M705-GRN360-MZ

M705-GRN360-MZ SMIC | Alldatasheet

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Spec TC-P100-1.1E May..2006 Senju Metal Industry, Co., Ltd. High-Reliability, High-Preheat Resistance Lead-Free Solder Paste M705-GRN360-MZ For Head & Pillow (BGA nonFor Head & Pillow (BGA non--wetting) problemwetting) problem

Spec TC-P100-1.1E May..2006 M705-GRN360-MZ M705-GRN360-MZ is eco-friendly solder past e that provides cream solder with high- temperature preheat resistance while mainta ining the high printability of our former paste, GRN360-L60. This new paste mitigat es problems involvin g defective solder fusion between solder balls and paste that have been exper ienced when BGA/CSP devices are mounted. The use of BGA/CSP devices has recently been expanding, mainly in digital products. Defective Fusion of BGA Bumps is:Defective Fusion of BGA Bumps is:

• A phenomenon where molten solder pieces are not fused together due to insufficient wetting. The number of such problems is increasing as Pb-free solder becomes more and more widely used.
• Though there is no metallic reaction, electrical continuity is created in some cases, making it difficult to detect this problem electrically.
• Visual inspection is only effective for checking the periphery of the bumps. A large-scale inspection such as substrate tilting observation by X-ray is required to nondestructively check the internal conditions of the bumps. An idea for defective bump fusion preventive measures on solder paste side based on diversified fusion mechanism analyses Flux reduction weakened by thermal and chemical factors Paste/bump contact deteriorated by physical factors * Large size BGA device that tends to warp easily * Though the substrate hardly warps, solder ball surfaces are stained. * High-density substrates that require high preheat temperature Margin of former solder paste SMT factors Reflow temperature, time, and ambience Printing stability Heat resistance of solder paste etc.. Margin UP! GR N360-MZ Improving BGA devices is difficult in practice, even if they contain the cause of defective fusion. Potential risk + variation > SMT process margin Æ Defective BGA fusion Increasing margin on material (solder paste) side

Spec TC-P100-1.1E May..2006 ‹ Flux composition and activity The methods of representing these items are specified in ANSI/J-STD-004 (American National Standard). Flux composition “RO”represents rosin base flux. Activity “L0 (Low 0)”means that the flux has a total halogen content of 0.0%. This symbol also means that the flux has passed all reliability tests (copper mirror test, silver chromate test, fluoride test, and copper plate corrosion test) specified in IPC-TM650, and has an insulation resistance of 100 MΩ (1E+0.8Ω) or more in uncleaned condition. M705-GRN360-MZ Performance Table Item M705-GRN360-MZ Test method Solder powder Ag: 3.0%, Cu:0.5%, Sn: balance 217～220℃ Spherical RO 0.0%／Flux 1.0E+12 min. 1.0E+9 min. No migration detected Aqueous solution resistance 750Ωm JIS Z 3197 Wet area ratio 77% JIS Z 3197 Solder ball Rank: 1 - 2 JIS Z 3284 Wet effectiveness and dewetting Rank: 1 - 2 JIS Z 3284 Pass Pass 190 Pa.s 0.65 12.0% 0.3 mm max. 1.3N 24 h/1.0 N min. Pass 6 months Flux Solder paste Copper plate corrosion test Alloy composition - - - Halogen content Potential difference titration JIS Z 3197 Flux content JIS Z 3197 Tackiness JIS Z 3284 Tack range JIS Z 3284 Product guarantee period Unopened cool storage at 0 – 10°C Melting temperature Differential scanning calorimeter (DSC) Powder shape SEM Powder particle size 25 ~ 36um SEM and laser beam method Flux composition * J-STD-004 Activity * J-STD-004 Surface insulation resistance (after 168 h at 40° C, 90%RH) JIS Z 3284 Humidity test under DC voltage (after 1000 h under 45 VDC at 85° C, 85%RH) JIS Z 3284 Copper mirror test JIS Z 3197 Fluoride test JIS Z 3197 Viscosity JIS Z 3284 Thixotropy index JIS Z 3284 Heat sagging JIS Z 3284 * Numerical values given in the table are not specifications.

Spec TC-P100-1.1E May..2006 30.50 28.38 6. 25 31.75 M705-GRN360 -K2-V M705-GRN360 -K 2-V L M705-GRN360 -L60C Competitor’s product Number of defectively fused pins / 1PKG (353 pins) Test conditions Test substrate: SENJU POP2 (FR-4, 1.0 mm thick) Surface treatment: Cu + preflux Printing aperture/thickness: 280 um/120 umt Defective BGA Fusion Prevention Performance of GRN360-MZ Fusing Performance in BGA/CSP Device Mounting Preheat Peak temperature 220°C or higher 170-205°C 110sec 227°C 18sec * This temperature profile was intentionally deviated from the standard profile to produce defective fusion. Note that this profile is different from that which we recommend for this paste. In comparison with our conventional products and competitors’ products, the GRN360-MZ demonstrates a higher degree of fusion even under such environments detrimental to fusion as PKG warping, abnormal temperature profile, and degraded solder ball surface characteristics, and ensures a stable mounting performance for BGA/CSP devices. SENJU POP2 Pattern on PCB side: 0.28 mmφ BGA device Pitch size: 0.5 mm pitch/353 pins (containing 0.3 mm Sn-Ag-Cu solder balls) * An easy-to-warp package used for stack mounting Humidified to intentionally produce defective fusion 85° C – 85%RH – 12 hr + baking for 3 hr Test temperature profile Good Fusing Performance Comparison between MZ and conventional GRN360 series 1PKG: number of defectively fused pins out of 353 pins BGA device Defective fusion MZ 100 150 200 250 0 50 100 150 200 time/sec temp./℃

Spec TC-P100-1.1E May..2006 100 150 200 250 0 50 100 150 200 250 時間/sec 温度/℃ Wettability Evaluation by Wetting Balance Method 120sec / 170-200degC GRN360-MZ has a function of reducing/cleaning solder ball surfaces even under an excessively stressed condition. This function accelerates the fusion of molten solder pieces, thereby enables stable mounting of BGA/CSP devices. Time to fuse: 16.9 sec Time to fuse: 6.5 sec Wetting behavior in the course from melting to fusion of solder Previous product (M705-GRN360-K2-V) Wetting behavior in the course from melting to fusion of solder M705-GRN360-MZ sensor Cu plate Solder bath Temp.: 240°C Solder ball 3.0Ag/0.5Cu/Sn Preheat treatment: in thermostatic oven at 200° C for 3 min Time (sec) Wetting stress (mN) (＋) (－) Baseline Measurement termination Start of heating (Solder bath comes into contact with copper plate.) Paste melts Zero-cross pointT0 T1 T3 T T1 - T2 Heating is started. – Flux activates. Heat Paste melts. Wetting starts. – Zero-cross point is passed through. Perfect fusion is attained. Copper plate Solder bath Solder ball Solder bath Heat Heat Heat Correlation between Meniscus Chart and Bump FusionCorrelation between Meniscus Chart and Bump Fusion Defective BGA Fusion Control Effect of GRN360-MZ Solder paste Deterioration of activity due to preheat treatment Temperature Time

Spec TC-P100-1.1E May..2006 Flowability of GRN360-MZ and its Stability Change with Time Change (increase) in the viscosity of solder paste causes defective squeegee removal, chipped printing, and other failures in a printing performed under the same conditions. Due to excellent viscosity stability retention characteristics、GRN360-MZ hardly changes its initial viscosity even in a production where this paste has to be continuously replenished. Solder paste should be used within 48 h after taken out of the cold storage yard. Viscosity Change during 24 h Continuous Squeegeeing Printing rate: 120 sheets/hr Printing ambience condition: 20 - 25 °C, 2 0 –4 0 % R H Squeegeeing timeMeasures revolutions (rpm) SQ0h SQ4h SQ8h SQ12h SQ24h 10 196 191 196 201 212 3 452 440 450 451 469 4 367 355 368 369 385 5 314 304 309 317 324 10 199 192 197 199 205 20 132 129 134 137 140 30 102 101 105 107 113 10 193 186 194 197 204 Thixotropy Viscosity of cream solder is highly sensitive to temperature, demonstrating a viscosity change of approx. 10 Pa.s per 1°Co f temperature change. Therefore, pr oper control of the ambient temperature is important to maintain highly reproducible printability. Note that the use of an automatic stirrer may increase the temperature of the paste and lower its viscosity. When using paste that has been stored at the normal temperature (use environment temperature) for 1 to 2 hours, take the minimum necessary measures to control paste temperature change, i.e. viscosity change, in either case of manual or automatic stirring. Viscosity and temperature changes due to automatic stirring (when JAPAN UNIX’s automatic stirrer is used)Temperature - paste viscosity diagram Dependence of Paste Viscosity on Temperature and Attention to Temperature Rise due to Automatic Stirring 100 150 200 250 300 00 .511 .52 Stirring time (min) Viscosity (Pa.s) ／10rpm at 25℃ Paste temperature （℃） Storage at normal temperature for 1 hour – paste viscosity Storage at normal temperature for 2 hours – paste viscosity Storage at normal temperature for 3 hours – paste viscosity Storage at normal temperature for 1 hour – paste temperature Storage at normal temperature for 2 hours – paste temperature Storage at normal temperature for 3 hours – paste temperature 212201196191196 100 150 200 250 300 350 400 0 4 8 1 21 62 02 4 Squeegeeing time (hr) Viscosity (Pa.s) 258 229 198 165 135 100 150 200 250 300 20 22.5 25 27.5 30 M easured temperature (℃) Viscosity (Pa.s)/10 rpm

Spec TC-P100-1.1E May..2006 The adhesion and adhesion retention power of solder paste are very important to prevent displacement of parts that have been mounted by a stage (substrate)-shifting type high-speed mounter and to maintain the mountability of parts after line maintenance. Use of paste with poor adhesion and adhesion retention power will result in various mounting failures such as tombstone effect. GRN360-MZ has high levels of initial adhesion and adhesion retention power. Print sagging/5th sheet in continuous printing After heating to 180°C for 120 sec Sagging of solder paste affects solder ball generation and bridging prevention in narrow-pitch parts mounting. GRN360-MZ hardly sags even when heated, which is very effective for preventing capillary ball generation. Adhesion Retention and Sagging of GRN360-MZ <Evaluation conditions> Measuring instrument: tackiness tester made by Rhesca Co. Pressurization rate: 2.0 mm/s Pressurization time: 0.2 s Measurement load: 0.49 N Lifting speed: 10 mm/s Storage ambience: 25°C 50%RH <Evaluation conditions> Print mask thickness: 150 um/JIS Z 3284 Sagging evaluation pattern Heating condition: 180°C x 120 sec Adhesion Change with Time According to Mask Thickness Print Sagging and Heat Sagging 0.5 1.5 0 4 8 1 2 1 62 02 4 Time after printing (h) Adhesion (N) Print thickness: 200 μm Print thickness: 150 μm

Spec TC-P100-1.1E May..2006 100 125 150 175 200 123456789 1 0 1 1 Printing volume percentage (%)/mas k aperture volume 100 125 150 175 200 123456789 1 0 1 1 Printing volume percentage (%)/mask aperture volume Printability of GRN360-MZ <Printing conditions> Printing machine used: SP-28PD Volume inspection machine: IPV NM-TD10 Print mask: SMIC9006 Clearance: 0 mm Mask thickness: 120 μm Printing plate lowering speed: 1.5 mm/sec (constant) Squeegee type: metal/60°in angle Printing plate lowering distance: 2.5 mm Printing speed: 40 mm/sec Printing pressure: 0.20 N/mm (blade length: 350 mm) Figures to be evaluated: φ0.3 mm dots and 0.4 mm pitch x 0.22 mm wide vertically printed slits Printing direction GRN360-MZ enables continuous printing without deteriorating the distinctness of printed figures, thereby minimizing blurred printing and sagged printing. This solder paste also maintains almost the same level of print transcription volume percentage as the initial percentage even after a brief suspension of printing, demonstrating that it has a high level of reproducible printability. Printed Figure, Transcription Volume Stability, and their Recovery after Brief Suspension of Printing 1st 9th 11th 16th Φ0.3mm 0.4mmPitch 0.22mm slit Printing 10 substrates Printing 5 substrates Mask cleaning Suspension of printing for 1 hr after mask cleaning Printing 5 substrates Change in Transcription Volume to Mask Aperture Ratio φ0.3 mm dots Change in Transcription Volume to Mask Aperture Ratio 0.4 mm pitch x 0.22 mm wide slits Cleaning Printing suspension for 1 hr after cleaning

Spec TC-P100-1.1E May..2006 Precautions in temperature profile design It is ideal to design a temperature profile so that all parts are treated according to the recommended profile. If ∆T of the substrate requires temperature conditions different from the above recommendation, adjust the temperature profile within the allowable range of the work while paying attention to the following: 150 200 250 100 TEMP (℃) Preheat zone Reflow zone 220 Temperature increase rate 2-3°C Temperature increase rate 2-4°C A: 150°C C: 240°C D: 40sec Reflow oven used for verification SAI-838 (air reflow oven) SNR-825 (nitrogen reflow oven) Recommended Temperature Profile for GRN360-MZ and Precautions in Profile Adjustment Recommended profile Point Recommendation Upper limit Lower limit A Preheat starting point 150°C 160°C 200°C 100sec 255°C 60sec 140°C B Preheat terminating point 180°C 160°C From A to B Preheating time 80sec 60sec C Peak temperature 240°C 230°C D Temperature holding time at 220°C or higher 40sec 30sec

• Excessive preheat treatment (due to higher treatment temperature and/or longer treatment time); Reoxidation of the solder powder and subsequent consumption and/or deterioration of activity of the flux will result, leading to defective melting of the solder, defective fusion of the BGA/CSP devices, or other defective mounting.
• Insufficient preheat treatment (due to lower treatment temperature and/or shorter treatment time); Remaining solvent in the flux may cause scattering of solder/flux and/or void generation in the reflow zone.
• Excessive main heating (due to higher peak temperature and/or longer solder melting time); Scattering of solder/flux accompanied by void discharge, generation/growth of voids in the area near the bottom electrode, deterioration in thermal fatigue resistance of soldered joints, and deterioration in external appearance of joints after reflow (deterioration in residue cracking resistance) will be caused.
• Insufficient main heating (due to lower peak temperature and/or shorter solder melting time); Insufficient main heating will cause poor wetting of electrodes of the parts (defective fusion in the case of BGA/CSP devices). Attention must also be paid to temperature drop in continuous mounting. Main heating with a sufficient margin is required. Preheat Peak temperature
• Excessively high temperature increase rate An excessively high temperature increase rate will affect the sagging characteristics of the solder paste, resulting in solder ball and/or side ball generation. Also pay attention to the scattering of the flux and tombstone effect.
• Excessively low temperature increase rate Paste is exposed to a thermal stress even when it is heated up to the peak temperature. An excessively low temperature increase rate may exert thermal stress on paste at a high-temperature range (200 - 220°C). Pay attention to the deterioration of reflow characteristics discussed above. Temperature increase rate B: 180°C From A to B: 80 sec * Solderability differs depending on the specifications of the reflow oven, as well as the type of substrate and parts used for surface-mounting. In very small apertures requiring a small amount of paste and structures that allows flux to flow out easily, in particular, solder may melt abnormally even in the preheat range shown in the figure above. For these apertures and structures, be sure to carry out a solderability evaluation test before using this paste.

Spec TC-P100-1.1E May..2006 Reflow Characteristics of GRN360-MZ M705-GRN360-L60 M705-GRN360-MZ When stressed excessively in a preheat process, our previous solder paste, GRN360-L60, often deteriorated the melting characteristics of very small dots and uniform wetting in flat lands. GRN360-MZ, which has improved heat resistance over the previous paste, ensures high solderability even after being subjected to a long, high-temperature preheat treatment. GRN360- MZ also demonstrates the same levels of control performances for solder ball generation between slits, residue scattering, and cracking as those of the previous paste. Air reflow characteristics for narrow slits, very small apertures, and flat lands Test mask thickness: 100 um Preheat Peak Temperature Time Temperature 116sec 238°C 220°C or more 186-202°C 38sec * The numerical values given in the above table are not for the recommended temperature profile. They were given for heat resistance evaluation test only. 100 150 200 250 0 50 100 150 200 250 時間／ｓｅ ｃ 温度/℃ 0.30mmφ 0.28mmφ 0.26mmφ 0.24mmφ 4mm■ 8mm■ 0.30mmφ 0.28mmφ 4mm■ 8mm■ 0.26mmφ 0.24mmφ Insufficient melting Insufficient melting Insufficient melting Dewetting Dewetting Insufficient melting Temperature Time

Spec TC-P100-1.1E May..2006 Copper plate corrosion test M705-GRN360-MZ Each test condition: complying with JIS Z 3197 Reliability Test of M705-GRN360-MZ Copper mirror test M705-GRN360-MZ Each test condition: complying with JIS Z 3197 Fluoride test M705-GRN360-MZ Each test condition: complying with JIS Z 3197 Before humidification After humidification WW rosin 25% MZ Silver chromate paper test M705-GRN360-MZ Each test condition: complying with JIS Z 3197 Blank Sample Sample

Spec TC-P100-1.1E May..2006 Before test After 1000 hours at 85°C 85%RH No migration was detected. Migration test/M705-GRN360-MZ Ambient conditions: 40°C 90%RH and 85°C 85%RH (two conditions) Applied voltage: 45 V Measures voltage: 100 V (measured inside oven) Reliability Test of M705-GRN360-MZ 1.0E+05 1.0E+06 1.0E+07 1.0E+08 1.0E+09 1.0E+10 1.0E+11 1.0E+12 1.0E+13 1.0E+14 1.0E+15 常態 常態 24h 48h 96h 168h 500h 1000h 室温 湿中 Insulation resistance (?) 試験条件 85℃85%RH 試験条件 40℃90%RH Test condition: 85°C 85%RH Test condition: 40°C9 0 % R H Normal state Normal state Room temperature In moisture