MADS-001317-1320AG MA-COM | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 3
Technical content
Features
- Low Series Resistance, 4 Ω
- Low Capacitance, 45 fF
- High Cutoff Frequency
- Silicon Nitride Passivation
- Polyimide Scratch Protection
- Solderable Bump Die Attach
Description
M/A-COM’s MADS-001317-1320AG is a Gallium Arsenide Flip-Chip Schottky diode with solder bumps. These devices are fabricated on OMCVD epitaxial wafers using a process designed for high device uniformity and extremely low parasitics. This device can be used up to 80 GHz. This diode is fully passivated with silicon nitride and has an additional layer of a polymer for scratch protection. The protective coatings prevent damage to the junction during handling and circuit attachment.
Applications
The high cutoff frequency of this device allows use through millimeter wave fr equencies. Typical Ap- plications include single and double balanced mix- ers in PCN transceivers, radios, police radar detec- tors and automotive radar detectors. Mounting Side with Solder Bumps Parameters and Test Conditions Symbol Units Min. Typ. Max. Junction Capacitance at 0V at 1 MHz Cj pF — 0.020 — Total Capacitance at 0V at 1 MHz1 Ct pF .030 0.045 0.060 Dynamic Resistance at 9.5 - 10.5 mA Rd Ohms — 4 7 Reverse Breakdown Voltage at 10 µA Vb Volts 4.5 7 — Forward Voltage at 1mA Vf Volts .60 .70 .80 Electrical Specifications TA = 25°C 1. Total Capacitance is equivalent to the sum of j unction capacitance (Cj) and parasitic capacitance (Cp).
- North America Tel: 800.366.2266 / Fax: 978.366.2266 Visit www.macom.com for additional data sheets and product information. M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. GaAs Solder Bump Flip Chip Schottky Diode M/A-COM Products Rev. V2 MADS-001317-1320AG ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under develop- ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. 0.013” (2) PL 0.011” (2) PL 0.008” Circuit Mounting Dimensions (Inches)
- North America Tel: 800.366.2266 / Fax: 978.366.2266 Visit www.macom.com for additional data sheets and product information. M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. GaAs Solder Bump Flip Chip Schottky Diode M/A-COM Products Rev. V2 MADS-001317-1320AG ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under develop- ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. Device Installation Procedures The following guidelines should be observed to avoid damaging GaAs Flip-Chips. Cleanliness These devices should be handled in a clean environment. Do not attempt to clean die after installation. Static Sensitivity Gallium Arsenide Schottky diodes are ESD sensitive and can be damaged by stat ic electricity. Since Schottky diodes are rated as Class 0, proper ESD techniques should be used when handling these devices. General Handling These devices have a polymer layer which provides scr atch protection for the junction area and the anode air bridge. Die can be handled with plastic tweezers or picked and placed automatically with a #27 tip vacuum pen- cil. Assembly Requirements using Tin Lead Solder This Flip Chip Diode employs a 6 µm thick, Sn 63/Pb 37 Solderable interface as part of the 50 µm high solder bump. These chips are designed to be soldered onto hard or soft substrates with the junction side down. They should be mounted onto silkscreened circuits using 60/40 Sn /Pb solder paste. A typical profile for a Sn 63/Pb 37soldering process is provided in Application Note, M538 Surface Mounting Instructions on the M/A-COM web- site www.macom.com Typical Spice Parameters Is (A) Rs (Ω) N Ct0 (pF) M Ik (A) Vj (V) FC BV (V) IBV (A) Absolute Maximum Ratings @ 25°C 2 Parameter Maximum Ratings Operating Temperature -65°C to +125°C Storage Temperature -65°C to +150°C Incident LO Power +20 dBm Incident RF Power +20 dBm Mounting Temperature +300°C for 10 seconds.
Ordering Information
MADS-001317-1320AG Gel Pack 2. Exceeding these limits may cause permanent damage.