MADS-001317-1500 MA-COM | Alldatasheet

Document overview

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  • PDF pages: 5

Technical content

Features

  • Usable Past 80GHz
  • Low Series Resistance
  • Low Capacitance
  • High Cutoff Frequency
  • Silicon Nitride Passivation
  • Polyimide Scratch Protection
  • Lead Free (RoHS Compliant)
  • Designed for Easy Circuit Insertion
  • Available in Pocket Tape and Reel
  • Can be Mounted with Solder or Conductive Epoxy Description and Applications M/A-COM's MADS-001317-1500 single is a gal- lium arsenide flip chip Schottky barrier diode. This device is fabricated on OMCVD epitaxial material using a process designed for high de- vice uniformity and extremely low parasitics. This diode is fully passivated with silicon nitride and has an additional layer of polyimide for scratch protection. The protective coating pre- vents damage to the junction during automated or manual handling. The flip chip configuration is suitable for pick and place insertion. This de- vice with can be attached with solder or conduc- tive epoxy. The high cutoff frequency of this diode allows use through millimeter wave fre- quencies. Typical applications include single and double balanced mixers in PCN transceiv- ers and radios, police radar detectors, and auto- motive radar detectors. MADS -001317– 1500

Ordering Information

MADS-001317-1500AG Gel Pack MADS-001317-1500AP Pocket Tape and Reel

Solderable GaAs Flip Chip Schottky Diode Rev. V3 MADS-001317-1500 Visit www.macomtech.com for additional data sheets and product information. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. Electrical Specifications @ + 25 °C Parameters and Test Conditions Symbol Units MADS-001317-1500 Min. Typ. Max. Junction Capacitance at 0V at 1 MHz Cj pF .020 Total Capacitance at 0V at 1 MHz 1 Ct pF .030 .045 .060 Dynamic Resistance at 9.5 - 10.5mA Rs Ohms 4 7 Forward Voltage at +1mA Vf1 Volts .60 .70 .80 Reverse Breakdown Voltage at -10uA Vbr Volts 4.5 7 Notes: 1. Total capacitance is equivalent to the sum of junction capacitance Cj and parasitic capacitance Cp.

Solderable GaAs Flip Chip Schottky Diode Rev. V3 MADS-001317-1500 Visit www.macomtech.com for additional data sheets and product information. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. Absolute Maximum Ratings 1 Parameter Absolute Maximum Operating Temperature -65 °C to +125 °C Storage Temperature -65 °C to +150 °C Incident LO Power +20 dBm Incident RF Power +20 dBm . Mounting Temperature +260 °C Electrostatic Discharge ( ESD ) Classification 2 Class 0 1. Operation of this device above any one of these parameters may cause permanent damage. 2. Human Body Model Forward Current vs Temperature 0.00 0.01 0.10 1.00 10.00 100.00 Forward Voltage (V) Forward Current (mA) - 50°C +125°C 25°C

Solderable GaAs Flip Chip Schottky Diode Rev. V3 MADS-001317-1500 Visit www.macomtech.com for additional data sheets and product information. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. Mounting Techniques Die attach for these devices is made simple through the use of surface mount die attach technology. This chip was designed to be inserted onto hard or soft substrates with the junction side down. This chip can be mounted with conductive epoxy or with solder. Solder Die Attach : This device can be mounted with Sn63/Pb37 or RoHS compliant solder. Typical reflow profiles are provided on M/A-Com application note M538, “ Surface Mounting Instructions” which can be found @ www.macomtech.com Epoxy Die Attach : This device can also be attached with conductive epoxy. The assembly can be preheated to 125 - 150°C. Use a minimum amount of epoxy. Cure epoxy as per manufacturer’s instructions. Handling Procedures The following precautions should be observed to avoid damaging these chips: Cleanliness: The chips should be handled in a clean environment. Do not attempt to clean die after installation. Static Sensitivity: Schottky barrier diodes are ESD sensitive and can be damaged by static electricity. Proper ESD techniques should be used when handling these devices. General Handling: The protective polymer coating on the active areas of these die provides scratch protection, particularly for the metal air bridge which contacts the anode. Die can be handled with tweezers or vacuum pickups and are suitable for use with automatic pick-and-place equipment.

Solderable GaAs Flip Chip Schottky Diode Rev. V3 MADS-001317-1500 Visit www.macomtech.com for additional data sheets and product information. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. Flip Chip Outline Drawing 1. Pad finish is .2 microns of gold over 4 microns of nickel.