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Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 14
Technical content
Features
- Designed for 2.0 V to 5.5 V VCC Operation
- 4.9 ns tPD at 5 V (typ)
- Inputs/Outputs Over−V oltage Tolerant up to 5.5 V
- IOFF Supports Partial Power Down Protection
- Source/Sink 8 mA at 3.0 V
- Available in SC−88A, SC−74A, TSOP−5, SOT−553, SOT−953 and UDFN6 Packages
- Chip Complexity < 100 FETs
- NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable
- These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant
Figure 1. Logic Symbol package dimensions section on page 7 of this data sheet.
ORDERING INFORMATION
SC−88A DF SUFFIX CASE 419A SOT−553 XV5 SUFFIX CASE 463B XX M/C0071 /C0071 XX = Specific Device Code M = Date Code* /C0071 = Pb−Free Package XX M/C0071 /C0071 XX M/C0071 /C0071 TSOP−5 DT SUFFIX CASE 4831 (Note: Microdot may be in either location) *Date Code orientation and/or position may vary depending upon manufacturing location. UDFN6 1.0 x 1.0 CASE 517BX X M SOT−953 P5 SUFFIX CASE 527AE X M XXX M/C0071 /C0071 SC−74A DBV SUFFIX CASE 318BQ XM UDFN6 1.45 x 1.0 CASE 517AQ1 MARKING DIAGRAMS
Figure 2. Pinout (Top View)
www.onsemi.com MAXIMUM RATINGS Symbol Characteristics Value Unit VCC DC Supply Voltage TSOP −5, SC−88A (NLV) SC−74A, SC−88A, UDFN6, SOT−953 −0.5 to +7.0 −0.5 to +6.5 V VIN DC Input Voltage TSOP −5, SC−88A (NLV) SC−74A, SC−88A, UDFN6, SOT−953 −0.5 to +7.0 −0.5 to +6.5 V VOUT DC Output Voltage (NLV) 1Gxx −0.5 to VCC + 0.5 V 1GTxx Active −Mode (High or Low State) Tri−State Mode (Note 1) Power−Down Mode (VCC = 0 V) −0.5 to VCC + 0.5 −0.5 to +7.0 −0.5 to +7.0 DC Output Voltage Active −Mode (High or Low State) Tri−State Mode (Note 1) Power−Down Mode (VCC = 0 V) −0.5 to VCC + 0.5 −0.5 to +6.5 −0.5 to +6.5 V IIK DC Input Diode Current V IN < GND −20 mA IOK DC Output Diode Current (NLV) 1Gxx V OUT > VCC, VOUT < GND ±20 mA 1GTxx V OUT < GND −20 DC Output Diode Current V OUT < GND −20 mA IOUT DC Output Source/Sink Current ±25 mA ICC or IGND DC Supply Current per Supply Pin or Ground Pin ±50 mA TSTG Storage Temperature Range −65 to +150 °C TL Lead Temperature, 1 mm from Case for 10 secs 260 °C TJ Junction Temperature Under Bias +150 °C /C0113JA Thermal Resistance (Note 2) SC −88A SC−74A SOT−953 UDFN6 377 320 254 154 °C/W PD Power Dissipation in Still Air SC −88A SC−74A SOT−953 UDFN6 332 390 491 812 mW MSL Moisture Sensitivity Level 1 − FR Flammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in − VESD ESD Withstand Voltage (Note 3) Human Body Model Charged Device Model 2000 1000 V ILatchup Latchup Performance (Note 4) ±100 mA Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Applicable to devices with outputs that may be tri −stated. 2. Measured with minimum pad spacing on an FR4 board, using 10mm −by−1inch, 2 ounce copper trace no air flow per JESD51−7. 3. HBM tested to ANSI/ESDA/JEDEC JS −001−2017. CDM tested to EIA/JESD22−C101−F. JEDEC recommends that ESD qualification to EIA/JESD22−A115−A (Machine Model) be discontinued per JEDEC/JEP172A. 4. Tested to EIA/JESD78 Class II.
www.onsemi.com RECOMMENDED OPERATING CONDITIONS Symbol Characteristics Min Max Unit VCC Positive DC Supply Voltage 2.0 5.5 V VIN DC Input Voltage 0 5.5 V VOUT DC Output Voltage (NLV) 1Gxx 0 VCC V 1GTxx Active −Mode (High or Low State) Tri−State Mode (Note NO TAG) Power−Down Mode (VCC = 0 V) VCC 5.5 5.5 DC Output Voltage Active −Mode (High or Low State) Tri−State Mode (Note NO TAG) Power−Down Mode (VCC = 0 V) VCC 5.5 5.5 V TA Operating Temperature Range −55 +125 °C tr, tf Input Rise and Fall Time TSOP −5, SC−88A (NLV) VCC = 3.0 V to 3.6 V VCC = 4.5 V to 5.5 V No Limit No Limit ns/V Input Rise and Fall Time SC −74A, SC−88A, UDFN6, SOT−953 VCC = 2.0 V VCC = 2.3 V to 2.7 V VCC = 3.0 V to 3.6 V VCC = 4.5 V to 5.5 V No Limit No Limit No Limit No Limit Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. DC ELECTRICAL CHARACTERISTICS Symbol Parameter Test Conditions VCC (V) UnitMin Typ Max Min Max Min Max VT+ Positive Input Threshold Voltage (NLV) 3.0 4.5 5.5 1.2 1.75 2.15 2.0 3.0 3.6 2.2 3.15 3.85 2.2 3.15 3.85 2.2 3.15 3.85 V Positive Input Threshold Voltage 3.0 4.5 5.5 2.0 3.0 3.6 2.2 3.15 3.85 2.2 3.15 3.85 2.2 3.15 3.85 V VT− Negative Input Threshold Voltage (NLV) 3.0 4.5 5.5 0.9 1.35 1.65 1.5 2.3 2.9 1.9 2.75 3.35 0.9 1.35 1.65 0.9 1.35 1.65 V Negative Input Threshold Voltage 3.0 4.5 5.5 0.9 1.35 1.65 1.5 2.3 2.9 0.9 1.35 1.65 0.9 1.35 1.65 V VH Hysteresis Voltage 3.0 4.5 5.5 0.30 0.40 0.50 0.85 1.05 1.20 1.60 2.00 2.25 0.30 0.40 0.50 1.60 2.00 2.25 0.30 0.40 0.50 1.60 2.00 2.25 V VOL Maximum Low−Level Output Voltage VIN = VIH or VIL IOL = 50 /C0109A 2.0 3.0 4.5 0.0 0.0 0.0 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 V IOL = 4 mA IOL = 8 mA 3.0 4.5 0.36 0.36 0.44 0.44 0.52 0.52 V IIN Maximum Input Leakage Current VIN = 5.5 V or GND 2.0 to 5.5 ICC Maximum Quiescent Supply Current VIN = VCC or GND 5.5 − − 1.0 − 20 − 40 /C0109A IOFF Power Off Leakage Current (NLV) VIN = 5.5 V 0.0 − − 1.0 − 10 − 10 /C0109A Power Off Leakage Current VIN = 5.5 V or VOUT = 5.5 V 0.0 − − 1.0 − 10 − 10 /C0109A Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions.
www.onsemi.com ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ AC ELECTRICAL CHARACTERISTICS Symbol Parameter Conditions VCC (V) UnitMin Typ Max Min Max Min Max tPZL Propagation Delay, (A or B) to Y (Figures 3 and 4) CL = 50 pF − 10.1 15.4 − 17.5 − 19.6 CL = 50 pF − 6.4 9.7 − 11.0 − 12.3 tPLZ Propagation Delay, (A or B) to Y (Figures 3 and 4) CL = 50 pF − 10.1 15.4 − 17.5 − 19.6 CL = 50 pF − 6.4 9.7 − 11.0 − 12.3 CIN Maximum Input Capacitance − 5.0 10 − 10 − 10 pF CPD Power Dissipation Capacitance (Note 5) Typical @ 25°C, VCC = 5.0 V pF16.0 5. C PD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD /C0015 VCC /C0015 fin + ICC. CPD is used to determine the no−load dynamic power consumption; PD = CPD /C0015 VCC2 /C0015 fin + ICC /C0015 VCC.
www.onsemi.com (See below) Shipping† M74VHC1G135DFT1G SC−88A VZ Q2 3000 / Tape & Reel M74VHC1G135DFT1G−L22038 SC−88A VZ Q2 3000 / Tape & Reel M74VHC1G135DFT2G SC−88A VZ Q4 3000 / Tape & Reel M74VHC1G135DFT2G−L22038 SC−88A VZ Q4 3000 / Tape & Reel NLVVHC1G135DFT2G* SC−88A VZ Q4 3000 / Tape & Reel MC74VHC1G135DBVT1G SC−74A VZ Q4 3000 / Tape & Reel M74VHC1G135DTT1G** TSOP−5 VZ Q4 3000 / Tape & Reel MC74VHC1G135XV5T2G (In Development) SOT−553 TBD Q4 4000 / Tape & Reel MC74VHC1G135P5T5G (In Development) SOT−953 TBD Q2 8000 / Tape & Reel MC74VHC1G135MU1TCG (In Development) UDFN6, 1.45 x 1.0, 0.5P TBD Q4 3000 / Tape & Reel MC74VHC1G135MU3TCG (In Development) UDFN6, 1.0 x 1.0, 0.35P TBD Q4 3000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable. ** Please refer to NLV specifications for this device. Pin 1 Orientation in Tape and Reel
www.onsemi.com PACKAGE DIMENSIONS NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419A −01 OBSOLETE. NEW STANDARD 419A−02. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. DIM A MIN MAX MIN MAX MILLIMETERS 1.80 2.200.071 0.087 INCHES B 1.15 1.350.045 0.053 C 0.80 1.100.031 0.043 D 0.10 0.300.004 0.012 G 0.65 BSC0.026 BSC J 0.10 0.250.004 0.010 K 0.10 0.300.004 0.012 N 0.20 REF0.008 REF S 2.00 2.200.079 0.087 B0.2 (0.008) MM 12 3 A G S D 5 PL H C N J K −B− SC−88A (SC−70−5/SOT−353) CASE 419A−02 ISSUE L /C0466mm inches/C0467SCALE 20:1 0.65 0.025 0.65 0.025 0.50 0.0197 0.40 0.0157 1.9 0.0748 SOLDER FOOTPRINT* *For additional information on our Pb−Free strategy and soldering details, please download the onsemi Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com PACKAGE DIMENSIONS SC−74A CASE 318BQ ISSUE B *For additional information on our Pb−Free strategy and soldering details, please download the onsemi Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIM MIN MAX MILLIMETERS D A 0.90 1.10 b 0.25 0.50 e 0.95 BSC A1 0.01 0.10 c 0.10 0.26 L 0.20 0.60 M 0 10 E 2.50 3.00 123 E D b A c /C0095/C0095 0.20 C AB C SEATING PLANE L M DETAIL A TOP VIEW SIDE VIEW A B END VIEW 1.35 1.65 2.85 3.15 2.40 0.70 DIMENSIONS: MILLIMETERS RECOMMENDED 0.95 PITCH 1.00 e A10.05 DETAIL A
www.onsemi.com PACKAGE DIMENSIONS TSOP−5 CASE 483−02 ISSUE M 0.7 0.028 1.0 0.039 /C0466mm inches/C0467SCALE 10:1 0.95 0.037 2.4 0.094 1.9 0.074 *For additional information on our Pb−Free strategy and soldering details, please download the onsemi Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSION A. 5. OPTIONAL CONSTRUCTION: AN ADDITIONAL TRIMMED LEAD IS ALLOWED IN THIS LOCATION. TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2 FROM BODY . DIM MIN MAX MILLIMETERS A B C 0.90 1.10 D 0.25 0.50 G 0.95 BSC H 0.01 0.10 J 0.10 0.26 K 0.20 0.60 M 0 10 S 2.50 3.00 12 3 S A G B D H C J /C0095/C0095 0.20 C ABT0.102X 2X T0.20 NOTE 5 C SEATING PLANE 0.05 K M DETAIL Z DETAIL Z TOP VIEW SIDE VIEW A B END VIEW 1.35 1.65 2.85 3.15
www.onsemi.com PACKAGE DIMENSIONS SOT−553, 5 LEAD CASE 463B ISSUE C 1.35 0.0531 0.5 0.0197 /C0466mm inches/C0467SCALE 20:1 0.5 0.0197 1.0 0.0394 0.45 0.0177 0.3 0.0118 *For additional information on our Pb−Free strategy and soldering details, please download the onsemi Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* e M0.08 (0.003) X b 5 PL A c −X− −Y− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. D E Y 12 3 L HE DIM A MIN NOM MAX MIN MILLIMETERS 0.50 0.55 0.60 0.020 INCHES b 0.17 0.22 0.27 0.007 c D 1.55 1.60 1.65 0.061 E 1.15 1.20 1.25 0.045 e 0.50 BSC L 0.10 0.20 0.30 0.004 0.022 0.024 0.009 0.011 0.063 0.065 0.047 0.049 0.008 0.012 NOM MAX
0.020 BSC
www.onsemi.com PACKAGE DIMENSIONS SOT−953 CASE 527AE ISSUE E *For additional information on our Pb−Free strategy and soldering details, please download the onsemi Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* E D C A HE 12 3 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF THE BASE MATERIAL. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. DIM MIN NOM MAX MILLIMETERS A 0.34 0.37 0.40 b 0.10 0.15 0.20 C 0.07 0.12 0.17 D 0.95 1.00 1.05 E 0.75 0.80 0.85 e 0.35 BSC L 0.95 1.00 1.05HE X Y PIN ONE INDICATOR b5X X0.08 Y L5X e L2 0.05 0.10 0.15
0.175 REF
BOTTOM VIEW 1.20 DIMENSIONS: MILLIMETERS 0.20 PACKAGE OUTLINE 0.35 PITCH 0.35
www.onsemi.com PACKAGE DIMENSIONS UDFN6, 1.45x1.0, 0.5P CASE 517AQ ISSUE O NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP . ÉÉÉ ÉÉÉ A B E D BOTTOM VIEW b e 0.10 B 0.05 AC C L6X NOTE 3 0.10 C PIN ONE REFERENCE TOP VIEW 0.10 C A A10.05 C 0.05 C C SEATING PLANESIDE VIEW 1 3 DIM MIN MAX MILLIMETERS A 0.45 0.55 A1 0.00 0.05 b 0.20 0.30 D 1.45 BSC E 1.00 BSC e 0.50 BSC L 0.30 0.40 L1 −−− 0.15 DIMENSIONS: MILLIMETERS 0.30 1.24 0.53 PITCH *For additional information on our Pb−Free strategy and soldering details, please download the onsemi Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 0.50 MOUNTING FOOTPRINT PACKAGE OUTLINE DETAIL A L OPTIONAL CONSTRUCTIONS L ÉÉÉ ÉÉÉÉÉÉ DETAIL B MOLD CMPDEXPOSED Cu OPTIONAL CONSTRUCTIONS A2 0.07 REF DETAIL B DETAIL A
www.onsemi.com PACKAGE DIMENSIONS ÉÉÉ ÉÉÉ UDFN6, 1x1, 0.35P CASE 517BX ISSUE O NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20 MM FROM TERMINAL TIP . 4. PACKAGE DIMENSIONS EXCLUSIVE OF BURRS AND MOLD FLASH. *For additional information on our Pb−Free strategy and soldering details, please download the onsemi Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* DIMENSION: MILLIMETERS RECOMMENDED DETAIL A L ALTERNATE TERMINAL CONSTRUCTION ÉÉ ÉÉÇÇ DETAIL B MOLD CMPDEXPOSED Cu ALTERNATE CONSTRUCTION 0.52 1.20 0.25 0.35 PITCH PACKAGE OUTLINE 1 DIM MIN MAX MILLIMETERS A 0.50 0.65 A1 0.00 0.05 A3 0.13 REF b 0.17 0.23 D 1.00 BSC E 1.00 BSC e 0.35 L 0.20 0.40 L1 −−− 0.15 L3 0.26 0.33 A B E D BOTTOM VIEW b e L6X NOTE 3 0.08 C PIN ONE REFERENCE TOP VIEW0.08 C A 0.05 C 0.05 C C SEATING PLANESIDE VIEW 1 3 DETAIL B AM0.07 B C M0.05 C DETAIL A onsemi, , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION TECHNICAL SUPPORT North American Technical Support: Voice Mail: 1 800−282−9855 Toll Free USA/Canada Phone: 011 421 33 790 2910 LITERATURE FULFILLMENT: Email Requests to: orderlit@onsemi.com onsemi Website: www.onsemi.com Europe, Middle East and Africa Technical Support: Phone: 00421 33 790 2910 For additional information, please contact your local Sales Representative