M24C02-R STMICROELECTRONICS | Alldatasheet

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Technical content

Figure 1. Packages

has a push-pull (rather than open drain) output. the value of the pull-up resistor can be calculated). Write operations are allowed. Data bytes are not acknowledged. Figure 4. Maximum RL Value versus Bus Capacitance (CBUS ) for an I2C Bus

Figure 5. I2C Bus Protocol Table 2. Device Select Code Note: 1. The most significant bit, b7, is sent first.

  1. E0, E1 and E2 are compared against the respective external pins on the memory device.
  2. A10, A9 and A8 represent most significant bits of the address.

any device that reads the data to be a receiver. a slave in all communication. and will not respond unless one is given. (SDA) on the rising edge of Serial Clock (SCL). sends the Device Select Code, shown in Table 2. (on Serial Data (SDA), most significant bit first). bit Device Type Identifier is 1010b.

16 Kbits, 2 KBytes (except where M24C01 devic-

set to 1 for Read and 0 for Write operations. Table 3. Operating Modes

1 X reSTART, Device Select, RW = 1

Figure 6. Write Mode Sequences with WC=1 (data write inhibited) a Device Select Code with the RW bit reset to 0. bit, and then waits for the data byte. Write, the internal memory Write cycle is triggered. trigger the internal Write cycle. vice does not respond to any requests. not Write-protected, the device replies with Ack. ating a Stop condition, as shown in Figure 7..

Figure 7. Write Mode Sequences with WC

Figure 8. Write Cycle Polling Flowchart using ACK data from its internal latches to the memory cells.

  1. to Table 17., but the typical time is shorter. To

– Initial condition: a Write cycle is in progress. byte of the new instruction). having been sent during Step 1).

Figure 9. Read Mode Sequences Note: The seven most significant bits of the Device Select Code of a Random Read (in the 1st and 3rd bytes) must be identical. the state of the Write Control (WC) signal. is incremented each time a byte is read. nates the transfer with a Stop condition.

M24C16, M24C08, M24C04, M24C02, M24C01 Sequential Read This operation can be used after a Current Ad- dress Read or a Random Address Read. The bus master does acknowledge the data byte output, and sends additional clock pulses so that the de- vice continues to output the next byte in sequence. To terminate the stream of bytes, the bus master must not acknowledge the last byte, and must generate a Stop condition, as shown in Figure 9.. The output data comes from consecutive address- es, with the internal address counter automatically incremented after each byte output. After the last memory address, the address counter ‘rolls-over’, and the device continues to output data from memory address 00h. Acknowledge in Read Mode For all Read commands, the device waits, after each byte read, for an acknowledgment during the th bit time. If the bus master does not drive Serial Data (SDA) Low during this time, the device termi- nates the data transfer and switches to its Stand- by mode. INITIAL DELIVERY STATE The device is delivered with the memory array erased: all bits are set to 1 (each byte contains FFh).

Table 4. Absolute Maximum Ratings

Table 5. Operating Conditions (M24Cxx) Note: 1. This range is Not for New Design, and will soon be replaced by the M24Cxx-W range. Table 6. Operating Conditions (M24Cxx-W) Table 7. Operating Conditions (M24Cxx-R)

Table 8. AC Measurement Conditions Figure 10. AC Measurement I/O Waveform Table 9. Input Parameters

  1. Sampled only, not 100% tested.

Table 10. DC Characteristics (M24Cxx, Device Grade 6) Note: 1. This range is Not for New Design, and will soon be replaced by the M24Cxx-Wxx6 range.

Table 11. DC Characteristics (M24Cxx, Device Grade 3) Note: 1. This range is Not for New Design, and will soon be replaced by the M24Cxx-Wxx3 range. Table 12. DC Characteristics (M24Cxx-W, Device Grade 6)

Table 13. DC Characteristics (M24Cxx-W, Device Grade 3) Note: 1. This is preliminary data. Table 14. DC Characteristics (M24Cxx-R)

Table 15. AC Characteristics (M24Cxx, Device Grade 6) Note: 1. For a reSTART condition, or following a Write cycle.

  1. Sampled only, not 100% tested.
  2. To avoid spurious START and STOP conditions, a minimum delay is placed between SCL=1 and the falling or rising edge of SDA.
  3. This is preliminary data for M24Cxx-Wxx3.

Table 16. AC Characteristics (M24Cxx, Device Grade 3; M24Cxx-W, Device Grade 6 or 3) Note: 1. For a reSTART condition, or following a Write cycle.

  1. Sampled only, not 100% tested.
  2. To avoid spurious START and STOP conditions, a minimum delay is placed between SCL=1 and the falling or rising edge of SDA.
  3. 10ms write time is offered on the standard device. 5ms write time is offered on new products bearing the Process Identification letter

“W” or “G” on the package, as described in Table 24.. Test conditions specified in Table 8. and Table 5. Test conditions specified in Table 8. and Table 5. or Table 6.

Table 17. AC Characteristics (M24Cxx-R) Note: 1. For a reSTART condition, or following a Write cycle.

  1. Sampled only, not 100% tested.
  2. To avoid spurious START and STOP conditions, a minimum delay is placed between SCL=1 and the falling or rising edge of SDA.
  3. 100kHz clock frequency is offered on the standard device. 400kHz clock frequency is offered on new products bearing the Process

Identification letter “W” or “G” on the package, as described in Table 24.. Test conditions specified in Table 8. and Table 7.

Figure 11. AC Waveforms

Figure 12. PDIP8 – 8 pin Plastic DIP, 0.25mm lead frame, Package Outline Note: Drawing is not to scale. Table 18. PDIP8 – 8 pin Plastic DIP, 0.25mm lead frame, Package Mechanical Data

Figure 13. SO8 narrow – 8 lead Plastic Small Outline, 150 mils body width, Package Outline Note: Drawing is not to scale. Table 19. SO8 narrow – 8 lead Plastic Small Outline, 150 mils body width, Package Mechanical Data

Figure 14. UFDFPN8 (MLP8) 8-lead Ultra thin Fine pitch Dual Flat Package No lead 2x3mm², Outline Note: 1. Drawing is not to scale.

  1. The central pad (the area E2 by D2 in the above illustration) is pulled, internally, to VSS . It must not be allowed to be connected to

any other voltage or signal line on the PCB, for example during the soldering process. Table 20. UFDFPN8 (MLP8) 8-lead Ultra thin Fine pitch Dual Flat Package No lead 2x3mm², Data

Figure 15. TSSOP8 – 8 lead Thin Shrink Small Outline, Package Outline Note: Drawing is not to scale. Table 21. TSSOP8 – 8 lead Thin Shrink Small Outline, Package Mechanical Data

Figure 16. TSSOP8 3x3mm² – 8 lead Thin Shrink Small Outline, 3x3mm² body size, Package Outline Note: Drawing is not to scale. Table 22. TSSOP8 3x3mm² – 8 lead Thin Shrink Small Outline, 3x3mm² body size, Mechanical Data

Table 23. Ordering Information Scheme tified Flow (HRCF) is described in the quality note QNEE9801. Please ask your nearest ST sales office for a copy.

  1. 2.5 to 5.5V devices bearing the process letter “W” or “G” in the package marking (on the top side of the package, on the right side,
  2. Used only for Device Grade 3
  3. This range is Not for New Design, and will soon be replaced by the M24Cxx-W range.

Table 24. How to Identify Current and New Products by the Process Identification Letter Sales Office for Process Change Notices PCN MPG/EE/0061 and 0062 (PCEE0061 and PCEE0062).

M24C16, M24C08, M24C04, M24C02, M24C01

REVISION HISTORY

Table 25. Document Revision History 04-Feb-2003 3.6 Document title spelt out more fully. “W”-marked devices with tw=5ms added. -R voltage range upgraded to 400kHz working, and no longer preliminary data. 5V voltage range at temperature range 3 (-xx3) no longer preliminary data. -S voltage range removed. -Wxx3 voltage+temp ranged added as preliminary data. -0.45V . tW (max) value for -R voltage range corrected. MLP package added. Absolute Maximum Ratings for VIO(min) and VCC (min) changed.

M24C16, M24C08, M24C04, M24C02, M24C01 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2004 STMicroelectronics - All rights reserved STMicroelectronics GROUP OF COMPANIES Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States