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Technical content

Features

 Attenuation 0.5-dB Steps to 15.5 dB  Temperature Stability: ± 0.1 dB from –55°C to +85°C Typical  Fast Switching Speed: 3 nS Typical to 90%  Ultra Low DC Power Consumption

Description

M/A-COM’s MADA2030G is a 5 -bit, 0.5 -dB step GaAs MMIC digital attenuator. The MADA2030G is ideally suited for use where high accuracy, fast switching, very low power consumption and low intermodulation products are required at a low cost. Typical applications include radio and cellular equipment, wireless LANS, GPS equipment and other gain/level control circuits. The MADA2030G is fabricated with a monolithic GaAs MMIC using a mature 1 -micron process. The process features full chip passivation for increased performance and reliability.

Ordering Information

Absolute Maximum Ratings 1,2 Parameter Absolute Maximum Input Power

500 MHz - 2 GHz

+34 dBm Control Voltage -8.5 VDC Operating Temperature +175°C Storage Temperature -65°C to +175°C 1. Exceeding any one or combination of these limits may cause permanent damage to this device. 2. M/A-COM does not recommend sustained operation near these survivability limits. Bond Pad Dimensions Bond Pad Dimension Inches (mm) RFIN, RFOUT 0.004 x 0.008 (0.100 x 0.200) VC1, VC2, VC3, VC3, VC4, VC4 VC5, VC5 0.004 x 0.004 (0.100 x 0.100) GND1, GND2, GND3 0.008 x 0.004 (0.200 x 0.100) GND4 0.004 x 0.004 (0.100 x 0.100)

5-Bit GaAs Digital Attenuator DC- 2.0 GHz Rev. V3 MADA2030G 2 2 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support Electrical Specifications: TA = 25°C, Z0 = 50  Parameter Test Conditions Units Min. Typ. Max. Reference Insertion Loss DC - 1.0 GHz DC - 2.0 GHz dB dB 1.9 2.3 Attenuation Accuracy DC - 2.0 GHz ± (0.3 dB ± 3% of attenuation setting in dB) dB VSWR (Worst Case) DC - 2.0 GHz Ratio — — 1.6:1 Phase Balance (For any bit or combinations of bits per unit)

500 MHz

1.0 GHz

2.0 GHz

+1 / -2 +2 / -3 +4 / -6 Switching Characteristics 50% Control to 90% RF, 50% Control to 10% RF Unfiltered Transients nS mV Input Power for 1 dB Compression

100 MHz

for two-tone input power up to +5 dBm for two-tone input power up to +5 dBm (Complementary Logic) VIN Low, 0 to -0.2 V VIN Hi, -5 V VIN Hi, -8 V µA µA µA 250 Handling Procedures Please observe the following precautions to avoid damage: Static Sensitivity Gallium Arsenide Integrated Circuits are sensitive to electrostatic discharge (ESD) and can be damaged by static electricity. Proper ESD control techniques should be used when handling these devices. Truth Table3 3. 0 = VIN Low, 0 to -0.2 V, 1 = VIN Hi, -5 V to -8 V VC1 VC2 VC3 VC3 VC4 VC4 VC5 VC5 Attenuation Setting 1 1 1 0 1 0 1 0 Reference 0 1 1 0 1 0 1 0 0.5 dB 1 0 1 0 1 0 1 0 1 dB 1 1 0 1 1 0 1 0 2 dB 1 1 1 0 0 1 1 0 4 dB 1 1 1 0 1 0 0 1 8 dB 0 0 0 1 0 1 0 1 15.5 dB RF Input 0.5 dB 1 dB 2 dB 4 dB 8 dB RF Output VC1 VC2 VC3 VC3 VC4 VC4 VC5 VC5 Schematic

5-Bit GaAs Digital Attenuator DC- 2.0 GHz Rev. V3 MADA2030G 3 3 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support Typical Performance Curves Attenuation Insertion Loss Worst Case VSWR 1.0 1.2 1.4 1.6 1.8 +25°C +85°C -55°C Frequency (GHz) 1.0 1.2 1.4 1.6 1.8 2.0 +25°C +85°C -55°C Frequency (GHz) 0.5 dB Bit 1 dB Bit 2 dB Bit 4 dB Bit 8 dB Bit 15.5 dB Bit Frequency (GHz)

5-Bit GaAs Digital Attenuator DC- 2.0 GHz Rev. V3 MADA2030G 4 4 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support Handling Procedures Permanent damage to the MADA2030G may occur if the following precautions are not adhered to: A. Cleanliness - The MADA2030G should be handled in a clean environment. DO NOT attempt to clean after the MADA2030G is installed. B. Static Sensitivity - All die handling equipment and personnel should be DC grounded. C. Transients - Avoid instrument and power supply transients while bias is applied to the MADA2030G. Use shielded signal and bias cables to minimize inductive pick-up. D. Bias - Apply voltage to either complementary control ports only when the other is grounded. Neither port should be allowed to ―float‖. E. General Handling - It is recommended that the MADA2030G chip be handled along the long side of the die with a sharp pair of bent tweezers. DO NOT touch the surface of the chip with fingers or tweezers. Mounting The MADA2030G is back-metallized with Pd/Ni/Au (100/1,000/10,000Å) metallization. It can be die-mounted using Au/Sn eutectic preforms or a thermally conductive epoxy. The package surface should be clean and flat before attachment. Eutectic Die Attach: A. An 80/20 Au/Sn preform is recommended with a work surface temperature of approximately 255°C and a tool temperature of 265°C. When hot 90/10 nitrogen/hydrogen gas is applied, tool tip temperature should be approximately 290°C. B. DO NOT expose the MADA2030G to a temperature greater than 320°C for more than 20 seconds. No more than 3 seconds of scrubbing should be required for attachment. Epoxy Die Attach: B Apply a minimum amount of epoxy and place the MADA2030G into position. A thin epoxy fillet should be visible around the perimeter of the die. C Cure epoxy per manufacturer’s recommended schedule. D Electrically conductive epoxy may be used but is not required. Wire Bonding A. Ball or wedge bond with 1.0 mil diameter pure gold wire. Thermosonic wire bonding with a nominal stage temperature of 150°C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Ultrasonic energy and time should be adjusted to the minimum levels to achieve reliable wirebonds. B. Wirebonds should be started on the chip and terminated on the package. GND bonds should be as short as possible; at least three and no more than four bond wires from ground pads to package are recommended.

5-Bit GaAs Digital Attenuator DC- 2.0 GHz Rev. V3 MADA2030G 5 5 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support M/A-COM Technology Solutions Inc. All rights reserved. Information in this document is provided in connection with M/A -COM Technology Solutions Inc ("MACOM") products. These materials are provided by MACOM as a service to its customers and may be used for informational purposes only. Except as provided in MACOM's Terms and Conditions of Sale for such products or in any separate agreement related to this document, MACOM assumes no liability whatsoever. MACOM assumes no responsibility for errors or omissions in these materials. MACOM may make changes to specifications and product descriptions at any time, without notice. MACOM makes no commitment to update the information and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to its specifications and product descriptions. No license, express or implied, by estoppels or otherwise, to any intellectual property rights is granted by this document. THESE MATERIALS ARE PROVIDED "AS IS" WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED, RELATING TO SALE AND/OR USE OF MACOM PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, CONSEQUENTIAL OR INCIDENTAL DAMAGES, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. MACOM FURTHER DOES NOT WARRANT THE ACCURACY OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN THESE MATERIALS. MACOM SHALL NOT BE LIABLE FOR ANY SPECIAL, INDIRECT, INCIDENTAL, OR CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS, WHICH MAY RESULT FROM THE USE OF THESE MATERIALS. MACOM products are not intended for use in medical, lifesaving or life sustaining applications. MACOM customers using or selling MACOM products for use in such applications do so at their own risk and agree to fully indemnify MACOM for any damages resulting from such improper use or sale.