MADP-064908-131000 MACOM | Alldatasheet
Document overview
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Technical content
Features
- No Wirebonds Required
- Rugged Silicon-Glass Construction
- Silicon Nitride Passivation & Polymer Scratch Protection
- Ultra-Low Parasitic Capacitance and Inductance
- Higher RF C.W. Power Handling
- Better Performance than Alternative Packaged Devices Description and Applications This device is a Silicon-Glass PIN diode chip fabricated with M/A-COM’s patented HMIC p rocess. This 8.0 µm I-region length device features 6 silicon pedestals embedded in a low loss, low dispersion glass. The diodes are formed on the top of a pedestal and connections to the backside of the device are facilitated by making the pedestal sid ewalls electrically conductive. Selective backside metallization is applied producing a surface mount device. The topside is f ully encapsulated with silicon nitride and has an additional polymer layer for scratch protection. These protective coatings pr event damage to the junction and the anode air -bridge during handling and assembly. The vertical Silicon Diode topology provid es for a highly efficient heat transfer medium. These packageless devices are suitable for usage in Higher ( 3 W Avg ) Incident Power Switches. Small Parasitic Inductance and Excellent RC Constant make the devices ideal for Absorptive SPST, Reflective SP 2T Switches, and Attenuator Circuits, where higher P1db and Power Handling values are required. Absolute Maximum Ratings1 @ TA = +25 °C (unless otherwise specified) 1. Operation of this device above any one of these parameters may cause permanent damage. Parameter Absolute Maximum Forward Current 250 mA Reverse Voltage l – 100 V l Operating Temperature -55 °C to +125 °C Storage Temperature -55 °C to +150 °C Junction Temperature +175 °C C.W. Incident Power (dBm) Mounting Temperature +300 °C for 10 seconds +35 dBm Dim Inches Millimeters Min. Max. Min. Max. A 0.060 0.062 1.524 1.575 B 0.036 0.038 0.914 0.965 C 0.004 0.008 0.102 0.203 D 0.011 0.012 0.279 0.305
0604 Case Style - ODS-1310 (Topview)
- Backside Metal: 0.1microns thick. 2. Shaded Areas Indicate Backside Ohmic Gold Contacts. C D D D D D D D D Side View 4 3 2 1 6 5 Circuit Side
Surface Mount Monolithic Integrated PIN Diode Chip:
0604 Unconnected Double Tee
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information.
- North America Tel: 800.366.2266 / Fax: 978.366.2266 Visit www.macom.com for additional data sheets and product information. MADP-064908-131000 Surmount TM PIN Chip V1 Electrical Specifications @ +25 °C, per Diode Junction Symbol Conditions Units Min. Typ. Max. CT -40 V, 1 MHz1 pF 0.05 0.07 CT -40 V, 1 GHz1,3 pF 0.04 0.06 RS 10 mA, 1 GHz2,3 Ω 5.0 VF 10 mA V 0.83 1.00 VR -10 µA V l – 70 l l – 100 l IR -70 V µA l – 0.1 l l – 10 l TL + 10 mA / -6 mA ns 200 θ TH 1A / 10 mA °C / W 150 1. Total capacitance, CT, is equivalent to the sum of Junction Capacitance ,Cj, and Parasitic Capacitance, Cpar. 2. Series resistance RS is equivalent to the total diode resistance : Rs = Rj ( Junction Resistance) + Rc ( Ohmic Resistance) 3. Rs, CT, TL, θ TH are measured on an HP4291A Impedance Analyzer with die mounted in an ODS -186 package with Sn 60/Pb 40 Solder Equivalent 0604 Style Double Tee Equivalent Circuit 2 3 Top View Notes: 1. Ports 2 and 5 have a Connected Cathode-Anode Node. 2. Ports 1,3,4, and 6 Have a Singular, Un-Connected Node.
Surface Mount Monolithic Integrated PIN Diode Chip: M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information.
- North America Tel: 800.366.2266 / Fax: 978.366.2266 Visit www.macom.com for additional data sheets and product information. MADP-064908-131000 Surmount TM PIN Chip V1 Assembly Guidelines Handling All semiconductor chips should be handled with care to avoid damage or contamination from perspira tion and skin oils. The use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components. Bulk handling should insure that abrasion and mechanical shock are minimized. Bonding Attachment to a circuit board is made simpl e through the use of surface mount technology. Mounting pads are conveniently located on the bottom surface of these devices and are removed from the active junction locations. These devices are well suited for solder attachment onto hard and soft substrates. The use of 80 Au / 20 Sn or Sn 60 / Pb 40 solder is recommended. Conductive silver epoxy for die attachment, approximately 2 mils in uniform thickness may also be used for lower Incident power applications ( < 1 W Average Power ). When soldering these devices to a hard substrate, hot gas die bonding is preferred. We recommend utilizing a vacuum tip and force of 60 to 100 grams applied normal to the top surface of the device. When soldering to soft substrates, it is recommended to use a lead -tin interface at the circuit board mounting pads. Position the die so that its mounting pads are aligned with the circuit board mountin g pads and reflow the solder by heating the circuit trace near the mounting pad while applying 60 to 100 grams of force perpend icular to the top surface of the die. The solder joint must Not be made one at a time, creating un-equal heat flow and thermal stress. Solder reflow should Not be performed by causing heat to flow through the top surface of the die. Since the HMIC glass is transparent, the edges of the mounting pads closest to each other can be visually inspected through the die after attach is completed. A typical profile for a Sn 60/ Pb 40 Soldering process is provided in Application Note, “ M538 ” “ Surface Mounting Instructions “ on the MA-COM website www.macom.com
Surface Mount Monolithic Integrated PIN Diode Chip: M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information.
- North America Tel: 800.366.2266 / Fax: 978.366.2266 Visit www.macom.com for additional data sheets and product information. MADP-064908-131000 Surmount TM PIN Chip V1 HMIC Die SN7406, SN7416 TTL Open Collector Gate Driver ( X2 ) J3 J2 B3 Bias B2 Bias 22 pF 22 pF 22 pF 15 nH 15 nH +5V +5 V 22 pF +5V +5V 15 nH 3,6 Circuit Applications : SP2T All Series Reflective Switch with +5V and TTL Logic Control ( 2- 18 GHz ) 100 Ω 100 Ω J22 pF +1.8 V 22 pF
Surface Mount Monolithic Integrated PIN Diode Chip: M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information.
- North America Tel: 800.366.2266 / Fax: 978.366.2266 Visit www.macom.com for additional data sheets and product information. MADP-064908-131000 Surmount TM PIN Chip V1 RF Truth Table for Reflective SP2T using Singular Power Supply: + 5V, + I Only RF State B2 Diode Bias B3 Diode Bias J1 – J2 Low Loss & J1– J3 Isolation + 3.6 V @ + 14 mA +0.5 V @ 0 mA J1 – J3 Low Loss & J1– J2 Isolation +0.5 V @ 0 mA + 3.6 V @ + 14 mA Notes: 1. Diode Forward Voltage Differential ( Δ Vf ) @ 15 mA = 0.9 V 2. Insertion Loss Diode Bias = ( + 5V – (2)* 0.9 V – 1.8 V ) / ( 100 Ω ) = 14 mA
Surface Mount Monolithic Integrated PIN Diode Chip: M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information.
- North America Tel: 800.366.2266 / Fax: 978.366.2266 Visit www.macom.com for additional data sheets and product information. MADP-064908-131000 Surmount TM PIN Chip V1 Circuit Applications : SPST All Series Absorptive Switch with +5V and TTL Logic Control ( 2- 18 GHz ) HMIC Die 22 pF 15 nH 1 2 3,4 22 pF TTL DRIVER +5V -5V 22 pF 15 nH B1 Bias 43 Ω
Surface Mount Monolithic Integrated PIN Diode Chip: M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information.
- North America Tel: 800.366.2266 / Fax: 978.366.2266 Visit www.macom.com for additional data sheets and product information. MADP-064908-131000 Surmount TM PIN Chip V1 RF Truth Table for Absorptive SPST using + 5V, – 5V Power Supplies RF State TTL Value B1 Diode Bias J1 – J2 Low Loss 0 - 1.8 V @ -20 mA J1– J2 Isolation 1 + 2.7 V @ + 20 mA Notes: 1. Diode Forward Voltage Differential ( Δ Vf ) @ 20 mA = 0.9 V 2. Diode Rs @ 20 mA = 3.5 Ω 3. Insertion Loss Diode Bias = ( – 1.8 V ) @ -20 mA from a Constant Current Source 4. Off Isolation Diode Back Bias Voltage through (2) Diodes = | – ( +2.7 V – 0 V ) | = | – 2.7 V |.
Surface Mount Monolithic Integrated PIN Diode Chip: M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information.
- North America Tel: 800.366.2266 / Fax: 978.366.2266 Visit www.macom.com for additional data sheets and product information. MADP-064908-131000 Surmount TM PIN Chip V1 Circuit Applications : SPST All Series Reflective Switch with +5V and TTL Logic Control ( 2- 18 GHz ) SN7406, SN7416 Open Collector Gate Driver HMIC Die 1 2 3,4 5 6 15 nH 22 pF J1 J2 B1 Bias +5V +5V 15 nH 22 pF 22 pF 1 k Ω 47 Ω RF Truth Table for Reflective SPST using Singular Power Supply: + 5V, + I Only RF State TTL Value B1 Diode Bias J1 – J2 Low Loss 0 + 0.5 V @ +20 mA J1– J2 Isolation 1 +5.0 V @ 0 mA
Surface Mount Monolithic Integrated PIN Diode Chip: M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information.
- North America Tel: 800.366.2266 / Fax: 978.366.2266 Visit www.macom.com for additional data sheets and product information. MADP-064908-131000 Surmount TM PIN Chip V1 MADP-064908 SPICE Model PinDiodeModel NLPINM1 Ffe=1.0 Af=1.0 Kf=0.0 Imax=1.0E+6 A/m^2 Fc=0.5 M=0.5 Vj=0.7 V Cj0=0.06 pF Rs=0.1 Ohm Tau=0.20 usec Cmin=0.05 pF Rr=20 K Ohm Wi=7.5 um Un=900 cm^2/V-sec Vi=0.0 V Is=1.0E-14 A wPmax=3.0 W wBv=80 V Equivalent per Diode Schematic Notes : Rs = 2 * Rvia + Rp Rp Cp Ls Rvia Rvia + _