M48Z129Y_05 STMICROELECTRONICS | Alldatasheet
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Figure 1. 32-pin PMDIP Module
Figure 4. Block Diagram Table 2. Operating Modes Note: X = VIH or VIL; VSO = Battery Back-up Switchover Voltage.
- See Table 10., page 12 for details.
Table 3. READ Mode AC Characteristics terminated by the earlier rising edge of W or E. W will disable the outputs tWLQZ after W falls. Figure 7. WRITE Enable Controlled, WRITE Mode AC Waveform
Figure 8. Chip Enable Controlled, WRITE Mode AC Waveforms Table 4. WRITE Mode AC Characteristics
- If E goes low simultaneously with W going low, the outputs remain in the high impedance state.
as a conventional BYTEWIDE™ static RAM. inputs are treated as “Don’t care”. does not jeopardize the rest of the RAM’s content. power supply lines is recommended. to the Application Note AN1012. MBRS120T3 is recommended for surface mount. Figure 9. Supply Voltage Protection
Table 5. Absolute Maximum Ratings Note: 1. Soldering temperature not to exceed 260°C for 10 seconds (total thermal budget not to exceed 150°C for longer than 30 seconds). No preheat above 150°C, or direct exposure to IR reflow (or IR preheat) allowed, to avoid damaging the Lithium battery. CAUTION: Negative undershoots below –0.3V are not allowed on any pin while in the Battery Back-up mode. tions when using the quoted parameters. Table 6. Operating and AC Measurement Conditions Note: Output Hi-Z is defined as the point where data is no longer driven.
Figure 10. AC Testing Load Circuit Table 7. Capacitance Note: 1. Effective capacitance measured with power supply at 5V; sampled only, not 100% tested. Table 8. DC Characteristics
Figure 11. Power Down/Up Mode AC Waveforms Table 9. Power Down/Up AC Characteristics
- VPFD (max) to VPFD (min) fall time of less than tF may result in deselection/write protection not occurring until 200µs after VCC pass-
- VPFD (min) to VSS fall time of less than tFB may cause corruption of RAM data.
Table 10. Power Down/Up Trip Points DC Characteristics Note: 1. All voltages referenced to VSS .
Figure 12. PMDIP32 – 32-pin Plastic Module DIP, Package Outline Note: Drawing is not to scale. Table 11. PMDIP32 – 32-pin Plastic DIP, Package Mechanical Data
Table 12. Ordering Information Scheme
M48Z129Y*, M48Z129V
REVISION HISTORY
Table 13. Document Revision History
M48Z129Y*, M48Z129V Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners © 2005 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America