MAFR0.5A JUXING | Alldatasheet
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Technical content
Features
Ideal for automated placement Glass passivated chip junction Fast switching for high efficiency High forward surge capability High temperature soldering： 260℃/10 seconds at terminals Component in accordance to RoHS 2002/95/1 and WEEE 2002/96/EC Major Ratings and Characteristics Mechanical Date Case: JEDEC MSMA molded plastic body over glass passivated chip Terminals: Solder plated, solderable per J-STD-002B and JESD22-B102D Polarit y : Laser band denotes cathode end I F(AV) 0.5 A V RRM
50 V to 1000 V
I FSM 15 A t rr 150nS, 250nS, 500nS V F 1.3 V T j max. 150 °C y Maximum Ratings & Thermal Characteristics A = 25 °C unless otherwise noted)
Electrical Characteristics
A = 25 °C unless otherwise noted) Note 2: Pulse test:300μs pulse width,1% duty cycle. Thermal resistance from junction to lead (1) R θJL Operating junction and storage temperature range T T STG Maximum repetitive peak reverse voltage V RRM Maximum RMS voltage V RMS Maximum DC blocking voltage V DC j MAFR 0.5A MAFR 0.5B MAFR 0.5D MAFR 0.5GItems Symbol MAFR 0.5J MAFR 0.5K MAFR 0.5M UNIT 50 100 200 400 600 800 1000 V 35 70 140 280 420 560 700 V 50 100 200 400 600 800 1000 V
0.5 AMaximum average forward rectified current I
F(AV) 15 A 35 ℃/W Peak forward surge current 8.3 ms single half sine-wave superimposed on rated load I FSM –55 to +150 ℃ MAFR0.5A~ MAFR0.5G MAFR0.5K~ MAFR0.5MMAFR0.5J UNIT I F =0.5A (2) V F 1.3 μAReverse current V R DC T j =25℃ T j =125℃ I R 100 Instantaneous forward voltage V Items Test conditions Symbol 8p FTypical junction capacitance 4.0V,1.0MHz C J 500 nSReverse recovery time I F = 0.5 A , I R = 1.0 A , I rr = 0.25 A t rr 150 250 http://www.trr-jx.com MAFR0.5A~MAFR0.5M Surface Mount Fast Recovery Rectifiers
A =25 ℃ unless otherwise noted) http://www.trr-jx.com MAFR0.5A~MAFR0.5M Surface Mount Fast Recovery Rectifiers
Product is intended for use in general electronics applications. Product should be worked less than the ratings; if exceeded, may cause permanent damage.or introduce latent failure mechanisms. The absolute maximum ratings are rated values and must not be exceeded during operation. The following are the general derating methods you design a circuit with a device. I F(AV) We recommend that the worst case current be no greater than 80% . I FSM : This rating specifies the non-repetitive peak current. This is only applied for an abnormal operation, which the general during the lifespan of the device. T J : Derate this rating when using a device in order to ensure high reliability. We recommend that the device be used at a T J of below 125°C. TRR is registered trademark of Rising-sun Technology. Rising-sun Technology reserves the right to make changes to any product in this specification to improve reliability,functional characteristics,or design without notice. Rising-sun Technology does not assure any liability arising out of the applications or any product described in this specification. Rising-sun Technology advises customers to obtain the latest version of the device information before placing orders to verify that the required information is current. http://www.trr-jx.com MAFR0.5A~MAFR0.5M Surface Mount Fast Recovery Rectifiers