LM20EP NSC | Alldatasheet
Document overview
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Technical content
Features
n Rated for full −55˚C to +130˚C range n Available in an SC70 and a micro SMD package n Predictable curvature error n Suitable for remote applications Key Specifications j Accuracy at +30˚C ±1.5 to ±4 ˚C (max) j Accuracy at +130˚C & −55˚C ±2.5 to ±5 ˚C (max) j Power Supply Voltage Range +2.4V to +5.5V j Current Drain 10 µA (max) j Nonlinearity ±0.4 % (typ) j Output Impedance 160 Ω (max) j Load Regulation 0µ A < IL< +16 µA −2.5 mV (max)
Applications
n Selected Military Applications n Selected Avionics Applications
Ordering Information
PART NUMBER VID PART NUMBER NS PACKAGE NUMBER (Note 3) LM20CIM7EP V62/04728-01 MAA05A (Notes 1, 2) TBD TBD Note 1: For the following (Enhanced Plastic) version, check for availability: LM20SIBPEP, LM20SIBPXEP, LM20BIM7EP, LM20BIM7XEP, LM20CIM7XEP, LM20SITLEP, LM20SITLXEP. Parts listed with an "X" are provided in Tape & Reel and parts without an "X" are in Rails. Note 2: FOR ADDITIONAL ORDERING AND PRODUCT INFORMATION, PLEASE VISIT THE ENHANCED PLASTIC WEB SITE AT: www.national.com/ mil Note 3: Refer to package details under Physical Dimensions May 2004 LM20EP Enhanced Plastic 2.4V, 10µA, SC70, micro SMD Temperature Sensor © 2004 National Semiconductor Corporation DS200999 www.national.com
Full-Range Celsius (Centigrade) Temperature Sensor (−55˚C to +130˚C) Operating from a Single Li-Ion Battery Cell Output Voltage vs Temperature 20099902 where: T is temperature, and V O is the measured output voltage of the LM20EP. 20099924 Temperature (T) Typical V O +130˚C +303 mV +100˚C +675 mV +80˚C +919 mV +30˚C +1515 mV +25˚C +1574 mV 0˚C +1863.9 mV −30˚C +2205 mV −40˚C +2318 mV −55˚C +2485 mV Connection Diagrams SC70-5 micro SMD 20099901 Note: - GND (pin 2) may be grounded or left floating. For optimum thermal conductivity to the pc board ground plane pin 2 should be grounded. - NC (pin 1) should be left floating or grounded. Other signal traces should not be connected to this pin. Top View See NS Package Number MAA05A 20099932 Note: - Pin numbers are referenced to the package marking text orientation. - Reference JEDEC Registration MO-211, variation BA - The actual physical placement of package marking will vary slightly from part to part. The package marking will designate the date code and will vary considerably. Package marking does not correlate to device type in any way. Top View See NS Package Number BPA04DDC and TLA04ZZA LM20EP Enhanced Plastic www.national.com 2
Absolute Maximum Ratings (Note 4) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. Supply Voltage +6.5V to −0.2V Output Voltage (V + + 0.6 V) to −0.6 V Output Current 10 mA Input Current at any pin (Note 5) 5 mA Storage Temperature −65˚C to +150˚C Maximum Junction Temperature JMAX) +150˚C ESD Susceptibility (Note 6) : Human Body Model 2500 V Machine Model 250 V Lead Temperature Vapor Phase (60 seconds) +215˚C Infrared (15 seconds) +220˚C Operating Ratings(Note 4) Specified Temperature Range: TMIN ≤ TA ≤ TMAX LM20BEP, LM20CEP with LM20BEP, LM20CEP with LM20SEP with LM20SEP with Supply Voltage Range (V +) +2.4 V to +5.5 V Thermal Resistance, θJA(Note 8) SC-70 micro SMD 415˚C/W 340˚C/W
Electrical Characteristics
Unless otherwise noted, these specifications apply for V + = +2.7 VDC. Boldface limits apply for T A =T J =T MIN to TMAX ; all other limits TA =T J = 25˚C; Unless otherwise noted. Parameter Conditions Typical (Note 9) LM20BEP LM20CEP LM20SEP Units (Limit)Limits Limits Limits (Note 10) (Note 10) (Note 10) Temperature to Voltage Error VO = (−3.88x10−6xT2) (Note 11) Output Voltage at 0˚C +1.8639 V Variance from Curve ±1.0 ˚C Non-Linearity (Note 12) −20˚C ≤ TA ≤ +80˚C ±0.4 % Sensor Gain (Temperature Sensitivity or Average Slope) to equation: V O=−11.77 mV/˚CxT+1.860V −12.2 −11.0 −12.6 −11.0 −12.6 mV/˚C (min) mV/˚C (max) Output Impedance 0 µA ≤ IL ≤ +16 µA (Notes 14, 15) 160 160 160 Ω (max) Load Regulation(Note 13) 0 µA ≤ IL ≤ +16 µA (Notes 14, 15) Quiescent Current +2. 4V ≤ V+ ≤ +5.0V 4.5 7 7 7 µA (max) +2. 4V ≤ V+ ≤ +5.0V 4.5 10 10 10 µA (max) Change of Quiescent Current +2. 4 V ≤ V+ ≤ +5.5V +0.7 µA Temperature Coefficient of −11 nA/˚C LM20EP Enhanced Plastic www.national.com3
other limits TA =T J = 25˚C; Unless otherwise noted. Note 5: When the input voltage (V I) at any pin exceeds power supplies (V I < GND or VI > V+), the current at that pin should be limited to 5 mA. Semiconductor Linear Data Book for other methods of soldering surface mount devices. Note 8: The junction to ambient thermal resistance ( θJA) is specified without a heat sink in still air using the printed circuit board layout shown in Figure 1. Note 9: Typicals are at TJ =T A = 25˚C and represent most likely parametric norm. Note 10: Limits are guaranteed to National’s AOQL (Average Outgoing Quality Level). computed by multiplying the internal dissipation by the thermal resistance. Note 15: Load regulation or output impedance specifications apply over the supply voltage range of +2.4V to +5.5V. Note 16: Line regulation is calculated by subtracting the output voltage at the highest supply input voltage from the output voltage at the lowest supply inputvoltage. a) Layout used for no heat sink measurements. b) Layout used for measurements with small heat hink. FIGURE 1. PCB Lyouts used for thermal measurements.
parabolic transfer function for V O.
- As shown in Figure 2 the error that is introduced by the
ture to which the LM20EP’s leads are attached to. thermal resistance for different conditions. FIGURE 2. First order equations optimized for different temperature ranges.
Physical Dimensions inches (millimeters) unless otherwise noted 5-Lead SC70 Molded Package 4-Bump micro SMD Ball Grid Array Package (Small Bump) The following dimensions apply to the BPA04DDC package shown above: X1=X2 = 853µm ±30µm, X3= 900µm ±50µm LM20EP Enhanced Plastic www.national.com 8
Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 4-Bump micro SMD Ball Grid Array Package (Large Bump) The following dimensions apply to the TLA04ZZA package shown above: X1=X2 = 963µm ±30µm, X3= 600µm ±75µm LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. BANNED SUBSTANCE COMPLIANCE National Semiconductor certifies that the products and packing materials meet the provisions of the Customer Products Stewardship Specification (CSP-9-111C2) and the Banned Substances and Materials of Interest Specification (CSP-9-111S2) and contain no ‘‘Banned Substances’’ as defined in CSP-9-111S2. National Semiconductor Americas Customer Support Center Email: new.feedback@nsc.com Tel: 1-800-272-9959 National Semiconductor Europe Customer Support Center Fax: +49 (0) 180-530 85 86 Email: europe.support@nsc.com Deutsch Tel: +49 (0) 69 9508 6208 English Tel: +44 (0) 870 24 0 2171 Français Tel: +33 (0) 1 41 91 8790 National Semiconductor Asia Pacific Customer Support Center Email: ap.support@nsc.com National Semiconductor Japan Customer Support Center Fax: 81-3-5639-7507 Email: jpn.feedback@nsc.com Tel: 81-3-5639-7560 www.national.com LM20EP Enhanced Plastic 2.4V, 10µA, SC70, micro SMD Temperature Sensor National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the righ t at any time without notice to change said circuitry and specifications.