MC74LCX16240 ONSEMI | Alldatasheet
Document overview
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Technical content
Features
- Designed for 2.3 to 3.6 V VCC Operation
- 5.0 V Tolerant − Interface Capability With 5.0 V TTL Logic
- Supports Live Insertion and Withdrawal
- IOFF Specification Guarantees High Impedance When VCC = 0 V
- LVTTL Compatible
- LVCMOS Compatible
- 24 mA Balanced Output Sink and Source Capability
- Near Zero Static Supply Current in All Three Logic States (10 /C0109A) Substantially Reduces System Power Requirements
- Latchup Performance Exceeds 500 mA
- ESD Performance: Human Body Model >2000 V; Machine Model >200 V
- These are Pb−Free Devices* *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. MARKING DIAGRAM TSSOP−48 DT SUFFIX CASE 1201 A = Assembly Location WL = Wafer Lot YY = Year WW = Work Week G = Pb−Free Package LCX16240G AWLYYWW See detailed ordering and shipping information in the package dimensions section on page 3 of this data sheet.
ORDERING INFORMATION
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481 OE2OE1
472 D0O0
463 D1O1
454 GNDGND
445 D2O2
436 D3O3
427 VCCVCC
418 D4O4
409 D5O5
3910 GNDGND
3811 D6O6
3712 D7O7
3613 D8O8
3514 D9O9
3415 GNDGND
3316 D10O10
3217 D11O11
3118 VCCVCC
3019 D12O12
2920 D13O13
2821 GNDGND
2722 D14O14
2623 D15O15
2524 OE3OE4
Figure 1. Pinout: TSSOP−48 (Top View) Table 1. PIN NAMES Figure 2. Logic Diagram
http://onsemi.com Device Package Shipping† MC74LCX16240DTR2 TSSOP−48* 2500 / Tape & Reel M74LCX16240DTR2G TSSOP−48* 2500 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb−Free. MAXIMUM RATINGS Symbol Parameter Value Condition Unit VCC DC Supply Voltage −0.5 to +7.0 V VI DC Input Voltage −0.5 ≤ VI ≤ +7.0 V VO DC Output Voltage −0.5 ≤ VO ≤ +7.0 Output in 3−State V −0.5 ≤ VO ≤ VCC + 0.5 Output in HIGH or LOW State (Note 1) V IIK DC Input Diode Current −50 VI < GND mA IOK DC Output Diode Current −50 VO < GND mA +50 VO > VCC mA IO DC Output Source/Sink Current ±50 mA ICC DC Supply Current Per Supply Pin ±100 mA IGND DC Ground Current Per Ground Pin ±100 mA TSTG Storage Temperature Range −65 to +150 °C Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. I O absolute maximum rating must be observed. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Typ Max Unit VCC Supply Voltage Operating Data Retention Only 2.0 1.5 2.5, 3.3 2.5, 3.3 3.6 3.6 V VI Input Voltage 0 5.5 V VO Output Voltage (HIGH or LOW State) (3−State) VCC 5.5 V IOH HIGH Level Output Current V CC = 3.0 V − 3.6 V VCC = 2.7 V − 3.0 V VCC = 2.3 V − 2.7 V −24 −12 mA IOL LOW Level Output Current V CC = 3.0 V − 3.6 V VCC = 2.7 V − 3.0 V VCC = 2.3 V − 2.7 V +24 +12 mA TA Operating Free−Air Temperature −40 +85 °C /C0068t//C0068V Input Transition Rise or Fall Rate, VIN from 0.8 V to 2.0 V, VCC = 3.0 V 0 10 ns/V
http://onsemi.com DC ELECTRICAL CHARACTERISTICS TA = −40°C to +85°C Symbol Characteristic Condition Min Max Unit VIH HIGH Level Input Voltage (Note 2) 2.3 V ≤ VCC ≤ 2.7 V 1.7 V 2.7 V ≤ VCC ≤ 3.6 V 2.0 VIL LOW Level Input Voltage (Note 2) 2.3 V ≤ VCC ≤ 2.7 V 0.7 V 2.7 V ≤ VCC ≤ 3.6 V 0.8 VOH HIGH Level Output Voltage 2.3 V ≤ VCC ≤ 3.6 V; IOL = 100 /C0109A VCC − 0.2 V VCC = 2.3 V; IOH = −8 mA 1.8 VCC = 2.7 V; IOH = −12 mA 2.2 VCC = 3.0 V; IOH = −18 mA 2.4 VCC = 3.0 V; IOH = −24 mA 2.2 VOL LOW Level Output Voltage 2.3 V ≤ VCC ≤ 3.6 V; IOL = 100 /C0109A 0.2 V VCC = 2.3 V; IOL= 8 mA 0.6 VCC = 2.7 V; IOL= 12 mA 0.4 VCC = 3.0 V; IOL = 16 mA 0.4 VCC = 3.0 V; IOL = 24 mA 0.55 II Input Leakage Current 2.3 V ≤ VCC ≤ 3.6 V; 0 V ≤ VI ≤ 5.5 V ±5.0 /C0109A IOZ 3−State Output Current 2.3 ≤ VCC ≤ 3.6 V; 0V ≤ VO ≤ 5.5 V; VI = VIH or V IL ±5.0 /C0109A IOFF Power−Off Leakage Current VCC = 0 V; VI or VO = 5.5 V 10 /C0109A ICC Quiescent Supply Current 2.3 ≤ VCC ≤ 3.6 V; VI = GND or VCC 20 /C0109A 2.3 ≤ VCC ≤ 3.6 V; 3.6 ≤ VI or VO ≤ 5.5 V ±20 /C0109A /C0068ICC Increase in ICC per Input 2.3 ≤ VCC ≤ 3.6 V; VIH = VCC − 0.6 V 500 /C0109A 2. These values of V I are used to test DC electrical characteristics only. AC CHARACTERISTICS tR = tF = 2.5ns; RL = 500 /C0087 Symbol Parameter Waveform TA = −40°C to +85°C Unit VCC = 3.3 V ± 0.3 V CL = 50 pF VCC = 2.7 V CL = 50 pF VCC = 2.5 V ± 0.2 V CL = 30 pF Min Max Min Max Min Max tPLH tPHL Propagation Delay Input to Output 1 1.5 1.5 4.5 4.5 1.5 1.5 5.3 5.3 1.5 1.5 5.4 5.4 ns tPZH tPZL Output Enable Time to High and Low Level 2 1.5 1.5 5.4 5.4 1.5 1.5 6.0 6.0 1.5 1.5 7.0 7.0 ns tPHZ tPLZ Output Disable Time From High and Low Level 2 1.5 1.5 5.3 5.3 1.5 1.5 5.4 5.4 1.5 1.5 6.4 6.4 ns tOSHL tOSLH Output−to−Output Skew (Note 3) 1.0 1.0 ns 3. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The specification applies to any outputs switching in the same direction, either HIGH−to−LOW (tOSHL) or LOW−to−HIGH (tOSLH); parameter guaranteed by design.
http://onsemi.com DYNAMIC SWITCHING CHARACTERISTICS TA = +25°C Symbol Characteristic Condition Min Typ Max Unit VOLP Dynamic LOW Peak Voltage (Note 4) VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V VCC = 2.5 V, CL = 30 pF, VIH = 2.5 V, VIL = 0 V 0.8 0.6 V V VOLV Dynamic LOW Valley Voltage (Note 4) VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V VCC = 2.5 V, CL = 30 pF, VIH = 2.5 V, VIL = 0 V −0.8 −0.6 V V 4. Number of outputs defined as “n”. Measured with “n−1” outputs switching from HIGH−to−LOW or LOW−to−HIGH. The remaining output is measured in the LOW state. CAPACITIVE CHARACTERISTICS Symbol Parameter Condition Typical Unit CIN Input Capacitance VCC = 3.3 V, VI = 0 V or VCC 7 pF COUT Output Capacitance VCC = 3.3 V, VI = 0 V or VCC 8 pF CPD Power Dissipation Capacitance 10 MHz, VCC = 3.3 V, VI = 0 V or VCC 20 pF
Figure 3. AC Waveforms Table 2. AC WAVEFORMS
6 V or VCC × 2
Figure 4. Test Circuit Table 3. TEST CIRCUIT
http://onsemi.com PACKAGE DIMENSIONS TSSOP−48 DT SUFFIX CASE 1201−01 ISSUE A ÇÇÇ ÇÇÇ SUM0.12 (0.005) V ST SUM0.254 (0.010) T −V− B A L K −U− 48X REF PIN 1 IDENT. 12 4 2548 0.076 (0.003) SEATING D −T− PLANE DIM MIN MAX MIN MAX INCHESMILLIMETERS A 12.40 12.60 0.488 0.496 B 6.00 6.20 0.236 0.244 D 0.05 0.15 0.002 0.006 F 0.50 0.75 0.020 0.030 G 0.50 BSC 0.0197 BSC J 0.09 0.20 0.004 0.008 J1 0.09 0.16 0.004 0.006 K 0.17 0.27 0.007 0.011 K1 0.17 0.23 0.007 0.009 L 7.95 8.25 0.313 0.325 M 0 8 0 8 /C0095/C0095/C0095/C0095 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 5. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 6. DIMENSIONS A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. ÉÉÉ ÉÉÉ C G H −W− DETAIL E J K SECTION N−N M 0.25 (0.010) F DETAIL E N N
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