M74HC04_V01 STM | Alldatasheet

Document overview

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  • PDF pages: 13

Technical content

Datasheet sections

  • 1 Pin information
  • 2 Functional description
  • 3 Electrical characteristics
  • 4 Package information
  • 4.1 DIP14 package information
  • 4.2 SO14 package information
  • 4.3 TSSOP14 package information
  • 5 Revision history

Features

 High speed: tPD = 8 ns (typ.) at VCC = 6 V  Low power dissipation: ICC = 1 μA (max.) at TA = 25 °C  High noise immunity: VNIH = VNIL = 28% VCC (min.)  Symmetrical output impedance: |IOH| = IOL = 4 mA (min) at VCC = 4.5 V  Balanced propagation delays: tPLH @ tPHL  Wide operating voltage range: VCC (OPR) = 2 V to 6 V  Pin and function compatible with 74 series 04  ESD performance – CDM: 1 kV – HBM: 2 kV – MM: 200 V

Description

The M74HC04 is a high-speed CMOS hex inverter manufactured using silicon gate C2MOS technology. The internal circuit is composed of 3 stages including a buffer output which enables high noise immunity and stable output. All inputs are equipped with protection circuits to guard against static discharge and transient excess voltage. TSSOP14DIP14 SO14 Table 1. Device summary

  1. Qualification and characterization according to AEC Q100 and Q003 or equivalent, advanced screening according to AEC

Q001 and Q002 or equivalent.

1 Pin information

Figure 1. Pin connections and IEC logic symbols Table 2. Pin description

7 GND Ground (0 V)

14 V CC Positive supply voltage

2 Functional description

Figure 2. Input and output equivalent circuit Table 3. Truth table

3 Electrical characteristics

extended periods may affect device reliability. Table 4. Absolute maximum ratings Table 5. Recommended operating conditions

Table 6. DC specifications

Table 7. AC electrical characteristics Table 8. Capacitive characteristics

  1. CPD is defined as the value of the IC’s internal equivalent capacitance which is calculated from the operating current

4 Package information

specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark.

4.1 DIP14 package information

Figure 5. Plastic DIP14 package mechanical outline Table 9. Plastic DIP14 package mechanical data

4.2 SO14 package information

Figure 6. Plastic SO14 package mechanical outline Table 10. SO14 package mechanical data

4.3 TSSOP14 package information

Figure 7. TSSOP14 package mechanical outline Table 11. TSSOP14 package mechanical data

5 Revision history

Table 12. Document revision history