M3004LAB1

M3004LAB1 STMICROELECTRONICS | Alldatasheet

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REMOTE CONTROL TRANSMITTER June 1992 REMO SEN 6N SEN 5N SEN 4N SEN 3N SEN 2N SEN 1N SEN 0N ADRM V DD VSS DRV 6N DRV 6N DRV 6N DRV 6N DRV 6N DRV 6N DRV 6N OSC OUT OSC IN 3004L-01.EPS PIN CONNECTIONS DIP20 (Plastic Package) ORDER CODE : M3004LAB1 .FLASHED OR MODULATED TRANSMISSION .7 SUB-SYSTEM ADDRESSES .UP TO 64 COMMANDS PER SUB-SYSTEM ADDRESS .HIGH-CURRENT REMOTE OUTPUT AT VDD =6 V( –IOH = 80mA) .LOW NUMBER OF ADDITIONAL COMPO- NENTS .KEY RELEASE DETECTION BY TOGGLE BITS .VERY LOW STAND-BY CURRENT (< 2 µA) .OPERATIONAL CURRENT < 1mA AT 6V SUPPLY .SUPPLY VOLTAGE RANGE 2 TO 6.5V .CERAMIC RESONATOR CONTROLLED FREQUENCY (typ. 450kHz)

DESCRIPTION

The M3004LAB1/M3004LDtransmitter IC are de- signed for infrared remote control systems. It has a total of 448 commands which are divided into 7 sub-system groups with 64 commands each. The sub-system code may be selected by a press but- ton, a slider switch or hard wired. The M3004LAB1/M3004LD generate the pattern for driving the output stage. These patterns are pulse distance coded. The pulses are infrared flashes or modulated. The transmission mode is defined in conjunction with the sub-system ad- dress. Modulated pulses allow receivers with nar- row-band preamplifiers for improved noise rejection to be used. Flashed pulses require a wide-band preamplifier within the receiver. SO20 (Plastic Package) ORDER CODE : M3004LD

Key matrix inputs and outputs (DRV0N to DRV6N and SEN0N to SEN6N) The transmitter keyboardis arrangedas a scanned matrix. The matrix consists of 7 driver outputs and 7 sense inputs as shown in Figure 1. The driver outputs DRV0N to DRV6N are open drain N-chan- nel tran-sistors and they are conductive in the stand-by mode. The 7 sense inputs (SEN0N to SEN6N) enable the generation of 56 command codes. With 2 external diodes all 64 commands are addressable. The sense inputs have P-channel pull-up transistors so that they are HIGH until they are pulled LOW by connecting them to an output via a keydepression to initiate a code transmission. ADDRESS MODE INPUT (ADRM) The sub-system address and the transmission mode are defined by connecting the ADRM input to one or more driver outputs (DRV0N to DRV6N) of the key matrix. If more than one driver is con- nected to ADRM, they must be decoupled by di- odes. This allows the definition of seven sub-systemaddressesas shown in table 3. If driver DRV6N is connected to ADRM, the data output format of REMO is modulated or if not connected, flashed. The ADRM input has switched pull-up and pull- down loads. In the stand-by mode only the pull- down device is active. Whether ADRM is open (sub-system address 0, flashed mode) or con- nected to the driver outputs, this input is LOW and will not cause unwanted dissipation. When the transmitter becomes active by pressing a key, the pull-down device is switched off and the pull-up device is switched on, so that the applied driver signals are sensed for the decodingof the sub-sys- tem address and the mode of transmission. The arrangement of the sub-system address cod- ing is such that only the driver DRVnM with the highest number (n) defines the sub-system ad- dress, e.g. if drivers DRV2N and DRV4N are con- nected to ADRM, only DRV4N will define the sub-system address. This option can be used in systems requiring more than one sub-system ad- dress. The transmitter may be hard-wired for sub- system address 2 by connectingDRV1N to ADRM. If now DRV3N is added to ADRM by a key or a switch, the transmitted sub-system address changes to 4. A change of the sub-system address will not start a transmission. ADRM DDV VSS OSCILLATOR KEYBOARD SCAN PULSE DISTANCE MODULATOR CONTROL LOGIC REMO OUTPUT OSCI OSCO DRV OUTPUTS S E N I N P U T S 0N 1N 3N 4N 5N 6N2N 3004L-02.EPS BLOCK DIAGRAM M3004LAB1 - M3004LD

REMOTE CONTROL SIGNAL OUTPUT (REMO) The REMO signal output stage is a push-pull type. In the HIGH state, a bipolar emitter-follower allows a high output current. The timing of the data output format is listed in tables 1 and 2. The information is defined by the distance t b between the leading edges of the flashed pulses or the first edge of the modulated pulses (see Figure 3). The format of the output data is given in Figures 2 and 3. The data word starts with two toggle bits T1 and T0, followed by three bits for defining the sub-system address S2, S1 and S0, and six bits F, E, D, C, BandA which are defined by the selected key. In the modulatedtransmission mode the first toggle bit is replaced by a constant reference time bit (REF). This can be used as a reference time for the decoding sequence. The toggle bits function is an indication for the decoder that the next instruction has to be considered as a new command. The codes for the sub-system address and the selected key are given in tables 3 and 4. The REMO output is protected against ”Lock-up”, i.e. the lengthof an output pulse is limited to < 1ms, even if the oscillator stops during an output pulse. This avoids the rapid discharge of the battery that would otherwise be caused by the continuousac- tivation of the LED. OSCILLATOR INPUT / OUTPUT (OSCI and OSCO) The external components must be connected to these pins when using an oscillator with a ceramic resonator. The oscillator frequency may vary be- tween 350kHz and 600kHz as defined by the reso- nator. FUNCTIONAL DESCRIPTION Keyboard operation In the stand-by mode all drivers (DRV0N to DRV6N) are on (low impedance to V SS ). Whenever a key is pressed, one or more of the sense inputs (SENnN) are tied to ground. This will start the power-up sequence. First the oscillator is activated and after the debounce time t DB (see Figure 4) the output drivers (DRV0N to DRV6N) become active successively. Within the first scan cycle the transmission mode, the applied sub-system address and the selected command code are sensed and loaded into an internal data latch. In contrast to the command code, the sub-system is sensed only within the first scan cycle. If the applied sub-system address is changed while the command key is pressed, the transmitted sub-sys- tem address is not altered. In a multiple key stroke sequence (see Figure 5) the command code is always altered in accordance with the sensed key. MULTIPLE KEY-STROKE PROTECTION The keyboard is protected against multiple key- strokes. If more than one key is pressed at the same time, thecircuit will not generatea new output at REMO (see Figure 5). In case of a multiple key-stroke, the scan repetition rate is increased to detect the release of a key as soon as possible. There are two restrictions caused by the special structure of the keyboard matrix : - The keys switching to ground (code numbers 7, 15, 23, 31, 39, 47, 55 and 63) and the keys connectedto SEN5Nand SEN6N arenot covered completely by the multiple key protection. If one sense input is switched to ground,further keys on the same sense line are ignored, i.e. the com- mand code corresponding to ”key to ground” is transmitted. - SEN5N and SEN6N are not protected against multiple keystroke on the same driver line, be- cause this condition has been used for the defi- nition ofadditional codes (code number 56 to 63). OUTPUT SEQUENCE (data format) The output operation will start when the selected code is found. A burst of pulses, including the latched addressandcommand codes,is generated at the output REMO as long as a key is pressed. The format of the output pulse train is given in Figures 2 and 3. The operation is terminated by releasing the key or if more than one key is pressed at the same time. Once a sequence is started, the transmitted data words will always be completed after the key is released. The toggle bits T0 and T1 are incremented if the key is released for a minimum time t REL (see Fig- ure 4). The toggle bits remain unchanged within a multiple key-stroke sequence. M3004LAB1 - M3004LD

fOSC 455kHz t OSC = 2.2µs tP 4xt OSC Flashed Pulse Width tM 12 x tOSC Modulation Period tML 8xt OSC Modulation Period Low tMH 4xt OSC Modulation Period High tW 55296 x tOSC Word Distance TO 1152 x tOSC Basic Unit of Pulse Distance The following number of pulses may be selected by Metal option : N = 8, 12, 16. Note : The different dividing ratio for TO and tW between flash mode and carrier mode is obtained by changing the modulo of a particular di- vider from divide by 3 during flash mode to divide by 4 during carrier mode. This allows the use of a 600kHz ceramic resonator dur- ing carrier mode to obtain a better noise immunity for the receiver without a significant change in TO and tW . For first samples, the correct divider ration is obtained by a metal mask option. For final parts, this is automatically done together with the selection of flash-/carrier mode. 3004L-02.TBL Table 2 :Pulse Train Separation (tb) Code t b Logic ”0” 2xT O Logic ”1” 3xT O Toggle Bit Time 2 x T O or 3 x TO Reference Time 3 x T O 3004L-03.TBL Table 3 :Transmission Mode and Sub-system Adress Selection. The sub-system address and the transmission mode are defined by connecting the ADRM input to one or more driver outputs (DRV0N T o DRV6N) of the key matrix. If more than one driver is con- nected to ADRM, they must be decoupled by di- odes. Mode Sub-system Address Driver DRVnN for n = # S 2 S 1 S 0 0123456 F L A S H E D O X X X X X O X X X X O X X X O X X O XO M O D U L A T E D O X X X X X O X X X X O X X X O X X O XO O O O O O O O O= connected to ADRM blank= not connected to ADRM X = don’t care 3004L-04.TBL Table 1 :Pulse Train Timing Mode T O (ms) t P (µs) t M (µs) t ML (µs) t MH (µs) t W (ms) Flashed 2.53 8.8 - - - 121 Modulated 2.53 - 26.4 17.6 8.8 121 3004L-01.TBL M3004LAB1 - M3004LD

Table 4 :Key Codes Matrix Drive Matrix Sense Code Matrix PositionFEDCBA DRV0N DRV1N DRV2N DRV3N DRV4N DRV5N DRV6N V SS SEN0N SEN0N SEN0N SEN0N SEN0N SEN0N SEN0N SEN0N SEN1N SEN2N SEN3N SEN4N SEN5N SEN6N SEN5N and SEN6N 8t o1 5 16 to 23 24 to 31 32 to 39 40 to 47 48 to 55 56 to 63 * The complete matrix drive as shown above for SEN0N is also applicable for the matrix sense inputs SEN1N to SEN6N and the combined SEN5/SEN6N. ** The C, B and A codes are identical to SEN0N as given above. 3004L-05.TBL ABSOLUTE MAXIMUM RATINGS Symbol Parameter Value Unit VDD Supply Voltage Range - 0.3 to + 7 V VI Input Voltage Range - 0.3 to (V DD + 0.3) V VO Output Voltage Range - 0.3 to (V DD + 0.3) V ± I D.C. Current into Any Input or Output Max. 10 mA - I (REMO) M Peak REMO Output Current during 10µs, Duty Factor = 1% Max. 300 mA Ptot Power Dissipation per Package for TA = - 20 to + 70oC Max. 200 mW Tstg Storage Temperature Range - 55 to + 125 oC TA Operating Ambient Temperature Range - 20 to + 70 oC 3004L-06.TBL

ELECTRICAL CHARACTERISTICS

VSS = 0V, TA =2 5oC (unless otherwise specified) Symbol Parameter Test Conditions Min. Typ. Max. Unit VDD Supply Voltage T A = 0 to + 70oC 2 6.5 V IDD Supply Current • Active fOSC = 455kHz V DD =3 V REMO,Output unload V DD =6 V 0.25 1.0 0.5 mA mA

• Inactive (stand-by mode) VDD =6 V 2 µA fOSC Oscill. Frequency V DD = 2 to 6.5V (cer resonator) 350 600 kHz KEYBOARD MATRIX - Inputs SE0N to SEN6N VIL Input Voltage Low V DD = 2 to 6.5V 0.3 x V DD V VIH Input Voltage High V DD = 2 to 6.5V 0.7 x V DD V -II Input Current V DD =2 V ,VI=0 V VDD = 6.5V, VI=0 V 100 100 600 µA µA II Input Leakage Current VDD = 6.5V, VI=V DD 1 µA KEYBOARD MATRIX - Outputs DRV0N to DRV6N VOL Output Voltage ”ON” VDD =2 V ,IO = 0.1mA VDD = 6.5V, IO = 2.5mA 0.3 0.6 V V IO Output Current ”OFF” VDD = 6.5V, VO = 11V 10 µA 3004L-07.TBL M3004LAB1 - M3004LD

VSS = 0V, TA =2 5oC (unless otherwise specified) Symbol Parameter Test Conditions Min. Typ. Max. Unit CONTROL INPUT ADRM VIL Input Voltage Low 0.3 x VDD V VIH Input Voltage High 0.7 x V DD V IIL Input Current Low (switched P and N channel pull-up/pull down) Pull-up Act. Oper. Condition, V IN =V SS VDD =2 V VDD = 6.5V 100 100 600 µA µA IIH Input Current High (switched P and N channel pull-up/pull down) Pull-down Act. Stand-by Cond.,VIN =V DD VDD =2 V VDD = 6.5V 100 100 600 µA µA DATA OUTPUT REMO -IOH Output Current High V DD =2 V ,VOH = 0.8V VDD = 6.5V, VOH =5 V mA mA IOL Output Current Low V DD =2 V ,VOL = 0.4V VDD = 6.5V, VOL = 0.4V 0.6 0.6 mA mA tOH Pulse Length V DD = 6.5V, Oscill. Stopped 1 mS OSCILLATOR II Input Current V DD =2 V VDD = 6.5V, OSC1 at VDD 5 µA µA VOH Output Voltage high V DD = 6.5V, - IOL = 0.1mA V DD - 0.8 V VOL Output Voltage Low V DD = 6.5V, IOH = 0.1mA 0.7 V 3004L-08.TBL V REMO DD V SS DRV0N SEN0N SEN1N SEN2N SEN5N SEN6N ADRM OSCI OSCO DRV1N DRV5N M3004LAB1 M3004LD 91 1 1 2 13 14 15 16 17 DRV6N 18 19 DRV4N DRV2N* DRV3N* SEN3N* SEN4N* 3004L-03.EPS Figure 1 :Typical Application M3004LAB1 - M3004LD

I L B e D Z b Z F E PM-DIP20.EPS PACKAGE MECHANICAL DATA

20 PINS - PLASTIC DIP

Dimensions Millimeters Inches a1 0.254 0.010 B 1.39 1.65 0.055 0.065 b 0.45 0.018 b1 0.25 0.010 D 25.4 1.000 E 8.5 0.335 e 2.54 0.100 e3 22.86 0.900 F 7.1 0.280 i 3.93 0.155 L 3.3 0.130 Z 1.34 0.053 DIP20.TBL M3004LAB1 - M3004LD

F C L E A e D b 20 11 11 0 s M PM-SO20L.EPS PACKAGE MECHANICAL DATA

20 PINS - PLASTIC MICROPACKAGE

Dimensions Millimeters Inches A 2.65 0.104 a1 0.1 0.2 0.004 0.008 a2 2.45 0.096 b 0.35 0.49 0.014 0.019 b1 0.23 0.32 0.009 0.013 C 0.5 0.020 c1 45 o (typ.) D 12.6 13.0 0.496 0.510 E 10 10.65 0.394 0.419 e 1.27 0.050 e3 11.43 0.450 F 7.4 7.6 0.291 0.300 L 0.5 1.27 0.020 0.050 M 0.75 0.030 S8 o (max.) SO20L.TBL Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No licence is granted by implication or otherwise under anypatent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of SGS-THOMSON Microelectronics.  1994 SGS-THOMSON Microelectronics - All Rights Reserve d Purchase of I 2C Components of SGS-THOMSON Microelectronics, conveys a license under the Philips I2C Patent. Rights to use these components in a I2C system, is granted provided that the system conforms to the I2C Standard Specifications as defined by Philips. SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - China - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco The Netherlands - Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A. M3004LAB1 - M3004LD