M538

M538 MA-COM | Alldatasheet

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Surface Mounting Instructions Rev. V6 Application Note M538 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Surface mount board layout is a critical portion of the total design. The footprint must be the correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry, the package will self -align when subjected to a solder reflow process and will also allow for just enough excess surface area for adequate solder filleting. The following recommended footprints are suggested guidelines only and may require ground plane modifications for electrical and/or thermal considerations. When an increase in ground plane size is necessary, solder mask over bare copper (SMOBC) should be utilized to contain solder and eliminate alignment problems during solder reflow. Electrical and/or thermal considerations may also require the board to contain plated vias located under the surface mount package. When this is necessary, the recommended via diameter is 0.3mm with a pitch of 1.0mm. To prevent solder wicking inside the via during reflow, solder mask pads are recommended over all vias located under the package. The solder mask diameter should be 100 microns larger than the via diameter. Blind or filled vias also work well as an alternative to solder mask to further enhance thermal conduction. Footprint Guidelines Package Style Footprints

Surface Mounting Instructions Rev. V6 Application Note M538 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.

Surface Mounting Instructions Rev. V6 Application Note M538 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.

Surface Mounting Instructions Rev. V6 Application Note M538 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.

Surface Mounting Instructions Rev. V6 Application Note M538 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.

Surface Mounting Instructions Rev. V6 Application Note M538 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Thermal resistance will be a function of the following:  Thermal conductivity of the substrate or board material  Footprint size available for heat spreading  Circuit board copper foil weight (2 oz minimum recommended for power applications)  Via hole quantity and location  Substrate or board thickness  Proximity of additional thermal loads on board  Velocity of air flow (forced air cooling) Thorough testing of the prototype is the only way to prove the adequacy of a thermal design. General Thermal Considerations A typical solder for a tin -lead soldering process is Sn63 (63%Sn, 37%Pb), which clearly is the industry standard for a number of reasons. Sn63 is a eutectic compound with a melting point (+183°C) high enough to exceed the standard operating temperature limit of most components (+150°C) and low enough so that internal component materials are not damaged during proper solder refold. The one draw back of Sn63 solder when used in combination with gold plated components is a phenomenon called “scavenging.” This occurs when gold plating migrates into the solder joint during reflow, which may cause embrittlement of the solder joint. Pretinning the package leads with Sn63 solder paste with RMA flux reduces the gold concentration and produces a stronger joint. A typical solder for a lead -free soldering process is Tin-Silver-Copper. 95.5Sn -3.8Ag-0.7Cu is one typical solder alloy composition that can used for a lead free soldering process. Solder Selection General Soldering Precautions The melting temperature of solder generally exceeds the recommended maximum operating temperature of the device. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, always observe the following instructions to minimize the thermal stress to the devices.  Always preheat the device (failure to do so can cause excessive thermal shock and stress that can result in damage to the device).  Limit the temperature in the reflow stage to peak temperature indicated in Tables 1 thru 3.  After completing the soldering process, allow the devices to cool naturally for at least 3 minutes. Gradual cooling should be used, as the use of forced cooling will increase the temperature gradient and may result in latent failure due to mechanical stress.  Avoid any mechanical stress or shock to the solder joints and devices during cooling. A solder stencil is required to apply the optimal amount of solder paste onto the pads of the footprint. The amount and thickness will directly affect the quality of the joint and are critical to ensure proper solder connection between the base of the package and the board. A .004 to .007 inch thick stainless steel stencil is recommended for most applications. The stencil opening should be the Solder Screen Guidelines Reflow Profile The most common solder reflow method is accomplished in a belt furnace using convection heat transfer. Tables 1 thru 3 along with Figure 1 show a typical convection reflow profile of temperature versus time. The profile reflects the three distinct heating stages, or zones (preheat, reflow, and cooling) recommended in automated reflow processes to ensure reliable, finished solder joints. The profile will vary among soldering systems and is intended as an example to use as a starting point. Other factors that can affect the profile include the density and types of components on the board, type of solder used and type of board or substrate material being used. Thermocouples should be securely attached to the top surface of a representative component to insure the temperature exposure is met. Profile should be recorded by data acquisition for future reference. same size as the footprint PCB pads (1:1 registration), excluding SMOBC areas. However, if fine pitch components on the same board require a thinner stencil, aperture modification may be necessary.

and/or prototype measurements. Commitment to develop is not guaranteed. typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. changes to the product(s) or information contained herein without notice. (TL to Tp) 3°C/second max. 3°C/second max. (Tp to TL) 6°C/second max. 6°C/second max. Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Table 1. Reflow Conditions refer to JEP140 for recommended thermocouple use. For example, if Tc is 260 °C and time tp is 30 seconds, this means the following for the supplier and the user. For a supplier: The peak temperature must be at least 260 °C. The time above 255 °C must be at least 30 seconds. For a user: The peak temperature must not exceed 260 °C. The time above 255 °C must not exceed 30 seconds. Note 3: All components in the test load shall meet the classification profile requirements. higher peak classification temperature is desired. Table 2. SnPb Eutectic Process - Classification Temperature (TC)

and/or prototype measurements. Commitment to develop is not guaranteed. typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. changes to the product(s) or information contained herein without notice. Figure 1. Reflow Profile values specified in Tables 2 or 3. The use of a higher T p does not change the classification temperature (Tc). Note 2: Package volume excludes external terminals (e.g., balls, bumps, lands, leads) and/or nonintegral heat sinks. reduces the thermal gradients between packages. However, thermal gradients due to differences in thermal mass of SMD packages may still exist. temperatures and profiles defined in Tables 1 and 3, whether or not Pb -free.