D10 STMICROELECTRONICS | Alldatasheet
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Technical content
D10, D15, D20, D22, C20, C30 MICROMODULES Memory Micromodules General Information for D1, D2 and C Packaging n Micromodules were developed specifically for embedding in Smartcards and Memory Cards n The Micromodule provides: – Support for the chip – Electrical contacts – Suitable embedding interface for gluing the module to the plastic package n Physical dimensions and contact positions compliant to the ISO 7816 standard n Micromodules delivered as a continuous Super 35 mm tape. (This differs from the standard 35 mm tape in the spacing distance between the indexing holes.)
DESCRIPTION
Memory Cards consist of two main parts: the plastic card, and the embedded Micromodule (which, in turn, carries the silicon chip). The plastic card is made of PVC, ABS or similar material, and can be over-printed with graphics, text, and magnetic strips. The Micromodule is embedded in a cavity in the plastic card. The Micromodules are mounted on Super 35 mm metallized epoxy tape, and are delivered on reels. These contain all of the chips from a number of wafers, including those chips that were found to be non-functioning during testing. Traceability is ensured by a label fixed on the reel. D10 D20 1 1 1 1 potting side contact side D15 D22 C30 C20 Table 1. Memory Card and Memory Tag Integrated Circuits
Table 3. Manufacturing Flow and Manufacturing Facility Locations Table 4. Material Specification Rousset, France. 6” wafer fab. Assembly Casablanca, Morocco. Assembly Casablanca, Morocco.
Table 5. Size of the Reel Box Table 6. AQL Levels Table 7. Visual and Mechanical Specification and Test Conditions Note: 1. Test 3 and 4 are conducted in accordance with MIL-STD-833.
1 Contact area Glue or particles, scratches print, sever defects on contact area
damaging the gold layer. Visual test distance 30 cm, naked eye.
2 Chip covering Thickness and external dimension measurement exceeding total
31 Die bond strength Die shear force < 10 N
41 Wire bonding Wire lift or broken at pull test with < 4 g
shows the recommended AQL levels. test conditions are described in Table 7. them are found in a contiguous block on the tape. electrical yield is less than 90%. sheets, or as agreed with the customer. box, which is also made of recycled cardboard. the ISO 2859 standard (test level II, normal test).
are listed in Table 8 and Table 9. Table 8. Package Related Tests sample of 45 devices taken from a lot, with the whole lot only accepted if every one of the 45 sample devices passed the test. Table 9. Product Related Tests
1 Geometry ST Specification Monitoring/Lot 5 0/45
3 Temperature cycling MIL-STD-883
4 Salt atmosphere
5 Moisture resistance MIL-STD-883
6 Vibration with electrical
10 G (repeated 20 times)
7 Bending properties ISO/IEC 7816-1
8 Torsion properties ISO/IEC 7816-1
1 Life test MIL-STD-883
2 Electrostatic discharge MIL-STD-883
3 Data retention,
4 Write/Erase cycles ST Specification 100,000 Cycles 200 ppm/
5 Magnetic field, memory
Figure 1. Reel and Winding Direction
Figure 2. D10, D20, D22 Tape Join Specification
- Measurements are subject to change without notice.
Figure 3. D15 Tape Join Specification
Figure 4. D10 Micromodule Outline
Figure 5. D15 Micromodule Outline
Figure 6. D20 Micromodule Outline
Figure 7. D22 Micromodule Outline
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. 1999 STMicroelectronics - All Rights Reserved The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A. http:// www.st.com