M95040 STMICROELECTRONICS | Alldatasheet

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Table 1. Product List Figure 1. Packages

M95040, M95020, M95010 SIGNAL DESCRIPTION During all operations, VCC must be held stable and within the specified valid range: VCC (min) to VCC (max). All of the input and output signals can be held High or Low (according to voltages of VIH, VOH , VIL or VOL , as specified in Table 13. to Table 17.). These signals are described next. Serial Data Output (Q).This output signal is used to transfer data serially out of the device. Data is shifted out on the falling edge of Serial Clock (C). Serial Data Input (D).This input signal is used to transfer data serially into the device. It receives in- structions, addresses, and the data to be written. Values are latched on the rising edge of Serial Clock (C). Serial Clock (C).This input signal provides the timing of the serial interface. Instructions, address- es, or data present at Serial Data Input (D) are latched on the rising edge of Serial Clock (C). Data on Serial Data Output (Q) changes after the falling edge of Serial Clock (C). Chip Select (S ).When this input signal is High, the device is deselected and Serial Data Output (Q) is at high impedance. Unless an internal Write cycle is in progress, the device will be in the Stand- by Power mode. Driving Chip Select (S ) Low se- lects the device, placing it in the Active Power mode. After Power-up, a falling edge on Chip Select (S is required prior to the start of any instruction. Hold (HOLD ).The Hold (HOLD) signal is used to pause any serial communications with the device without deselecting the device. During the Hold condition, the Serial Data Output (Q) is high impedance, and Serial Data Input (D) and Serial Clock (C) are Don’t Care. To start the Hold condition, the device must be se- lected, with Chip Select (S ) driven Low. Write Protect (W).This input signal is used to control whether the memory is write protected. When Write Protect (W) is held Low, writes to the memory are disabled, but other operations remain enabled. Write Protect (W ) must either be driven High or Low, but must not be left floating.

Figure 5. SPI Modes Supported

Figure 7. shows the position of the Status Register Bits b7, b6, b5 and b4 are always read as 1. instructions are accepted by the device. of Write cycles, as summarized in Table 4.. Table 3. Status Register Format of safety features have been built in to the device. – The WEL bit is reset at power-up. cept in the case of RDSR and READ instructions). tion until the present cycle is complete. Table 4. Write-Protected Block Size

The memory is organized as shown in Figure 7.. Figure 7. Block Diagram

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Table 5. Instruction Set

when the previous Write cycle is not yet finished. (BP0, BP1) become frozen at a constant value. updated during the on-going Write cycle. cates the status of the internal Write Enable Latch. be software protected against Write instructions. Figure 10. Read Status Register (RDSR) Sequence

b1 and b0 of the Status Register. shifted in on Serial Data Input (D). – if Write Protect (W) is Low. Figure 11. Write Status Register (WRSR) Sequence

(S) signal can occur at any time during the cycle. ed, if a Write cycle is currently in progress. Table 6. Address Range Bits Figure 12. Read from Memory Array (READ) Sequence Note: Depending on the memory size, as shown in Table 6., the most significant address bits are Don’t Care.

programmed in a single instruction. Figure 13. Byte Write (WRITE) Sequence Note: Depending on the memory size, as shown in Table 6., the most significant address bits are Don’t Care.

Figure 14. Page Write (WRITE) Sequence Note: Depending on the memory size, as shown in Table 6., the most significant address bits are Don’t Care.

M95040, M95020, M95010 POWER-UP AND DELIVERY STATE Power-up State After Power-up, the device is in the following state: – low power Standby Power mode – deselected (after Power-up, a falling edge is required on Chip Select (S ) before any instructions can be started). – not in the Hold Condition – the Write Enable Latch (WEL) is reset to 0 – Write In Progress (WIP) is reset to 0 The BP1 and BP0 bits of the Status Register are unchanged from the previous power-down (they are non-volatile bits). Initial Delivery State The device is delivered with the memory array set at all 1s (FFh). The Block Protect (BP1 and BP0) bits are initialized to 0.

Table 7. may cause permanent damage to the de- Table 7. Absolute Maximum Ratings the European directive on Restrictions on Hazardous Substances (RoHS) 2002/95/EU.

Table 8. Operating Conditions (M950x0) Table 9. Operating Conditions (M950x0-W) Table 10. Operating Conditions (M950x0-R) Table 11. AC Measurement Conditions Note: Output Hi-Z is defined as the point where data out is no longer driven. Figure 15. AC Measurement I/O Waveform

Table 12. Capacitance Note: Sampled only, not 100% tested, at TA=25°C and a frequency of 5MHz. Table 13. DC Characteristics (M950x0, Device Grade 6) Note: 1. For all 5V range devices, the device meets the output requirements for both TTL and CMOS standards.

  1. Previous product: identified by Process Identification letter K.
  2. Present product: identified by Process Identification letter W or G.

Table 14. DC Characteristics (M950x0, Device Grade 3) Note: 1. For all 5V range devices, the device meets the output requirements for both TTL and CMOS standards.

  1. Previous product: identified by Process Identification letter K.
  2. Present product: identified by Process Identification letter W or G.

Table 15. DC Characteristics (M950x0-W, Device Grade 6) Note: 1. Previous product: identified by Process Identification letter K.

  1. Present product: identified by Process Identification letter W or G.

Table 16. DC Characteristics (M950x0-W, Device Grade 3) Note: 1. Previous product: identified by Process Identification letter K.

  1. Present product: identified by Process Identification letter W or G.

Table 17. DC Characteristics (M950x0-R) Note: 1. Preliminary data: Product under development. Please contact your nearest ST sales office for information.

Table 18. AC Characteristics (M950x0, Device Grade 6)

  1. Value guaranteed by characterization, not 100% tested in production.
  2. Previous product: identified by Process Identification letter K.
  3. Present product: identified by Process Identification letter W or G.

Test conditions specified in Table 11. and Table 8.

Table 19. AC Characteristics (M950x0, Device Grade 3)

  1. Value guaranteed by characterization, not 100% tested in production.
  2. Previous product: identified by Process Identification letter K.
  3. Present product: identified by Process Identification letter W or G.

Test conditions specified in Table 11. and Table 8.

Table 20. AC Characteristics (M950x0-W, Device Grade 6)

  1. Value guaranteed by characterization, not 100% tested in production.
  2. Previous product: identified by Process Identification letter K.
  3. Present product: identified by Process Identification letter W or G.

Test conditions specified in Table 11. and Table 9.

Table 21. AC Characteristics (M950x0-W, Device Grade 3)

  1. Value guaranteed by characterization, not 100% tested in production.
  2. Previous product: identified by Process Identification letter K.
  3. Present product: identified by Process Identification letter W or G.

Test conditions specified in Table 11. and Table 9.

Table 22. AC Characteristics (M950x0-R)

  1. Value guaranteed by characterization, not 100% tested in production.
  2. Preliminary data: Product under development. Please contact your nearest ST sales office for information.

Test conditions specified in Table 11. and Table 10.

Figure 18. Output Timing

Figure 19. PDIP8 – 8 pin Plastic DIP, 0.25mm lead frame, Package Outline Note: Drawing is not to scale. Table 23. PDIP8 – 8 pin Plastic DIP, 0.25mm lead frame, Package Mechanical Data

Figure 20. SO8 narrow – 8 lead Plastic Small Outline, 150 mils body width, Package Outline Note: Drawing is not to scale. Table 24. SO8 narrow – 8 lead Plastic Small Outline, 150 mils body width, Package Mechanical Data

Figure 21. TSSOP8 – 8 lead Thin Shrink Small Outline, Package Outline Note: Drawing is not to scale. Table 25. TSSOP8 – 8 lead Thin Shrink Small Outline, Package Mechanical Data

Table 26. Ordering Information Scheme tified Flow (HRCF) is described in the quality note QNEE9801. Please ask your nearest ST sales office for a copy.

  1. Used only for Device Grade 3

Table 27. How to Identify Present and Previous Products by the Process Identification Letter 6 = Industrial temperature range, –40 to 85 °C. 3 = Device tested with High Reliability Certified Flow1.

M95040, M95020, M95010

REVISION HISTORY

Table 28. Document Revision History

  1. Wording changes, according to the standard glossary

24-Oct-2002 3.3 Minimum values for tCHHL and tCHHH changed. Correction to current products, identified by the process letter K not L. Temperature range 5 removed. informaton clarified. tHHQX corrected to tHHQV. Signal Description updated.

M95040, M95020, M95010 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners © 2004 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America