MADP-000504-10720T

MADP-000504-10720T_15 MA-COM | Alldatasheet

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 6

Technical content

Features

• High Power Handling
• Low Loss / Low Distortion
• Leadless Low Inductance MELF Package
• Non-Magnetic
• Surface Mountable
• RoHS Compliant
• MSL 1

Applications

The MADP-000504-10720T MELF is well suited for use in low loss, low distortion, UHF and VHF high power switching circuits. It is specifically designed to operate in high magnetic fields and to tune or protect RF coils in MRI circuits. This device is designed to meet the most demanding electrical and mechanical environments. Parameter Absolute Maximum Forward Voltage1,2 1.0 V Reverse Voltage1,2 500V Operating Temperature -65°C to +175°C Storage Temperature -65°C to +200°C Mounting Temperature +260°C for 30 seconds Absolute Maximum Ratings @ 25°C 1. Exceeding these limits may cause permanent damage to the device. 2. Values will de-rate linearly over temperature. Package Style 1072 Dot Denotes Cathode

Ordering Information

MADP-000504-10720T Tape and reel Quantity 1500 pcs Tape and reel information can be found in Application Note M513 on the M/A-COM website

• North America Tel: 800.366.2266 / Fax: 978.366.2266 Visit www.macom.com for additional data sheets and product information. M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Non Magnetic MELF PIN Diode MADP-000504-10720T ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under develop- ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. Electrical Specifications @ TA = +25°C Parameters Symbols Conditions Units Min. Typ. Max. Total Capacitance1 C T100V -100 V @ 1 MHz pF — — 0.50 Package Capacitance C p — pF 0.16 Series Resistance R S +100 mA @ 100 MHz Ω — — 0.60 Minority Carrier Lifetime T L I F = +10 mA / IR = -6 mA µS — 1.0 — Forward Voltage VF + 50 mA V — — 1.0 Reverse Leakage Current -I R -500 V nA — — | -100 | Thermal Resistance2 θ — °C/W — 16 20 Power Dissipation2,3 Pd — W — 7.5 3rd Order Input Intermodulation Distortion IIP3 Power In = +10dBm Freq. = 1000 MHz Spacing = 1 MHz dBm — >54 — Thermal Resistance4 θ — °C/W — 48 51 Power Dissipation4,5 Pd — W — — 2.9 I Region Thickness — — µm 44 1. Total capacitance Ct = Cj (Chip Junction C apacitance) + Cp (Parasitic Package Capacitance) 2. Diode attached to an infinite heatsink. 3. De-rate linearly by -50 mw/°C to 0W @ +125 °C . 4. Diode in air. 5. De-rate linearly by -19.3 mw/°C to 0W @ +125 °C Series Resistance vs. Forward Current Capacitance vs. Reverse Voltage 0 2 04 06 08 0 1 0 0

100 MHz

Rs (Ohms) Forward Bias (mA) 0.46 0.47 0.48 0.49 0.5 0.51 0.52 0.53 0.54 0 2 04 06 08 0 1 0 0 Capacitance (pF) Reverse Bias (V) Typical DC Performance Curves

• North America Tel: 800.366.2266 / Fax: 978.366.2266 Visit www.macom.com for additional data sheets and product information. M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Non Magnetic MELF PIN Diode MADP-000504-10720T ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under develop- ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. Typical RF Performance Curves (50 – 4000 MHz) MOUNTED IN A SERIES CONFIGURATION Input Return Loss Output Return Loss -50 -40 -30 -20 -10 01234 S11 Mag (dB) Frequency (GHz) -50 -40 -30 -20 -10 01234 S22 Mag (dB) Frequency (GHz) Insertion Loss Isolation -50 -40 -30 -20 -10 01234 -10V -25V Isolation (dB) Frequency (GHz) -0.5 -0.4 -0.3 -0.2 -0.1 01234 IL (10mA) IL (50mA) IL (100mA) Insertion Loss (dB) Frequency (GHz)

• North America Tel: 800.366.2266 / Fax: 978.366.2266 Visit www.macom.com for additional data sheets and product information. M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Non Magnetic MELF PIN Diode MADP-000504-10720T ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under develop- ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. Typical RF Performance Curves (50 – 4000 MHz) MOUNTED IN A SHUNT CONFIGURATION Insertion Loss Isolation -35 -30 -25 -20 -15 -10 01234 10mA 50mA 100mA Isolation (dB) Frequency (GHz) Input Return Loss Output Return Loss -50 -40 -30 -20 -10 01234 S22 Mag (dB) Frequency (GHz) -50 -40 -30 -20 -10 01234 S11 Mag (dB) Frequency (GHz) -1.6 -1.4 -1.2 -0.8 -0.6 -0.4 -0.2 01234 IL (10V) Insertion Loss (dB) Frequency (GHz)

• North America Tel: 800.366.2266 / Fax: 978.366.2266 Visit www.macom.com for additional data sheets and product information. M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Non Magnetic MELF PIN Diode MADP-000504-10720T ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under develop- ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. Package Outline (1072 MELF ) A A B C Solderable Surfaces Cathode Dimension INCHES MM MIN. MAX. MIN. MAX. A 0.080 0.095 2.032 2.413 B 0.115 0.125 2.921 3.175 C 0.008 0.023 0.203 0.584 Dimension Package Style 1072 inches mm A 0.093 2.36 B 0.050 1.27 C 0.060 1.52 B B C A Circuit Pad Layout

• North America Tel: 800.366.2266 / Fax: 978.366.2266 Visit www.macom.com for additional data sheets and product information. M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Non Magnetic MELF PIN Diode MADP-000504-10720T ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under develop- ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. Handling Procedures The following precautions should be observed to avoid damaging these devices. Cleanliness and Storage MELF devices should be handled and stored in a clean environment. The metalized ends of the device are tin plated for greater solderability and any continuous exposure to high humidity (>80%) for extended periods of time may cause the surface to oxidize. Caution should be taken when storing devices for extended intervals. ESD These devices are susceptible to ESD and are rated Class 1C. General Handling Device can be handled with tweezers or vacuum pickups and are suitable for use with automatic pick-and-place equipment. RoHS The MADP-000504-10720T is fully RoHS compliant meaning it contains less than the maximum allowable concentration of 0.1%, by weight, in homogenous materials for lead, hex chrome, mercury, PBB, PBDE, and 0.01% for cadmium. Mounting Techniques Solder Attach Typical wave soldering or reflow techniques may be used to mount MELF packages to circuit boards. Alloys such as Sn63/Pb37 or any RoHS compliant solder may be used. For more information visit the M/A-COM Tech website and refer to application note M538. Assembly Recommendations
• Devices may be soldered using standard Sn63/Pb37 or any RoHS compliant solder. Leads are bright tin plated to a minimum thickness of 50μm to ensure an optimum connection.
• For recommended Sn/Pb and RoHS soldering time/temperature profiles. See Application Note M538 on the M/A-COM Technology Solutions website. Note: Click links below to view datasheets of other MELF and packaged PIN diodes. PACKAGED_PIN_DIODES and/or MA4P MELF & HIPAX Series