M1G CHENDA | Alldatasheet
Document overview
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Technical content
Features
The plastic package carries Underwriters Laboratory Flammability Classification 94V-0 Idea for printed circuit board Glass passivated Junction chip Low reverse leakage High forward surge current capability High temperature soldering guaranteed
250 C/10 seconds at terminals
Dimensions in inches and (millimeters) 0.208(5.30) 0.067 (1.70) 0.051 (1.30) 0.177(4.50) 0.157(3.99) 0.110(2.80) 0.094(2.40) 0.060(1.52) 0.030(0.76) 0.188(4.80) 0.012(0.305) 0.006(0.152) 0.008(0.203)MAX. 0.096(2.42) 0.078(1.98) Case : JEDEC DO-214AC/SMA Molded plastic body Terminals : Solder plated, solderable per MIL-STD-750,Method 2026 Polarity : Polarity symbol marking on body Mounting Position : Any Weight : 0.0023 ounce, 0.07 grams Ratings at 25 C ambient temperature unless otherwise specified. Single phase half-wave 60Hz,resistive or inductive load,for capacitive load current derate by 20%. Maximum repetitive peak reverse voltage 200 400 800 1000 V Maximum RMS voltage VRMS 70 140 280 560 700 V Maximum DC blocking voltage VDC 100 200 400 800 1000 V Maximum average forward rectified current at TL=110℃ I(AV) 1.0 A Peak forward surge current 8.3ms single half sine-wave superimposed onrated load (JEDEC Method) IFSM 30 A Maximum instantaneous forward voltage at 1.0A VF V Maximum DC reverse current at rated DC blocking voltage TA=25℃ TA=125℃ IR 5.0 50.0 Typical junction capacitance (NOTE 1) CJ 15.0 pF Typical thermal resistance (NOTE 2) RθJA 65.0 ℃/W M2G M3G UNITS Parameter M4G M5G M6G M7G MDD MDD MDD MDD MDD MDD SYMBOLS 1.10 μA TJ,TSTG -55 to +150 ℃Operating junction and storage temperature range Maximum Ratings And Electrical Characteristics VRMM MDDMarking Code M1 M1G 100 600 420 600 2.Mounted on 10cm x 10cm x 1mm copper pad area 3.The typical data above is for reference only.
Rev:2019A0 Page :2 Ratings And Characteristic Curves The curve above is for reference only. https://www.microdiode.com 1.0 0.8 0.6 0.4 0.2 75 100 125 150 25 1750 50 5.0 0.1 1.0 10 100 0.01 0.1 1 10 100 100 0.1 REVERSE VOLT AGE,VOLTS t,PULSE DURATION,sec. FIG. 5-TYPICAL JUNCTION CAPACITANCE FIG. 6-TYPICAL TRANSIENT THERMAL IMPEDANCE FIG. 3-TYPICAL INSTANTANEOUS FORWARD CHARACTERISTICS NUMBER OF CYCLES AT 60 Hz FIG. 2-MAXIMUM NON-REPETITIVE PEAK FORWARD SURGE CURRENT FIG. 1- FORWARD CURRENT DERATING CURVE AVERAGE FORWARD RECTIFIED CURRENT, AMPERESINSTANT ANEOUS FORWARD CURRENT,AMPERES JUNCTION CAPACITANCE, pF PEAK FORWARD SURGE CURRENT, AMPERES INSTANTANEOUS FORWARD VOLTAGE, VOL TS Single Phase Half Wave 60Hz Resistive or inductive Load 1 100 8.3ms SINGLE HALF SINE-WAVE (JEDEC Method) 0.01 0.1 TJ=25 C 100 200 0 20 40 60 80 100 1,000 100 0.1 0.01 TJ=100 C TJ=25 C TJ=150 C PERCENT OF PEAK REVERSE VOLTAGE,% FIG. 4-TYPICAL REVERSE CHARACTERISTICS INSTANTANEOUS REVERSE CURRENT, MICROAMPERES TRANSIENT THERMAL IMPEDANCE, C/W AMBIENT TEMPERATURE, C TJ=25 C PULSE WIDTH=300 µs 1%DUTY CYCLE Reverse Voltage - 50 to 1000 Volts Forward Current - 1.0 Ampere M1G THRU M7G
https://www.microdiode.com Rev:2019A0 Page :3 Important Notice and Disclaimer Microdiode Electronics (Jiangsu) reserves the right to make changes to this document and its products and specifications at any time without notice. Customers should obtain and confirm the latest product information and specifications before final design,purchase or use. Microdiode Electronics (Jiangsu) makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, not does Microdiode Electronics (Jiangsu) assume any liability for application assistance or customer product design. Microdiode Electronics (Jiangsu) does not warrant or accept any liability with products which are purchased or used for any unintended or unauthorized application. No license is granted by implication or otherwise under any intellectual property rights of Microdiode Electronics (Jiangsu). Microdiode Electronics (Jiangsu) products are not authorized for use as critical components in life support devices or systems without express written approval of Microdiode Electronics (Jiangsu). Suggested Pad Layout 0.095 0.215 Symbol Unit (mm) A C3 .90 D 0.060 5.45 2.41 E B Unit (inch) 0.154 1.52 0.0661.68 E B d F W PA D D1D2 C T Item Tolerance SMA Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 7" Reel outside diameter 13" Reel inner diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width P E B C d F T W P A D D D Reel width W1 Symbol 0.1 0.1 0.1 min min 0.5 0.1 0.3 1.0 0.1 0.05 0.1 0.1 0.1 0.1 2.0 2.0 unit:mm 1.50 330.00 178.00 50.00 62.00 13.00 1.75 5.50 4.00 4.00 2.00 0.28 12.00 18.00 Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. 2.80 5.33 2.36 Reel packing SMA 7" 2,000 4.0 4,000 183*155*183 178 382*356*392 160,000 16.0 PACKAGE REEL SIZE REEL COMPONENT SPACING BOX INNER BOX REEL DIA, CARTON SIZE CARTON APPROX. GROSS WEIGHT (kg)(pcs)(m/m)(m/m)(m/m)(pcs)(m/m)(pcs) SMA 11" 5,000 4.0 10,000 290*290 *38 330 310*310*360 80,000 11.0 Reverse Voltage - 50 to 1000 Volts Forward Current - 1.0 Ampere M1G THRU M7G SMA 13" 7,500 4.0 15,000 335*335*38 330 350*330*360 120,000 14.5