M28LV64 STMICROELECTRONICS | Alldatasheet

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64K (8K x 8) LOW VOLTAGE PARALLEL EEPROM with SOFTWARE DATA PROTECTION NOT FOR NEW DESIGN May 1997 1/18 This is information on a product still in production but not recommended for new designs. AI01538B A0-A12 W DQ0-DQ7 VCC M28LV64 G E VSS RB * Figure 1. Logic Diagram Table 1. Signal Names

DESCRIPTION

The M28LV64 is an 8K x 8 low power Parallel EEPROM fabricated with SGS-THOMSON pro- prietary single polysilicon CMOS technology. The device offers fast access time with low power dis- sipation and requires a 2.7V to 3.6V power supply. TSOP28 (N) 8 x13.4mm SO28 (MS) 300 mils Note:* RB function is only available on the M28L V64.

W A11 G E DQ5DQ1 DQ2 DQ3VSS DQ4 DQ6 A12 RB V CC AI01539B M28LV648 Figure 2A. DIP Pin Connections Warning: NC = Not Connected. AI01540B NC A10 DQ4 NC DQ0 DQ1 DQ2 DU DQ3 W 1 RB A11 DQ6 DQ7 32 DU VCC M28LV64 A12 NC DQ5 G E VSS Figure 2B. LCC Pin Connections Warning: NC = Not Connected, DU = Don’t Use. DQ0 A11 DQ7 G E DQ5 DQ1 DQ2 DQ3 DQ4 DQ6 NC W A12 RB VCC AI01542B M28LV6428 VSS A10 Figure 2D. TSOP Pin Connections Warning: NC = Not Connected. DQ0 DQ1 A10 E NC DQ7 G DQ5 VCC DQ4 W RB AI01541B M28LV648 DQ2 VSS DQ6

23 A11

Figure 2C. SO Pin Connections Warning: NC = Not Connected. M28L V64

relevant quality documents . Table 2. Absolute Maximum Ratings(1) Figure 3. Block Diagram

Note: 1. 0 = VIL;1=V IH;X=V IL or VIH. Table 3. Operating Modes(1) ing with Ready/Busy, Data Polling and Toggle Bit. possible using the standard JEDEC algorithm. Enable is high, power consumption is reduced. from the M28LV64 through the I/O pins. the writing of data to the M28LV64. Write operation if VCC is below VWI (see Table 6). a power-up as specified in Table 6. impedance when either G or E is high. operationis internally timed until completion. during any byte write operation. the internal programming cycle will start.

Note: 1. Sampled only, not 100% tested. Table 4. Capacitance(1) (TA =2 5°C, f = 1 MHz ) Note: 1. All I/O’s open circuit. Table 5. Read Mode DC Characteristics Note: 1. Sampled only, not 100% tested. Table 6. Power Up Timing(1)(TA = 0 to 70°C or –40 to 85°C; VCC = 2.7V to 3.6V)

0.5 VCC

Figure 7. AC Testing Input Output Waveforms Figure 8. AC Testing Equivalent Load Circuit

Notes:1. Output Hi-Z is defined as the point at which data is no longer driven.

  1. Guaranted, not 100% sampled.

Table 7. Read Mode AC Characteristics Figure 9. Read Mode AC Waveforms

Note: 1. With a 3.3 kΩ external pull-up resistor. Table 8. Write Mode AC Characteristics

ORDERING INFORMATION SCHEME Speed -200 200ns -250 250ns -300 300ns Write Monitoring blank RB function active X No RB function Package P PDIP28 K PLCC32 MS SO28 300 mils N TSOP28 8 x 13.4mm Temperature Range 1 0 to 70 °C 6 –40 to 85 °C Example: M28LV64 -200 X K 1 The M2864 is replaced by the M28C64-xxW. Devices are shipped from the factory with the memory content set at all ”1’s” (FFh). For a list of available options(Speed, Package, etc...) or for further information on any aspect of this device, please contact the SGS-THOMSON Sales Office nearest to you. M28LV64

A L B1 B e1 D S E1 E N Cα eA Symb mm inches Typ Min Max Typ Min Max A 3.94 5.08 0.155 0.200 A1 0.38 1.78 0.015 0.070 A2 3.56 4.06 0.140 0.160 B 0.38 0.56 0.015 0.021 B1 1.14 1.78 0.045 0.070 C 0.20 0.30 0.008 0.012 D 34.70 37.34 1.366 1.470 E 14.80 16.26 0.583 0.640 E1 12.50 13.97 0.492 0.550 eA 15.20 17.78 0.598 0.700 L 3.05 3.82 0.120 0.150 S 1.02 2.29 0.040 0.090 α 0° 15° 0° 15° N2 8 2 8 PDIP28 Drawing is not to scale. PDIP28 - 28 pin Plastic DIP, 600 mils width M28L V64

Drawing is not to scale. PLCC D Ne E1 E Nd CP B D2/E2 e A j Symb mm inches Typ Min Max Typ Min Max A 2.54 3.56 0.100 0.140 A1 1.52 2.41 0.060 0.095 B 0.33 0.53 0.013 0.021 B1 0.66 0.81 0.026 0.032 D 12.32 12.57 0.485 0.495 D1 11.35 11.56 0.447 0.455 D2 9.91 10.92 0.390 0.430 E 14.86 15.11 0.585 0.595 E1 13.89 14.10 0.547 0.555 E2 12.45 13.46 0.490 0.530 N3 2 3 2 Nd 7 7 Ne 9 9 CP 0.10 0.004 PLCC32 PLCC32 - 32 lead Plastic Leaded Chip Carrier, rectangular M28LV64

Drawing is not to scale. Symb mm inches Typ Min Max Typ Min Max A 2.46 2.64 0.097 0.104 A1 0.13 0.29 0.005 0.011 A2 2.29 2.39 0.090 0.094 B 0.35 0.48 0.014 0.019 C 0.23 0.32 0.009 0.013 D 17.81 18.06 0.701 0.711 E 7.42 7.59 0.292 0.299 H 10.16 10.41 0.400 0.410 L 0.61 1.02 0.024 0.040 α 0° 8° 0° 8° N2 8 2 8 CP 0.10 0.004 SO28 SO28 - 28 lead Plastic Small Outline, 300 mils body width SO-b E N CPB e D C LA1 α H A M28L V64

Drawing is not to scale. Symb mm inches Typ Min Max Typ Min Max A 1.25 0.049 A1 0.20 0.008 A2 0.95 1.15 0.037 0.045 B 0.17 0.27 0.007 0.011 C 0.10 0.21 0.004 0.008 D 13.20 13.60 0.520 0.535 D1 11.70 11.90 0.461 0.469 E 7.90 8.10 0.311 0.319 L 0.50 0.70 0.020 0.028 α 0° 5° 0° 5° N2 8 2 8 CP 0.10 0.004 TSOP28 TSOP28 - 28 lead Plastic Thin Small Outline, 8 x 13.4mm TSOP-c E CP B e A D DIE C LA1 α M28LV64

Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of SGS-THOMSON Microelectronics.  1997 SGS-THOMSON Microelectronics - All Rights Reserved SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands - Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A. M28L V64