MADA2030G MACOM | Alldatasheet

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Technical content

Features

Attenuation 0.5-dB Steps to 15.5 dB Temperature Stability ±0.1 dB from -55° to +85°C Typical Fast Switching Speed, 3 ns Typical to 90% Guaranteed Specifications(From -55°C to +85°C) Frequency Range DC - 2.0 GHz Nominal Attenuation 0.5 dB Steps to 15.5 dB Max Attenuation Accuracy ±0.15 dB ±3% of Attenuation Setting VSWR W orst Case Setting DC - 2 GHz 1.6:1 Max Reference Insertion Loss DC - 2 GHz 2.3 dB Max DC - 1 GHz 1.9 dB Max Operating Characteristics Impedance 50 Ω Nominal Phase Balance (For any bit or combinations of bits per unit)

2 GHz +4/-6 Degrees Typ

1 GHz +2/-3 Degrees Typ

500 MHz +1/-2 Degrees Typ

Switching Time (50% CTL to 90/10% RF) 3 ns Typ Switching T ransients (Unfiltered) 7 mV Typ Input Power for 1 dB Compression Above 500 MHz +27 dBm Typ

100 MHz +24 dBm Typ

Intermodulation Intercept Point (for two-tone input power up to +5 dBm) Intercept Points IP2 IP3 Above 500 MHz +68 dBm Typ +45 dBm Typ

100 MHz +45 dBm Typ +40 dBm Typ

Control Voltages (Complementary Logic) VINLow 0 to -0.2 V @ 5 µA Max VINHi -5 V @ 75 µA Typ to -8 V @ 250 µA Max Die Size 0.045" x 0.039" x 0.010" (1.14mm x 0.99mm x 0.25mm Typical Performance l l l

V 2.00 Handling,Mounting and Bonding Procedure MADA2030G DA2030 Truth Table Control Input Attenuation VC1 VC2 VC3 VC3 VC4 VC4 VC5 VC5 Settings VinHi VinHi VinHi VinLow V inHi VinLow V inHi VinLow Reference VinLow V inHi VinHi VinLow V inHi VinLow V inHi VinLow .5dB VinHi VinLow V inHi VinLow V inHi VinLow V inHi VinLow 1dB VinHi VinHi VinLow V inHi VinHi VinLow V inHi VinLow 2dB VinHi VinHi VinHi VinLow V inLow V inHi VinHi VinLow 4dB VinHi VinHi VinHi VinLow V inHi VinLow V inLow V inHi 8dB Maximum Ratings A. Control Voltage :-8.5 Vdc B. Max Input RF Power: +34 dBm (500 MHz - 4 GHz) C. Storage Temperature:-65°C to +175°C D. Maximum Operating Temperature:+175°C BondPad Dimensions Inches (mm) Die Size Inches (mm) 0.045" x 0.039" x 0.010" (1.14mm x 0.99mm x 0.25mm) SchematicHandling Precautions Permanent damage to the MADA2030 may occur if the following precautions are not adhered to: A. Cleanliness – The MADA2030 should be handled in a clean e nv i r o n m e n t .DO NOT attempt to clean unit after the MADA2030 is installed. B. Static Sensitivity – All chip handling equipment and personnel should be DC grounded. C. T ransient – Avoid instrument and pow er supply transients while bias is applied to the MADA2030.Use shielded signal and bias cables to minimize inductive pick-up. D. Bias – Apply voltage to either complementary control ports only when the other is grounded.Neither port should be allow ed to “float”. E. General Handling – It is recommended that the MADA2030 chip be handled along the long side of the die with a sharp pair of bent tweezers.DO NOT touch the surface of the chip with fingers or tweezers. Mounting The MADA2030 is back - m e t a l l i zed with Pd/Ni/Au (100/1,000/10,000Å) metallization.It can be die-mounted with AuSn eutectic preforms or with thermally conductive epoxy.The package surface should be clean and flat before attachment. Eutectic Die Attach: A. A 80/20 gold/tin preform is recommended with a work surface temperature of approximately 255°C and a tool temperature of 265°C.When hot 90/10 nitrogen/hydrogen gas is applied, tool tip temperature should be approximately 290°C. B. DO NOT expose the MADA2030 to a temperature greater than 320°C for more than 20 seconds.No more than 3 sec- onds of scrubbing should be required for attachment. Epoxy Die Attach: A. Apply a minimum amount of epoxy and place the MADA2030 into position.A thin epoxy fillet should be visible around the perimeter of the chip. B. Cure epoxy per manufacturer’s recommended schedule. C. Electrically conductive epoxy may be used but is not required. Wire Bonding A. Ball or wedge bond with 1.0 mil diameter pure gold wire. T h e rmo- sonic wirebonding with a nominal stage temperature of 150°C and a ball bonding force of 40 to 50 grams or we d g e bonding force of 18 to 22 grams is recommended.U l t ra s o n i c energy and time should be adjusted to the minimum levels to a c h i eve reliable wirebonds. B. Wirebonds should be started on the chip and terminated on the p a ck a g e. GND bonds should be as short as possibl e ;at least three and no more than four bond wires from ground pads to p a ckage are recommended. RFin, RFout:0.004" x 0.004" (0.100mm x 0.100mm) VC1,VC2,VC3,VC3,VC4,VC4: 0.004" x 0.004" (0.100mm x 0.100mm) GND1,GND2,GND3: 0.009" x 0.004" GND4: 0.004" x 0.004" (0.100mm x 0.100mm) VinLow 0 to -0.2V VinHi -5V to -8V