MAMG-000912-090PSM MA-COM | Alldatasheet

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Technical content

Features

 Compact Size (14x24 mm2)  GaN on SiC D-Mode Transistor Technology  Fully Matched, de-coupled DC and RF  Typical Bias: 50 V, Class AB  Intended for Pulsed RADAR Applications  Output Power > 90 W, with 30 dB Gain and 60% Power Added Efficiency  Pulse width up to 600 μs.  MTTF = 600 years (TJ < 200°C)  Thermally Enhanced Laminate LGA Package  RoHS* Compliant. Lead Free Reflow Compatible  MSL-3

Description

The MAMG -000912-090PSM is a 2 -stage GaN power module in a “True SMT” laminate package. The module is fully matched. Under pulsed conditions, it can deliver output power greater than

90 W, with 30 dB typical associated gain and 60%

typical power added efficiency. Flexible design allows for gate and/or drain pulsing. Additional features include a gate voltage sense port for use in temperature compensation or pulse droop compensation. The overall package size is very small, only 14x24 mm 2. The module’s compact size, combined with excellent RF performance makes this product an ideal solution for pulsed RADAR applications where small size, light weight and performance (SWaP) are the key. Ordering Information1 Functional Schematic Pin Configuration Pin No. Function

1 RF IN

2 VG 3

3 VD1

4 NC 4

5 VG sense 5

6 Ground

7 VD2

8 RF OUT

9 NC 4

MAMG-000912-090PSM Bulk Packaging MAMG-0T0912-090PSM 100 Piece Reel MAMG-A00912-090PSM Evaluation Board2 3. One common gate voltage for both stages in the module. 4. Do not connect. 5. Do not connect to ground if not used. 1. Reference Application Note M513 for reel size information. 2. Includes one module surface mounted onto board. * Restrictions on Hazardous Substances, European Union Directive 2002/95/EC.

960-1215 MHz 90 W 2-Stage GaN Module Surface Mount Laminate Package Rev. V2 MAMG-000912-090PSM 2 2 2 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macomtech.com for additional data sheets and product information. For further information and support please visit: https://www.macomtech.com/content/customersupport Electrical Specifications RF FUNCTIONAL TESTS: Freq. = 960-1215 MHz, VDD = 50 V, IDQ = 300 mA, TA = 25°C, ZL = 50 Ω, Pulse Width = 300 us, Duty Cycle = 10%, PIN = 19 dBm Frequency f 960 1090 1215 MHz Peak Output Power 7 POUT 90 95 - 105 105 W Power Gain GP - 30 - 31 31 dB Power Added Efficiency PAE 55 58 - 63 63 % Pulse Droop 8 Droop - 0.2 0.3 0.2 0.2 dB 2nd Harmonic 2F0 - -30 - -30 -30 dBc 3rd Harmonic 3F0 - -40 - -40 -40 dBc Load Mismatch Stability VSWR-S - 5:1 - 5:1 5:1 - Load Mismatch Tolerance VSWR-T - 6:1 - 6:1 6:1 - 6. Typical RF performance measured in RF evaluation board (see layout on page 3). 7. Peak output power measured at center of pulse. 8. Pulse droop measured between 10% and 90% of pulse. Parameter Absolute Maximum Input Power 24 dBm Drain Supply Voltage (pulsed), VDD +55 V Gate Supply Voltage Range, VGG -9 V to -2.5 V Supply Current, IDD 4.0 A Power Dissipation, Pulsed Mode @ 85ºC 80 W Junction Temperature14 200 °C Operating Temperature -40°C to +85°C Storage Temperature -65°C to +150°C ESD Maximum - Human Body Model (HBM) 600 V ESD Maximum - Charged Device Model (CDM) 300 V Absolute Maximum Ratings 9,10,11,12,13 9. Exceeding any one or combination of these limits may cause permanent damage to this device. 10. MACOM does not recommend sustained operation near these survivability limits. 11. For saturated performance it is recommended that the sum of (3 * VDD + abs (VGG)) < 175 V. 12. CW operation is not recommended. 13. Operating at nominal conditions with TJ ≤ 200°C will ensure MTTF > 1 x 106 hours. Junction temperature directly affects device MTTF and should be kept as low as possible to maximize lifetime. 14. Junction Temperature (TJ) = TC + ӨJC * ((V * I) - (POUT - PIN)). Typical Transient Thermal Resistance ӨJC = 1.6 °C/W (50V, 600 μs pulses, 10% duty cycle)

960-1215 MHz 90 W 2-Stage GaN Module Surface Mount Laminate Package Rev. V2 MAMG-000912-090PSM 3 3 3 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macomtech.com for additional data sheets and product information. For further information and support please visit: https://www.macomtech.com/content/customersupport Parts List Parts are measured and sampled in the evaluation board shown on the left. The board is made of 8-mil thick RO4003C and is bolted onto a Ni -plated Aluminum plate. Electrical and thermal ground is provided using a Cu -filled via -hole array (pictured below). Very few external components are used, as DC blocks are not required. Evaluation Board Outline Part Case Style Value C1 Radial 100 F C2 0603 10 nF Turning the device ON 1. Set VG to the pinch-off value (VP), typically -6 V. 2. Turn on VD to nominal voltage (50 V). 3. Increase VG to desired quiescent current. 4. Apply RF power to desired level. Turning the device OFF 1. Turn off RF power. 2. Decrease VG down to VP. 3. Turn off VD. 4. Turn off VG. Bias Sequencing

960-1215 MHz 90 W 2-Stage GaN Module Surface Mount Laminate Package Rev. V2 MAMG-000912-090PSM 4 4 4 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macomtech.com for additional data sheets and product information. For further information and support please visit: https://www.macomtech.com/content/customersupport Applications Section Output Power vs. Frequency Pulse Droop vs. Frequency Typical Large-Signal Performance Curves Over Temperature: Pulsed RF, 300 μs Pulses, 10% Duty Cycle, VDD = 45 V, IDQ = 300 mA, PIN = 19 dBm Power Added Efficiency vs. Frequency 100 105 110 115 120 125Peak Output Power (W) Freq (MHz) -40 0 +25 +50 +85 70Power Added Eff (%) Freq (MHz) -40 0 +25 +50 +85 0.00 0.10 0.20 0.30 0.40 0.50 Pulse Droop (dB) Freq (MHz) -40 0 +25 +50 +85

960-1215 MHz 90 W 2-Stage GaN Module Surface Mount Laminate Package Rev. V2 MAMG-000912-090PSM 5 5 5 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macomtech.com for additional data sheets and product information. For further information and support please visit: https://www.macomtech.com/content/customersupport Applications Section Max. Transient Channel Temp. vs. Pulse Width (VDD = 35 V) Maximum Transient Channel Temperature (Based on IR-Scan Measurements) Pulsed RF, IDQ = 300 mA, PIN = 19 dBm, TC = 80°C 100 105 110 115 120 125 130Channel T emperature (°C) Pulse Duration (s) 5% duty 10% duty 20% duty 100 105 110 115 120 125 130 135 140 145 150 155 160 165 170Channel T emperature (°C) Pulse Duration (s) 5% duty 10% duty 20% duty 115 120 125 130 135 140 145 150 155 160 165 170 175 180 185 190 195 200Channel T emperature (°C) Pulse Duration (s) 5% duty 10% duty Max. Transient Channel Temp. vs. Pulse Width (VDD = 45 V) Max. Transient Channel Temp. vs. Pulse Width (VDD = 50 V)

960-1215 MHz 90 W 2-Stage GaN Module Surface Mount Laminate Package Rev. V2 MAMG-000912-090PSM 6 6 6 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macomtech.com for additional data sheets and product information. For further information and support please visit: https://www.macomtech.com/content/customersupport Handling Procedures Please observe the following precautions to avoid damage: Static Sensitivity Gallium Nitride Devices and Circuits are sensitive to electrostatic discharge (ESD) and can be damaged by static electricity. Proper ESD control techniques should be used when handling these devices. Package Outline 15,16,18 15. All dimensions are in inches. 16. Reference Application Note S2083 for lead -free solder reflow recommendations. Plating is Ni/Pd/Au. 17. Landing pattern indicates solder mask opening. Cu -filled via-holes under the ground are used for optimal thermal performance. Recommended pattern: 8 -mil diameter, 8 -mil spacing. 18. Layout drawing available upon request. Recommended Landing Pattern 15,16,17,18