MA5104 ZARLINK | Alldatasheet

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Symbol Parameter Conditions FT Basic Functionality V DD = 4.5V - 5.5V, FREQ = 1MHz VIL = VSS , VIH = VDD , VOL ≤ 1.5V, VOH ≥ 1.5V TEMP = -55°C to +125°C, GPS PATTERN SET GROUP A SUBGROUPS 7, 8A, 8B Figure 9: Functionality Subgroup Definition

1 Static characteristics specified in Tables 4 and 5 at +25°C

2 Static characteristics specified in Tables 4 and 5 at +125°C

3 Static characteristics specified in Tables 4 and 5 at -55°C

7 Functional characteristics specified in Table 9 at +25°C

8A Functional characteristics specified in Table 9 at +125°C 8B Functional characteristics specified in Table 9 at -55°C

9 Switching characteristics specified in Tables 6 and 7 at +25°C

10 Switching characteristics specified in Tables 6 and 7 at +125°C

11 Switching characteristics specified in Tables 6 and 7 at -55°C

Figure 10: Definition of Subgroups

Figure 12: Write Cycle 1. WE must be high during all address transitions. 2. A write occurs during the overlap (TWLWH ) of a low CS, a high CE and a low WE. 3. TWHAV is measured from either CS or WE going high or CE going low, whichever is the earlier, to the end of the write cycle. 4. If the CS low transition occurs simultaneously with, or after, the WE low transition, the output remains in the high impedance state. 5. DATA OUT is the write data of the current cycle, if selected. 6. DATA OUT is the read data of the next address,if selected. 7. T ELWL must be met to prevent memory corruption. ADDRESS TAVAVW TAVWH TAVWL TWLWH (2) TWHAV (3) TELWL (7) (4) TWLQZ WE TAXQX TWLQH DATA OUT (5) (6) HIGH IMPEDANCE DATA VALIDDATA IN TDVWH TWHDX TELWH CS

OUTLINES AND PIN ASSIGNMENTS Figure 13: 18-Lead Ceramic DIL (Solder Seal) - Package Style C Ref Millimetres Inches A1 0.38 - 1.53 0.015 - 0.060 b 0.35 - 0.59 0.014 - 0.023 c 0.20 - 0.36 0.008 - 0.014 H 4.44 - 5.38 0.175 - 0.212 XG406 D W A e b Z H A 1 15° M E C Seating Plane 1810

18 Vdd

13 A10

12 A11

11 Din

Figure 14: 24-Lead Ceramic Flatpack (Solder Seal) - Package Style F 1N C 2A 0 3A 1 4A 2 5A 3 6A 4 7A 5

8 Dout

11 Vss

Min. Nom. Max. A - - 0.105 A1 0.026 - - b 0.015 - 0.019 c 0.003 - 0.006 D 0.590 - 0.610 e - 0.050 - L 0.265 - 0.305 M 0.395 - 0.405 Me 0.30 - - Z 0.005 - 0.045 XG537 M b e D L A c Pin 1 Z M E

Figure 15: Burnin and Radiation Configuration Package Option Burnin Function F C Via Static 1 Static 2 Dynamic Radiation A0 2 1 R 0V 5V F0 5V A1 3 2 R 0V 5V F1 5V A2 4 3 R 0V 5V F2 5V A3 5 4 R 0V 5V F3 5V A4 6 5 R 0V 5V F4 5V A5 7 6 R 0V 5V F5 5V DOUT 8 7 R 0V 5V LOAD 5V WEB 10 8 R 0V 5V F12 5V VSS 11 9 Direct 0V 0V 0V 0V CSB 13 10 R 0V 5V 0V 5V DIN 15 11 R 0V 5V F13 5V A11 16 12 R 0V 5V F11 5V A10 17 13 R 0V 5V F10 5V A9 18 14 R 0V 5V F9 5V A8 21 15 R 0V 5V F8 5V A7 22 16 R 0V 5V F7 5V A6 23 17 R 0V 5V F6 5V VDD 24 18 Direct 5V 5V 5V 5V 1. F0=150KHz, F1=F0/2, F2=F0/4, F3=F0/8 etc. 2. Burnin R=1k 3. Radiation R=10k

ORDERING INFORMATION

For details of reliability, QA/QC, test and assembly options, see ‘Manufacturing Capability and Quality Assurance Standards’ Section 9. Unique Circuit Designator S L C R Radiation Hard Processing 30 kRads (Si) Guaranteed 50 kRads (Si) Guaranteed 100 kRads (Si) Guaranteed Radiation Tolerance C F Ceramic DIL (Solder Seal) Flatpack (Solder Seal) Package Type QA/QCI Process (See Section 9 Part 4) Test Process (See Section 9 Part 3) Assembly Process (See Section 9 Part 2) L C D E B S Rel 0 Rel 1 Rel 2 Rel 3/4/5/STACK Class B Class S Reliability Level MAx5104xxxxx HEADQUARTERS OPERATIONS GEC PLESSEY SEMICONDUCTORS Cheney Manor, Swindon, Wiltshire, SN2 2QW, United Kingdom. Tel: (01793) 518000 Fax: (01793) 518411 GEC PLESSEY SEMICONDUCTORS P .O. Box 660017,

1500 Green Hills Road, Scotts Valley,

California 95067-0017, United States of America. Tel: (408) 438 2900 Fax: (408) 438 5576 CUSTOMER SERVICE CENTRES

  • FRANCE & BENELUX Les Ulis Cedex Tel: (1) 64 46 23 45 Fax: (1) 64 46 06 07
  • GERMANY Munich Tel: (089) 3609 06-0 Fax: (089) 3609 06-55
  • ITALY Milan Tel: (02) 66040867 Fax: (02) 66040993
  • JAPAN Tokyo Tel: (03) 5276-5501 Fax: (03) 5276-5510
  • NORTH AMERICA Scotts Valley, USA Tel: (408) 438 2900 Fax: (408) 438 7023
  • SOUTH EAST ASIA Singapore Tel: (65) 3827708 Fax: (65) 3828872
  • SWEDEN Stockholm Tel: 46 8 702 97 70 Fax: 46 8 640 47 36
  • TAIWAN, ROC Taipei Tel: 886 2 5461260 Fax: 886 2 7190260
  • UK, EIRE, DENMARK, FINLAND & NORWAY Swindon, UK Tel: (01793) 518527/518566 Fax: (01793) 518582 These are supported by Agents and Distributors in major countries world-wide. © GEC Plessey Semiconductors 1995 Publication No. DS3580-3.2 April 1995 TECHNICAL DOCUMENTATION - NOT FOR RESALE. PRINTED IN UNITED KINGDOM. This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves the right to alter without prior knowledge the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request.