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Technical content
Features
Frequency: 2300–2690 MHz Rx mode (2500 MHz) – Gain: 33.0 dB – IIP3: 0 dBm –N F :1 . 2d B Tx mode (2500 MHz) – Robustness short- -term incidents: 39.0 dBm (Avg.), 47.0 dBm (Peak) – Robustness indefinitely incidents:37.0 dBm (Avg.), 45.0 dBm (Peak) ANT port return loss: – Rx mode: –20 dB – Tx mode: –20 dB Reverse isolation: 55 dB Insertion loss ANT to Tx/TERM port: –0.75 dB 1.8 V logic JEDEC- -compliant control interface 5 V supply Power consumption: – Rx mode: 500 mW – Tx mode: 70 mW 50 ohm operation with no external matching Compact 6.2 mm 6.2 mm LGA package, which is compatible with QFN 6 6 footprint Document Number: AFRX5G272 Rev. 0, 07/2020 NXP Semiconductors Technical Data 2300–2690 MHz, 33 dB, 1.2 dB NF AIRFAST RX MODULE AFRX5G272 6.2 mm 6.2 mm Module 2020 NXP B.V.
Figure 1. Functional Block Diagram Table 1. Maximum Ratings Table 2. ESD Protection Characteristics Table 3. Moisture Sensitivity Level
- Continuous use at maximum temperature will affect MTTF.
Table 4. Electrical Characteristics(VDD = 5 Vdc, 2500 MHz, TA =2 5C, 50 ohm system, in NXP Application Circuit)
20 MHz LTE, 8 dB PAR Incident on ANT Pin
Table 5. Ordering Information
Figure 2. Pin Connections Table 6. Functional Pin Description
2 ANT Antenna Port/RF Input Port
8 VDD DC Bias Voltage
14 Rxout RF Output for LNA
19 Tx/TERM 50 Termination Port (user will need to provide 50 termination externally)
- T/R = Low, ANT to Tx. T/R = High, ANT to Rxout.
Figure 3. AFRX5G272 Application Circuit Component Layout Table 7. AFRX5G272 Application Circuit Designations and Values convenient application of a T/R control voltage. R1 and R2 arenot required in customer end application board designs.
Figure 4. Product Marking
PACKAGE INFORMATION
Refer to the following resource to aid your design process. Development Tools Printed Circuit Boards FAILURE ANALYSIS At this time, because of the physical characteristics of the part, failure analysis is limited to electrical signature analysis. In cases where NXP is contractually obligated to perform failure analysis (FA) services, full FA may be performed by third party vendors with moderate success. For updates contact your local NXP Sales Office.
REVISION HISTORY
The following table summarizes revisions to this document. Revision Date Description
0 July 2020 Initial release of data sheet
Document Number: AFRX5G272 Rev. 0, 07/2020 Information in this document is provided solely to enablesystem and software implementers to use NXP products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits based on the information in this document. NXP reserves the right to make changes without further notice to any products herein. NXP makes no warranty, representation, orguarantee regarding the suitability of its products for any particularpurpose, nor does NXP assume any liability arising out of the application or use of any product or circuit, andspecifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in NXP data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including “typicals,” must be validated for each customer application by customer’s technical experts. NXP does not convey any license under its patent rights nor the rights of others. NXP sells products pursuant to standard terms and conditions of sale, which can be found at the following address:nxp.com/ SalesTermsandConditions. NXP, the NXP logo, Freescale, the Freescale logo and Airfast are trademarks of NXP B.V. All other product or service names are the property of their respective owners. E 2020 NXP B.V. How to Reach Us: Home Page: nxp.com Web Support: nxp.com/support