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M66-DS is an ultra -small Dual SIM Dual Standby quad -band GSM/GRPS module using LCC castellation package. Based on the latest 2G chipset, it has the optimal performance in SMS & data transmission and audio service even in harsh environment. The Dual SIM Dual Standby function allows customers to use two (U)SIM cards in one device simultaneously. The ultra - compact 15.8mm × 17.7mm × 2.3mm profile makes M66-DS a perfect platform for size sensitive applications. M66-DS adopts surface mount technology, making it an ideal solution for durable and rugged designs. The low profile and small size of LCC package ensures M66 -DS can be easily embedded into low -volume applications and provides reliable connectivity for the applications. This kind of package is ideally suited for large -scale manufacturing which has strict require- ments for cost and efficiency. The compact form factor, low power consumption and two (U)SIM card interfaces make M66 -DS the best choice for applica- tions such as wearable device, automotive, industrial PDA, personal tracking, wireless POS, smart metering, telematics and other M2M applications. Key Benefits Ultra compact form factor with Dual SIM Dual Standby (DSDS) feature Easier soldering process with LCC package Power consumption as low as 1.3mA Support Voice, Bluetooth and QuecFOTATM Embedded powerful Internet service protocols, multiple Sockets & IP addresses Quad-band GPRS Multi-slot Class 12 Highly Compact Size LCC Package Embedded Internet Services Protocols DSDS Digital Audio EMAIL US: info@quectel.com VISIT US: www.quectel.com Extended Temperature Range: -40°C ~ +85°C Bluetooth 3.0 Quectel Confidential
Quad-band: 850/ 900/ 1800/ 1900MHz Data GPRS Class 12: Max. 85.6kbps (Downlink) Max. 85.6kbps (Uplink) PBCCH Coding Schemes: CS 1, 2, 3. 4 USSD Non-transparent Mode SMS Point-to-point MO and MT SMS Cell Broadcast Text and PDU Mode Voice Speech Codec Modes: Half Rate (HR) Full Rate (FR) Enhanced Full Rate (EFR) Adaptive Multi-Rate (AMR) Echo Arithmetic: Echo Cancellation Echo Suppression Noise Reduction Interfaces (U)SIM Card Interface: × 2 (3.0V/ 1.8V) UART × 3 Analog Audio Channel:
2 Output Channels and 1 Input Channel
Bluetooth: BT 3.0 Profile: SPP, HFP ADC* × 1 PCM* × 1 SD* × 1 RTC × 1 Antenna Pad: × 2 (GSM Antenna Pad and Bluetooth Antenna Pad) Enhanced Features DSDS eCall Jamming Detection DTMF Audio Play/ Audio Record QuecFOTATM QuecCell QuecLocator QuecFile OpenCPUTM RIL for Android MUX Bluetooth Electrical & Sensitivity Output Power: Class 4 (2W @850/ 900MHz) Class 1 (1W @1800/ 1900MHz) Consumption: 1.3mA @DRX=5 1.2mA @DRX=9 Sensitivity: GSM850: -109dBm GSM900: -109dBm DCS1800: -109dBm PCS1900: -109dBm Supply Voltage: 3.3V~4.6V, 4.0V Typ. Software Features BT 3.0 Protocols: TCP/ UDP/ PPP/ FTP/ HTTP/ SMTP*/ CMUX/ DSDS General Features GPRS Multi-slot Class: Class 12 GPRS Mobile Station: Class B Temperature Range: -40°C ~ +85°C Dimensions: 17.7mm × 15.8mm × 2.3mm Weight: Approx. 1.3g GSM 07.07, 07.05 and other Enhanced AT Commands * Under Development Quectel M66-DS 17.7 mm 15.8 mm 2.3 mm Copyright © 2017 Quectel Wireless Solutions Co., Ltd. All Rights Reserved http://www.quectel.com HQ address: 7th Floor, Hongye Building, No.1801 Hongmei Road, Xuhui District, Shanghai 200233, China Tel: +86 21 51086236 Fax: +86 21 54453668 Email: info@quectel.com Quectel Confidential