MA08509D MACOM | Alldatasheet

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Technical content

10W Power Amplifier Die Preliminary Release (8.0-11 GHz) Specifications subject to change without notice. 902179 D /square6 North America: Tel. (800)366-2266, Fax (800)618-8883 /square6 Asia/Pacific: Tel. +81-44-844-8296, Fax +81-44-844-8298 /square6 Europe: Tel. +44 (1344) 869 595, Fax +44 (1344) 300 020 Visit www.macom.com for additional data sheets and product information

FEATURES

  • Broadband Performance
  • 32% Typical Power Added Efficiency
  • 50 Ω Input/Output Impedance
  • Self-Aligned MSAG® MESFET Process V DD V GG RF IN RF OUT V DD Description Maximum Ratings (TA = 25 °C unless otherwise noted) Rating Symbol Value Unit DC Drain Supply Voltage V DD 12 Vdc DC Gate Supply Voltage V GG -6 Vdc RF Input Power PIN 500 mW Junction Temperature TJ 150 °C The MA08509D is a three stage MMIC power amplifier fabricated using M/A-COM’s mature GaAs Self-Aligned MSAG® MESFET Process. This product is fully matched to 50 ohms on both the input and the output. Storage Temperature T STG -40 to +85 ELECTRICAL CHARACTERISTICS VDD = 10.0 V, VGG = -4 V, PIN = 18 dBm, TA = 25 °C Characteristic Symbol Min Typ Max Unit Frequency ƒ 8.0 - 11.0 GHz Output Power, saturated P SAT 39.0 40 41.5 dBm Power Gain, saturated G SAT 20 22 dB Gain Flatness Over Frequency @ Pin = 18 dBm - +/- 1.0 dB Power Added Efficiency (POUT=PSAT) PAE 25 32 % Return Loss S 11 -6 -4 dB Harmonics 2ƒο, 3ƒο -30 dBc Output Stage Thermal Resistance @ Pin = 18 dBm R th 5.4 °C/W

10W Power Amplifier Die (8-11 GHz) MA08509D Specifications subject to change without notice. 902179 D /square6 North America: Tel. (800)366-2266, Fax (800)618-8883 /square6 Asia/Pacific: Tel. +81-44-844-8296, Fax +81-44-844-8298 /square6 Europe: Tel. +44 (1344) 869 595, Fax +44 (1344) 300 020 Visit www.macom.com for additional data sheets and product information

APPLICATION INFORMATION

50 Ω50 Ω RF OUT 100 pF VGG VDD VDD VDD VDD 0.1 µF 5000 pF 5000 pF 0.1 µF 5000 pF 0.1 µF 5000 pF 0.1 µF 5000 pF 0.1 µF 100 pF 5000 pF 0.1 µF VGG Figure 5. Recommended bonding diagram for pedestal Die attach: Use AuSn (80/20) 1-2 mil.

  1. User must apply negative bias to V GG before