 GND

3 RF2 (Out) 11 GND

4 GND 12 RF4 (Out)

5 RF1 (Out) 13 GND

6 GND 14 RF3 (Out)

7 RFIN 15 GND

8 GND 16 GND

  • Restrictions on Hazardous Substances, European Union Directive 2002/95/EC. 1. Pins 1,2,4,6,8,9,10,11,13,15 and 16 must be RF and DC grounded. Pin 1 Pin 16

Low Cost Four-way SMT Power Splitter/Combiner, 824 - 960 MHz Rev. V2 MAPDCC0007 Visit www.macomtech.com for additional data sheets and product information. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. Electrical Specifications: TA = 25°C2 Parameter Frequency Units Min Typ Max Insertion Loss “above 6.0 dB theoretical loss” 824 - 960 MHz dB — 1.0 1.2 Isolation 824 - 960 MHz dB 18 23 — Input VSWR 824 - 960 MHz Ratio — 1.2:1 1.4:1 Output VSWR 824 - 960 MHz Ratio — 1.4:1 1.75:1 Amplitude Balance 824 - 960 MHz dB — 0.3 0.7 Phase Balance 824 - 960 MHz Deg — 2 4 Recommended PCB Configuration Absolute Maximum Ratings 3,4 Parameter Absolute Maximum Input Power 5 1W CW Operating Temperature -40°C to +85°C Storage Temperature -65°C to +150°C 3. Exceeding any one or combination of these limits may cause permanent damage to this device. 4. M/A-COM does not recommend sustained operation near these survivability limits. 5. With internal load dissipation of 0.125W maximum. Handling Procedures Please observe the following precautions to avoid damage: Static Sensitivity GMIC Circuits are sens itive to electrostatic discharge (ESD) and can be damaged by static electricity. Proper ESD control techniques should be used when handling these devices. 2. All specifications apply with a 50-ohm source and load impedance.

Low Cost Four-way SMT Power Splitter/Combiner, 824 - 960 MHz Rev. V2 MAPDCC0007 Visit www.macomtech.com for additional data sheets and product information. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. VSWR vs. Frequency Isolation vs. Frequency Typical Performance Curves Insertion Loss vs. Frequency (above theoretical split loss) 0.00 0.50 1. 0 0 1. 50 2.00 824 858 892 926 960 Fre qu e n cy (MHz ) Insertion Loss (dB) 1. 0 0 1. 2 5 1. 50 1. 75 2.00 824 858 892 926 960 Fre qu e n cy (MHz ) VSWR Input Output 824 858 892 926 960 Fre qu e n cy (MHz ) Isolation (dB) Lead-Free, SOW-16† † Reference Application Note M538 for lead-free solder reflow recommendations.