MADP-030025-13140P

MADP-017025-1314 MA-COM | Alldatasheet

Document overview

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Technical content

Features

♦ 0603 Outline ♦ Surface Mount ♦ 25µm I-Region Length Devices ♦ No Wirebonds Required ♦ Silicon Nitride Passivation ♦ Polymer Scratch Protection ♦ Low Parasitic Capacitance and Inductance ♦ High Average and Peak Power Handling

Description

This device is a silicon, glass PIN diode surmount chip fabricated with M/A-COM’s patented HMIC TM process. This device features two silicon pedestals embedded in a low loss, low dispersion glass. The diode is formed on the top of one pedestal and connections to the backside of the device are facilitated by ma king the pedestal sidewalls electrically conductive. Selective backside metallization is applied producing a surface mount device. This vertical topology provides for exceptio nal heat transfer. The topside is fully encapsulated with silicon nitride and has an additional polymer layer for scratch and impact protection. These protective coatings prevent damage to the junction and the anode air-bridge during handling and assembly.

Applications

These packageless devices are suitable for usage in moderate incident power, ≤50dBm/C.W. or where the peak power is ≤75dBm, pulse width is 1 µS, and duty cycle is 0.01%. Their low parasitic inductance, 0.4 nH, and excellent RC constant, make these devices a superior choice for higher frequency switch elements when compared to their plastic package counterparts Parameter Absolute Maximum Forward Current 500 mA Reverse Voltage - 135 V Operating Temperature -55°C to +125°C Storage Temperature -55 °C to +150°C Junction Temperature +175°C C.W. Incident Power +44dBm MADP-017025 +47dBM MADP-030025 Mounting Temperature +280°C for 30 seconds Peak Incident Power (dBm) +50 dBm, 10 µS, 1% duty

SURMOUNT™ 25µM PIN Diodes RoHS Compliant Rev. V5 MADP-017025-1314 MADP-030025-1314 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Electrical Specifications @ TA = 25°C (unless otherwise noted) Notes: 1) Total capacitance, C T, is equivalent to the sum of Junction Capacitance ,Cj, and Parasitic Capacitance, Cpar. 2) Series resistance R S is equivalent to the total diode resistance : Rs = Rj ( Junction Resistance) + Rc ( Ohmic Resistance) 3) R s and CT are measured on an HP4291A Impedance Analyzer with die mounted in an ODS213 package with 80/20, Au/Sn solder. MADP-0XX025 Series Typical Spice Parameters @ +25°C Parameter Symbol Conditions Units Min Typ Max Min Typ Max MADP-017025 MADP-030025 Capacitance 1 C T - 40V, 1MHz 1 pF 0.23 0.29 0.50 0.56 Capacitance 1 C T - 40V, 1GHz 1,3 pF 0.23 0.50 Capacitance 1, 85°C C T - 40V, 1GHz 1,3 pF 0.22 - Resistance 2 R S +10mA, 1GHz 2,3 Ω 1.01 0.65 Resistance 2 R S +70mA, 1GHz 2,3 Ω 0.64 0.45 Resistance 2, 85°C R S +10mA, 1GHz 2,3 Ω 1.48 - Resistance 2, 85°C R S +70mA, 1GHz 2,3 Ω 1.03 - Forward Voltage V F +10mA V 0.74 0.90 0.73 0.90 Reverse Leakage Current IR | -135V | µA - 10 - 10 Third Order Intercept Point IP3 F1 = 1800MHz F2 = 1810MHz Input Power = +39dBm CW I bias = +70mA dBm 76 77 C.W. Thermal Resistance RqJL IH = 0.5A, IL= 10mA °C/W 30 13 Lifetime T L +10mA / -6mA ( 50 % - 90 % V ) uS 2.3 2.8 Spice Parameter N RS IS IK BV IBV Ct CJO VJ M FC Cpar_Cj Units - Ω A (mA) (Volts) (µA) (pF) (pF) (Volts) - - (F)

SURMOUNT™ 25µM PIN Diodes RoHS Compliant Rev. V5 MADP-017025-1314 MADP-030025-1314 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. MADP-0XXX15 Series Typical Performance Curves @ +25°C Ct vs. V Rs vs. I Ct vs. Freq. Ls vs. Freq. Rs vs. Freq. Ls vs. I 0.00 0.10 0.20 0.30 0.40 0.50 0.60 0.70 0.80 0.90 1.00 0 1 02 03 04 0 Voltage (V) Ct @ 1GHz (pF) MADP-017025 MADP-030025 0.10 1.00 10.00 0.001 0.01 0.1 Current (A) Rs @ 1GHz (ohm) MADP-017025 MADP-030025 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 Frequency (GHz) Ct (pF) MADP-17025 MADP-300250V 10V 40V 10V 40V 0.02 0.04 0.06 0.08 0.1 0.12 0.14 0.16 0.18 0.2 Frequency (GHz) Ls @ 5, 10, 20mA (nH) MADP-17025 MADP-30025 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 Frequency (GHz) Rs (ohm) MADP-017025 10mA 20mA MADP-030025 10mA 20mA A A 0.00 0.02 0.04 0.06 0.08 0.10 0.12 0.14 0.16 0.18 0.20 Current (A) Ls @ 1GHz (nH) MADP-017025 MADP-030025

SURMOUNT™ 25µM PIN Diodes RoHS Compliant Rev. V5 MADP-017025-1314 MADP-030025-1314 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Assembly Guidelines Handling All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin oils. The use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components. Bulk handling should insure that abrasion and mechanical shock are minimized. Bonding Attachment to a circuit board is made simple through the use of surface mount technology. Mounting pads are conveniently located on the bottom surface of these devic es and are removed from the active junction locations. These devices are well suited for solder or conductive epoxy attachment onto hard and soft substrates. The use of 60/40, Pb/Sn, 80/20, Au/Sn or any other lead-free so lder is recommended to achieve the lowest series resistance and optimum heat sink. When soldering these devices to a har d substrate, hot gas die bonding is preferred. We recommend utilizing a vacuum tip and applying a force of 40 - 60 grams to the top surface of the device. When soldering, position the die so that its mounting pads are aligne d with the circuit board mounting pads and reflow the solder by heating the circuit trace near the mounting pads while applying 40 to 60 grams of force perpendicular to the top surface of the die. Both mounting pads should be heat ed simultaneously so that the solder under both pads flows at the same time. The solder joint should not be made one at a time. By doing so, would create an un-equal heat flow and potentially create thermal stress to the chip. Solder reflow should not be performed by causing heat to flow through the top surface of the die. Die should be uniformly heated in a re-flow oven. Proper flow is ea sily determined looking down from the top since the HMIC glass is transparent and the edges of the mounting pads can be visua lly inspected through the die after attachment is complete. A typical soldering process profile and handling instructions ar e provided in Application Notes, M538 Surface Mounting Instructions and M541 Bonding and Handling Procedures on the MA-COM website at www.macomtech.com. Conductive silver epoxy may also be used for die attachme nt, in lower Incident power applications where the average power is < 1 W. Apply a thin controlled amount approximately 1- 2 mils thick to minimize ohmic and thermal stresses. Take care not to br idge the gap between the chip pads with epoxy. A thin epoxy fillet should be visible around the perimeter of the pads a fter placement to ensure full coverage. Cure per epoxy per manufacturer’s recommended schedule.

Ordering Information

MADP-017025-13140G 100 piece gel pack MADP-017025-13140P 3000 piece reel MADP-030025-13140P 3000 piece reel MADP-030025-13140G 100 piece gel pack